SPICE MODEL of TPCF8102 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ464 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ438 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a power MOSFET and includes:
1) Component details such as the part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Summaries of simulations and comparisons to measurement data for key MOSFET parameters and characteristics including transconductance, Vgs-Id, switching time, and more.
3) Summaries of simulations and comparisons to measurement data for the body diode's forward current, reverse recovery, and zener voltage characteristics.
4) References and example circuits used in the simulations.
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and model parameters.
2) Simulation results of the transistor's transconductance, voltage-current characteristics, gate charge, switching times and other properties.
3) Comparisons of the simulated results with measurement data showing good agreement.
4) Reference curves and evaluation circuits used in the simulations.
SPICE MODEL of TPC8012-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8012-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a Toshiba power MOSFET (TPCF8302) and its internal body diode. It includes:
1) Details of the MOSFET and diode components and manufacturer.
2) SPICE models for the MOSFET describing its electrical parameters and characteristics.
3) Simulation results comparing measured and simulated MOSFET characteristics including Id-Vgs, switching time, and more.
4) SPICE model for the internal diode and simulation results for its zener voltage characteristic.
SPICE MODEL of 2SK2661 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number and manufacturer.
2) Descriptions of the SPICE model parameters used to simulate the MOSFET.
3) Simulation results that compare measurements of the MOSFET's electrical characteristics to the model, such as transconductance, Vgs-Id curve, and switching times.
3) Circuit schematics used to perform the simulations and measure characteristics like output, forward current, and reverse recovery.
SPICE MODEL of 2SJ464 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ464 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ438 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the device modeling report for a power MOSFET and includes:
1) Component details such as the part number, manufacturer, and remarks on the MOSFET and body diode models.
2) Summaries of simulations and comparisons to measurement data for key MOSFET parameters and characteristics including transconductance, Vgs-Id, switching time, and more.
3) Summaries of simulations and comparisons to measurement data for the body diode's forward current, reverse recovery, and zener voltage characteristics.
4) References and example circuits used in the simulations.
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and model parameters.
2) Simulation results of the transistor's transconductance, voltage-current characteristics, gate charge, switching times and other properties.
3) Comparisons of the simulated results with measurement data showing good agreement.
4) Reference curves and evaluation circuits used in the simulations.
SPICE MODEL of TPC8012-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8012-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a Toshiba power MOSFET (TPCF8302) and its internal body diode. It includes:
1) Details of the MOSFET and diode components and manufacturer.
2) SPICE models for the MOSFET describing its electrical parameters and characteristics.
3) Simulation results comparing measured and simulated MOSFET characteristics including Id-Vgs, switching time, and more.
4) SPICE model for the internal diode and simulation results for its zener voltage characteristic.
SPICE MODEL of 2SK2661 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number and manufacturer.
2) Descriptions of the SPICE model parameters used to simulate the MOSFET.
3) Simulation results that compare measurements of the MOSFET's electrical characteristics to the model, such as transconductance, Vgs-Id curve, and switching times.
3) Circuit schematics used to perform the simulations and measure characteristics like output, forward current, and reverse recovery.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3728-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3728-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ407 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and remarks on the model.
2) Descriptions and parameters for the Pspice model of the MOSFET.
3) Results of circuit simulations characterizing the MOSFET's transconductance, Vgs-Id curve, gate charge, switching time and other properties.
4) Comparisons of the simulation results to manufacturer measurement data showing good agreement.
SPICE MODEL of 2SK3644-01 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key parameters and simulation results of a power MOSFET transistor and its internal body diode. It includes tables of parameters for the MOSFET and diode models, graphs comparing simulated and measured output characteristics like forward current and switching times, and evaluation circuits used in the simulations. The models aim to accurately represent the electrical behavior of the real components for circuit design and analysis.
SPICE MODEL of 2SK3611-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3611-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3938 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2740 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6104 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components and modeling parameters of the TPC6104 power MOSFET manufactured by Toshiba. It includes:
1) Details of the MOSFET and diode components, manufacturer, and part number.
2) Descriptions and values of the various MOSFET model parameters used in circuit simulations.
3) Results of simulations validating the MOSFET model against measurements of electrical characteristics like transconductance, Vgs-Id, and switching times.
4) Explanations of the evaluation circuits used to simulate the electrical behaviors.
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N65A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of an IRFB9N65A power MOSFET manufactured by International Rectifier. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the PSpice models used to simulate the MOSFET's electrical characteristics.
3) Results of simulations validating the MOSFET's transconductance, capacitance, switching time and other characteristics against manufacturer measurements.
4) Circuit diagrams of the evaluation setups used in the simulations.
SPICE MODEL of IRFIB7N50A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3728-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3728-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ407 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and remarks on the model.
2) Descriptions and parameters for the Pspice model of the MOSFET.
3) Results of circuit simulations characterizing the MOSFET's transconductance, Vgs-Id curve, gate charge, switching time and other properties.
4) Comparisons of the simulation results to manufacturer measurement data showing good agreement.
SPICE MODEL of 2SK3644-01 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key parameters and simulation results of a power MOSFET transistor and its internal body diode. It includes tables of parameters for the MOSFET and diode models, graphs comparing simulated and measured output characteristics like forward current and switching times, and evaluation circuits used in the simulations. The models aim to accurately represent the electrical behavior of the real components for circuit design and analysis.
SPICE MODEL of 2SK3611-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3611-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3938 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3938 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2740 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2740 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6104 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components and modeling parameters of the TPC6104 power MOSFET manufactured by Toshiba. It includes:
1) Details of the MOSFET and diode components, manufacturer, and part number.
2) Descriptions and values of the various MOSFET model parameters used in circuit simulations.
3) Results of simulations validating the MOSFET model against measurements of electrical characteristics like transconductance, Vgs-Id, and switching times.
4) Explanations of the evaluation circuits used to simulate the electrical behaviors.
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15H50C (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N65A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of an IRFB9N65A power MOSFET manufactured by International Rectifier. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the PSpice models used to simulate the MOSFET's electrical characteristics.
3) Results of simulations validating the MOSFET's transconductance, capacitance, switching time and other characteristics against manufacturer measurements.
4) Circuit diagrams of the evaluation setups used in the simulations.
SPICE MODEL of IRFIB7N50A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK15H50C (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK15H50C (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J314T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J314T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ407 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ407 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K15FV (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FV (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J16FS (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J16FS (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J16FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J16FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J16FS (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J16FS (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J13T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a TOSHIBA SSM3J13T power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the MOSFET and body diode PSpice models.
3) Simulation results and comparisons to measurements for key electrical characteristics like transconductance, Vgs-Id, gate charge, switching time and more.
4) Reference curves for characteristics like output, forward current, reverse recovery and zener voltage.
The report examines the device's electrical behavior and validates its PSpice model against experimental data.
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K15FV (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3K14T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3K14T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Full-RAG: A modern architecture for hyper-personalizationZilliz
Mike Del Balso, CEO & Co-Founder at Tecton, presents "Full RAG," a novel approach to AI recommendation systems, aiming to push beyond the limitations of traditional models through a deep integration of contextual insights and real-time data, leveraging the Retrieval-Augmented Generation architecture. This talk will outline Full RAG's potential to significantly enhance personalization, address engineering challenges such as data management and model training, and introduce data enrichment with reranking as a key solution. Attendees will gain crucial insights into the importance of hyperpersonalization in AI, the capabilities of Full RAG for advanced personalization, and strategies for managing complex data integrations for deploying cutting-edge AI solutions.
“An Outlook of the Ongoing and Future Relationship between Blockchain Technologies and Process-aware Information Systems.” Invited talk at the joint workshop on Blockchain for Information Systems (BC4IS) and Blockchain for Trusted Data Sharing (B4TDS), co-located with with the 36th International Conference on Advanced Information Systems Engineering (CAiSE), 3 June 2024, Limassol, Cyprus.
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
GraphSummit Singapore | The Future of Agility: Supercharging Digital Transfor...Neo4j
Leonard Jayamohan, Partner & Generative AI Lead, Deloitte
This keynote will reveal how Deloitte leverages Neo4j’s graph power for groundbreaking digital twin solutions, achieving a staggering 100x performance boost. Discover the essential role knowledge graphs play in successful generative AI implementations. Plus, get an exclusive look at an innovative Neo4j + Generative AI solution Deloitte is developing in-house.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/building-and-scaling-ai-applications-with-the-nx-ai-manager-a-presentation-from-network-optix/
Robin van Emden, Senior Director of Data Science at Network Optix, presents the “Building and Scaling AI Applications with the Nx AI Manager,” tutorial at the May 2024 Embedded Vision Summit.
In this presentation, van Emden covers the basics of scaling edge AI solutions using the Nx tool kit. He emphasizes the process of developing AI models and deploying them globally. He also showcases the conversion of AI models and the creation of effective edge AI pipelines, with a focus on pre-processing, model conversion, selecting the appropriate inference engine for the target hardware and post-processing.
van Emden shows how Nx can simplify the developer’s life and facilitate a rapid transition from concept to production-ready applications.He provides valuable insights into developing scalable and efficient edge AI solutions, with a strong focus on practical implementation.
A tale of scale & speed: How the US Navy is enabling software delivery from l...sonjaschweigert1
Rapid and secure feature delivery is a goal across every application team and every branch of the DoD. The Navy’s DevSecOps platform, Party Barge, has achieved:
- Reduction in onboarding time from 5 weeks to 1 day
- Improved developer experience and productivity through actionable findings and reduction of false positives
- Maintenance of superior security standards and inherent policy enforcement with Authorization to Operate (ATO)
Development teams can ship efficiently and ensure applications are cyber ready for Navy Authorizing Officials (AOs). In this webinar, Sigma Defense and Anchore will give attendees a look behind the scenes and demo secure pipeline automation and security artifacts that speed up application ATO and time to production.
We will cover:
- How to remove silos in DevSecOps
- How to build efficient development pipeline roles and component templates
- How to deliver security artifacts that matter for ATO’s (SBOMs, vulnerability reports, and policy evidence)
- How to streamline operations with automated policy checks on container images
Climate Impact of Software Testing at Nordic Testing DaysKari Kakkonen
My slides at Nordic Testing Days 6.6.2024
Climate impact / sustainability of software testing discussed on the talk. ICT and testing must carry their part of global responsibility to help with the climat warming. We can minimize the carbon footprint but we can also have a carbon handprint, a positive impact on the climate. Quality characteristics can be added with sustainability, and then measured continuously. Test environments can be used less, and in smaller scale and on demand. Test techniques can be used in optimizing or minimizing number of tests. Test automation can be used to speed up testing.
Building RAG with self-deployed Milvus vector database and Snowpark Container...Zilliz
This talk will give hands-on advice on building RAG applications with an open-source Milvus database deployed as a docker container. We will also introduce the integration of Milvus with Snowpark Container Services.
In the rapidly evolving landscape of technologies, XML continues to play a vital role in structuring, storing, and transporting data across diverse systems. The recent advancements in artificial intelligence (AI) present new methodologies for enhancing XML development workflows, introducing efficiency, automation, and intelligent capabilities. This presentation will outline the scope and perspective of utilizing AI in XML development. The potential benefits and the possible pitfalls will be highlighted, providing a balanced view of the subject.
We will explore the capabilities of AI in understanding XML markup languages and autonomously creating structured XML content. Additionally, we will examine the capacity of AI to enrich plain text with appropriate XML markup. Practical examples and methodological guidelines will be provided to elucidate how AI can be effectively prompted to interpret and generate accurate XML markup.
Further emphasis will be placed on the role of AI in developing XSLT, or schemas such as XSD and Schematron. We will address the techniques and strategies adopted to create prompts for generating code, explaining code, or refactoring the code, and the results achieved.
The discussion will extend to how AI can be used to transform XML content. In particular, the focus will be on the use of AI XPath extension functions in XSLT, Schematron, Schematron Quick Fixes, or for XML content refactoring.
The presentation aims to deliver a comprehensive overview of AI usage in XML development, providing attendees with the necessary knowledge to make informed decisions. Whether you’re at the early stages of adopting AI or considering integrating it in advanced XML development, this presentation will cover all levels of expertise.
By highlighting the potential advantages and challenges of integrating AI with XML development tools and languages, the presentation seeks to inspire thoughtful conversation around the future of XML development. We’ll not only delve into the technical aspects of AI-powered XML development but also discuss practical implications and possible future directions.
Essentials of Automations: The Art of Triggers and Actions in FMESafe Software
In this second installment of our Essentials of Automations webinar series, we’ll explore the landscape of triggers and actions, guiding you through the nuances of authoring and adapting workspaces for seamless automations. Gain an understanding of the full spectrum of triggers and actions available in FME, empowering you to enhance your workspaces for efficient automation.
We’ll kick things off by showcasing the most commonly used event-based triggers, introducing you to various automation workflows like manual triggers, schedules, directory watchers, and more. Plus, see how these elements play out in real scenarios.
Whether you’re tweaking your current setup or building from the ground up, this session will arm you with the tools and insights needed to transform your FME usage into a powerhouse of productivity. Join us to discover effective strategies that simplify complex processes, enhancing your productivity and transforming your data management practices with FME. Let’s turn complexity into clarity and make your workspaces work wonders!
Unlocking Productivity: Leveraging the Potential of Copilot in Microsoft 365, a presentation by Christoforos Vlachos, Senior Solutions Manager – Modern Workplace, Uni Systems
Threats to mobile devices are more prevalent and increasing in scope and complexity. Users of mobile devices desire to take full advantage of the features
available on those devices, but many of the features provide convenience and capability but sacrifice security. This best practices guide outlines steps the users can take to better protect personal devices and information.
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
Generative AI Deep Dive: Advancing from Proof of Concept to ProductionAggregage
Join Maher Hanafi, VP of Engineering at Betterworks, in this new session where he'll share a practical framework to transform Gen AI prototypes into impactful products! He'll delve into the complexities of data collection and management, model selection and optimization, and ensuring security, scalability, and responsible use.
UiPath Test Automation using UiPath Test Suite series, part 5DianaGray10
Welcome to UiPath Test Automation using UiPath Test Suite series part 5. In this session, we will cover CI/CD with devops.
Topics covered:
CI/CD with in UiPath
End-to-end overview of CI/CD pipeline with Azure devops
Speaker:
Lyndsey Byblow, Test Suite Sales Engineer @ UiPath, Inc.
Removing Uninteresting Bytes in Software FuzzingAftab Hussain
Imagine a world where software fuzzing, the process of mutating bytes in test seeds to uncover hidden and erroneous program behaviors, becomes faster and more effective. A lot depends on the initial seeds, which can significantly dictate the trajectory of a fuzzing campaign, particularly in terms of how long it takes to uncover interesting behaviour in your code. We introduce DIAR, a technique designed to speedup fuzzing campaigns by pinpointing and eliminating those uninteresting bytes in the seeds. Picture this: instead of wasting valuable resources on meaningless mutations in large, bloated seeds, DIAR removes the unnecessary bytes, streamlining the entire process.
In this work, we equipped AFL, a popular fuzzer, with DIAR and examined two critical Linux libraries -- Libxml's xmllint, a tool for parsing xml documents, and Binutil's readelf, an essential debugging and security analysis command-line tool used to display detailed information about ELF (Executable and Linkable Format). Our preliminary results show that AFL+DIAR does not only discover new paths more quickly but also achieves higher coverage overall. This work thus showcases how starting with lean and optimized seeds can lead to faster, more comprehensive fuzzing campaigns -- and DIAR helps you find such seeds.
- These are slides of the talk given at IEEE International Conference on Software Testing Verification and Validation Workshop, ICSTW 2022.
SPICE MODEL of TPCF8102 (Standard+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Model Parameter)
PART NUMBER: TPCF8102
MANUFACTURER: TOSHIBA
Body Diode (Model Parameter) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
2. Circuit Configuration
TP CF8 10 2
MOSFET MODEL
Pspice model
Model description
Parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
3. Transconductance Characteristic
Circuit Simulation Result
Comparison table
gfs
Id(A) Error(%)
Measurement Simulation
-0.500 6.097 6.250 2.509
-1.000 8.333 8.621 3.452
-2.000 11.765 11.765 -0.002
-5.000 17.240 17.422 1.053
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
4. Vgs-Id Characteristic
Circuit Simulation result
-10A
-8A
-6A
-4A
-2A
0A
0V -0.5V -1.0V -1.5V -2.0V -2.5V
I(V3)
V_V1
Evaluation circuit
TPCF8102
V3
0Vdc
V1
-4.5Vdc
V2
-10Vdc
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
5. Comparison Graph
Circuit Simulation Result
Simulation Result
VGS(V)
ID(A) Error (%)
Measurement Simulation
-0.200 -1.225 -1.242 1.412
-0.500 -1.290 -1.302 0.922
-1.000 -1.370 -1.371 0.044
-2.000 -1.460 -1.471 0.740
-5.000 -1.655 -1.680 1.498
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
6. Rds(on) Characteristic
Circuit Simulation result
-3.0A
-2.0A
-1.0A
-0.1A
0V -20mV -50mV -80mV -110mV -140mV -170mV
I(V3)
V_V2
Evaluation circuit
TPCF8102
V3
0Vdc
V1
-4.5Vdc
V2
-10Vdc
0
Simulation Result
ID=-3.0A, VGS=-4.5V Measurement Simulation Error (%)
R DS (on) 24.000 m 24.000 m 0.000
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
14. Reverse Recovery Characteristic Reference
Trj=8.8(ns)
Trb=31.2(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
15. ESD PROTECTION DIODE SPICE MODEL
Zener Voltage Characteristic
Circuit Simulation Result
10mA
9mA
8mA
7mA
6mA
5mA
4mA
3mA
2mA
1mA
0A
0V 2V 4V 6V 8V 10V 12V 14V 16V 18V 20V
I(R1)
V_V1
Evaluation Circuit
R1
0.01m OPEN
OPEN
OPEN
V1 OPEN
TPCF8102
0Vdc R2
1MEG
0
OPEN
OPEN
OPEN
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005