SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8102 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3770-01MR (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3770-01MR (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01SJ (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01S (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01L (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8102 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW11N60CFD (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3770-01MR (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3770-01MR (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01SJ (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01L (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a Toshiba power MOSFET (TPCF8302) and its internal body diode. It includes:
1) Details of the MOSFET and diode components and manufacturer.
2) SPICE models for the MOSFET describing its electrical parameters and characteristics.
3) Simulation results comparing measured and simulated MOSFET characteristics including Id-Vgs, switching time, and more.
4) SPICE model for the internal diode and simulation results for its zener voltage characteristic.
SPICE MODEL of 2SK2661 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3770-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3770-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01SJ (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components, parameters, and simulation results of a power MOSFET transistor model. It describes the MOSFET and body diode components, lists parameters for the Pspice models, and shows simulation results that match measurement data for characteristics like transconductance, capacitance, switching times, and reverse recovery.
SPICE MODEL of 2SK3872-01SJ (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6104 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components and modeling parameters of the TPC6104 power MOSFET manufactured by Toshiba. It includes:
1) Details of the MOSFET and diode components, manufacturer, and part number.
2) Descriptions and values of the various MOSFET model parameters used in circuit simulations.
3) Results of simulations validating the MOSFET model against measurements of electrical characteristics like transconductance, Vgs-Id, and switching times.
4) Explanations of the evaluation circuits used to simulate the electrical behaviors.
SPICE MODEL of 2SK3677-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3677-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J13T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a TOSHIBA SSM3J13T power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the MOSFET and body diode PSpice models.
3) Simulation results and comparisons to measurements for key electrical characteristics like transconductance, Vgs-Id, gate charge, switching time and more.
4) Reference curves for characteristics like output, forward current, reverse recovery and zener voltage.
The report examines the device's electrical behavior and validates its PSpice model against experimental data.
SPICE MODEL of SSM3J13T (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET transistor and its internal body diode and ESD protection diode. It includes:
1) Details of the device components and manufacturer.
2) Descriptions of the MOSFET, body diode and ESD protection diode models used in the simulation.
3) Circuit simulations and results graphs characterizing the key electrical properties of the MOSFET like transconductance, capacitance, switching time and more.
4) Simulations and comparisons of the forward and reverse recovery characteristics of the body diode.
5) A zener voltage simulation of the ESD protection diode.
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J13T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J13T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01L (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
The document provides a device modeling report for a Toshiba power MOSFET (TPCF8302) and its internal body diode. It includes:
1) Details of the MOSFET and diode components and manufacturer.
2) SPICE models for the MOSFET describing its electrical parameters and characteristics.
3) Simulation results comparing measured and simulated MOSFET characteristics including Id-Vgs, switching time, and more.
4) SPICE model for the internal diode and simulation results for its zener voltage characteristic.
SPICE MODEL of 2SK2661 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2661 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8018-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N60A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N60A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3770-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3770-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01SJ (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3872-01L (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components, parameters, and simulation results of a power MOSFET transistor model. It describes the MOSFET and body diode components, lists parameters for the Pspice models, and shows simulation results that match measurement data for characteristics like transconductance, capacitance, switching times, and reverse recovery.
SPICE MODEL of 2SK3872-01SJ (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3872-01SJ (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC6104 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key components and modeling parameters of the TPC6104 power MOSFET manufactured by Toshiba. It includes:
1) Details of the MOSFET and diode components, manufacturer, and part number.
2) Descriptions and values of the various MOSFET model parameters used in circuit simulations.
3) Results of simulations validating the MOSFET model against measurements of electrical characteristics like transconductance, Vgs-Id, and switching times.
4) Explanations of the evaluation circuits used to simulate the electrical behaviors.
SPICE MODEL of 2SK3677-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3677-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFIB7N50A (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFIB7N50A (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J13T (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document provides a device modeling report for a TOSHIBA SSM3J13T power MOSFET. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the MOSFET and body diode PSpice models.
3) Simulation results and comparisons to measurements for key electrical characteristics like transconductance, Vgs-Id, gate charge, switching time and more.
4) Reference curves for characteristics like output, forward current, reverse recovery and zener voltage.
The report examines the device's electrical behavior and validates its PSpice model against experimental data.
SPICE MODEL of SSM3J13T (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a power MOSFET transistor and its internal body diode and ESD protection diode. It includes:
1) Details of the device components and manufacturer.
2) Descriptions of the MOSFET, body diode and ESD protection diode models used in the simulation.
3) Circuit simulations and results graphs characterizing the key electrical properties of the MOSFET like transconductance, capacitance, switching time and more.
4) Simulations and comparisons of the forward and reverse recovery characteristics of the body diode.
5) A zener voltage simulation of the ESD protection diode.
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N65A (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRFB9N30A (Professional+BDS Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM3J13T (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM3J13T (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8114 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8114 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPU02N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8302 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPD02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPD02N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SPB02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key parameters and simulation results for a power MOSFET transistor model. It includes the component name and manufacturer, a list of model parameters, graphs comparing measurement and simulation results for characteristics like transconductance, voltage-current relationship, and switching times, and evaluation circuits used in the simulations.
SPICE MODEL of 2SJ438 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and model parameters.
2) Simulation results of the transistor's transconductance, voltage-current characteristics, gate charge, switching times and other properties.
3) Comparisons of the simulated results with measurement data showing good agreement.
4) Reference curves and evaluation circuits used in the simulations.
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCF8102 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SJ464 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SJ464 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number and manufacturer.
2) Descriptions of the SPICE model parameters used to simulate the MOSFET.
3) Simulation results that compare measurements of the MOSFET's electrical characteristics to the model, such as transconductance, Vgs-Id curve, and switching times.
3) Circuit schematics used to perform the simulations and measure characteristics like output, forward current, and reverse recovery.
SPICE MODEL of SPP02N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPP02N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3728-01MR (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK3728-01MR (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8024-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8024-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRFB9N65A (Professional+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of an IRFB9N65A power MOSFET manufactured by International Rectifier. It includes:
1) Details of the MOSFET components and manufacturer.
2) Descriptions and parameters of the PSpice models used to simulate the MOSFET's electrical characteristics.
3) Results of simulations validating the MOSFET's transconductance, capacitance, switching time and other characteristics against manufacturer measurements.
4) Circuit diagrams of the evaluation setups used in the simulations.
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK2563 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of SSM5H08TU (Professional+BDP+SBDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling and simulation of a Power MOSFET. It includes:
1) Details of the MOSFET component being modeled, including manufacturer, part number, and key electrical parameters.
2) Descriptions of the models used to simulate various electrical characteristics of the MOSFET, including its transconductance, capacitances, switching times, and more.
3) Results of circuit simulations comparing measured data to simulated data for characteristics like Id-Vgs, gate charge, output characteristics and more. Differences between measurement and simulation are generally within a few percent.
4) Reference schematics for the evaluation circuits used to simulate each characteristic.
SPICE MODEL of 2SJ407 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the modeling of a Power MOSFET transistor. It includes:
1) Details of the MOSFET part number, manufacturer, and remarks on the model.
2) Descriptions and parameters for the Pspice model of the MOSFET.
3) Results of circuit simulations characterizing the MOSFET's transconductance, Vgs-Id curve, gate charge, switching time and other properties.
4) Comparisons of the simulation results to manufacturer measurement data showing good agreement.
SPICE MODEL of SSM5H08TU (Professional+BDS+SBDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SSM5H08TU (Professional+BDS+SBDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK3644-01 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
This document summarizes the key parameters and simulation results of a power MOSFET transistor and its internal body diode. It includes tables of parameters for the MOSFET and diode models, graphs comparing simulated and measured output characteristics like forward current and switching times, and evaluation circuits used in the simulations. The models aim to accurately represent the electrical behavior of the real components for circuit design and analysis.
SPICE MODEL of SPW47N60C3 (Professional+BDSP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of SPW47N60C3 (Professional+BDSP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8025 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8025 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
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This document provides an inventory list of parts at Spice Park as of March 2024. It contains 3 sections - Semiconductor parts (diodes, transistors, ICs etc.), Passive parts (capacitors, resistors etc.), and Battery parts. For Semiconductor parts, it lists 36 different part types and provides the quantity of each part. It then provides further details of Diode/General Purpose Rectifiers, listing the manufacturer and quantity of 652 individual part numbers.
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Tsuyoshi Horigome
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 total pieces of electronic components and parts. It lists 36 categories of semiconductor devices, 11 categories of passive parts, 10 types of batteries, 5 mechanical parts, DC motors, lamps, and power supplies. It provides the most detailed listing for solar cells, with 1,003 total pieces from 51 manufacturers listed with part numbers.
The document provides an inventory update from February 2024 of Spice Park, which contains 6,694 electronic components. It lists the components by type (e.g. semiconductor), part number, manufacturer, thermal rating, and quantity on hand. For example, it shows that there are 621 general purpose rectifier diodes from manufacturers such as Fairchild, Fuji, Intersil, Rohm, Shindengen, and Toshiba. The detailed four-page section provides further information on the first item, general purpose rectifier diodes, including 152 individual part numbers and specifications.
This document discusses circuit simulations using LTspice. It describes driving a circuit simulation by inserting a 250 ohm resistor between the output terminals. It also describes simulating a 1 channel bridge circuit where the DUT1 and DUT2 resistors are both set to 100 ohms and the input voltage is set to either 1V or 5V.
This document discusses parametric sweeps of external and internal resistance values Rg for circuit simulation in LTspice. It also references outputting a waveform similar to a report on fall time characteristics for a device modeling report with customer Samsung.
Northern Engraving | Nameplate Manufacturing Process - 2024Northern Engraving
Manufacturing custom quality metal nameplates and badges involves several standard operations. Processes include sheet prep, lithography, screening, coating, punch press and inspection. All decoration is completed in the flat sheet with adhesive and tooling operations following. The possibilities for creating unique durable nameplates are endless. How will you create your brand identity? We can help!
Freshworks Rethinks NoSQL for Rapid Scaling & Cost-EfficiencyScyllaDB
Freshworks creates AI-boosted business software that helps employees work more efficiently and effectively. Managing data across multiple RDBMS and NoSQL databases was already a challenge at their current scale. To prepare for 10X growth, they knew it was time to rethink their database strategy. Learn how they architected a solution that would simplify scaling while keeping costs under control.
Conversational agents, or chatbots, are increasingly used to access all sorts of services using natural language. While open-domain chatbots - like ChatGPT - can converse on any topic, task-oriented chatbots - the focus of this paper - are designed for specific tasks, like booking a flight, obtaining customer support, or setting an appointment. Like any other software, task-oriented chatbots need to be properly tested, usually by defining and executing test scenarios (i.e., sequences of user-chatbot interactions). However, there is currently a lack of methods to quantify the completeness and strength of such test scenarios, which can lead to low-quality tests, and hence to buggy chatbots.
To fill this gap, we propose adapting mutation testing (MuT) for task-oriented chatbots. To this end, we introduce a set of mutation operators that emulate faults in chatbot designs, an architecture that enables MuT on chatbots built using heterogeneous technologies, and a practical realisation as an Eclipse plugin. Moreover, we evaluate the applicability, effectiveness and efficiency of our approach on open-source chatbots, with promising results.
Digital Banking in the Cloud: How Citizens Bank Unlocked Their MainframePrecisely
Inconsistent user experience and siloed data, high costs, and changing customer expectations – Citizens Bank was experiencing these challenges while it was attempting to deliver a superior digital banking experience for its clients. Its core banking applications run on the mainframe and Citizens was using legacy utilities to get the critical mainframe data to feed customer-facing channels, like call centers, web, and mobile. Ultimately, this led to higher operating costs (MIPS), delayed response times, and longer time to market.
Ever-changing customer expectations demand more modern digital experiences, and the bank needed to find a solution that could provide real-time data to its customer channels with low latency and operating costs. Join this session to learn how Citizens is leveraging Precisely to replicate mainframe data to its customer channels and deliver on their “modern digital bank” experiences.
Generating privacy-protected synthetic data using Secludy and MilvusZilliz
During this demo, the founders of Secludy will demonstrate how their system utilizes Milvus to store and manipulate embeddings for generating privacy-protected synthetic data. Their approach not only maintains the confidentiality of the original data but also enhances the utility and scalability of LLMs under privacy constraints. Attendees, including machine learning engineers, data scientists, and data managers, will witness first-hand how Secludy's integration with Milvus empowers organizations to harness the power of LLMs securely and efficiently.
Have you ever been confused by the myriad of choices offered by AWS for hosting a website or an API?
Lambda, Elastic Beanstalk, Lightsail, Amplify, S3 (and more!) can each host websites + APIs. But which one should we choose?
Which one is cheapest? Which one is fastest? Which one will scale to meet our needs?
Join me in this session as we dive into each AWS hosting service to determine which one is best for your scenario and explain why!
How to Interpret Trends in the Kalyan Rajdhani Mix Chart.pdfChart Kalyan
A Mix Chart displays historical data of numbers in a graphical or tabular form. The Kalyan Rajdhani Mix Chart specifically shows the results of a sequence of numbers over different periods.
Dandelion Hashtable: beyond billion requests per second on a commodity serverAntonios Katsarakis
This slide deck presents DLHT, a concurrent in-memory hashtable. Despite efforts to optimize hashtables, that go as far as sacrificing core functionality, state-of-the-art designs still incur multiple memory accesses per request and block request processing in three cases. First, most hashtables block while waiting for data to be retrieved from memory. Second, open-addressing designs, which represent the current state-of-the-art, either cannot free index slots on deletes or must block all requests to do so. Third, index resizes block every request until all objects are copied to the new index. Defying folklore wisdom, DLHT forgoes open-addressing and adopts a fully-featured and memory-aware closed-addressing design based on bounded cache-line-chaining. This design offers lock-free index operations and deletes that free slots instantly, (2) completes most requests with a single memory access, (3) utilizes software prefetching to hide memory latencies, and (4) employs a novel non-blocking and parallel resizing. In a commodity server and a memory-resident workload, DLHT surpasses 1.6B requests per second and provides 3.5x (12x) the throughput of the state-of-the-art closed-addressing (open-addressing) resizable hashtable on Gets (Deletes).
The Microsoft 365 Migration Tutorial For Beginner.pptxoperationspcvita
This presentation will help you understand the power of Microsoft 365. However, we have mentioned every productivity app included in Office 365. Additionally, we have suggested the migration situation related to Office 365 and how we can help you.
You can also read: https://www.systoolsgroup.com/updates/office-365-tenant-to-tenant-migration-step-by-step-complete-guide/
Introduction of Cybersecurity with OSS at Code Europe 2024Hiroshi SHIBATA
I develop the Ruby programming language, RubyGems, and Bundler, which are package managers for Ruby. Today, I will introduce how to enhance the security of your application using open-source software (OSS) examples from Ruby and RubyGems.
The first topic is CVE (Common Vulnerabilities and Exposures). I have published CVEs many times. But what exactly is a CVE? I'll provide a basic understanding of CVEs and explain how to detect and handle vulnerabilities in OSS.
Next, let's discuss package managers. Package managers play a critical role in the OSS ecosystem. I'll explain how to manage library dependencies in your application.
I'll share insights into how the Ruby and RubyGems core team works to keep our ecosystem safe. By the end of this talk, you'll have a better understanding of how to safeguard your code.
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2024/06/how-axelera-ai-uses-digital-compute-in-memory-to-deliver-fast-and-energy-efficient-computer-vision-a-presentation-from-axelera-ai/
Bram Verhoef, Head of Machine Learning at Axelera AI, presents the “How Axelera AI Uses Digital Compute-in-memory to Deliver Fast and Energy-efficient Computer Vision” tutorial at the May 2024 Embedded Vision Summit.
As artificial intelligence inference transitions from cloud environments to edge locations, computer vision applications achieve heightened responsiveness, reliability and privacy. This migration, however, introduces the challenge of operating within the stringent confines of resource constraints typical at the edge, including small form factors, low energy budgets and diminished memory and computational capacities. Axelera AI addresses these challenges through an innovative approach of performing digital computations within memory itself. This technique facilitates the realization of high-performance, energy-efficient and cost-effective computer vision capabilities at the thin and thick edge, extending the frontier of what is achievable with current technologies.
In this presentation, Verhoef unveils his company’s pioneering chip technology and demonstrates its capacity to deliver exceptional frames-per-second performance across a range of standard computer vision networks typical of applications in security, surveillance and the industrial sector. This shows that advanced computer vision can be accessible and efficient, even at the very edge of our technological ecosystem.
Discover top-tier mobile app development services, offering innovative solutions for iOS and Android. Enhance your business with custom, user-friendly mobile applications.
AppSec PNW: Android and iOS Application Security with MobSFAjin Abraham
Mobile Security Framework - MobSF is a free and open source automated mobile application security testing environment designed to help security engineers, researchers, developers, and penetration testers to identify security vulnerabilities, malicious behaviours and privacy concerns in mobile applications using static and dynamic analysis. It supports all the popular mobile application binaries and source code formats built for Android and iOS devices. In addition to automated security assessment, it also offers an interactive testing environment to build and execute scenario based test/fuzz cases against the application.
This talk covers:
Using MobSF for static analysis of mobile applications.
Interactive dynamic security assessment of Android and iOS applications.
Solving Mobile app CTF challenges.
Reverse engineering and runtime analysis of Mobile malware.
How to shift left and integrate MobSF/mobsfscan SAST and DAST in your build pipeline.
What is an RPA CoE? Session 1 – CoE VisionDianaGray10
In the first session, we will review the organization's vision and how this has an impact on the COE Structure.
Topics covered:
• The role of a steering committee
• How do the organization’s priorities determine CoE Structure?
Speaker:
Chris Bolin, Senior Intelligent Automation Architect Anika Systems
Monitoring and Managing Anomaly Detection on OpenShift.pdfTosin Akinosho
Monitoring and Managing Anomaly Detection on OpenShift
Overview
Dive into the world of anomaly detection on edge devices with our comprehensive hands-on tutorial. This SlideShare presentation will guide you through the entire process, from data collection and model training to edge deployment and real-time monitoring. Perfect for those looking to implement robust anomaly detection systems on resource-constrained IoT/edge devices.
Key Topics Covered
1. Introduction to Anomaly Detection
- Understand the fundamentals of anomaly detection and its importance in identifying unusual behavior or failures in systems.
2. Understanding Edge (IoT)
- Learn about edge computing and IoT, and how they enable real-time data processing and decision-making at the source.
3. What is ArgoCD?
- Discover ArgoCD, a declarative, GitOps continuous delivery tool for Kubernetes, and its role in deploying applications on edge devices.
4. Deployment Using ArgoCD for Edge Devices
- Step-by-step guide on deploying anomaly detection models on edge devices using ArgoCD.
5. Introduction to Apache Kafka and S3
- Explore Apache Kafka for real-time data streaming and Amazon S3 for scalable storage solutions.
6. Viewing Kafka Messages in the Data Lake
- Learn how to view and analyze Kafka messages stored in a data lake for better insights.
7. What is Prometheus?
- Get to know Prometheus, an open-source monitoring and alerting toolkit, and its application in monitoring edge devices.
8. Monitoring Application Metrics with Prometheus
- Detailed instructions on setting up Prometheus to monitor the performance and health of your anomaly detection system.
9. What is Camel K?
- Introduction to Camel K, a lightweight integration framework built on Apache Camel, designed for Kubernetes.
10. Configuring Camel K Integrations for Data Pipelines
- Learn how to configure Camel K for seamless data pipeline integrations in your anomaly detection workflow.
11. What is a Jupyter Notebook?
- Overview of Jupyter Notebooks, an open-source web application for creating and sharing documents with live code, equations, visualizations, and narrative text.
12. Jupyter Notebooks with Code Examples
- Hands-on examples and code snippets in Jupyter Notebooks to help you implement and test anomaly detection models.
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectorsDianaGray10
Join us to learn how UiPath Apps can directly and easily interact with prebuilt connectors via Integration Service--including Salesforce, ServiceNow, Open GenAI, and more.
The best part is you can achieve this without building a custom workflow! Say goodbye to the hassle of using separate automations to call APIs. By seamlessly integrating within App Studio, you can now easily streamline your workflow, while gaining direct access to our Connector Catalog of popular applications.
We’ll discuss and demo the benefits of UiPath Apps and connectors including:
Creating a compelling user experience for any software, without the limitations of APIs.
Accelerating the app creation process, saving time and effort
Enjoying high-performance CRUD (create, read, update, delete) operations, for
seamless data management.
Speakers:
Russell Alfeche, Technology Leader, RPA at qBotic and UiPath MVP
Charlie Greenberg, host
Connector Corner: Seamlessly power UiPath Apps, GenAI with prebuilt connectors
SPICE MODEL of TPC8114 (Professional+BDS Model) in SPICE PARK
1. Device Modeling Report
COMPONENTS: Power MOSFET (Professional)
PART NUMBER: TPC8114
MANUFACTURER: TOSHIBA
Body Diode (Standard) / ESD Protection Diode
Bee Technologies Inc.
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
2. MOSFET MODEL
Pspice model
Model description
parameter
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
3. Vgs-Id Characteristic
Circuit Simulation result
Evaluation circuit
V3
U7
0V dc
TP C8 114
V2
-5V dc
V1
-10
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
4. Comparison Graph
Circuit Simulation Result
Simulation Result
VGS(V)
ID(A) Error (%)
Measurement Simulation
-2.50 -2.00 -1.95 -2.50
-10.00 -2.20 -2.14 -2.73
-25.00 -2.40 -2.37 -1.25
-45.00 -2.60 -2.58 -0.77
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
5. Id-Rds(on) Characteristic
Circuit Simulation result
Evaluation circuit
V3
U7
0V dc
TP C8 114
V2
-5V dc
V1
-10
0
Simulation Result
ID=-9, VGS=-10V Measurement Simulation Error (%)
R DS (on) 3.1 m 3.1 m 0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
9. Output Characteristic
Circuit Simulation result
-3V
-2.6V
-2.4V
-2.2V
VGS=-2.0V
Evaluation circuit
V3
U7
0V dc
TP C8 114
V2
-5V dc
V1
-10
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
10. Body Diode Model
Pspice model
Model description
parameter
IS Saturation Current
N Emission Coefficient
RS Series Resistance
IKF High-injection Knee Current
CJO Zero-bias Junction Capacitance
M Junction Grading Coefficient
VJ Junction Potential
ISR Recombination Current Saturation Value
BV Reverse Breakdown Voltage(a positive value)
IBV Reverse Breakdown Current(a positive value)
TT Transit Time
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
11. Forward Current Characteristic
Circuit Simulation Result
Evaluation Circuit
R1
0.01m
D1
V1
0Vdc
D8114
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
15. Reverse Recovery Characteristic Reference
Trj=22(ns)
Trb=250(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Example
Relation between trj and trb
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005
16. Zener Voltage Characteristic
Circuit Simulation Result
Evaluation Circuit
R1
0.01m
V1 DZ8114
0Vdc U2
0
All Rights Reserved Copyright (c) Bee Technologies Inc. 2005