SlideShare a Scribd company logo
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
1
Device Modeling Report
Bee Technologies Inc.
COMPONENTS: Power MOSFET (Parameter Model)
PART NUMBER: TPC8119
MANUFACTURER: TOSHIBA
REMARK: Body Diode (Parameter Model)
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
2
MOSFET MODEL
PSpice model
parameter
Model description
LEVEL
L Channel Length
W Channel Width
KP Transconductance
RS Source Ohmic Resistance
RD Ohmic Drain Resistance
VTO Zero-bias Threshold Voltage
RDS Drain-Source Shunt Resistance
TOX Gate Oxide Thickness
CGSO Zero-bias Gate-Source Capacitance
CGDO Zero-bias Gate-Drain Capacitance
CBD Zero-bias Bulk-Drain Junction Capacitance
MJ Bulk Junction Grading Coefficient
PB Bulk Junction Potential
FC Bulk Junction Forward-bias Capacitance Coefficient
RG Gate Ohmic Resistance
IS Bulk Junction Saturation Current
N Bulk Junction Emission Coefficient
RB Bulk Series Resistance
PHI Surface Inversion Potential
GAMMA Body-effect Parameter
DELTA Width effect on Threshold Voltage
ETA Static Feedback on Threshold Voltage
THETA Modility Modulation
KAPPA Saturation Field Factor
VMAX Maximum Drift Velocity of Carriers
XJ Metallurgical Junction Depth
UO Surface Mobility
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
3
0
10
20
30
40
0 5 10 15 20
TransconductanceGFS(s)
- Drain Current ID (A)
Measurement
Simulation
Transconductance Characteristic
Circuit Simulation Result
Comparison table
-Id(A)
gfs
Error(%)
Measurement Simulation
1.00 7.700 7.990 3.77
2.00 11.000 11.251 2.28
5.00 18.000 17.633 -2.04
10.00 25.200 24.693 -2.01
20.00 34.850 34.456 -1.13
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
4
V1
0Vdc
V2
-10
0
V3
0VdcU1
TPC8119
V_V1
0V -1.0V -2.0V -3.0V -4.0V -5.0V
I(V3)
0A
-8A
-16A
-24A
-32A
-40A
Vgs-Id Characteristic
Circuit Simulation result
Evaluation circuit
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
5
0
10
20
30
40
0 1 2 3 4 5
-DraincurrentID(A)
- Gate−source voltage VGS (V)
Measurement
Simulation
Comparison Graph
Circuit Simulation Result
Simulation Result
-ID(A)
-VGS(V)
Error (%)
Measurement Simulation
1.00 1.850 1.839 -0.595
2.00 1.950 1.944 -0.333
5.00 2.135 2.151 0.749
10.00 2.370 2.387 0.717
20.00 2.700 2.725 0.926
30.00 2.970 2.987 0.572
40.00 3.230 3.211 -0.588
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
6
U1
TPC8119
0
V3
0Vdc
VDS
0Vdc
V1
-10
V_VDS
0V -20mV -40mV -50mV
I(V3)
0A
-1.0A
-2.0A
-3.0A
-4.0A
-5.0A
Rds(on) Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
ID= -5 A, VGS= -10 V Measurement Simulation Error (%)
RDS (on) m 10.000 9.984 -0.160
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
7
VDD
-24
I1TD = 0
TF = 5n
PW = 600u
PER = 1000u
I1 = 0
I2 = 1m
TR = 5n
-
+
W1
ION = 0uA
IOFF = 1mA
W
I2
11
0
D2
Dbreak
0
U1
TPC8119
Time*1mA
0 10n 20n 30n 40n 50n
V(W1:4)
0V
-5V
-10V
-15V
-20V
Gate Charge Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
VDD= -24V,ID= -10A
,VGS= -10V
Measurement Simulation Error (%)
Qgs(nc) 5.000 5.000 0.000
Qgd(nc) 13.000 13.060 0.462
Qg(nc) 40.000 37.684 -5.790
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
8
Capacitance Characteristic
Simulation Result
VSD(V)
Cbd(pF)
Error (%)
Measurement Simulation
1.00 390.000 394.700 1.205
2.00 280.000 283.800 1.357
5.00 175.000 179.540 2.594
10.00 125.000 121.000 -3.200
20.00 85.000 87.770 3.259
Simulation
Measurement
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
9
0
VDD
-15.3Vdc
V2
TD = 1u
TF = 5n
PW = 10u
PER = 20u
V1 = 0
TR = 5n
V2 = 20
L2
50nH
R2
4.7
R1
4.7
L1
30nH
U1
TPC8119
RL
3
Time
0.8us 0.9us 1.0us 1.1us 1.2us
V(U1:4) V(U1:5)/1.5
2V
0V
-2V
-4V
-6V
-8V
-10V
-12V
-14V
Switching Time Characteristic
Circuit Simulation result
Evaluation circuit
Simulation Result
ID= -5A, VDD= -15V
VGS= -10V
Measurement Simulation Error(%)
ton ns 16.000 16.049 0.306
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
10
V2
-2
V1
0
0
V3
0Vdc
U1
TPC8119
V_V2
0V -0.5V -1.0V -1.5V -2.0V
I(V3)
0A
-10A
-20A
-30A
-40A
Output Characteristic
Circuit Simulation result
Evaluation circuit
VGS= -2.7V
-10.0V
-3.3V
-3.7
V -3.5V
-8V
VV
-6V
-5V -4V
-3V
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
11
U1
TPC8119
VDS
0
Vsense
0Vdc
V_VDS
0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V
I(Vsense)
100mA
1.0A
10A
100A
BODY DIODE SPICE MODEL
Forward Current Characteristic
Circuit Simulation Result
Evaluation Circuit
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
12
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1
DrainreversecurrentIDR(A)
Drain−source voltage VDS (V)
Measurement
Simulation
Comparison Graph
Circuit Simulation Result
Simulation Result
IDR(A)
VDS(V)
Measurement
VDS(V)
Simulation
%Error
0.1 0.6350 0.634 -0.205
0.2 0.6500 0.651 0.154
0.5 0.6750 0.676 0.148
1.0 0.7000 0.699 -0.143
2.0 0.7280 0.728 0.027
5.0 0.7750 0.774 -0.129
10.0 0.8150 0.816 0.123
20.0 0.8750 0.873 -0.229
40.0 0.9550 0.956 0.084
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
13
U1
TPC8119
V1
TD = 90ns
TF = 10ns
PW = 1us
PER = 100us
V1 = -9.4v
TR = 10ns
V2 = 10.6v
R1
50
0
Time
0.6us 0.8us 1.0us 1.2us 1.4us 1.6us
I(R1)
-400mA
-200mA
0A
200mA
400mA
Reverse Recovery Characteristic
Circuit Simulation Result
Evaluation Circuit
Compare Measurement vs. Simulation
Parameter Measurement Simulation Error (%)
trj ns 18.000 18.209 1.161
All Rights Reserved Copyright (c) Bee Technologies Inc. 2008
14
Reverse Recovery Characteristic Reference
Trj= 18.000 (ns)
Trb= 46.000.(ns)
Conditions:Ifwd=lrev=0.2(A),Rl=50
Relation between trj and trb
Example

More Related Content

What's hot

SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
 SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 

What's hot (20)

SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8108 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8205-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK70X04K3 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK15A50D (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARKSPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TK8A50D (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8058-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SJ668 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK15A50D (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
 SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARKSPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TK8A50D (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8063-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8014 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8105 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPCA8022-H (Standard+BDS Model) in SPICE PARK
 

Similar to SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK

SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
Tsuyoshi Horigome
 
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
Tsuyoshi Horigome
 

Similar to SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK (14)

SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC6012 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8057-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKSPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCP8303 (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3K320T (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM4K27CT (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKSPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARKSPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
SPICE MODEL of SSM3J130TU (Standard+BDS Model) in SPICE PARK
 
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM3J15FU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARKSPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
SPICE MODEL of SSM6J409TU (Professional+BDP Model) in SPICE PARK
 
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARKSPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
SPICE MODEL of 2SK2615 (Standard+BDS Model) in SPICE PARK
 

More from Tsuyoshi Horigome

KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPIKGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
Tsuyoshi Horigome
 
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
Tsuyoshi Horigome
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
Tsuyoshi Horigome
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Tsuyoshi Horigome
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
Tsuyoshi Horigome
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Tsuyoshi Horigome
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
Tsuyoshi Horigome
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Tsuyoshi Horigome
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
Tsuyoshi Horigome
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
Tsuyoshi Horigome
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
Tsuyoshi Horigome
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
Tsuyoshi Horigome
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
Tsuyoshi Horigome
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
Tsuyoshi Horigome
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
Tsuyoshi Horigome
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
Tsuyoshi Horigome
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
Tsuyoshi Horigome
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
Tsuyoshi Horigome
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
Tsuyoshi Horigome
 

More from Tsuyoshi Horigome (20)

KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPIKGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
KGIとKPIについて(営業の目標設定とKPIの商談プロセス) About KGI and KPI
 
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
FedExで書類を送付する場合の設定について(オンライン受付にて登録する場合について)
 
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
Update 46 models(Solar Cell) in SPICE PARK(MAY2024)
 
SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )SPICE PARK APR2024 ( 6,793 SPICE Models )
SPICE PARK APR2024 ( 6,793 SPICE Models )
 
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
Update 22 models(Schottky Rectifier ) in SPICE PARK(APR2024)
 
SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )SPICE PARK APR2024 ( 6,747 SPICE Models )
SPICE PARK APR2024 ( 6,747 SPICE Models )
 
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
Update 31 models(Diode/General ) in SPICE PARK(MAR2024)
 
SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )SPICE PARK MAR2024 ( 6,725 SPICE Models )
SPICE PARK MAR2024 ( 6,725 SPICE Models )
 
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)Update 29 models(Solar cell) in SPICE PARK(FEB2024)
Update 29 models(Solar cell) in SPICE PARK(FEB2024)
 
SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )SPICE PARK FEB2024 ( 6,694 SPICE Models )
SPICE PARK FEB2024 ( 6,694 SPICE Models )
 
Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)Circuit simulation using LTspice(Case study)
Circuit simulation using LTspice(Case study)
 
Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)Mindmap of Semiconductor sales business(15FEB2024)
Mindmap of Semiconductor sales business(15FEB2024)
 
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
2-STAGE COCKCROFT-WALTON [SCHEMATIC] using LTspice
 
PSpice simulation of power supply for TI is Error
PSpice simulation of power supply  for TI is ErrorPSpice simulation of power supply  for TI is Error
PSpice simulation of power supply for TI is Error
 
IGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or RgintIGBT Simulation of Results from Rgext or Rgint
IGBT Simulation of Results from Rgext or Rgint
 
Electronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposalsElectronic component sales method centered on alternative proposals
Electronic component sales method centered on alternative proposals
 
Electronic component sales method focused on new hires
Electronic component sales method focused on new hiresElectronic component sales method focused on new hires
Electronic component sales method focused on new hires
 
Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)Mindmap(electronics parts sales visions)
Mindmap(electronics parts sales visions)
 
Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出Chat GPTによる伝達関数の導出
Chat GPTによる伝達関数の導出
 
伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)伝達関数の理解(Chatgpt)
伝達関数の理解(Chatgpt)
 

Recently uploaded

Presentation of the OECD Artificial Intelligence Review of Germany
Presentation of the OECD Artificial Intelligence Review of GermanyPresentation of the OECD Artificial Intelligence Review of Germany
Presentation of the OECD Artificial Intelligence Review of Germany
innovationoecd
 
dbms calicut university B. sc Cs 4th sem.pdf
dbms  calicut university B. sc Cs 4th sem.pdfdbms  calicut university B. sc Cs 4th sem.pdf
dbms calicut university B. sc Cs 4th sem.pdf
Shinana2
 
A Comprehensive Guide to DeFi Development Services in 2024
A Comprehensive Guide to DeFi Development Services in 2024A Comprehensive Guide to DeFi Development Services in 2024
A Comprehensive Guide to DeFi Development Services in 2024
Intelisync
 
Nordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptxNordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptx
MichaelKnudsen27
 
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdfNunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
flufftailshop
 
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStrDeep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
saastr
 
Digital Marketing Trends in 2024 | Guide for Staying Ahead
Digital Marketing Trends in 2024 | Guide for Staying AheadDigital Marketing Trends in 2024 | Guide for Staying Ahead
Digital Marketing Trends in 2024 | Guide for Staying Ahead
Wask
 
UI5 Controls simplified - UI5con2024 presentation
UI5 Controls simplified - UI5con2024 presentationUI5 Controls simplified - UI5con2024 presentation
UI5 Controls simplified - UI5con2024 presentation
Wouter Lemaire
 
Recommendation System using RAG Architecture
Recommendation System using RAG ArchitectureRecommendation System using RAG Architecture
Recommendation System using RAG Architecture
fredae14
 
Best 20 SEO Techniques To Improve Website Visibility In SERP
Best 20 SEO Techniques To Improve Website Visibility In SERPBest 20 SEO Techniques To Improve Website Visibility In SERP
Best 20 SEO Techniques To Improve Website Visibility In SERP
Pixlogix Infotech
 
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Driving Business Innovation: Latest Generative AI Advancements & Success StoryDriving Business Innovation: Latest Generative AI Advancements & Success Story
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Safe Software
 
Taking AI to the Next Level in Manufacturing.pdf
Taking AI to the Next Level in Manufacturing.pdfTaking AI to the Next Level in Manufacturing.pdf
Taking AI to the Next Level in Manufacturing.pdf
ssuserfac0301
 
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxOcean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
SitimaJohn
 
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
saastr
 
Monitoring and Managing Anomaly Detection on OpenShift.pdf
Monitoring and Managing Anomaly Detection on OpenShift.pdfMonitoring and Managing Anomaly Detection on OpenShift.pdf
Monitoring and Managing Anomaly Detection on OpenShift.pdf
Tosin Akinosho
 
Trusted Execution Environment for Decentralized Process Mining
Trusted Execution Environment for Decentralized Process MiningTrusted Execution Environment for Decentralized Process Mining
Trusted Execution Environment for Decentralized Process Mining
LucaBarbaro3
 
June Patch Tuesday
June Patch TuesdayJune Patch Tuesday
June Patch Tuesday
Ivanti
 
5th LF Energy Power Grid Model Meet-up Slides
5th LF Energy Power Grid Model Meet-up Slides5th LF Energy Power Grid Model Meet-up Slides
5th LF Energy Power Grid Model Meet-up Slides
DanBrown980551
 
Finale of the Year: Apply for Next One!
Finale of the Year: Apply for Next One!Finale of the Year: Apply for Next One!
Finale of the Year: Apply for Next One!
GDSC PJATK
 
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
saastr
 

Recently uploaded (20)

Presentation of the OECD Artificial Intelligence Review of Germany
Presentation of the OECD Artificial Intelligence Review of GermanyPresentation of the OECD Artificial Intelligence Review of Germany
Presentation of the OECD Artificial Intelligence Review of Germany
 
dbms calicut university B. sc Cs 4th sem.pdf
dbms  calicut university B. sc Cs 4th sem.pdfdbms  calicut university B. sc Cs 4th sem.pdf
dbms calicut university B. sc Cs 4th sem.pdf
 
A Comprehensive Guide to DeFi Development Services in 2024
A Comprehensive Guide to DeFi Development Services in 2024A Comprehensive Guide to DeFi Development Services in 2024
A Comprehensive Guide to DeFi Development Services in 2024
 
Nordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptxNordic Marketo Engage User Group_June 13_ 2024.pptx
Nordic Marketo Engage User Group_June 13_ 2024.pptx
 
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdfNunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
Nunit vs XUnit vs MSTest Differences Between These Unit Testing Frameworks.pdf
 
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStrDeep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
Deep Dive: Getting Funded with Jason Jason Lemkin Founder & CEO @ SaaStr
 
Digital Marketing Trends in 2024 | Guide for Staying Ahead
Digital Marketing Trends in 2024 | Guide for Staying AheadDigital Marketing Trends in 2024 | Guide for Staying Ahead
Digital Marketing Trends in 2024 | Guide for Staying Ahead
 
UI5 Controls simplified - UI5con2024 presentation
UI5 Controls simplified - UI5con2024 presentationUI5 Controls simplified - UI5con2024 presentation
UI5 Controls simplified - UI5con2024 presentation
 
Recommendation System using RAG Architecture
Recommendation System using RAG ArchitectureRecommendation System using RAG Architecture
Recommendation System using RAG Architecture
 
Best 20 SEO Techniques To Improve Website Visibility In SERP
Best 20 SEO Techniques To Improve Website Visibility In SERPBest 20 SEO Techniques To Improve Website Visibility In SERP
Best 20 SEO Techniques To Improve Website Visibility In SERP
 
Driving Business Innovation: Latest Generative AI Advancements & Success Story
Driving Business Innovation: Latest Generative AI Advancements & Success StoryDriving Business Innovation: Latest Generative AI Advancements & Success Story
Driving Business Innovation: Latest Generative AI Advancements & Success Story
 
Taking AI to the Next Level in Manufacturing.pdf
Taking AI to the Next Level in Manufacturing.pdfTaking AI to the Next Level in Manufacturing.pdf
Taking AI to the Next Level in Manufacturing.pdf
 
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean lotus Threat actors project by John Sitima 2024 (1).pptxOcean lotus Threat actors project by John Sitima 2024 (1).pptx
Ocean lotus Threat actors project by John Sitima 2024 (1).pptx
 
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
Overcoming the PLG Trap: Lessons from Canva's Head of Sales & Head of EMEA Da...
 
Monitoring and Managing Anomaly Detection on OpenShift.pdf
Monitoring and Managing Anomaly Detection on OpenShift.pdfMonitoring and Managing Anomaly Detection on OpenShift.pdf
Monitoring and Managing Anomaly Detection on OpenShift.pdf
 
Trusted Execution Environment for Decentralized Process Mining
Trusted Execution Environment for Decentralized Process MiningTrusted Execution Environment for Decentralized Process Mining
Trusted Execution Environment for Decentralized Process Mining
 
June Patch Tuesday
June Patch TuesdayJune Patch Tuesday
June Patch Tuesday
 
5th LF Energy Power Grid Model Meet-up Slides
5th LF Energy Power Grid Model Meet-up Slides5th LF Energy Power Grid Model Meet-up Slides
5th LF Energy Power Grid Model Meet-up Slides
 
Finale of the Year: Apply for Next One!
Finale of the Year: Apply for Next One!Finale of the Year: Apply for Next One!
Finale of the Year: Apply for Next One!
 
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
Deep Dive: AI-Powered Marketing to Get More Leads and Customers with HyperGro...
 

SPICE MODEL of TPC8119 (Standard+BDS Model) in SPICE PARK

  • 1. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 1 Device Modeling Report Bee Technologies Inc. COMPONENTS: Power MOSFET (Parameter Model) PART NUMBER: TPC8119 MANUFACTURER: TOSHIBA REMARK: Body Diode (Parameter Model)
  • 2. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 2 MOSFET MODEL PSpice model parameter Model description LEVEL L Channel Length W Channel Width KP Transconductance RS Source Ohmic Resistance RD Ohmic Drain Resistance VTO Zero-bias Threshold Voltage RDS Drain-Source Shunt Resistance TOX Gate Oxide Thickness CGSO Zero-bias Gate-Source Capacitance CGDO Zero-bias Gate-Drain Capacitance CBD Zero-bias Bulk-Drain Junction Capacitance MJ Bulk Junction Grading Coefficient PB Bulk Junction Potential FC Bulk Junction Forward-bias Capacitance Coefficient RG Gate Ohmic Resistance IS Bulk Junction Saturation Current N Bulk Junction Emission Coefficient RB Bulk Series Resistance PHI Surface Inversion Potential GAMMA Body-effect Parameter DELTA Width effect on Threshold Voltage ETA Static Feedback on Threshold Voltage THETA Modility Modulation KAPPA Saturation Field Factor VMAX Maximum Drift Velocity of Carriers XJ Metallurgical Junction Depth UO Surface Mobility
  • 3. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 3 0 10 20 30 40 0 5 10 15 20 TransconductanceGFS(s) - Drain Current ID (A) Measurement Simulation Transconductance Characteristic Circuit Simulation Result Comparison table -Id(A) gfs Error(%) Measurement Simulation 1.00 7.700 7.990 3.77 2.00 11.000 11.251 2.28 5.00 18.000 17.633 -2.04 10.00 25.200 24.693 -2.01 20.00 34.850 34.456 -1.13
  • 4. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 4 V1 0Vdc V2 -10 0 V3 0VdcU1 TPC8119 V_V1 0V -1.0V -2.0V -3.0V -4.0V -5.0V I(V3) 0A -8A -16A -24A -32A -40A Vgs-Id Characteristic Circuit Simulation result Evaluation circuit
  • 5. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 5 0 10 20 30 40 0 1 2 3 4 5 -DraincurrentID(A) - Gate−source voltage VGS (V) Measurement Simulation Comparison Graph Circuit Simulation Result Simulation Result -ID(A) -VGS(V) Error (%) Measurement Simulation 1.00 1.850 1.839 -0.595 2.00 1.950 1.944 -0.333 5.00 2.135 2.151 0.749 10.00 2.370 2.387 0.717 20.00 2.700 2.725 0.926 30.00 2.970 2.987 0.572 40.00 3.230 3.211 -0.588
  • 6. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 6 U1 TPC8119 0 V3 0Vdc VDS 0Vdc V1 -10 V_VDS 0V -20mV -40mV -50mV I(V3) 0A -1.0A -2.0A -3.0A -4.0A -5.0A Rds(on) Characteristic Circuit Simulation result Evaluation circuit Simulation Result ID= -5 A, VGS= -10 V Measurement Simulation Error (%) RDS (on) m 10.000 9.984 -0.160
  • 7. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 7 VDD -24 I1TD = 0 TF = 5n PW = 600u PER = 1000u I1 = 0 I2 = 1m TR = 5n - + W1 ION = 0uA IOFF = 1mA W I2 11 0 D2 Dbreak 0 U1 TPC8119 Time*1mA 0 10n 20n 30n 40n 50n V(W1:4) 0V -5V -10V -15V -20V Gate Charge Characteristic Circuit Simulation result Evaluation circuit Simulation Result VDD= -24V,ID= -10A ,VGS= -10V Measurement Simulation Error (%) Qgs(nc) 5.000 5.000 0.000 Qgd(nc) 13.000 13.060 0.462 Qg(nc) 40.000 37.684 -5.790
  • 8. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 8 Capacitance Characteristic Simulation Result VSD(V) Cbd(pF) Error (%) Measurement Simulation 1.00 390.000 394.700 1.205 2.00 280.000 283.800 1.357 5.00 175.000 179.540 2.594 10.00 125.000 121.000 -3.200 20.00 85.000 87.770 3.259 Simulation Measurement
  • 9. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 9 0 VDD -15.3Vdc V2 TD = 1u TF = 5n PW = 10u PER = 20u V1 = 0 TR = 5n V2 = 20 L2 50nH R2 4.7 R1 4.7 L1 30nH U1 TPC8119 RL 3 Time 0.8us 0.9us 1.0us 1.1us 1.2us V(U1:4) V(U1:5)/1.5 2V 0V -2V -4V -6V -8V -10V -12V -14V Switching Time Characteristic Circuit Simulation result Evaluation circuit Simulation Result ID= -5A, VDD= -15V VGS= -10V Measurement Simulation Error(%) ton ns 16.000 16.049 0.306
  • 10. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 10 V2 -2 V1 0 0 V3 0Vdc U1 TPC8119 V_V2 0V -0.5V -1.0V -1.5V -2.0V I(V3) 0A -10A -20A -30A -40A Output Characteristic Circuit Simulation result Evaluation circuit VGS= -2.7V -10.0V -3.3V -3.7 V -3.5V -8V VV -6V -5V -4V -3V
  • 11. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 11 U1 TPC8119 VDS 0 Vsense 0Vdc V_VDS 0V 0.2V 0.4V 0.6V 0.8V 1.0V 1.2V I(Vsense) 100mA 1.0A 10A 100A BODY DIODE SPICE MODEL Forward Current Characteristic Circuit Simulation Result Evaluation Circuit
  • 12. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 12 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 DrainreversecurrentIDR(A) Drain−source voltage VDS (V) Measurement Simulation Comparison Graph Circuit Simulation Result Simulation Result IDR(A) VDS(V) Measurement VDS(V) Simulation %Error 0.1 0.6350 0.634 -0.205 0.2 0.6500 0.651 0.154 0.5 0.6750 0.676 0.148 1.0 0.7000 0.699 -0.143 2.0 0.7280 0.728 0.027 5.0 0.7750 0.774 -0.129 10.0 0.8150 0.816 0.123 20.0 0.8750 0.873 -0.229 40.0 0.9550 0.956 0.084
  • 13. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 13 U1 TPC8119 V1 TD = 90ns TF = 10ns PW = 1us PER = 100us V1 = -9.4v TR = 10ns V2 = 10.6v R1 50 0 Time 0.6us 0.8us 1.0us 1.2us 1.4us 1.6us I(R1) -400mA -200mA 0A 200mA 400mA Reverse Recovery Characteristic Circuit Simulation Result Evaluation Circuit Compare Measurement vs. Simulation Parameter Measurement Simulation Error (%) trj ns 18.000 18.209 1.161
  • 14. All Rights Reserved Copyright (c) Bee Technologies Inc. 2008 14 Reverse Recovery Characteristic Reference Trj= 18.000 (ns) Trb= 46.000.(ns) Conditions:Ifwd=lrev=0.2(A),Rl=50 Relation between trj and trb Example