This document provides a top 10 list for successful MEMS commercialization in a downturn. It discusses MEMS optical attenuators integrated into receiver packages, which provide increased density and lower costs. The top tips include using clear terminology, focusing on reliability and standards customers understand, identifying applications where MEMS fits uniquely, integrating proven technologies, providing real benefits, and setting realistic expectations. Successful MEMS requires adapting the technology to market needs. A key challenge is developing reliability models.

1. Successful MEMS Implementation
in a Downturn: A Top 10 List
Dr. James Wylde
04 Mar 2004

2. Table of Contents
 Bookham Technology
 Optical Attenuators
 Integrated MEMS Technology
 Top ten commercialization tips
 Conclusion
 COMS2004

3. Caswell
• Actives R & D
• InP/GaAs wafer fab assembly
Milton, Abingdon
• Headquarters
• ASOC R & D
• ASOC wafer fab and assembly
Bookham (Nov ’02) Intro of NNOC
Paignton (UK)
• Actives and Amps R&D
• Assembly
Zurich (Switzerland)
• Pump chips R&D
• Pump chip wafer fab
Ottawa (Canada)
• InP wafer fab
• Actives R&D

4. Ottawa (Carling)
InP Wafer Fab
R&D
Milton (Oxford)
ASOC
Paignton
Tx/Rx
EDFA
Zurich+
Poughkee
psie
980 Pump
laser
Caswell
GaAs & InP Wafer Fabs
MMIC; DBR Tunable Laser
Bookham Locations

5. Introduction
 MEMS became a force in optical telecom in late 1990’s
– Large scale Optical Cross Connect Switches
– Passive Silicon Optical Benches
– Optical Attenuators
 2000 – Days of the M&A
– Xros/Nortel: $3.25B
– Coretek/Nortel: $900M
– Cronos/JDSU: CHECK
 2002 – Days of the Shutdown
– Xros: closed
– Coretek: closed
– Cronos: sold to MEMSCap for $10M
 However, several Optical MEMS efforts have thrived

6. Optical Attenuators
 Nature of fiber is that different wavelengths are attenuated at
different rates through a fiber
 “Water Curve”

7. Optical Attenuators
 Links are also amplified @ ~80klm
 Different wavelengths can be attenuated and amplified at different
gains
Tx Amplifier Amplifier Rx
 Receivers must deal with large changes in power level for various
wavelengths

8. Optical Attenuators
 Typical links used discrete optical attenuators to balance the power
in channels
– Typically expensive ($300 ea) and
– Require 1 - 2m of fiber
– Occupy 3-4 cm2 of board space
Variable Optical
Attenuator
Linear
Amplifier
 e-
Photo-
detector

9. Market Background
• Competing Technologies (LCD, EO)
• MEMS “bad rap”
• Industry in survival mode
BUT:
• Customers feeling the same squeeze
• Technology barriers to existing solutions
= Opportunity for MEMS
Integrated MEMS Rx

10. • The PTV/ATV 10G combines a 10Gb/s receiver with a MEMS
based VOA in one package
• Enables increased density and lower cost to system vendors
(density x2, CR ~300/ch)
Integrated MEMS Rx
Fiber
A
B
C
D
E
F
G
H
I

11. Integrated MEMS Rx

12.  Performance: “The proof in the pudding”
VMV=0V, 0dB atten
Amplifier well into
overload
VMV=12V, 20dB atten
Signal extinguished
VMV=9V, 5dB atten
Eye recovered
VMV=10V, 8dB atten
Signal attenuated
Integrated MEMS Rx

13.  Performance: “The proof in the pudding”
temp' dependance of VOA attenuation
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
4 5 6 7 8 9 10 11 12 13
Bias voltage
attenuation/biascurrent
Iatt @ 0
0degC
85degC
Iatt @ 25
Iatt @ 85
25degC
Integrated MEMS Rx

14. #10
 Terminology
– Everyone has to speak the same language
– 3000 word glossary (MANCEF estimate)
– MST, Micromachine, Microtechnology, Nanotechnology,
MEMS, NEMS, Microsystems!?!?!?!?!?!?!

15. #9
 Reliability
– Speak in terms your customer understands
Only in Canada eh?

16. #8
 Standards
– Again, talk in terms customers understand
– Telcordia 1221 + 468
– 3 MEMS standards, 100+ semiconductor standards

17. #7
 Specifications
– Again, talk in terms customers understand
Be careful of spec creep!

18. #6
 Look for places where small tech works
but other technologies don’t!
– LCD, EO competitors!

19. #5
 Integrate with technologies that are
proven!

20. #4
 Need to provide a REAL benefit: cost?
Performance? Size?

21. #3
 Set realistic expectations with customers.

22. #2
 Remember: MEMS Inside doesn’t sell!

23. #1
 Have Fun! Smile!

24. Conclusion
 Integrated devices offer significant space and cost savings
 Integration offers design challenges with additional DOF
 MEMS Solution viable for unique applications
– Other solutions don’t fit!
 Combination of design tools and shortloop experiments
enabled faster TTM
 Successful implementation of MEMS by:
– Adapting technology to the required solution
– Identify the market need and design the MEMS to fit the need
 A significant challenge to the widespread acceptance of
“small tech” is the lack of a sound reliability model