How to Identify and Prevent ESD Failures using PathFinderAnsys
This presentation provides an introduction to common ESD failure mechanism in today's ICs and the challenges in addressing them. It will highlight PathFinder, a layout based ESD integrity analysis platform with an integrated modeling, extraction and simulation environment that enables IC designers perform exhaustive verification of all ESD discharge pathways at the IP and full-chip level. It will also share case study of some real life ESD failure scenarios and how PathFinder was used to root-cause them. It reviews the list of ESD checks that can be performed from early floor planning to final sign-off for ESD robustness and ESD failure prevention. Learn more on our website: https://bit.ly/1vRDycB
Improving the capture efficiency of fine particles has attracted more attention because of the negative impact of fine particles on human health. In particular, high-efficiency particulate air (HEPA) filters need to be designed to effectively capture ultrafine particles smaller than 300 nm, which is important to produce clean breathable air and also to ensure safety in biosafety laboratories and the nuclear industry.
This PPT illustrates a sample procedure as per fluent to simulate flow through pleated filters using porus media concept .
How to Identify and Prevent ESD Failures using PathFinderAnsys
This presentation provides an introduction to common ESD failure mechanism in today's ICs and the challenges in addressing them. It will highlight PathFinder, a layout based ESD integrity analysis platform with an integrated modeling, extraction and simulation environment that enables IC designers perform exhaustive verification of all ESD discharge pathways at the IP and full-chip level. It will also share case study of some real life ESD failure scenarios and how PathFinder was used to root-cause them. It reviews the list of ESD checks that can be performed from early floor planning to final sign-off for ESD robustness and ESD failure prevention. Learn more on our website: https://bit.ly/1vRDycB
Improving the capture efficiency of fine particles has attracted more attention because of the negative impact of fine particles on human health. In particular, high-efficiency particulate air (HEPA) filters need to be designed to effectively capture ultrafine particles smaller than 300 nm, which is important to produce clean breathable air and also to ensure safety in biosafety laboratories and the nuclear industry.
This PPT illustrates a sample procedure as per fluent to simulate flow through pleated filters using porus media concept .
Do wide and deep networks learn the same things? Uncovering how neural networ...Seunghyun Hwang
Review : Do wide and deep networks learn the same things? Uncovering how neural network representations vary with width and depth (Google Research, arxiv preprint)
- by Seunghyun Hwang (Yonsei University, Severance Hospital, Center for Clinical Data Science)
Stress and Durability Analysis of Threaded Connections in a Cast Aluminum Cyl...Altair
Bolted connections involve sharp notched components that are therefore sensitive to fatigue loading. In internal combustion engines, the journal bearings of the crankshaft are supported by bearing caps which are bolted to the cylinder block. These threaded connections are a fatigue concern as cracking may be experienced on dynamometer tests of new engines. The critical element of this application however is not the steel studs rather the threaded bolt holes in the cast engine block. While the nominal stress concept is applicable to the fatigue design of studs, a local stress approach has to be adopted to assess the fatigue strength of threaded bolt holes.
This paper addresses the fatigue design of this kind of threaded connection. Initially alternate methods of FE modeling and analysis of threaded joints by the local approach are critically examined. The parallel development of a simplified experimental test system involving a threaded hole in cast AlSi7 is described and used to generate baseline fatigue data under known loading conditions. The fatigue behavior of the experimental system is then analyzed on the basis of alternate FE models and post processing approaches. Finally, recommendations for the accurate and computationally efficient FE modeling and durability analysis of threaded connections in cast aluminum cylinder block are outlined.
Speakers
Marco Bersella, Engineer, TP Engineering srl
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
orvo started as a supplier for Apple’s iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo’s Module in its flagship. In iPhone 6s series, Apple integrates Qorvo’s LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flip™) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
A short introduction presentation about the Basics of Finite Element Analysis. This presentation mainly represents the applications of FEA in the real time world.
The new SAP Cloud Platform Integration L2 Deck provides the product overview on SAP Cloud Platform Integration services and wide variety of customer use cases.
ANSYS RedHawk-CPA: New Paradigm for Faster Chip-Package ConvergenceAnsys
Due to the increasing size of SoCs and the variation in the switching current and parasitic profile across the chip, the individual connections between the SoC and the package at the C4 bump level need to be as granular as possible to provide resolution to the power analysis. To see the benefit from changes made to the chip and/or package in a timely manner requires that both layouts can be modified and modeled in an integrated manner. This presentation introduces RedHawk-CPA, a new feature which allows the inclusion of both chip and package layouts for a unified DC, transient and AC power integrity analysis. It will demonstrate how RedHawk-CPA can improve the level of accuracy as well as reduce the time to power closure. Learn more on our website: https://bit.ly/1ssSGM0
This presentation highlights the new capabilities of RedHawk, the industry standard power noise and reliability sign-off solution that is FinFET ready. The new features include Distributed Machine Processing (DMP) for ultra large design simulation with sign-off accuracy, Chip Package Analysis (CPA) - the industry's first integrated chip-package co-simulation and co-analysis environment, and foundry certification for 16nm FinFET design. Learn more on our website: https://bit.ly/1t3lNZ1
Do wide and deep networks learn the same things? Uncovering how neural networ...Seunghyun Hwang
Review : Do wide and deep networks learn the same things? Uncovering how neural network representations vary with width and depth (Google Research, arxiv preprint)
- by Seunghyun Hwang (Yonsei University, Severance Hospital, Center for Clinical Data Science)
Stress and Durability Analysis of Threaded Connections in a Cast Aluminum Cyl...Altair
Bolted connections involve sharp notched components that are therefore sensitive to fatigue loading. In internal combustion engines, the journal bearings of the crankshaft are supported by bearing caps which are bolted to the cylinder block. These threaded connections are a fatigue concern as cracking may be experienced on dynamometer tests of new engines. The critical element of this application however is not the steel studs rather the threaded bolt holes in the cast engine block. While the nominal stress concept is applicable to the fatigue design of studs, a local stress approach has to be adopted to assess the fatigue strength of threaded bolt holes.
This paper addresses the fatigue design of this kind of threaded connection. Initially alternate methods of FE modeling and analysis of threaded joints by the local approach are critically examined. The parallel development of a simplified experimental test system involving a threaded hole in cast AlSi7 is described and used to generate baseline fatigue data under known loading conditions. The fatigue behavior of the experimental system is then analyzed on the basis of alternate FE models and post processing approaches. Finally, recommendations for the accurate and computationally efficient FE modeling and durability analysis of threaded connections in cast aluminum cylinder block are outlined.
Speakers
Marco Bersella, Engineer, TP Engineering srl
Qorvo TQF6405 High Band FEM SMR-BAW Filter iPhone 6s Plus 2016 teardown reve...Yole Developpement
orvo started as a supplier for Apple’s iPhone with the first iPhone 3G. Since then Apple has been integrating Qorvo’s Module in its flagship. In iPhone 6s series, Apple integrates Qorvo’s LTE High Band Front-End Module.
The merge of Triquint and RFMD in Qorvo formed a top competitor in wireless communication specially in SMR BAW filter.
Located on the main board of the Apple iPhone 6s Plus smartphone, the Qorvo TQF6405 is a complete Front-End Module for high band LTE application. The component is made with several filter dies, assembled on a coreless PCB substrate. It integrates many technology like copper pillar, SMR-BAW filter, proprietary of Qorvo.
All dies present in the component uses TriQuint's proven front-side Cu/Sn pillar technology (Cu-Flip™) for simplified assembly and low interconnect inductance, allowing the assembly of all components of the Front-End Module on the same chip with an area of less than 35 mm².
Specific air cavities are made around each resonator before copper pillar fabrication to preserve any losses.
More information on that report at http://www.i-micronews.com/reports.html
A short introduction presentation about the Basics of Finite Element Analysis. This presentation mainly represents the applications of FEA in the real time world.
The new SAP Cloud Platform Integration L2 Deck provides the product overview on SAP Cloud Platform Integration services and wide variety of customer use cases.
ANSYS RedHawk-CPA: New Paradigm for Faster Chip-Package ConvergenceAnsys
Due to the increasing size of SoCs and the variation in the switching current and parasitic profile across the chip, the individual connections between the SoC and the package at the C4 bump level need to be as granular as possible to provide resolution to the power analysis. To see the benefit from changes made to the chip and/or package in a timely manner requires that both layouts can be modified and modeled in an integrated manner. This presentation introduces RedHawk-CPA, a new feature which allows the inclusion of both chip and package layouts for a unified DC, transient and AC power integrity analysis. It will demonstrate how RedHawk-CPA can improve the level of accuracy as well as reduce the time to power closure. Learn more on our website: https://bit.ly/1ssSGM0
This presentation highlights the new capabilities of RedHawk, the industry standard power noise and reliability sign-off solution that is FinFET ready. The new features include Distributed Machine Processing (DMP) for ultra large design simulation with sign-off accuracy, Chip Package Analysis (CPA) - the industry's first integrated chip-package co-simulation and co-analysis environment, and foundry certification for 16nm FinFET design. Learn more on our website: https://bit.ly/1t3lNZ1
Sensors are electromechanical devices that use magnetic
field for sensing
Velocity sensors for antilock brakes and stability control
Position sensors for static seat location
Eddy current sensors for flaw detection
Full DDR Bank Power and Signal Integrity Analysis with Chip-Package-System Co...Ansys
For today's DDR/IO designs, reliable and predictable chip-to-chip signal transmission depends on the quality of the voltage delivered to the I/O circuit and the magnitude of the signal-to-signal and signal-to-power coupling. Validation of high-speed parallel I/O interfaces requires simulation of an entire I/O bank together with the entire power distribution network for the die, package and the PCB. This presentation discusses Sentinel-SSO™ and how its underlying technologies deliver sign-off accurate I/O-SSO verification with the capacity to handle an entire I/O bank. Learn more on our website: https://bit.ly/1qklvW0
Introduction to TakeCharge on-chip ESD solutions from SoficsSofics
TakeCharge is a semiconductor Intellectual Property (IP) portfolio that is used by 70+ IC design companies worldwide to protect integrated Circuit (IC) interfaces against ESD stress.
The portfolio includes various ESD clamps, concepts that reduce IC cost, enable high end applications and can protect against severe EOS/ESD constraints.
The presentation includes several examples
- Low leakage on-chip ESD clamps (10 nA range)
- Low parasitic capacitance (150fF range)
- Easily ported to any CMOS node
- Reduce development cost and time and manufacturing costs
Deep analysis of the 400Gb optical transceiver from a leading Chinese company.
More information: https://www.systemplus.fr/reverse-costing-reports/innolights-400g-qsfp-dd-optical-transceiver/
Ansys Reliability Engineering Services (RES) is the leader in delivering comprehensive reliability solutions to the electronics industry. Ansys RES leverages a team of reliability experts with a 20,000 sq. ft. laboratory to accurately predict the robustness of a device and investigate failures through physical testing and analysis paired with simulation and modeling. Ansys RES routinely helps clients improve product reliability, time-to-market and customer satisfaction.
Accelerating Innovation Through HPC-Enabled SimulationsAnsys
Presentation explaining how customers cope with product design complexity with pervasive engineering simulation but also addressing the importance of a HPC-enabled platform for scaling the deployment of simulation, and what innovative companies have accomplished via HPC-enabled simulations, on premise and in the cloud.
Mechanical Simulations for Electronic ProductsAnsys
As electronic devices become smaller and more ubiquitous, the printed circuit boards and components that drive them face increasing power densities and evermore complexity. To ensure product reliability and performance, accurate and detailed analysis methodologies are necessary.
The purpose of this study is to evaluate the reception of the GPS signal of a Telematics Electronic Control Unit
(ECU) in two different cabin geometries. In the first cabin, the ECU is installed in the center of the dashboard. In
the second cabin, the ECU is installed in two different positions: 1-Near the center of the dashboard and 2- On the
right side of the dashboard.
ANSYS SCADE Usage for Unmanned Aircraft VehiclesAnsys
SCADE on-board the UAS P.1HH HammerHead
The Use of SCADE to develop the P.1HH Vehicle Control & Management System (Integrated Modular Avionics System) greatly reduced development time and effort.
Learn more about ANSYS SCADE Solutions for Aerospace & Defense http://bit.ly/1EdcsOJ
Benefits of Intel Technologies for Engineering SimulationAnsys
This presentation gives the perspective of an ISV (independent software vendor) on the usage of the latest Intel technologies for engineering simulation. It starts off with introducing ANSYS and why our customers have a continually increasing need for higher computing performance so that they can run faster, bigger, and more simulations. In order to meet this continually growing compute demand, it demonstrates how we have worked closely with Intel to optimize our software at different scales of parallelism (from workstation, server-based clusters to supercomputers). Key strategies to enable efficient parallel execution are discussed, and recent examples of the value of software optimization are shown.
High-performance computing (HPC) is now gradually becoming more common in small and mid-sized companies. Nevertheless, many misconceptions still surround HPC, preventing companies from taking advantage of it for becoming more competitive.
For more information visit http://www.ansys.com/hpc-myths
ANSYS Mechanical software provides a vast library of material models that can help users simulate various kinds of behaviors such as elasticity, plasticity, creep and hyperelasticity, just to name a few.
Although these models can be used to investigate the mechanical response of a large number of different materials such as metals, rubbers, biological tissues and special alloys, users may wish to incorporate their own material laws into ANSYS.
This task can be accomplished by means of a user-programmable feature named USERMAT, a subroutine that allows users to write their own material constitutive equations within a general material framework using ANSYS’ current element technology.
This presentation shows the use of USERMAT recently shown at the 2014 ANSYS Regional Conference in Eindhoven, The Netherlands.
ANSYS technology enables you to predict with confidence that your products will thrive in the real world. Customers trust our software to help ensure the integrity of their products and drive business success through innovation.
For more information please visit ansys.com
Totem Technologies for Analog, Memory, Mixed-Signal DesignsAnsys
Analog, mixed-signal and custom designs face unique challenges when it comes to power and reliability analysis. SRAM and FLASH memories are pushing the envelope to handle large designs, while mixed-signal and RF designs need concurrent analysis of large analog blocks with interspersed digital logic as well as substrate noise coupling. This presentation demonstrates how Totem, a single platform for Power Noise and Reliability, can be used to address the unique challenges for analog, mixed-signal and custom designs. Learn more on our website: https://bit.ly/1qk5Juj
Achieving Power Noise Reliability Sign-off for FinFET based DesignsAnsys
As the industry shifts to FinFET devices, designs are more sensitive to noise, have higher power density, and interconnects are more susceptible to EM and thermal issues. To ensure robustness of these designs, today's methodology needs to include design for reliability. This presentation describes how RedHawk and Totem platforms enable accurate power noise and reliability sign off for standard cell and analog / mixed-signal IP all the way to SoC. Learn more on our website: https://bit.ly/1CW3FRT and https://bit.ly/1qk5Juj
Methods for Achieving RTL to Gate Power ConsistencyAnsys
Consistency between RTL and signoff power numbers is necessary in enabling early low power design decisions with confidence. A modeling and characterization approach that takes into account physical design parameters is required to ensure this consistency. This presentation covers factors that affect RTL power accuracy and how PowerArtist™ PACE™ technology models physical effects to deliver predictable RTL power accuracy for sub-20nm designs. Learn more on our website: https://bit.ly/10Rpcxu
Thermal reliability faces critical challenges from emerging FinFET-based designs. As designs transition from planar MOS to FinFET transistors, current density increases by 25% and that combined with lower thermal conductivity substrate and 3-D narrow fin structure, local heat gets trapped resulting in thermal-aware EM issues. This presentation introduces Sentinel-TI™, a thermal integrity platform and demonstrates how Chip Thermal Model (CTM™) based power-thermal convergence and interconnect-driven methodology help address the thermal reliability challenges associated with these design. Learn more on our website: https://bit.ly/1sh7I8p, https://bit.ly/1CW3FRT, https://bit.ly/1qk5Juj and (https://bit.ly/1rtrGat)
PowerArtist™ includes production-proven RTL power analysis with interactive visual debug, analysis-driven automatic RTL power reduction, and a Tcl interface to the database enabling custom reports and tracking of power through regressions. PowerArtist generated models bridge the RTL and layout gap delivering physical-aware RTL power accuracy and RTL-power driven early power grid integrity. This presentation provides an overview of PowerArtist and covers RTL design-for-power best practices using real-life examples. Learn more on our website: https://bit.ly/10Rpcxu
Modeling a Magnetic Stirrer Coupling for the Dispersion of Particulate MaterialsAnsys
Particles must be well-dispersed in a fluid medium before particle size measurements can be done. Engineers at Malvern Instruments Ltd. used ANSYS Maxwell to take a new magnetic drive design, optimize it and produce a solution that comfortably drives any magnetic stirrer bead over the required range of stir speeds and dispersant viscosities to achieve sufficient particle dispersion.
Solving 3-D Printing Design Problems with ANSYS CFD for UAV ProjectAnsys
Researchers at the University of Sheffield’s Advanced Manufacturing Research Centre wanted to determine the optimized desired cruise conditions of different 3-D printed UAVs. They turned to ANSYS software to create, analyze and optimize the design.
ANSYS and Intel have worked together to help our customers run larger, higher-fidelity models on the new Intel® Xeon® Processor E5-2600 v3 product family.
This presentation demonstrates why hardware accelerators (like NVIDIA GPU and Intel Xeon Phi) could be of interest for CFD simulation. It presents the current status of accelerator-based solver support in ANSYS Fluent 15.0. By means of examples, technical guidelines and performance data will be discussed. Finally, licensing and future directions associated with accelerator-based CFD simulation will be briefly addressed.
Cosmetic shop management system project report.pdfKamal Acharya
Buying new cosmetic products is difficult. It can even be scary for those who have sensitive skin and are prone to skin trouble. The information needed to alleviate this problem is on the back of each product, but it's thought to interpret those ingredient lists unless you have a background in chemistry.
Instead of buying and hoping for the best, we can use data science to help us predict which products may be good fits for us. It includes various function programs to do the above mentioned tasks.
Data file handling has been effectively used in the program.
The automated cosmetic shop management system should deal with the automation of general workflow and administration process of the shop. The main processes of the system focus on customer's request where the system is able to search the most appropriate products and deliver it to the customers. It should help the employees to quickly identify the list of cosmetic product that have reached the minimum quantity and also keep a track of expired date for each cosmetic product. It should help the employees to find the rack number in which the product is placed.It is also Faster and more efficient way.
The Internet of Things (IoT) is a revolutionary concept that connects everyday objects and devices to the internet, enabling them to communicate, collect, and exchange data. Imagine a world where your refrigerator notifies you when you’re running low on groceries, or streetlights adjust their brightness based on traffic patterns – that’s the power of IoT. In essence, IoT transforms ordinary objects into smart, interconnected devices, creating a network of endless possibilities.
Here is a blog on the role of electrical and electronics engineers in IOT. Let's dig in!!!!
For more such content visit: https://nttftrg.com/
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
In this month's edition, along with this month's industry news to celebrate the 13 years since the group was created we have articles including
A case study of the used of Advanced Process Control at the Wastewater Treatment works at Lleida in Spain
A look back on an article on smart wastewater networks in order to see how the industry has measured up in the interim around the adoption of Digital Transformation in the Water Industry.
Understanding Inductive Bias in Machine LearningSUTEJAS
This presentation explores the concept of inductive bias in machine learning. It explains how algorithms come with built-in assumptions and preferences that guide the learning process. You'll learn about the different types of inductive bias and how they can impact the performance and generalizability of machine learning models.
The presentation also covers the positive and negative aspects of inductive bias, along with strategies for mitigating potential drawbacks. We'll explore examples of how bias manifests in algorithms like neural networks and decision trees.
By understanding inductive bias, you can gain valuable insights into how machine learning models work and make informed decisions when building and deploying them.
Hierarchical Digital Twin of a Naval Power SystemKerry Sado
A hierarchical digital twin of a Naval DC power system has been developed and experimentally verified. Similar to other state-of-the-art digital twins, this technology creates a digital replica of the physical system executed in real-time or faster, which can modify hardware controls. However, its advantage stems from distributing computational efforts by utilizing a hierarchical structure composed of lower-level digital twin blocks and a higher-level system digital twin. Each digital twin block is associated with a physical subsystem of the hardware and communicates with a singular system digital twin, which creates a system-level response. By extracting information from each level of the hierarchy, power system controls of the hardware were reconfigured autonomously. This hierarchical digital twin development offers several advantages over other digital twins, particularly in the field of naval power systems. The hierarchical structure allows for greater computational efficiency and scalability while the ability to autonomously reconfigure hardware controls offers increased flexibility and responsiveness. The hierarchical decomposition and models utilized were well aligned with the physical twin, as indicated by the maximum deviations between the developed digital twin hierarchy and the hardware.
NUMERICAL SIMULATIONS OF HEAT AND MASS TRANSFER IN CONDENSING HEAT EXCHANGERS...ssuser7dcef0
Power plants release a large amount of water vapor into the
atmosphere through the stack. The flue gas can be a potential
source for obtaining much needed cooling water for a power
plant. If a power plant could recover and reuse a portion of this
moisture, it could reduce its total cooling water intake
requirement. One of the most practical way to recover water
from flue gas is to use a condensing heat exchanger. The power
plant could also recover latent heat due to condensation as well
as sensible heat due to lowering the flue gas exit temperature.
Additionally, harmful acids released from the stack can be
reduced in a condensing heat exchanger by acid condensation. reduced in a condensing heat exchanger by acid condensation.
Condensation of vapors in flue gas is a complicated
phenomenon since heat and mass transfer of water vapor and
various acids simultaneously occur in the presence of noncondensable
gases such as nitrogen and oxygen. Design of a
condenser depends on the knowledge and understanding of the
heat and mass transfer processes. A computer program for
numerical simulations of water (H2O) and sulfuric acid (H2SO4)
condensation in a flue gas condensing heat exchanger was
developed using MATLAB. Governing equations based on
mass and energy balances for the system were derived to
predict variables such as flue gas exit temperature, cooling
water outlet temperature, mole fraction and condensation rates
of water and sulfuric acid vapors. The equations were solved
using an iterative solution technique with calculations of heat
and mass transfer coefficients and physical properties.