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© Ian Phillips 2017
https://ianp24.blogspot.com
They're	not	making	atoms	any	smaller!
...	The	future	for	Electronic	System	Products?	
Invited	talk	at	the	...
Portsmouth	and	district	Physical	Society	
with	Institute	of	Physics	South	Central	Branch.
@the	University	of	Portsmouth
15feb17
Prof. Ian Phillips
Principal Staff Eng’r.
ARM Ltd (Retired Dec16)
Visiting Prof. at ...
Contribution to
Industry Award 2008
1v0
2
§ 1947:	William	Shockley,	John	Bardeen	and	Walter	Brattain
Just	70yrs	since	the	First	Transistor	...
FirstTransfer-Resistor (Point-Contact)
First Junction Transistor
‘ ’
i
i
3
§ Very	different	‘Architecture’
§ And	different	‘Modes’	of	transistor	action	emerging	=>
§ £’s	per	transistor	...	So	use	sparingly!
1951:	Just	2yrs	later;	the	First	Commercial	Transistors
1954:The OC71
4
c1960:	7-Transistor	Radio	Commonplace
5
Radio	is	Just	Signal	Processing	...
Bush Radio (c1960)
Analogue
7 Transistors
1 Diode
Evoke DAB Radio (c2005)
Digital
100 M Transistors !
2-3 Embedded Processors
BTH Crystal Set (c1925)
Analogue
1 Diode
Tele-Verta Radio (c1945)
Analogue
4 Valves
1 Rectifier Valve
...	Integration	Technology	made	transistors	diminishingly	
cheap,	thus	opened	the	door	to	Digital	Signal	Processing
When	active	components	are	expensive	...
...	use	them	frugally	and	efficiently
6
Radio as	Computation	...
Vrf=Vi*100
Vlo=Cos(t*1^6)
Vi
Vrf
Vif=Vrf*Vlo
Vlo
Vif
Vro='Bandpass'(Vif*1000)
Vro
Architecture
7
Radio	as	Computation	...
Vrf=Vi*100
Vlo=Cos(t*1^6)
Vi
Vrf
Vif=Vrf*Vlo
Vlo
Vif
Vro='Bandpass'(Vif*1000)
Vro
Valve
Technology
Architecture
8
Radio	as	Computation	...
Vrf=Vi*100
Vlo=Cos(t*1^6)
Vi
Vrf
Vif=Vrf*Vlo
Vlo
Vif
Vro='Bandpass'(Vif*1000)
Vro
Transistor
Technology
Architecture
9
Radio	as	Computation	...
Vrf=Vi*100
Vlo=Cos(t*1^6)
Vi
Vrf
Vif=Vrf*Vlo
Vlo
Vif
Vro='Bandpass'(Vif*1000)
Vro
Architecture
‘Integrated Circuit’
Technology
10
1957/8:	The	Planar	Transistor	=>	Integrated	Circuit
Kilby 1958:	The	First	Integrated	Circuit.	
… Just	3	Components
11
1961:	First	Commercial	Integrated	Circuit	(IC)
§ And	the	birth	of	Digital	Electronics	...
§ Much	less efficient;	but	much	more scalable
§ More	absolute	and	reproducible	results
§ A	natural	‘architecture’	for	State-Based	control	
§ State	machines	(and	ultimately	processors)
§ Memory
Fairchild:	“Flip-Flop”		(4	transistors,	2	resistors).		$120.
4mm
Robert	Noyce
Founder	of	Fairchild	Semiconductor	in	1957	
and	Intel	Corporation	in	1968
12
1965:	Moore’s	Law
§ “Moore's	Law”	was	coined	by	Carver	Mead	in	1970,	from	Gordon	Moore's	article	in	
Electronics	Magazine	19	April	1965	"Cramming	more	components	onto	integrated	circuits“.
“The complexity for minimum component
costs has increased at a rate of roughly a factor
of two per year ... Certainly over the short term this
rate can be expected to continue, if not to increase.
Over the longer term, the rate of increase is a bit more
uncertain, although there is no reason to believe it will
not remain nearly constant for at least 10 years. That
means by 1975, the number of components per
integrated circuit for minimum cost will be 65,000. I
believe that such a large circuit can be built on a single
wafer”
In 1965 he was designing ICs with ~80 components!
And basing his observations on 30-40 component ICs!
13
1965:	Integrating	30-40	components	...
§ Transistor	Transistor	Logic	(TTL)...
14
10nm
100nm
1um
10um
100um
ApproximateProcessGeometry
ITRS’99
Transistors/Chip(M)
http://en.wikipedia.org/wiki/Moore’s_law
Moore’s	Law:	50	yrs	of		Technology	Driven	Opportunity	...
Transistor/PM(K)
X
...	20,000x	transistors,	and	10x	speed	in	last	25yrs!
15
2012: Moore’s Law got 45nmTransistors into Production ...
NB: The Tegra 3 is similar to the Apple A4
NVIDIA’sTegra 3 Processor Chip (Around 1B tr.)
...	A further	~100x	Functionality	due	to	Connective	Complexity!
16
But	in	70yrs	the	Atoms	have	not	got	any	SMALLER	!
§ Growing	opinion	that	10	or	7nm	will	be	the	
smallest	yieldable	node	...	Ever!
§ Just	2-3	gen.	(3-6yr)	to	the	end	of	‘Planar’	Scaling	!?
... So is this the end for Moore’s Law ?
130nm
90nm
28nm
14nm
7nm
§ Already	getting	Seriously	Difficult	...
§ Difficulty	Making	nm	scale	
Transistors	&	Interconnect	…
§ Sharply	Increasing	Process	
Complexity	and	Cost
§ Reduces	Yield	and	Reliability
§ Changing	Design	and	Photolithography
§ The	Statistical	Nature	of	Atoms	shows	through	...
§ Makes	Transistor	electrical	characteristics	
randomly	variable
§ Significantly	Increasing	Design	Complexity
§ Power,	Speed	and	Cost	
benefit	of	scaling	stopped	
at	100nm	(Dennard	Scaling)
17
nm
28
3um
2um
1.5um
800
1.0um (1000 nm)
500
350
250
180
90
130
65
45
32
22
Like	Painting	1”	lines	with	a	4”	Paintbrush	...
Infra-red
Ultra-violet
720nm
380nm
X-rays
red blood cell
measles virus
catalase
193nm
“Deep UV”
Excimer Laser
16nm
“Extreme UV”
Ionized Tin
Silicon Atom = 0.2nm
Silicon Crystal = 0.54nm
430nm
“Deep Blue”
Mercury Vapor
Sub-Wavelength
Sub-Wavelength ‘optical tricks’ such
as immersion lithography, dual-tone resist
and multiple patterning
18
Moor’s	Law	has	been	maintained	for	50yrs by	Teamwork	…
Apple:	A7	Chip,	10	Layer	Metal
Intel:	22nm	FIN-FET	(2.5D)
ASML:	EUV	13.6nm	Stepper	($100m)
A.Assenov:	Atomic-Level	Process	Modelling
§ Improving	Transistor	and	Process	Architectures	...
§ Photolithography	Lenses,	Masks	and	Photo-Chemistry
§ Manufacturing	Machines	and	Metrology	Tools
§ Mechanics	(Handling,	Alignment)	and	Control
§ Process	and	Environment	Control
§ Understanding	of	Physics
§ Use	of	more	Elements
§ Better	Process	Modelling
19
§ General	Purpose,	Stored	Program,	Computing Mechanism
§ Technology:	Electronics	(valves),	Digital (base	2)
§ Available	today	...	Enhanced	by	Micro-Electronics	(Mainframe	<=>	Laptop)
Computing	Drove	Electronic	Technology	in	1947	…
Uo.Manchester, BABY Computer (Reconstruction 2000)
20
Does	High	Performance	Computing	Drive	Technology	today?
§ HPCs,	Mainframes	&	Workstations	…	
§ Professional	Electronic	Systems
§ Weather,	Military	and	Financial
§ Highest	in-box	performance	needs
§ ‘Streches the	envelope’
§ Surely	such	challenges	must	always	
be	the	Technology	Driver	!!
NO !… They	don’t	have	enough	Market	Volume/Value	to	justify	Technology	Development	Costs	!
21
Consumer	Drives	Technology	Development	…
Purchased	and	Used	by	Consumers.	Chosen	for	Function not	Technology
22
...	‘Old’	Markets	remain today;	but	they	inherit their	Technologies	from	the	Lead	Markets!
Business	Opp’ty Has	Always	Driven	Technology	Evolution
1970 1980 1990 2000 2010 2020 2030
Millionsof
Units
1st Era
Select work-tasks
2nd Era
Broad-based computing
for specific tasks
3rd Era
Computing as part
of our lives
But	End-Customer	has	evolved	from	Professional	to	Consumer
23
10nm
100nm
1um
10um
100um
ApproximateProcessGeometry
ITRS’99
Transistors/Chip(M)
Transistor/PM(K)
http://en.wikipedia.org/wiki/Moore’s_law
Designer	Productivity	was	always	the	Challenge	...
24
10nm
100nm
1um
10um
100um
ApproximateProcessGeometry
ITRS’99
Transistors/Chip(M)
Transistor/PM(K)
http://en.wikipedia.org/wiki/Moore’s_law
...	Without	>90%	Reuse,	today’s	Electronic	Systems	would	be	Un-Producible	!
Designer	Productivity	was	always	the	Challenge	...
Global TeamsLocal TeamsSmall TeamSingle Designer
Expertise ReuseHW&SW ReuseSome ReuseClean Sheet
25
How	to	Utilize	‘A	few	Billion’	Transistors	...
SanDisk:	19nm	128Gb	flash	memory	chip
...	At	least	60,000m	(60B)	transistors
§ Regular	Structures	like Memory are	excellent	...	
§ BUT it	has	to	have	a	use	in	the	System	Context	(No	use	just	filling	a	chip	with	memory!)
§ Function-Blocks are	also	essential	(CPU’s	GPU’s,	Accelerators,	Encryption,	etc)
§ These	are	large	reusable	blocks	in	themselves
§ They	also	facilitate	the	use	of	memory	(0n-chip	and	nearby)
...	Processors (aka	Software-Engines)	are	
especially	useful	because	they	also	enable	
External-Design of functionality	(Software)
26
1991:The ARM RISC-Processor IP Core …
27
ARM7 Core
DMA
Par.
Port
PCMCIA UART (2)
Int’t.
Contr.
Memory
Interface
Timers
W’Dog
Arb’tr.
Misc.
1991: ARM RISC-Processor IP Core …
28
Designer	Productivity	Had	Become	the	Methodology	Driver
§ The	Product	Possibilities	offered	by	utilising	the	Billions	of	Affordable	and	Aesthetically	
Encapsulate-able	Transistors	is	Commercially	Beguiling!
§ But	the	only	way to	realise	these	possibilities	in	a	reasonable	time,	with	a	reasonable	team	
and	at	a	reasonable	cost;	is	huge	amounts	of	Reuse of	Design	and	Technology	...
§ Hardware,	Software and	other	Technologies;	Methods and	Tools
§ In-Company:	Sourced	and	Evolved	from	Predecessor	Products
§ Ex-Company:	Sourced	from	businesses	with	lesser-known(?)	Histories,	but	Specialist	Knowledge
§ Reuse	Improves	Quality;	as	objects	are	designed	more	carefully,	and	bug-fixes	are	incremental
§ But beware;	systems	always	have	residual	errors!	
...	Now;	Clean-Sheet	approaches	will	be	several	orders	of	magnitude	higher	cost!	
…	So;	>99%	Reuse	is	the	rule	for	all Electronic	System	Product	Design	and	Development!
...	Including;	specialised	Professional	Electronic	System	Applications/Products
29
Software Tools
- The character
of the system
Physical IP
– The process-specific
logic-blocks of the chip
Processor and Graphics IP
– The engine of the chip
2016:	ARM	IP	- Same	Concept,	but	much	more	System	...
§ And	System	Designers	use	ever-more	Reuse	Objects	(Virtual	and	Physical)	
from	ARM and	from	other	sources	Internally	and	Externally
Early software
development on
Virtual Platforms
Power MgmtBluetooth
Cellular Modem
WiFi
SIM
GPS
Flash Controller
Touchscreen
& Sensor Hub
Sensor Hub
Camera
Apps Processor
30
ARM	CPU/GPUs	are	Software-Engines	...
...	A	range	with	different	functional	sweet-spots	for	different	applications
About 50MTr
About
50KTr
31
...	ARM	supplies	around	24	Processors	in	6	Families	...
...	Processors	optimised	to	be	used	Alone	or	in	Combination	to	best-fit	the	Application
32
...	With	CoreLink for	Heterogeneous	Multi-Processing	...
ACE
ACE
NIC-400 Network Interconnect
Flash GPIO
NIC-400
USBQuad
Cortex-
A15
L2 cache
Interrupt Control
CoreLink™
DMC-520
x72
DDR4-3200
PHY
AHB
Snoop
Filter
Quad
Cortex-
A15
L2 cache
Quad
Cortex-
A15
L2 cache
Quad
Cortex-
A15
L2 cache
CoreLink™
DMC-520
x72
DDR4-3200
8-16MB L3 cache
PCIe
10-40
GbE
DPI Crypto
CoreLink™ CCN-504 Cache Coherent Network
IO Virtualisation with System MMU
DSP
DSP
DSP
SATA
Dual channel
DDR3/4 x72
Up to 4 cores
per cluster
Up to 4
coherent
clusters
Integrated
L3 cache
Up to 18 AMBA
interfaces for
I/O coherent
accelerators
and IO
Peripheral address space
Heterogeneous processors – CPU, GPU, DSP and
accelerators
Virtualized Interrupts
Uniform
System
memory
...	Platform	Models	and	Development	Systems	to	help	the	customer	develop	their	Product
33
…	Tools,	Libraries	and	Partners	to	Realize	the	Opportunities
§ Technology	to	build	Electronic	System	solutions:
§ Software,	Drivers,	OS-Ports,	Tools,	Utilities		to	create	
efficient	system	with	optimized	software	solutions
§ Diverse	Physical	Components,	including	CPU	and	GPU	
processors	designed	for	specific	tasks
§ Interconnect System	IP	delivering	coherency	and	the	
quality	of	service	required	for	lowest	memory	bandwidth
§ Optimised	Cell-Libraries	for	a	highly	optimized	SoC
implementations
§ Well	Connected	to	Partners	in	the	Life-Cycle:
§ For	complementary	tools	and	methods	required	by	
System	Developers
§ Global	Technology	Global	Partners:
§ ~1000	Partners;	Millions	of	Developers
34
Supplying	in	the	Life-Cycle	of	Electronic	System	Products
ARM	Chips	shipped	in	2014
by	ARM	Partners
ARM	Chips	Shipped	to	Date	by	
ARM	Partners
35
§ ARM is	a	UK	Established	and	Headquartered	Co.	
§ The	Global	Leader	for	Embedded	CPU-IP	...
§ Effectively Outsourcing	R&D for	companies	building	
Chips	and	Electronic-System	products
§ Technology	Reuse	shares	the	development	and	
maintenance	cost	over	Multiple	Users	and	Applications
§ Technology	Roadmap Preserves	customers	Investment
§ Innovative	Business	Model	yields	high	margins
§ Upfront	license	fee	– flexible	licensing	models
§ Ongoing	royalties	– typically	a	percentage	of	chip	price
...	ARM’s	Virtual	Product	Creates	New	and	
Transforms	Existing	markets
A	21c	‘Virtual’	Business
2-3
20+	years
Multiple	applications	
development	and	sales
2-3	years
Partner	chip	
development
2-3	years
ARM	research	and	
development
Cost	incurred
License	revenue	$
Royalty	revenue	$
~1,200	total	licenses
…	163	in	2014
>350 potential	
royalty	payers
12bn	ARM-based	chips	2014
20%	CAGR	over	last	5	years
~£820m Revenue			(~28% on	R&D)
~3,300 Employees	ww (~1,400 in	the	UK)
… Figures from ARMY2014 Published Results (Pre SoftBank acquisition)
36
Design	its	about	Delivering a	Commercial	Opportunity	...
§ Designers	create	(Technology	Based)	Stuff to	be	a	Valuable and	Viable	Product ...
§ Functional - It	has	GOT	to	work
§ Economical - Its	cost	has	got	to	be	less	than	its	value
§ Reproducible – It	has	to	Yield,	be	Distributable	and	Reliable	(enough)
§ Innovative – It	has	to	be	Competitive	against	alternative	implementations
§ They	Deliver	a	Promise for	the	future	...
§ Certainty
§ Timescales
§ Development	and	Manufacturing	Costs
§ Quality	(Dependability	and	Reliability)
§ And	they	base	it	on	the	use	of	Appropriate Available Technology ...
§ Not	the	fanciest,	newest	or	optimistically	promised	(Have	to	judge	between	claim	and	reality)
§ It	is	about	working	with others	(teams)	internally	and	externally	to	deliver
§ It	is	about	thinking	around	and	about	the	problem,	and	being	ingenious in	the	solution	(Ingineer!)
...	The	Designers	Role	is	to	Create	a	Marketable	Product	Differentiation!
37
Technology	in	an	iConic Technology-Product	...
38
But	Design	Actually	Happens	at	Many Levels	Below	this	...
39
Inside	the	Case	...
Down	1-Level:	Modules
iPhone 4's vibrator motor.
rear-facing 5 MP camera with 720p video at
30 FPS, tap to focus feature, and LED flash.
Source ... http://www.ifixit.com
40
Take	a	Look	Inside...
http://www.ifixit.com
The Control Board.
Level-1: Modules
41
Inside	The	Control	Board			(A-side)	
Level-2:	Sub-Assemblies	
§ Visible Computing	Contributors	...
§ Samsung:	Flash	Memory		 - NV-MOS
§ Cirrus	Logic:	Audio	Codec		 - Bi-CMOS
§ AKM:	Magnetic	Sensor			 - MEM-CMOS
§ Texas	Instruments:Touch Screen	Controller	and	mobile	DDR		 - Analogue-CMOS
§ RF	Filters			 - SAW-Technology	
§ Invisible Computing	Contributors	...
§ OS,	Drivers,	Stacks,	Applications,	GSM,	Security,	Graphics,	Video,	Sound,	etc
§ Software	Tools,	Debug	Tools,	etc
http://www.ifixit.com
42
Inside	The	Control	Board			(B-side)
Level-2:	Sub-Assemblies
§ More	Visible Computing	Contributors	...
§ A4	Processor. Spec:Apple,	Design	&	Mfr:	Samsung Digital-CMOS	(?nm)	...
§ Provides	the	iPhone	4	with	its	GP	&	Graphical	computing	power.
§ ARM CPU	and	other	ARM IP	based
§ Imagination	Tech.	GPU
§ ST-Micro:	3	axis	Gyroscope			- MEM-CMOS
§ Broadcom:	Wi-Fi,	Bluetooth,	and	GPS			- Analogue-CMOS
§ Skyworks:	GSM						 Analogue-Bipolar
§ Triquint:	GSM	PA					 Analogue-GaAs
§ Infineon:	GSM	Transceiver			- Anal/Digi-CMOS GPS
Bluetooth,
EDR &FM
http://www.ifixit.com
43
The	A4	SIP	Package			(Cross-section)
Down	3-Levels:	IC	Packaging
§ The	processor	is	the	centre	rectangle.	The	silver	circles	beneath	it	are	solder	balls.
§ Two	rectangles	above	are	RAM	die,	offset	to	make	room	for	the	wirebonds.
§ Putting	the	RAM	close	to	the	processor	reduces	latency,	making	RAM	faster	and	
cuts	power.
§ Unknown Mfr	(Memory)
§ Samsung/Apple/ARM (Processor)
§ Unknown (SIP	Technology)
Source ... http://www.ifixit.com
Processor SOC Die
2 Memory Dies
Glue
Memory
‘Package’
4-Layer Platform
Package’
44
§ The	most	important	technology	is	the	one	that	you	‘don’t	have’,	that	your	competitors	do!!
§ That	includes	technologies	that	you	‘thought	you	had’	(ie:	Don’t	work	as	you	expected	them	to!)
The	Chips	(and	their	Processes)	are	Important	…
… But	they	are	NOT The	Most	Important	part	of	a	Product
Down 4-levels: Chip Design(s)
45
Many	Virtual-Components in	todays	iCons
ØAnalogue	and	Digital	Design
ØEmbedded	Software
ØSignal	Processing
ØDisplays	and	Transducer	Technology
ØSystem	Knowledge	and	Know-How
ØResearch (Preparation)
ØEducation	and	Training
ØComponent,	Sub-System	and	
Systems	Design	and	Qual’n
ØMicro-Machines	(MEMs)
ØMechanics,	Plastics	and	Glass	Tech.
ØMetrology,	Methodology	and	Tools
ØManufacture	(Reproduction),	Robotics	and	Test
...	Only	Physical	Components	appear	on	the	BOM
…	Virtual	Components	are	out	of	sight	(and	mind!)
46
The	Market’s	Insatiable	Appetite	for:	New	– Better	- Cheaper
§ Our	21c	Society	expects	ever	More	Sophisticated	Tech.	Products at	ever	Lower	Cost
§ And	for	~50yrs	Planar	Shrinking	of	CMOS	has	delivered	this	...	But	we	have	become	myopic about	alternatives!
...	The	Market	doesn’t	mandate Smaller	Processes	as	the	way	to	deliver	it!
§ Since	~100nm	(~2005)	Si	shrinks	have	slowed,	got	more	intricate	
and	expensive	... Yet ‘Shrinking’	has	continued	as	normal,	as	designers	
re-focused	on	System-Design to	deliver	it	...
§ Delivering	System performance	through	integration	of	multiple-technologies ...	
...	All	equally	important	now!
§ Through	(Re)use of	Physical	and	Virtual	Components	for	Quality and	Productivity
§ Through	Device	and	System	Architecture and	Methods
§ Through	integrated	Manufacturing and	Business	Models
...	The	slowing	of	Moore’s	Law	for	Si	hasn’t	meant	the	end	of	‘System	Shrinking’!
… So	in	the	21c	it	is	clear	that	Moore’s	Law is	actually	about	Functional	Density
...	so	its	delivery	is	not	inextricably	bound	to	the	size	of	transistors!
47
Conclusions
§ Over	the	last	70yrs,	the	Transistor has	transformed	our	Lives ...
§ We	have	become	used	to	Technology	advancing	at	an	exponential	pace	to	continuously-
improve	all	aspects	of	Societal	and	Individual	needs,	whilst	reducing	the	cost
§ But	as	Integrated	Transistors	approach	atomic	size;	we	approach	a	nadir,	where	further	
Si-technology	enabled	advancement	is	increasingly	difficult	...	The	end	of	Moore’s	Law?
§ But	whilst	the	capability	of	Silicon	to	deliver	is	already	reducing;	Products are	maintaining	
expectation	by	include	a	wider	scope	of	technologies to	deliver	it	at	the	System-Level
§ The	Transistor	is	not	dead,	but	is	no-longer	the	epicenter	of	the	product;	the	21c	Product is	an	
alloy	of	technologies delivering	cost-effective	End-Product	Functionality.
§ Moore’s	Law	was	arguably	always	a	doubling	of	System-Functionality	every	18-24	mth;	
and	in	that	vein	shows	every	sign	of	continuing	for	the	foreseeable	future!
48
© Ian Phillips 2017
https://ianp24.blogspot.com
Thankyou	for	Listening	...
...	And	Good	Luck	with	the	next	50yrs	of	Moore’s	Law	J

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