Download as PDF, PPTX
More Related Content
Sun Microsystems
- 1. Click to editthe title text format Новый взгляд на современные системы Владимир Овчинников Системный инженер Sun Microsystems 1
- 2.
- 3. Зак Мура: Закон Мура:количество транзисторов на Закон кристалле удваивается каждые два года Relative Performance 1980 1985 1990 1995 2000 2005 3
- 4. Производительность памяти отстаетот производительности процессоров 10000 2x Every CPU Frequency Two Years Relative Performance DRAM Speeds 1000 Gap 100 10 2x Every Six Years 1 1980 1985 1990 1995 2000 2005 4
- 5. Однопотоковые вычисления Up to85% Cycles Waiting for Memory HURRY Single Threaded UP AND Performance WAIT! Typical Processor Utilization:15–25% Thread C M C M C M T Memory Latency Compute ime 5
- 6. Многопотоковость или“Прохладные потоки” - CoolThreads Single Threaded Performance Chip Multi-threaded (CMT) Performance Processor Utilization: Up to 85% Thread 4 C M C M C M Thread 3 C M C M C M Thread 2 C M C M C M Thread 1 C M C M C M T Memory Latency Compute ime 6
- 7. Chip Multi-Threading –много потоков на одном кристалле Relative Performance 7
- 8. 4 потока х8 ядер = UltraSPARC T1 Memory Latency Core-1 Thread 4 Thread 3 Compute Thread 2 Thread 1 Thread 4 Core-2 Thread 3 Thread 2 Thread 1 Thread 4 Core-3 Thread 3 Thread 2 Thread 1 Thread 4 Thread 3 Core-4 Thread 2 Thread 1 Thread 4 Thread 3 Core-5 Thread 2 Thread 1 Thread 4 Thread 3 Core-6 Thread 2 Thread 1 Thread 4 Thread 3 Thread 2 Core-7 Thread 1 Thread 4 Thread 3 Thread 2 Core-8 Thread 1 Time 8
- 9. SPARC Enterprise Click toedit the title text format • Extreme Rackmount Density T1000 > 1RU chassis, 19” depth Network Infrastructure Workhorse > Up to 16 GB DDR2 memory • UltraSPARC T1 processor > 6 or 8 cores @ 1 Ghz > 4 Gb Ethernet ports Expansive web access tier: • Simple, Reliable Design Web Server > 1 S-ATA 3.5” disk drive Identity/Directory Server > 1 PCI-E expansion slot Portal Server, • Low Cost/High Efficiency App Integration, > Under 180 watts typical Index, Search, > Diskless configs available Edge / Network Node > Single power supply 9
- 10. • UltraSPARC T1@ 1.2 or 1.4 Ghz SPARCthe title text format Click to edit Enterprise > 4, 6 or 8 core versions T2000 • Rackmount Dense > 2RU chassis, 24.4” depth The Application Engine > Up to 64* GB DDR-2 Memory • High Reliability > Hot Plug, Redundant Power Supplies & Fans > RAID • Expandable > 3 PCI-E, 1 or 2 PCI-X slots > 4x SAS/SATA 2.5” disk drives with Java Application Servers, Enterprise RAID 0,1 Application Servers (ERP, CRM), Web > Optional DVD drive Tier Consolidation > 2 USB ports – • Low Power/ Low TCO > <325 watts power typical 10
- 11. Новый технологический процесс– еще больше много потоков на ядро • Up to 8 cores @1.2GHz or 1.4GHz FB DIMM FB DIMM FB DIMM FB DIMM • Up to 64 threads per CPU FB DIMM FB DIMM FB DIMM FB DIMM • Up to 16 FB-DIMMs, 4 memory controllers Relative Performance > Up to 64GB memory (4GB DIMMs) MC MC MC MC U U U U > 2.5x memory BW of UltraSPARC T1 L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$ • 8 x fully pipelined Floating Point units / Full Cross Bar core, 1 per core C0 C1 C2 C3 C4 C5 C6 C7 • Dual 10Gbit Ethernet and PCI-E FPU FPU FPU FPU FPU FPU FPU FPU integrated onto chip MAU MAU MAU MAU MAU MAU MAU MAU DMA Sub-System • 4MB L2 (8 banks) 16 way associative • Enhanced MAU/Security co-processor NIU Sys I/F per core PCI-E (E-net+) Buffer Switch Core • Advanced Power saving features Power ~95W <1.5W/thread • 65nm process technology 2x 10GE Ethernet 11
- 12. SPARC edit thetitle text format Click to Enterprise T5120 • 1 chassis, 26.5” depth • Up to 8 cores @1.4GHz > Up to 64 threads • 16 FB-DIMM memory slots > 128GB of memory, (8GB DIMMs) • 4 hot plug SATA/SAS 2.5” disk • Optimized for best price / drive (Raid 0,1) performance & performance / watt • Redundant, hot-swappable PSUs and Fans • Scale-Out of web & network • 3 PCI-E expansion slots infrastructure (2 x 10 GBE I/0 slots) • 4 x 1GbE Ethernet as standard • Direct replacement of • 4 USB ports T1000/T2000 12
- 13. SPARC edit thetitle text format Click to Enterprise T5220 • 2 RU chassis, 26.5” depth • Up to 8 cores @1.4GHz > Up to 64 threads • 16 FB-DIMM memory slots > 128GB of memory, (8GB DIMMs) • 8 hot plug SATA/SAS 2.5” disk drive (Raid 0,1) • Optimized for best price / • Redundant, hot-swappable PSUs performance & performance / watt and Fans • Scale-Out of web & network • 6 PCI-E expansion slots (2 x 10 GBE I/0 slots) infrastructure • 4 x 1GbE Ethernet as standard • Direct replacement of • 4 USB ports T1000/T2000 13
- 14. Each Coherency Link6.4GBytes/s per direction, 12.8GB/s total • Click to edit the title text format Per Socket 4 x Coherency links give Snoop bandwidth of 51.2GB/s > Up to 8 cores @1.2GHz or 1.4GHz FB-DIMM FB-DIMM FB-DIMM FB-DIMM > Up to 64 Threads per socket 4x FB-DIMM FB-DIMM FB-DIMM FB-DIMM Coherency > 4MB L2$ 8 banks x 16 Way SA Links > Up to 8 FPU's, 1 per core MCU MCU > Up to 8 Crypto cores, 1 per core CU CU CU CU > 2 memory Controllers, 16 DIMMS L2$ L2$ L2$ L2$ L2$ L2$ L2$ L2$ > 25Read+13WriteGB/s Memory BW Full Cross Bar > One x8 PCIe interface CO C1 C2 C3 C4 C5 C6 C7 FPU FPU FPU FPU FPU FPU FPU FPU • Per system MAU MAU MAU MAU MAU MAU MAU MAU > 2 sockets glue-less > 4 sockets using UST2 Plus XBR System I/F PCI-Express > 16 or 32 PCIe lanes on 2 or 4 x8 @2.5GHz Socket systems SSI Bus Power ~105W 4GBytes/s • 65nm process technology <1.5W/thread bi-directional 14
- 15. Sun SPARC Enterprise T5140/T5240 Continues to offer N2/T5120/T5220 values: • Security – embedded crypto • Networking – on-board 10GbE (not on- chip) • Floating Point – FPU per core • High Reliability – hot-plug HDD, • Expanding the CMT line to include redundant/hot-swap PSU and fans, low total part count multi-processor systems New features include: • First Victoria Falls based platform • More capacity: > 2 VF processors per system • 4/6/8 cores per CPU - Up to 128 > More PCI-E IO lanes (all slots x8) threads > 8-disk 1U and 16-disk 2U configs available • Twice the threads of T5120/T5220 in > Up to 32 DIMMs in the 2U the same footprint • Enhanced Virtualization: > 128 isolated OS instances utilizing • Memory capacity at RR of up to 64GB LDOMs (1U) or 128GB (2U), FB-DIMM 15
- 16. Sun SPARC Enterprise New features include: T5440 • More capacity: > 4 VF processors per system > 1.2 and 1.4 GHz offerings > 6 or 8 cores per CPU > 8 PCI-E slots (all slots x8) > Scaling CMT to New Heights > Two intended for graphics > 4 sockets / 256 threads > Two shared with XAUI > Up to 512GB Memory > Up to 64 DIMMs slots > Up to 28 x PCI-E slots (with 2 I/O > 256 GB with 4 GB DIMMs Boxes) • Enhanced Virtualization: > 128 isolated OS instances > Extends T5120/T5220 and utilizing LDOMs T5140/T5240 proposals > Electronic Prognostics > Monitors internal sensors to anticipate failures 16
- 17. Sun и Intel– родственность технологий • многоядерные процессоры • многопроцессорные системы • контроллер оперативной памяти на одном кристалле с процессором • скоростная шина обмена данными • встроенная поддержка технологий виртуализации 17
- 18.
- 19. Sun Blade 6000 Clickto edit the title text format • Chassis > 10 RU, 24” deep > 6000W (N+N grid redundant) > Service Processor/CMM > 2 PCI-E Express modules/blade > 2 NEMs • Up to 10 Blades > AMD Opteron dual socket > Intel Xeon dual/quad socket > Niagara T2 single socket 19
- 20. Passive Midplane Front – Server Module Rear – NEM, EM and and Power Supply Connectors Rear Fan Module Connectors PCI-E ExpressModule Connectors to Server Server Module power connectors Front Panel LED control board ● Server Module I/O connectors ● Network Express Module connectors ● Network Express Modules ● Each NEM provides: ● Two PCI Express x8 interfaces or CMM connector ● To every Server Module ● Two XAUI interfaces (GbE, FC or IB) ● PCI Express x8 interface or ● Serial Attached SCSI links (4 total) ● XAUI interface (GbE, FC or IB) ● Gigabit Ethernet links (2 total) Serial Attached SCSI links (2 total) Modules ● ● PCI ExpressModules ● Gigabit Ethernet link (1 total) ● Two PCI Express x8 interfaces ● CMM Ethernet link ● Service Processor Ethernet link ● I2C Network 20 ● I2C Network
- 21. 21 Passive Midplane DataInterfaces thernet E rocessor E x8 Service P PCI- x8 -E AUI I PC or X net E x8 r PCI- bit Ethe a Gig SAS AUI o r X net E x8 r PCI- bit Ethe a Gig AS S
- 22. CMT Blades Best forBusiness Infrastructure Free Virtualization and Wire-Speed Encryption • Sun Blade T6320 • 3x more I/O throughput T6320 T6340 than IBM Sockets 1 2 • 2x more memory than IBM 8 Core 2X UltraSPARC T2+ CPU • Sun Blade T6340 UltraSPARC T2 with 16 Core Memory Up to 128 GB Up to 256 GB • 5x more core density than HP On-Chip 10 GbE Yes No 2X PCIe 1.0 X8, 2X PCIe 1.0 X8, • 2x more memory than HP PCle I/O 2X Pcle X4 2X Pcle X4 • Industry’s most flexible I/O • Pre-installed cost free Solaris 10 and LDom 22
- 23. AMD Blades Best BusinessVirtualization Platform • Sun Blade X6240 • Ideal blade for core IT infrastructure apps • 2.7x more I/O throughput X6240 X6440 and 2x more memory Sockets 2 4 than HP Six-Core or Quad-core Six-Core or Quad-core CPU • Sun Blade X6440 AMD Opterons AMD Opterons • Ideal blade for core business Memory Up to 128 GB Up to 256 GB applications requiring I/O virtualization Throughput 142 Gb/s 142 Gb/s • Industry’s leading I/O throughput and leading memory capacity 23
- 24. Intel Blades Best Scalabilityand Compute Density • Sun Blade X6270: ● Best business blades, ideal for single demanding or multiple virtualized business workloads X6270 X6275 ● Up to 2x more hot plug storage ● Up to 4x the I/O throughput Sockets 2 2 per node/4 total (270Gb/s) Four-Core Intel® Xeon® Four-Core Intel® Xeon® CPU Processor 5500 Series Processor 5500 Series • Sun Blade X6275: ● On-board IB or standard Ethernet Memory Up to 144 GB (18 DDR3 DIMMs) Up to 96 GB per node/ 192 GB total (24 DDR3 DIMMs) ● Industry TOP HPC blade with I/O unmatched capabilities Throughput Up to 270 Gb/s Up to 129 Gb/s per node ● Up to 9 TFLOPS peak performance ● Leading density - 2x compute nodes in a single blade ● End-to-End Quad Data Rate IB 24
- 25. Gigabit Ethernet Pass-throughNEM Midplane connectors The Gigabit Ethernet Blade 9 Blade 7 Blade 2 Blade 1 Blade 8 Blade 6 Blade 5 Blade 4 Blade 3 Blade 0 pass-through NEM provides connectivity to external network switches which allow Server Module communications to the outside External Network Ports 25
- 26. PCI Express ExpressModules •EMs available from Sun: • Future EMs: > Dual-port GbE EM > Quad-port Gb EM > Dual-port 4Gbps > 10GbE EM FiberChannel EM > Quad-port FC-AL > Dual-port 4X InfiniBand EM 26
- 27. Старый новый способ хранения данных 27
- 28.
- 29. Современные жесткие диски Enterprise HDD > 180 Write IOPS > 320 Read IOPS > 300 GB > ~18W 29
- 30. Традиционное решение проблемы Увеличение объема кеша 30
- 31. Традиционное решение проблемы - большое количество дисков - запись на внешние (более быстрые) дорожки 31
- 32. Новые возможности хранения данных • Enterprise SSD > 7,000 Write IOPS > 35,000 Read IOPS > 32GB > ~3W 32
- 33. Что внутри EnterpriseSSD 33
- 34. Похожий на обычныйдиск ... 34
- 35. ... или намодуль оперативной памяти 35
- 36. ... или наRAID-контроллер Super Capacitor Internal SAS Connectors (SFF 8087) Flash Modules 36
- 37. Новые серверы Compute сиспользованием 2x Intel Xeon 5500-series ● ● 18x DDR3-1333 RDIMMs SSD ● 144 GB Max (RR + 90 days) ● 72 GB Max at RR I/O ● 3/6x PCIe Gen 2 slots (1 x16, 2 x8) ● 8/16 x SFF SAS & SATA drives ● 8/16 SAS/SATA HDDs/SSDs (w/ HBA) ● 6/12 SATA HDDs/SSDs (w/o HBA) ● Internal CompactFlash and USB ● 4x on-board Gigabit Ethernet ports Availability ● Hot-swap disks ● HW RAID 0,1,5,6,10,50,60 (w/ HBA) ● Hot-swap redundant 750W PSUs ● Hot-swap redundant fans Management ● Integrated LOM Service Processor 37
- 38. Нам не нужны такие мощные серверы! 38
- 39.
- 40. Industry Leading ServerVirtualization Hard Partitions Virtual Machines OS Virtualization Resource Management App Server Database Identity Server File Server Web Server Mail Server Calendar Server Database Web Server SunRay Server Database App Server App OS Server Multiple OSs Single OS Trend to flexibility Trend to isolation Dynamic System Solaris Resource Sun xVM Solaris Containers Domains (Zones + SRM) Manager > Very High RAS (LDoms and Xen) (SRM) > Very Scalable VMware Solaris Trusted > Very scalable and low overhead > Mature Technology Microsoft Extensions > Single OS to manage > Ability to run different Virtual Server Solaris Containers for Linux Applications > Fine grained resource OS versions management 40
- 41. Logical Domains Technology • Virtualization and partitioning of machine resources > Each domain is a full virtual machine, with a dynamically reconfigurable sub-set of machine resources, and its own independent OS > Protection & isolation via SPARC hardware and hypervisor firmware LDom A LDom B LDom C LDom D OS Environment of choice Linux FreeBSD LDoms Manager Hypervisor CPU CPU CPU CPU CPU CPU CPU CPU Platform Memory Memory Memory Memory Hardware I/O I/O 41
- 42. Driving Innovation atEvery Level: UltraSPARC® T2 Plus Processor Third-generation CMT Processors Pack 128 Systems into a single 4RU package Sun started the multithreaded revolution in 2005, and is still the industry leader, with more threads per core than anyone else 42
- 43. Click to editthe title text format Новый взгляд на современные системы Владимир Овчинников Системный инженер Sun Microsystems 43