How will AI impact the semiconductor market through consumer applications?
More information on that report at : https://www.i-micronews.com/report/product/hardware-and-software-for-ai-2018-consumer-focus.html
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2022/06/autonomous-driving-ai-workloads-technology-trends-and-optimization-strategies-a-presentation-from-qualcomm/
Ahmed Sadek, Senior Director of Engineering at Qualcomm, presents the “Autonomous Driving AI Workloads: Technology Trends and Optimization Strategies” tutorial at the May 2022 Embedded Vision Summit.
Enabling safe, comfortable and affordable autonomous driving requires solving some of the most demanding and challenging technological problems. From centimeter-level localization to multimodal sensor perception, sensor fusion, behavior prediction, maneuver planning and trajectory planning and control, each one of these functions introduces its own unique challenges that must be solved, verified, tested and deployed on the road.
In this talk, Sadek reviews recent trends in AI workloads for autonomous driving as well as promising future directions. He covers AI workloads in camera, radar and lidar perception, AI workloads in environmental modeling, behavior prediction and drive policy. To enable optimized network performance at the edge, quantization and neural architecture optimization are typically performed either during training or post-training. Sadek also covers the importance of hardware-aware quantization and network architecture optimization, and introduces the innovation done by Qualcomm in these areas.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
3 Military Applications of the Internet of ThingsTyrone Systems
The Internet of Things (IoT) is a potential solution to this problem. By integrating systems of sensors, actuators, and control systems into existing military infrastructures, the military can become more efficient and effective.
As generative AI adoption grows at record-setting speeds and computing demands increase, hybrid processing is more important than ever. But just like traditional computing evolved from mainframes and thin clients to today’s mix of cloud and edge devices, AI processing must be distributed between the cloud and devices for AI to scale and reach its full potential. In this talk you’ll learn:
• Why on-device AI is key
• Which generative AI models can run on device
• Why the future of AI is hybrid
• Qualcomm Technologies’ role in making hybrid AI a reality
For the full video of this presentation, please visit: https://www.edge-ai-vision.com/2022/06/autonomous-driving-ai-workloads-technology-trends-and-optimization-strategies-a-presentation-from-qualcomm/
Ahmed Sadek, Senior Director of Engineering at Qualcomm, presents the “Autonomous Driving AI Workloads: Technology Trends and Optimization Strategies” tutorial at the May 2022 Embedded Vision Summit.
Enabling safe, comfortable and affordable autonomous driving requires solving some of the most demanding and challenging technological problems. From centimeter-level localization to multimodal sensor perception, sensor fusion, behavior prediction, maneuver planning and trajectory planning and control, each one of these functions introduces its own unique challenges that must be solved, verified, tested and deployed on the road.
In this talk, Sadek reviews recent trends in AI workloads for autonomous driving as well as promising future directions. He covers AI workloads in camera, radar and lidar perception, AI workloads in environmental modeling, behavior prediction and drive policy. To enable optimized network performance at the edge, quantization and neural architecture optimization are typically performed either during training or post-training. Sadek also covers the importance of hardware-aware quantization and network architecture optimization, and introduces the innovation done by Qualcomm in these areas.
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
3 Military Applications of the Internet of ThingsTyrone Systems
The Internet of Things (IoT) is a potential solution to this problem. By integrating systems of sensors, actuators, and control systems into existing military infrastructures, the military can become more efficient and effective.
As generative AI adoption grows at record-setting speeds and computing demands increase, hybrid processing is more important than ever. But just like traditional computing evolved from mainframes and thin clients to today’s mix of cloud and edge devices, AI processing must be distributed between the cloud and devices for AI to scale and reach its full potential. In this talk you’ll learn:
• Why on-device AI is key
• Which generative AI models can run on device
• Why the future of AI is hybrid
• Qualcomm Technologies’ role in making hybrid AI a reality
RATION DISTRIBUTON -RAJIV GANDHI INSTITUTE OF TECHNOLOGYMOHAMMED AZEEZULLA
VISVESVARAYA TECHNOLOGICAL UNIVERSITY
RAJIV GANDHI INSTITUTE OF TECHNOLOGY
DEPT. OF ECE
Project Review on
“RFID AND GSM BASED AUTOMATIC RATION DISTRIBUTION SYSTEM USING ARM PROCESSOR ”
Seminar by:
KANCHAN KUMAR MAHATO [1RG11EC017]
P. VENKATESH [1RG13EC039]
K.M MOHAMMED AZEEZULLA [1RG13EC014]
Internal guide : Mrs.PADMAVATHI.R
associate professor
20 Latest Computer Science Seminar Topics on Emerging TechnologiesSeminar Links
A list of Top 20 technical seminar topics for computer science engineering (CSE) you should choose for seminars and presentations in 2019. The list also contains related seminar topics on the emerging technologies in computer science, IT, Networking, software branch. To download PDF, PPT Seminar Reports check the links.
PPT is presenting the Qualcomm Snapdragon SoC family use in mobile devices and further ARM microcontroller architecture is discussed with its programmer's model, instructions set, etc.
Embedded system, basic structure, characteristics, advantages, disadvantages of Embedded system, open source Embedded platforms and its benefits, sensors, actuators, DAS.
In this talk, we will briefly review the current trend toward Edge Computing first. Then, characteristics and requirements for the Industrial Edge Computing will be addressed and discussed. Among them, Decentralized Fault-Resilient Architecture, Time-sensitive Operations, Data-centric Computation, Autonomous Systems and Flexibility are the most important ones. Some influential open-source projects for the industrial edge computing will also be introduced in this talk, including Cyclone DDS, ROS2, Autoware and zenoh.
This video and the corresponding presentation looks at the definition of Extended Reality, XR and how 3GPP 5G standards are evolving to cater for XR in the future releases.
XR is an umbrella term for all the immersive technologies. The ones we already have today are Augmented Reality (AR), Virtual Reality (VR), and Mixed Reality (MR) plus those that are yet to be created. All immersive technologies extend the reality we experience by either blending the Real and/or Virtual Worlds or by creating a fully immersive experience.
The video for this presentation is available here: https://www.youtube.com/watch?v=nDAmK3jhCuQ
All our #3G4G5G slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
IoT Solutions for Smart Energy Smart Grid and Smart Utility ApplicationsEurotech
Smart Energy Smart Grid and Smart Infrastructure - Many Applications and Devices
An introduction to Eurotech' s IoT Field-to-Application Building Blocks for the Energy and Utility Industry
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
RATION DISTRIBUTON -RAJIV GANDHI INSTITUTE OF TECHNOLOGYMOHAMMED AZEEZULLA
VISVESVARAYA TECHNOLOGICAL UNIVERSITY
RAJIV GANDHI INSTITUTE OF TECHNOLOGY
DEPT. OF ECE
Project Review on
“RFID AND GSM BASED AUTOMATIC RATION DISTRIBUTION SYSTEM USING ARM PROCESSOR ”
Seminar by:
KANCHAN KUMAR MAHATO [1RG11EC017]
P. VENKATESH [1RG13EC039]
K.M MOHAMMED AZEEZULLA [1RG13EC014]
Internal guide : Mrs.PADMAVATHI.R
associate professor
20 Latest Computer Science Seminar Topics on Emerging TechnologiesSeminar Links
A list of Top 20 technical seminar topics for computer science engineering (CSE) you should choose for seminars and presentations in 2019. The list also contains related seminar topics on the emerging technologies in computer science, IT, Networking, software branch. To download PDF, PPT Seminar Reports check the links.
PPT is presenting the Qualcomm Snapdragon SoC family use in mobile devices and further ARM microcontroller architecture is discussed with its programmer's model, instructions set, etc.
Embedded system, basic structure, characteristics, advantages, disadvantages of Embedded system, open source Embedded platforms and its benefits, sensors, actuators, DAS.
In this talk, we will briefly review the current trend toward Edge Computing first. Then, characteristics and requirements for the Industrial Edge Computing will be addressed and discussed. Among them, Decentralized Fault-Resilient Architecture, Time-sensitive Operations, Data-centric Computation, Autonomous Systems and Flexibility are the most important ones. Some influential open-source projects for the industrial edge computing will also be introduced in this talk, including Cyclone DDS, ROS2, Autoware and zenoh.
This video and the corresponding presentation looks at the definition of Extended Reality, XR and how 3GPP 5G standards are evolving to cater for XR in the future releases.
XR is an umbrella term for all the immersive technologies. The ones we already have today are Augmented Reality (AR), Virtual Reality (VR), and Mixed Reality (MR) plus those that are yet to be created. All immersive technologies extend the reality we experience by either blending the Real and/or Virtual Worlds or by creating a fully immersive experience.
The video for this presentation is available here: https://www.youtube.com/watch?v=nDAmK3jhCuQ
All our #3G4G5G slides and videos are available at:
Videos: https://www.youtube.com/3G4G5G
Slides: https://www.slideshare.net/3G4GLtd
5G Page: https://www.3g4g.co.uk/5G/
Free Training Videos: https://www.3g4g.co.uk/Training/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
IoT Solutions for Smart Energy Smart Grid and Smart Utility ApplicationsEurotech
Smart Energy Smart Grid and Smart Infrastructure - Many Applications and Devices
An introduction to Eurotech' s IoT Field-to-Application Building Blocks for the Energy and Utility Industry
Artificial Intelligence Computing for Consumer 2019 report by Yole Développem...Yole Developpement
While AI is a feature expected in smartphones, this fantastic technology has spread like wildfire to the smart home ecosystem and is profoundly impacting the semiconductor industry.
More information on https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Microphones, Microspeakers and Audio Solutions Market and Technology Trends 2019Yole Developpement
The voice-based world is shaking up the audio industry, making it worth $20.8B in 2024.
More information on https://www.i-micronews.com/products/microphones-microspeakers-and-audio-solutions-market-and-technology-trends-2019/
Artificial Intelligence Computing for Automotive 2019 Report by Yole Développ...Yole Developpement
Artificial Intelligence for automotive: why you should care.
More information on that report at: https://www.i-micronews.com/produit/artificial-intelligence-computing-for-automotive-2019/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Imaging Technologies for Automotive 2016 Report by Yole Developpement Yole Developpement
Imaging technology, which is currently mainly cameras, is exploding into the automotive space, and is set to grow at 20% CAGR to reach $7.3B in 2021
INFOTAINMENT AND ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS) PROPEL AUTOMOTIVE IMAGING
Since 2008, when a recession acted as a wakeup call to the whole industry, the automotive market has undergone obvious structural change. Capitalizing on technologies initially developed for smartphones, electronics have invaded, and imaging technology is now taking center stage. From less than one camera per car on average in 2015, there will be more than three cameras per car by 2021, which means 371 million automotive imaging devices.
Cameras were initially mounted for ADAS purposes on high-end vehicles, with deep learning image analysis techniques promoting early adoption. The Israeli company Mobileye has been instrumental in bringing this technology to market, along with On Semiconductor, which provided the CMOS image sensor. Copycat competition will probably pick up as the market now justifies initial investment in design and technology. It is now a well-established fact that vision-based autonomous emergency braking (AEB) is possible and saves life. Adoption of forward ADAS cameras will therefore accelerate.
Growth of imaging for automotive is also being fueled by the park assist application, and 360° surround view camera volume is skyrocketing. While it’s becoming mandatory in the US to have a rearview camera, that uptake is dwarfed by 360° surround view cameras, which enable a “bird’s eye view” perspective. This trend is most beneficial to companies like Omnivision at sensor level and Panasonic and Valeo, which have become the main manufacturers of automotive cameras.
Mirror replacement cameras are currently the big unknown and take-off will primarily depend on its appeal and car design regulation. Europe and Japan are at the forefront of this trend, which should become slightly significant by 2021.
Solid state lidar is well talked about and will start to be found in high end cars by 2021. Cost reduction will be a key driver as the push for semi-autonomous driving will be felt more strongly by car manufacturers. The report will analyse the impact of lidar for automotive vision in detail.
Night vision cameras using Long Wave Infrared (LWIR) technology were initially perceived as a status symbol. However, they’re increasingly appreciated for their ability to automatically detect pedestrians and wildlife. LWIR will therefore become integrated into ADAS systems in future.
3D cameras will be limited to in-cabin infotainment and driver monitoring. This technology will be key for luxury cars and therefore is of limited use today.
If any significant semi-autonomous trend picks up, the technology will probably become mandatory, due to safety issues.
More information on that report at http://www.i-micronews.com/reports.html
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
CMOS Image Sensor Service – Imaging Research 2019 Monitors by Yole DéveloppementYole Developpement
As camera quantity and die size increase per end-device, a 10.1% year-on-year growth rate is expected for 2019.
More information on CMOS monitor at: https://www.i-micronews.com/products/cmos-image-sensor-service-camera-module-research/
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
For the full video of this presentation, please visit:
https://www.embedded-vision.com/platinum-members/embedded-vision-alliance/embedded-vision-training/videos/pages/may-2019-embedded-vision-summit-tschudi
For more information about embedded vision, please visit:
http://www.embedded-vision.com
Yohann Tschudi, Technology and Market Analyst at Yole Développement, presents the "AI Is Moving to the Edge—What’s the Impact on the Semiconductor Industry?" tutorial at the May 2019 Embedded Vision Summit.
Artificial intelligence is proliferating into numerous edge applications and disrupting numerous industries. Clearly this represents a huge opportunity for technology suppliers. But it can be difficult to discern exactly what form this opportunity will take. For example, will edge devices perform AI computation locally, or in the cloud? Will edge devices use separate chips for AI, or will AI processing engines be incorporated into the main processor SoCs already used in these devices?
In this talk, Tschudi answers these questions by presenting and explaining his firm's market data and forecasts for AI processors in mobile phones, drones, smart home devices and personal robots. He explains why there is a strong trend towards executing AI computation at the edge, and quantifies the opportunity for separate processor chips and on-chip accelerators that address visual and audio AI tasks.
Paramount to the future of safety and autonomy, the automotive imaging market is at a key crossroads.
More information on https://www.i-micronews.com/products/imaging-for-automotive-2019/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Next-Generation Human Machine Interaction in Displays 2019 report by Yole Dév...Yole Developpement
Sensors directly integrated in displays: still a long way to wow!
More information on https://www.i-micronews.com/products/next-generation-human-machine-interaction-in-displays-2019/
The global IoT Sensors market report provides geographic analysis covering regions, such as North America, Europe, Asia-Pacific, and Rest of the World. The IoT Sensors market for each region is further segmented for major countries including the U.S., Canada, Germany, the U.K., France, Italy, China, India, Japan, Brazil, South Africa, and others.
Image Signal Processor and Vision Processor Market and Technology Trends 2019...Yole Developpement
Artificial intelligence-powered newcomers are reshuffling the pack.
More information on https://www.i-micronews.com/products/image-signal-processor-and-vision-processor-market-and-technology-trends-2019/
From almost zero to a multi-billion dollar market in three years!
Apple introduced the iPhone 5s in 2013, after acquiring Authentec a year earlier. Since then, fingerprint sensors have been massively adopted, and the volumes of sensors shipped into the consumer market have grown incredibly. At first, the sensors were a convenience and protection feature for unlocking phones. However, they are now shifting into a security feature for online identification and mobile payment in an increasing number of smartphones.
From 23 million units in 2013, 689 million fingerprint sensors for smartphones were sold in 2016. This is an incredible 210% compound annual growth rate (CAGR) between 2013 and 2016! The 2016-2022 timeframe will see a more reasonable, but still impressive, 19% CAGR.
Fingerprint sensing is becoming a mandatory feature on every smartphone, adding a lot of value. However such an increase in volume is always followed by strong cost pressure, and this is what has happened over the last three years. The average cost of a fingerprint sensor has decreased from around $5 in 2013 to $3 in 2016, and even less for low-end technologies. And the pressure hasn’t gone away. Current technologies have now reached maturity, and are threatened by new technologies, which need lower cost to gain momentum. This is the case for ultrasonic detection, for instance.
For more information please visit our website: http://www.i-micronews.com/reports.html
Proliferation of cameras for imaging and sensing is driving CMOS image sensor (CIS) growth.
More information on that report at : https://www.i-micronews.com/report/product/status-of-the-cis-industry-2018.html
Report’s Key Features
• PDF with > 80 slides
• Excel file > 4,350 patents
• Overview of the most recent patents published in 2019 by MEMS players.
• Main patent applicants.
• Main MEMS technologies and devices analyzed:
– Inertial sensors (accelerometers, gyroscopes, IMUs)
– Microphones
– Microspeakers
– Ultrasonic sensors
– Gas sensors
– Pressure sensors
– Micromirrors
– MEMS Packaging
• IP dynamics and trends of the different MEMS devices.
• Comparison of recent IP and market activities.
• Noticeable 2019 patents from main players.
• Excel database containing all patents analyzed in the report, including technology and application segmentation.
Sensors for robotic vehicles 2018 report by yole developpement i-micronewsYole Developpement
High end industrial sensors will win in the emerging robotic vehicle industry.
THE ROBOTIC VEHICLE SUPPLY CHAIN IS NOW STARTING
Announcements are piling up from companies like
Waymo, Uber, Lyft, Baidu and their automotive
manufacturing partners such as Fiat Chrysler
Automobiles, Mercedes, BMW and Renault-
Nissan. 2018 will most probably be the initial launch
year for robotic taxis in several cities around the
globe. The move has direct consequences for
technology providers in high-end sensing and
computing equipment. The vehicle count that we
can collect suggests several tens of thousands of
vehicles on the road worldwide before end of
2022. As far as we know, each robotic vehicle will
be equipped with a suite of sensors encompassing
Lidars, radars, cameras, Inertial Measurement
Units (IMUs) and Global Navigation Satellite
Systems (GNSS). The technology is ready and
the business models associated with autonomous
driving (AD) seem to match the average selling
prices for those sensors.
Similar to Hardware and Software for AI 2018 – Consumer focus (20)
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
Slack (or Teams) Automation for Bonterra Impact Management (fka Social Soluti...Jeffrey Haguewood
Sidekick Solutions uses Bonterra Impact Management (fka Social Solutions Apricot) and automation solutions to integrate data for business workflows.
We believe integration and automation are essential to user experience and the promise of efficient work through technology. Automation is the critical ingredient to realizing that full vision. We develop integration products and services for Bonterra Case Management software to support the deployment of automations for a variety of use cases.
This video focuses on the notifications, alerts, and approval requests using Slack for Bonterra Impact Management. The solutions covered in this webinar can also be deployed for Microsoft Teams.
Interested in deploying notification automations for Bonterra Impact Management? Contact us at sales@sidekicksolutionsllc.com to discuss next steps.
Builder.ai Founder Sachin Dev Duggal's Strategic Approach to Create an Innova...Ramesh Iyer
In today's fast-changing business world, Companies that adapt and embrace new ideas often need help to keep up with the competition. However, fostering a culture of innovation takes much work. It takes vision, leadership and willingness to take risks in the right proportion. Sachin Dev Duggal, co-founder of Builder.ai, has perfected the art of this balance, creating a company culture where creativity and growth are nurtured at each stage.
Connector Corner: Automate dynamic content and events by pushing a buttonDianaGray10
Here is something new! In our next Connector Corner webinar, we will demonstrate how you can use a single workflow to:
Create a campaign using Mailchimp with merge tags/fields
Send an interactive Slack channel message (using buttons)
Have the message received by managers and peers along with a test email for review
But there’s more:
In a second workflow supporting the same use case, you’ll see:
Your campaign sent to target colleagues for approval
If the “Approve” button is clicked, a Jira/Zendesk ticket is created for the marketing design team
But—if the “Reject” button is pushed, colleagues will be alerted via Slack message
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2. 2
REPORT OBJECTIVES
1. To provide a scenario for AI within the dynamics of the consumer market and understand the impact of AI on
the semiconductor industry
o Hardware for AI revenue forecast, volume shipments forecast
o Systems ASP forecast, revenue forecast, volume shipments forecast
o Focus on consumer applications embedding technologies: smartphone, drones, cameras, smart/robot home
2. To provide in-depth understanding of the ecosystem & players.
o Who are the players? What are the relationships inside this ecosystem? Who will win the battle for controlling the data?
o Who are the key suppliers to watch and which technologies do they provide?
3. To provide key technical insight & analysis about future technology trends and challenges.
o Key technology choices
o Technology dynamics
o Emerging technologies and roadmaps
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
3. 3
WHO SHOULD BE INTERESTED IN THIS REPORT?
IC manufacturers and vendors and intellectual
property sellers:
o Evaluate market potential of future technologies
and products for new applicative markets
o Screen potential new suppliers for introducing new
disruptive technologies
o Monitor and benchmark your competitors’
advancements
Artificial Intelligence related companies:
o Spot new technologies and define diversification
strategies
o Position your company in the ecosystem
Technology suppliers:
o Understand the strategies of big players as well as
start-ups
Equipment and materials manufacturers:
o Understand the ecosystem dynamics
o Understand the differentiated value of your products
and technologies in this market
o Identify new business opportunities and prospects
Electronics manufacturers and original equipment
makers:
o Evaluate the benefits of using these new technologies
in your end-system
o Screen and select new sensor suppliers
Financial and strategic investors:
o Understand the potential of technologies and
markets
o Familiarize yourself with key emerging companies and
start-ups
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
4. 4
METHODOLOGY
• Our methodology in building our market forecasts is quite different to other market research companies' methodologies:
o Our approach is to build a model where data from product shipments, module sales, sensor production and player
market share are all linked with detailed assumptions.
• To do so, we collect data from multiple sources including:
o Open-source secondary data from industry observers OICA, UN, IMF…
o Primary data from direct interviews and visits with players.
o Direct contacts and surveys with equipment & material suppliers.
o Direct analysis from teardown reports: especially from System Plus Consulting.
o From specific markets we previously surveyed in different areas, such as mobile cameras, medical, or automotive
sensors, amongst others.
• As a result, today we are able to present unique key market metrics that result directly from this primary research work:
o The main advantage of this approach is to be able to deliver a scenario grounded in feedback from the players
themselves.
o We plan to update the market information presented in this study within 1-2 years.
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
5. 5
METHODOLOGIES & DEFINITIONS
Market forecast model is based on the following elementary structured blocks:
Yole’s analysis
framework
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
6. 6
SCOPE OF THE REPORT
Speech Recognition
Software
Scene understanding
Object detection
Authentication
Vision
processor
Vision
processing unit
Hardware
Sound
processor
Sound
processing unit
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Focus on 3
representative
consumer markets
Smartphone
Drone
Robot
home
Audio
GPU
DCHW
GPU
DC HW
Imaging
Edge
computing
Cloud
computing
Headset
Camera
VPA
7. 7
TABLE OF CONTENTS
o REPORT OBJECTIVES & METHODOLOGY 4
o EXECUTIVE SUMMARY 13
1 – INTRODUCTION 45
2 – MARKET & TECHNOLOGY TRENDS 59
o Smartphone 70
o Consumer drones 81
o Smart/robot home 87
3 – MARKET FORECASTS 99
o Smartphone – 5 years forecast 101
o Smartphone SoC – 5 years forecast 102
o Smartphone – OEM vs manufacturers 104
o Smartphone – AI SoC – 5 years forecast 107
o Consumer drone – 5 years forecast 108
o Consumer drone – AI hardware – 5 years forecast 112
o Audio – AI hardware market value – 10 years forecast 113
o Audio – Embedded SPU – 10 years forecast 115
o Audio – Sound processor – 10 years forecast 117
o Imaging – Vision processor – 5 years forecast 118
o Imaging – Embedded VPU – 5 years forecast 120
o Imaging – AI market value by type – 5 years forecast 122
o Embedded vs standalone hardware for AI revenue 123
4 – ECOSYSTEMS 124
o Hardware for AI – Introduction 126
o Hardware for AI – Smartphone 145
o Hardware for AI – Consumer drone 166
o Software for AI – Design 183
o Software for AI – Strategy 190
5 –TECHNOLOGIES 216
o Hardware – Smartphone SoC physical description 217
o Hardware – Cloud computing integration 228
o Software – Biometrics authentication 234
o Software –Virtual Personal Assistant 247
o Software – Photography and augmented reality 254
o Software – Gesture recognition 259
6 – ALGORITHMS REVIEW 262
o AI algorithms for imaging 263
o AI algorithms for audio 270
7 – CONCLUSION 281
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
8. 8
ABOUTTHE AUTHORS OF THIS REPORT
Biography & contact details
Adrien Sanchez
As a Technology and market Analyst, Adrien Sanchez is a member of the Semiconductor & Software business unit at Yole
Développement (Yole), part of Yole Group of Companies. Adrien performs, in collaboration with his team, reports covering
software, Artificial Intelligence, machine learning, neural network and AI dedicated hardware.
Adrien is preparing a double degree with Grenoble Institute of Technology PHELMA (Grenoble INP Phelma, France) and
Grenoble Ecole de Management (GEM, France). Prior Yole he worked as an intern at AW Europe (Belgium) on image recognition
and comprehension for ADAS.”
Contact: sanchez@yole.fr
As a Software & Market Analyst, Dr. Yohann Tschudi is a member of the Semiconductor & Software division at Yole
Développement (Yole). Yohann is daily working with his team, to identify, understand and analyze the role of the software and
computing parts within any semiconductor products, from the machine code to the highest level of algorithms. After his thesis at
CERN (Geneva, Switzerland), Yohann developed a dedicated software for fluid mechanics and thermodynamics applications.
Afterwards, he served during 2 years at the University of Miami (FL, United-States) as an AI scientist. Yohann has a PhD in High
Energy Physics and a master degree in Physical Sciences from Claude Bernard University (Lyon, France).
Contact: tschudi@yole.fr
YohannTschudi
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
11. 11
IMAGING – EMERGENCE OF AI
AI in imaging has been made possible thanks to 2 parameters :
• Availability of computing hardware at low cost with the use of GPU which was first dedicated to graphics in gaming;
• Availability of data for training neural networks and accumulated on Cloud servers since internet exists.
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Moore’s
law
End of Moore’s law?
12. 12
AUDIO ON THE EDGE TRICKIER THAN IMAGING
• Several layers of algorithms
• Always on
• Latency
• Low power
• Small size
• Time dimension
• Still in R&D
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Low-level algorithms
Audio signal processing
Sampling, filtering, compression,…
Mid-level algorithms
Preparing the input
Noise cancellation, Beamforming, …
High-level algorithms
Machine Learning
Natural Language Processing
Speech recognition
Digital Signal
Processor
Sound/Speech
Processing Unit
• Two layers of algorithms
• Latency
• Not always on
• No low power requirements
• Size less important
• No time dimension
• Mature
13. 13
WHERE IS AI ON THE CONSUMER MARKET?
3 consumer
markets are
addressed
in this
report
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Smartphone
3 representative markets
of the impact of AI
Robot home
Drone
Hardware and
Software for AI:
Consumer focus
AI
Hardware
Softwar
e
A two-track
AI approach
• AI for imaging & AI for audio
• Edge or Cloud?
• New AI dedicated computing hardware?
• What are AI real benefits?
Mains
approaches and
questions
14. 14
SOFTWARE – CLOUD OR EDGE?
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
On the
device
On the cloud
One or the
other way
Exclusive
On the device for
internet connection and
personal data reasons
Biometric
authentication
Augmented
Reality
On the device for
latency reasons
Current trend
AI applications included finding and
sending information on internet
Speech recognitionSpeech recognition
Non-exhaustive list
NLP/NLU
E-commerce
AI applications that need internet to run
On internet information:
Meteo, Music, Wikipedia, real time
updated maps, news,…
Scene recognition
and optimization of
camera setting
On the device for
latency reasons
(and privacy?)
Object recognitionObject recognition Translation
Translation
Personal emoji
as Animoji
VPA
• Training
• Inference
• Inference
• (Training is
emerging)
15. 15
IMAGING – DEDICATED HARDWARE FOR AI
2 different
ways to
compute
imaging AI
Coming
down from
the
autonomous
automotive
market
Vision Processing Unit (VPU)
Unit embedded within the application processor (AP) of the system
Vision Processor (VP)
Specialized stand alone chip
AP enables to integrate
various functions into a single
chip, including imaging.
Imaging embedded in AP is
already in smartphone
applications.
Main application in consumer
is biometry, control (drones),
AR/VR and photography
New applications for VP
include mainly smart homes
Understand the environment around the
device
This type of unit has been created first to
compute ComputerVision algorithms
(Mobileye eyeQ)
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
16. 16
AUDIO – FUTURE DEDICATED HARDWARE FOR AI
2 different
ways to
compute
audio AI
On going
development
Sound Processing Unit (SPU)
Unit embedded within the application processor (AP) of the system
Sound Processor (SP)
Specialized stand alone chip
AP enables to integrate
various functions into a single
chip, including audio.
Audio embedded in AP is
spreading in smartphone
applications.
New applications with low
power and higher level audio
computation (AI) are pulling
for new audio dedicated
processing units, SPU.
New applications for SP
include smart homes,
headsets, and HMD.Focus on the future interaction mean
between a human and the home robot
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
17. 17
EMBEDDEDVS STAND ALONE HARDWARE FOR AI REVENUE IN $M
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Sound
Processor
46%
Embedded Sound
Processing Unit
4%
Vision
Processor
7%
Embedded Vision
Processing Unit
43%
2020e Sound
Processor
41%
Embedded Sound
Processing Unit
6%
Vision
Processor
15%
Embedded Vision
Processing Unit
38%
2023eVision
Processor
4%
Embedded Vision
Processing Unit
96%
2017
CAGR17-20 96%
CAGR17-20 501%
CAGR20-23 31%
CAGR20-23 36%
$635 $9,722
CAGR17-20 148%
$23,305
CAGR20-23 34%
$611
$24
$4,581
$5,141
$10,243
$13,062
Total embedded in
AP
Total
specialized chip
• We expect two different behaviors for imaging and audio: while audio AI will probably be run on a specialized stand alone chip, imaging AI will be embedded.
• This difference is mostly due to the smartphone market where computing for imaging is embedded in the AP and computing for audio can be found in both forms
• All the systems will have a place in many applications and embedded and standalone specialized chips will have almost equivalent revenues by 2023
18. 18
THE THREE ESSENTIAL BUILDING BLOCKS FOR SMART BUILDINGS
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
AI and data access are key for
creating value in the smart
homes. Sensors
can only provide data
AI
Data access
Connected
sensor hub
GAFAMS are the best positioned to
monetize data gathered from smart homes
and buildings
19. 19
ON THE ROAD TO ROBOT HOME – DATA
Data coming from sensors are stored and treated by companies that propose subscription for
services to consumer
About 30%
CAGR for all
sensors in
smart homes
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
These data are and will be
used as input for training
neural network
20. 20
ON THE ROAD TO ROBOT HOME
Convergence
of home
applications
Security
RobotsHome assistant,VPA, Hub
Tablet
Telepresence
Security
Home based
medical assistance
Elderly help
Companion Robot
Connectivity
Home help
Home comfort
Robot
home
Toy Robots
Pet Robots
Family Robots
Connected devices
Refrigerator
Audio system
Vacuum CleanerShutter
Lawnmower
Thermostat
Weather Station
Food dispenser
Lock
Senior fall detection
device
Camera
Alarm
Smoke detector
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
21. 21
DRONES – SOFTWARE OPTIMIZED FOR DEDICATED HARDWARE
Edge
computing and
AI implies
strong
requirements
in energy &
computing
efficiency
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
No
latency
No
dependency
to internet
coverage
Edge computing
Energy efficiency
AI-based
algorithms
Computing
efficiency
Dedicated
hardware
Optimized
software
for/and
Few players
Low power
consumption
Low latency
High bandwidth and #
operation per sec
22. 22
HARDWARE FOR AI:VALUE CHAIN FOR CONSUMER APPLICATIONS
@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
Without edge processing HW design
Specialization
Cloud
Edge
With edge processing HW design
Decentralized Centralized
Specialization
Edge
Edge
AP designers and
manufacturers
Close to sensor
• Today most of the value
coming from data is detained
by GAFAM & BATX
• They are even designing their
own hardware to get deeper in
the value chain
• There is a tough competition
on the edge between computing
close to sensor or centralized
in AP
23. 23
RELATED REPORTS
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@2018 | www.yole.fr | Hardware and software for AI - Consumer focus
24. This report is dedicated to the impact of Artificial
Intelligence (AI) on the semiconductor industry.
This trend is particularly important in this period
of slowdown in Moore's law and the increasing
regulation of data privacy. While the 1990s and
early 2000s saw the emergence of decentralized
computing with increasingly powerful central
processing units (CPUs) and graphics processing
units (GPUs) mounted on boards, the arrival of the
mobile phone created the need to have calculation
devices that are more efficient, smaller, and less
greedy. The centralization of computing was then
revealed as an adequate solution to meet its needs
and the system-on-chip (SoC), the technological
marker of this centralization, began to spread in
these systems. However, AI algorithms, mainly
convolutional neural networks (CNNs), involve
many operations. While GPUs were adapted
to the Cloud, they are less suitable for Edge
computing on the device itself for reasons of
excessive energy consumption.
This emerging desire to take the calculation to the
device itself is rather recent and corresponds to
a desire to free devices from the constraints of
the Cloud in areas like data privacy, security, cost
and latency. However, the constraints on the Edge
are also important: devices must consume little
power, always stay on and be fast and accurate.
With Moore's law slowing down, it is necessary
for companies to follow these trends today. To
deliver all the necessary criteria, they must create
hardware dedicated to the desired software
task. For AI in imaging, this dedicated hardware
corresponds to what Apple has named its ‘Neural
Engine’ for example. It provides accelerators
dedicated to extremely fast calculations of the
weights associated with neurons of the inference
network.
In this report, Yole Développement (Yole) look at
thesetrendsfortwodifferenttypesofarchitectures;
those embedded in the SoC and dedicated chips. AI
devices in imaging, such as Vision Processing Units
or Vision Processors (VPU/VP), and in audio, such as
Sound Processing Units or Sound Processors (SPU/
SP), are completely different in terms of algorithms
and resulting hardware. In all cases, in this race
for specialization and optimization, software and
hardware require common developments.
HARDWARE AND SOFTWARE FOR AI 2018
CONSUMER FOCUS
Market & Technology report - September 2018
FROM THE CLOUD TO THE EDGE; FROM MOORE'S LAW TO SPECIALIZATION
How will AI impact the semiconductor market through consumer applications?
KEY FEATURES
• Artificial Intelligence (AI)
technologies used in consumer
applications
• Cloud computing and edge
computing for AI
• System on chip including AI
units and sound processor/vision
processor for AI descriptions,
ecosystems and trends
• Focus on smartphones, drones and
smart home
• AI software design and companies’
strategies
(Yole Développement, September 2018)
PC Mobile Smart Cognition
Rise of AI
-
Imaging
Functionalities:
Key
events
1995
3D Graphics
Cards
2006
Deep Neural
Network with GPU
2000
Deep Neural
Network
2010
Siri
2014
Alexa
2017
First SoC
with NPU
Mobile
Virtual
personal
assistant
Smartphone
Smart
hearable
Surveillance
camera
Specialization
Smart
camera
including
audio AI
Next Gen
VPA
EdgeCloud
Trends
1990 2020
Audio
Decentralized Centralized
Vacuum
cleaner
Smart
watches
On the road to an intelligent interface
MAJOR REVENUES SET TO INCREASE
This report focus on three promising markets for
this type of hardware: smartphones, drones and
systems included in smart homes such as cameras
and virtual personal assistants (VPAs), among
others. The following figure shows the revenues
for VPU/VP and SPU/SP architectures. Based on
our assumptions and combining audio and imaging,
the artificial intelligence hardware market could
25. HARDWARE AND SOFTWARE FOR AI 2018 – CONSUMER FOCUS
reach more than $10 billion for embedded hardware
and more than $13 billion for stand-alone chips in
2023. For imaging, specialization has already begun
in smartphones or drones and will enter smart
homes by 2020. For audio, because hardware and
software technology is still in the optimization phase,
penetration in these markets will not be effective
until the end of 2019 and more likely in the course
of 2020.
The most promising market is smartphones. Yole
hypothesize that AI for imaging will be embedded
in the smartphone Application Processor (AP).
For audio, according to the choices of different
companies and their respective technological status,
we could see AI embedded in the AP or computed by
a specialized standalone chip.
In the same way, the market of drones capable of
integrating AI has been studied. This includes mid-
price drones with a minimum average selling price
(ASP) of $500 and high-end drones with an average
ASP of $1200. AI technology would be based mainly
on imaging around the recognition of gestures for
control, obstacles and the environment using massive
VPs.
For the smart home market, all architectures could
potentially be used. That makes this market disparate
but extremely rich and promising. Because data
is a profitable resource, this market has a large
ecosystem. Promising startups mix with Google,
Apple, Facebook, Amazon, Microsoft (GAFAM),
Baidu, Alibaba, Tencent and Xiaomi (BATX) in a
battle to control this increasingly regulated resource.
Embedded vs stand alone hardware for AI revenue
(Yole Développement, September 2018)
DATA IS MONEY
Controlling data provides phenomenal firepower
in the field of AI. Data is needed to create more
precise, more efficient, more customizable, better
algorithms. Getting the best algorithms leads to
greater penetration and acceptance by the public and,
obviously, higher revenues.
Who are the players in this game? What are their
strategies, visions and cultures? This report try
to answer these questions and understand future
trends in software and hardware. The battle is
raging between decentralization companies, like ams,
Sony or Knowles and AP manufacturers, like Apple,
HiSilicon, Qualcomm or NVidia. GAFAM and BATX
will play a central role, as some of them now design
their own hardware and are acquiring or investing
massively in AI software technologies.
This battle has just begun and Yole are trying to
decipher the forces involved, the trends. It’s an
exciting exercise – this world is constantly, very
quickly moving.
Hardware for AI: Value chain for consumer applications
(Yole Développement, September 2018)
Without edge processing HW design
Specialization
DATA
Cloud
Edge
With edge processing HW design
Decentralized Centralized
Specialization
Edge
Edge
AP designers and
manufacturers
Close to sensor
-
Sound
Processor
46%
Embedded Sound
Processing Unit
4%
Vision
Processor
7%
Embedded Vision
Processing Unit
43%
2020e Sound
Processor
41%
Embedded Sound
Processing Unit
6%
Vision
Processor
15%
Embedded Vision
Processing Unit
38%
2023eVision
Processor
4%
Embedded Vision
Processing Unit
96%
2017
CAGR17-20 96%
CAGR17-20 501%
CAGR20-23 31%
CAGR20-23 36%
$635
$9,722
CAGR17-20 148%
$23,305
CAGR20-23 34%
$611
$24
$4,581
$5,141
$10,243
$13,062
Total embedded in
AP
Total
specialized chip
26. MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
Alibaba, Alphabet, Amazon, AMD, Another Brain, Apple, ARM, Asus, ATI, Baidu, CEVA, Cray, Deephi
Tech, DeepMind, Facebook, Google, Graphcore, Hisilicon, Hover Camera, Huawei, IBM, Imagination,
Infineon, Instagram, Intel, Kalray, Knowles, Lattice, LightOn, Mediatek, Microsoft, Motorola, Nokia,
Nuance, Nvidia, Oppo, Parrot, Qualcomm, Samsung, Skydio, Sensetime, Socionext, Sony, ST
Microelectronics, Synopsis, Tencent, Texas Instrument, Videantis, Xiaomi, Xilinx, and many more...
Report objectives and methodology 4
Executive summary 13
1- Introduction 45
2- Market and technology trends 59
Smartphone
Consumer drones
Smart/robot home
3- Market forecasts 99
Smartphone – 5 year forecast
Smartphone SoC – 3 years forecast
Smartphone SoC – Market share
Smartphone – AI SoC – 5 years forecast
Consumer drone – 5 years forecast
Consumer drone – AI hardware – 5 years
forecast
Audio – Sound processor – 5 years forecast
Audio – Embedded SPU – 5 years forecast
Audio – AI market value by type – 5 years
forecast
Imaging – Vision processor – 5 years
forecast
Imaging – Embedded VPU – 5 years forecast
Imaging – AI market value by type – 5 years
forecast
Embedded vs standalone hardware for AI
revenue
4- Ecosystems 124
Hardware for AI – Introduction
Hardware for AI – Smartphone
Hardware for AI – Consumer drone
Software for AI – Design
Software for AI – Strategy
5- Technologies 216
Hardware – Smartphone SoC integration
Hardware – Cloud computing integration
Software – Biometrics authentication
Software – Virtual personal assistant
Software – Photography and augmented
reality
Software – Gesture recognition
6- Algorithm review 261
AI algorithms for imaging
AI algorithms for audio
7- Conclusion 280
TABLE OF CONTENTS (complete content on i-Micronews.com)
Find more
details about
this report here:
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As a Software and Market
Analyst, Dr. Yohann
Tschudi is a member
of the Semiconductor and Software
division at Yole Développement (Yole).
Yohann works with his team every day
to identify, understand and analyze the
role of the software and computing parts
within any semiconductor products, from
the machine code to the highest level of
algorithms. After his thesis at CERN in
Geneva, Switzerland, Yohann developed
dedicated software for fluid mechanics and
thermodynamics applications. Afterwards,
worked at the University of Miami, Florida,
United States, for two years as an AI
scientist. Yohann has a PhD in High Energy
Physics and a master’s degree in Physical
Sciences from Claude Bernard University
in Lyon, France.
AUTHORS
OBJECTIVES OF THE REPORT
1. To provide a scenario for AI within the dynamics of the consumer market and understand the
impact of AI on the semiconductor industry
• Hardware for AI revenue forecast, volume shipments forecasts
• Systems ASP, revenue, volume shipments forecast
• Focus on consumer applications embedding technologies: smartphone, drones, cameras, smart/
robot home
2. To provide in-depth understanding of the ecosystem and players.
• Who are the players? What are the relationships inside this ecosystem? Who will win the battle for
controlling the data?
• Who are the key suppliers to watch and which technologies do they provide?
3. To provide key technical insight analysis about future technology trends and challenges.
• Key technology choices
• Technology dynamics
• Emerging technologies and roadmaps
As a Technology and
market Analyst, Adrien
Sanchez is a member of
the Semiconductor Software business unit
at Yole Développement (Yole), part of Yole
Group of Companies. Adrien performs,
in collaboration with his team, reports
covering software, Artificial Intelligence,
machine learning, neural network and AI
dedicated hardware.
Adrien is preparing a double degree with
Grenoble Institute of Technology PHELMA
(Grenoble INP Phelma, France) and Grenoble
Ecole de Management (GEM, France).
Prior Yole he worked as an intern at AW
Europe (Belgium) on image recognition and
comprehension for ADAS.
27. ORDER FORM
Hardware and Software for AI 2018 – Consumer focus
SHIPPING CONTACT
First Name:
Email:
Last Name:
Phone:
PAYMENT
BY CREDIT CARD
Visa Mastercard Amex
Name of the Card Holder:
Credit Card Number:
Card Verification
Value (3 digits except AMEX: 4 digits):
Expiration date:
BY BANK TRANSFER
BANK INFO: HSBC, 1 place de la Bourse,
F-69002 Lyon, France,
Bank code: 30056, Branch code: 00170
Account No: 0170 200 1565 87,
SWIFT or BIC code: CCFRFRPP,
IBAN: FR76 3005 6001 7001 7020 0156 587
RETURN ORDER BY
• FAX: +33 (0)472 83 01 83
• MAIL: YOLE DÉVELOPPEMENT, Le Quartz,
75 Cours Emile Zola, 69100 Villeurbanne/Lyon - France
SALES CONTACTS
• Western US Canada - Steve Laferriere:
+ 1 310 600-8267 – laferriere@yole.fr
• Eastern US Canada - Troy Blanchette:
+1 704 859 0453 – troy.blanchette@yole.fr
• Europe RoW - Lizzie Levenez:
+ 49 15 123 544 182 – levenez@yole.fr
• Japan Rest of Asia - Takashi Onozawa:
+81 34405-9204– onozawa@yole.fr
• Greater China - Mavis Wang:
+886 979 336 809 – wang@yole.fr
• Specific inquiries: +33 472 830 180 – info@yole.fr
(1)
Our Terms and Conditions of Sale are available at
www.yole.fr/Terms_and_Conditions_of_Sale.aspx
The present document is valid 24 months after its publishing date:
September 19, 2018
/
ABOUT YOLE DEVELOPPEMENT
BILL TO
Name (Mr/Ms/Dr/Pr):
Job Title:
Company:
Address:
City:
State:
Postcode/Zip:
Country*:
*VAT ID Number for EU members:
Tel:
Email:
Date:
PRODUCT ORDER - Ref YD18036
Please enter my order for above named report:
One user license*: Euro 5,990
Multi user license: Euro 6,490
- The report will be ready for delivery from October 15, 2018
- For price in dollars, please use the day’s exchange rate. All reports are
delivered electronically at payment reception. For French customers,
add 20% for VAT
I hereby accept Yole Développement’s Terms and Conditions of Sale(1)
Signature:
*One user license means only one person at the company can use the report.
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media and
corporate finance services, reverse engineering and reverse costing services and well as IP and patent analysis. With a strong focus on emerging applications
using silicon and/or micro manufacturing, the Yole group of companies has expanded to include more than 80 collaborators worldwide covering MEMS and image
sensors, Compound Semiconductors, RF Electronics, Solid-state lighting, Displays, Software, Optoelectronics, Microfluidics Medical, Advanced Packaging,
Manufacturing, Nanomaterials, Power Electronics and Batteries Energy Management.
The “More than Moore” market research, technology and strategy consulting company Yole Développement, along with its partners System Plus Consulting,
PISEO and KnowMade, support industrial companies, investors and RD organizations worldwide to help them understand markets and follow technology
trends to grow their business.
CONSULTING AND ANALYSIS
• Market data research, marketing analysis
• Technology analysis
• Strategy consulting
• Reverse engineering costing
• Patent analysis
• Design and characterization of innovative optical systems
• Financial services (due diligence, MA with our partner)
More information on www.yole.fr
MEDIA EVENTS
• i-Micronews.com website related @Micronews e-newsletter
• Communication webcast services
• Events: TechDays, forums…
More information on www.i-Micronews.com
REPORTS
• Market technology reports
• Patent investigation and patent infringement risk analysis
• Teardowns reverse costing analysis
• Cost simulation tool
More information on www.i-micronews.com/reports
CONTACTS
For more information about :
• Consulting Financial Services: Jean-Christophe Eloy (eloy@yole.fr)
• Reports: David Jourdan (jourdan@yole.fr) Yole Group of Companies
• Press Relations Corporate Communication: Sandrine Leroy (leroy@yole.fr)
28. Definitions: “Acceptance”: Action by which the Buyer accepts
the terms and conditions of sale in their entirety. It is done by
signing the purchase order which mentions “I hereby accept
Yole’s Terms and Conditions of Sale”.
“Buyer”: Any business user (i.e. any person acting in the course
of its business activities, for its business needs) entering into the
following general conditions to the exclusion of consumers acting
in their personal interests.
“Contracting Parties” or “Parties”: The Seller on the
one hand and the Buyer on the other hand.
“Intellectual Property Rights” (“IPR”) means any
rights held by the Seller in its Products, including any patents,
trademarks, registered models, designs, copyrights, inventions,
commercial secrets and know-how, technical information,
company or trading names and any other intellectual property
rights or similar in any part of the world, notwithstanding the fact
that they have been registered or not and including any pending
registration of one of the above mentioned rights.
“License”: For the reports and databases, 3 different licenses
are proposed. The buyer has to choose one license:
• One user license: one person at the company can use the report.
• Multi-user license: the report can be used by unlimited users
within the company. Subsidiaries and Joint-Ventures are not
included.
• Corporate license: purchased under “Annual Subscription”
program, the report can be used by unlimited users within the
company. Joint-Ventures are not included.
“Products”: Depending on the purchase order, reports or
database on MEMS, CSC, Optics/MOEMS, Nano, bio… to
be bought either on a unit basis or as an annual subscription.
(i.e. subscription for a period of 12 calendar months). The
annual subscription to a package (i.e. a global discount based
on the number of reports that the Buyer orders or accesses
via the service, a global search service on line on I-micronews
and a consulting approach), is defined in the order. Reports are
established in PowerPoint and delivered on a PDF format and the
database may include Excel files.
“Seller”: Based in Lyon (France headquarters), Yole
Développement is a market research and business development
consultancy company, facilitating market access for advanced
technology industrial projects. With more than 20 market
analysts, Yole works worldwide with the key industrial companies,
RD institutes and investors to help them understand the markets
and technology trends.
1. SCOPE
1.1 The Contracting Parties undertake to observe the following
general conditions when agreed by the Buyer and the Seller.
ANY ADDITIONAL, DIFFERENT, OR CONFLICTING
TERMS AND CONDITIONS IN ANY OTHER DOCUMENTS
ISSUED BY THE BUYER AT ANY TIME ARE HEREBY
OBJECTED TO BY THE SELLER, SHALL BE WHOLLY
INAPPLICABLE TO ANY SALE MADE HEREUNDER AND
SHALL NOT BE BINDING IN ANY WAY ON THE SELLER.
1.2 This agreement becomes valid and enforceable between the
Contracting Parties after clear and non-equivocal consent
by any duly authorized person representing the Buyer. For
these purposes, the Buyer accepts these conditions of sales
when signing the purchase order which mentions “I hereby
accept Yole’s Terms and Conditions of Sale”. This results in
acceptance by the Buyer.
1.3 Orders are deemed to be accepted only upon written
acceptance and confirmation by the Seller, within [7 days] from
the date of order, to be sent either by email or to the Buyer’s
address. In the absence of any confirmation in writing, orders
shall be deemed to have been accepted.
2. MAILING OF THE PRODUCTS
2.1 Products are sent by email to the Buyer:
• within [1]
month from the order for Products already
released; or
• within a reasonable time for Products ordered prior to
their effective release. In this case, the Seller shall use its best
endeavours to inform the Buyer of an indicative release date
and the evolution of the work in progress.
2.2 Some weeks prior to the release date the Seller can propose
a pre-release discount to the Buyer
The Seller shall by no means be responsible for any delay in
respect of article 2.2 above, and including incases where a
new event or access to new contradictory information would
require for the analyst extra time to compute or compare
the data in order to enable the Seller to deliver a high quality
Products.
2.3 The mailing of the Product will occur only upon payment
by the Buyer, in accordance with the conditions contained
in article 3.
2.4. The mailing is operated through electronic means either by
email via the sales department or automatically online via an
email/password. If the Product’s electronic delivery format
is defective, the Seller undertakes to replace it at no charge
to the Buyer provided that it is informed of the defective
formatting within 90 days from the date of the original
download or receipt of the Product.
2.5 The person receiving the Products on behalf of the Buyer
shall immediately verify the quality of the Products and their
conformity to the order. Any claim for apparent defects or
for non-conformity shall be sent in writing to the Seller within
8 days of receipt of the Products. For this purpose, the Buyer
agrees to produce sufficient evidence of such defects. .
2.6 No return of Products shall be accepted without prior
information to the Seller, even in case of delayed delivery.
Any Product returned to the Seller without providing prior
information to the Seller as required under article 2.5 shall
remain at the Buyer’s risk.
3. PRICE, INVOICING AND PAYMENT
3.1 Prices are given in the orders corresponding to each Product
sold on a unit basis or corresponding to annual subscriptions.
They are expressed to be inclusive of all taxes. The prices
may be reevaluated from time to time. The effective price is
deemed to be the one applicable at the time of the order.
3.2 Yole may offer a pre release discount for the companies willing
to acquire in the future the specific report and agreeing on the
fact that the report may be release later than the anticipated
release date. In exchange to this uncertainty, the company will
get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to
Yole Développement, credit card or by electronic transfer to
the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request
down payments from the Buyer. In this case, the need of down
payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days
from invoice date, except in the case of a particular written
agreement. If the Buyer fails to pay within this time and fails
to contact the Seller, the latter shall be entitled to invoice
interest in arrears based on the annual rate Refi of the «BCE»
+ 7 points, in accordance with article L. 441-6 of the French
Commercial Code. Our publications (report, database, tool...)
are delivered only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct,
during the contract, the Seller will have the right to invoice
at the stage in progress, and to take legal action for damages.
4. LIABILITIES
4.1 The Buyer or any other individual or legal person acting on
its behalf, being a business user buying the Products for its
business activities, shall be solely responsible for choosing the
Products and for the use and interpretations he makes of the
documents it purchases, of the results he obtains, and of the
advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable
pecuniary loss, caused by the Products or arising from a
material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental
or consequential damages (including, but not limited to,
damages for loss of profits, business interruption and loss of
programs or information) arising out of the use of or inability
to use the Seller’s website or the Products, or any information
provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other
inaccuracies in the Product or interpretations thereof.
4.4 All the information contained in the Products has been
obtained from sources believed to be reliable. The Seller
does not warrant the accuracy, completeness adequacy or
reliability of such information, which cannot be guaranteed to
be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice
to the Buyer from time to time be modified by or substituted
with similar Products meeting the needs of the Buyer. This
modification shall not lead to the liability of the Seller,
provided that the Seller ensures the substituted Product is
similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that
the Products contain defects, the Seller undertakes to replace
the defective products as far as the supplies allow and without
indemnities or compensation of any kind for labor costs,
delays, loss caused or any other reason. The replacement is
guaranteed for a maximum of two months starting from the
delivery date. Any replacement is excluded for any event as set
out in article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing
of the Products are given for information only and are not
guaranteed. If such deadlines are not met, it shall not lead to
any damages or cancellation of the orders, except for non
acceptable delays exceeding [4] months from the stated
deadline, without information from the Seller. In such case only,
the Buyer shall be entitled to ask for a reimbursement of its first
down payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied,
including, without limitation, those of sale ability and fitness for
a particular purpose, with respect to the Products. Although
the Seller shall take reasonable steps to screen Products for
infection of viruses, worms, Trojan horses or other codes
containing contaminating or destructive properties before
making the Products available, the Seller cannot guarantee
that any Product will be free from infection.
5. FORCE MAJEURE
The Seller shall not be liable for any delay in performance directly
or indirectly caused by or resulting from acts of nature, fire, flood,
accident, riot, war, government intervention, embargoes, strikes,
labor difficulties, equipment failure, late deliveries by suppliers or
other difficulties which are beyond the control, and not the fault
of the Seller.
6. PROTECTION OF THE SELLER’S IPR
6.1 All the IPR attached to the Products are and remain the
property of the Seller and are protected under French and
international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce,
redistribute, resell or publish the Product, or any part of it
to any other party other than employees of its company. The
Buyer shall have the right to use the Products solely for its
own internal information purposes. In particular, the Buyer
shall therefore not use the Product for purposes such as:
• Information storage and retrieval systems;
• Recordings and re-transmittals over any network (including
any local area network);
• Use in any timesharing, service bureau, bulletin board or
similar arrangement or public display;
• Posting any Product to any other online service (including
bulletin boards or the Internet);
• Licensing, leasing, selling, offering for sale or assigning the
Product.
6.3 The Buyer shall be solely responsible towards the Seller of
all infringements of this obligation, whether this infringement
comes from its employees or any person to whom the Buyer
has sent the Products and shall personally take care of any
related proceedings, and the Buyer shall bear related financial
consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for
the needs of the contract. This person will be the recipient
of each new report in PDF format. This person shall also be
responsible for respect of the copyrights and will guaranty that
the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact
shall decide who within the Buyer, shall be entitled to access
on line the reports on I-micronews.com. In this respect, the
Seller will give the Buyer a maximum of 10 password, unless
the multiple sites organization of the Buyer requires more
passwords. The Seller reserves the right to check from time
to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee
of the buyer can access the report or the employee of the
companies in which the buyer have 100% shares. As a matter
of fact the investor of a company, the joint venture done with
a third party etc..cannot access the report and should pay a
full license price.
7. TERMINATION
7.1 If the Buyer cancels the order in whole or in part or postpones
the date of mailing, the Buyer shall indemnify the Seller for
the entire costs that have been incurred as at the date of
notification by the Buyer of such delay or cancellation. This
may also apply for any other direct or indirect consequential
loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions
or the order, the non-breaching Party may send a notification
to the other by recorded delivery letter upon which, after a
period of thirty (30) days without solving the problem, the
non-breaching Party shall be entitled to terminate all the
pending orders, without being liable for any compensation.
8. MISCELLANEOUS
All the provisions of these Terms and Conditions are for the
benefit of the Seller itself, but also for its licensors, employees
and agents. Each of them is entitled to assert and enforce those
provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in
writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and
Conditions and the Buyer, is deemed to have accepted the latest
version of these terms and conditions, provided they have been
communicated to him in due time.
9. GOVERNING LAW AND JURISDICTION
9.1 Any dispute arising out or linked to these Terms and
Conditions or to any contract (orders) entered into in
application of these Terms and Conditions shall be settled
by the French Commercial Courts of Lyon, which shall have
exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and
the Seller, in accordance with these Terms and Conditions.
TERMS AND CONDITIONS OF SALES