This document describes test development services provided by SEM, including structural and functional testing. SEM has 15+ years of experience in test engineering and can support various industries. Services include in-circuit testing, boundary scan testing, optical inspection, X-ray inspection, and flying probe testing using equipment from Agilent, Teradyne, Goepel, and others. SEM also develops customized functional test solutions and provides turnkey test systems for applications like IT equipment, communications devices, consumer products, and more.
Ideal 3D Stacked Die Test - IEEE Semiconductor Wafer Test Workshop SWTW 2013Ira Feldman
My presentation from IEEE SWTW 2013 - For a full description please see my blog:
http://hightechbizdev.com/2013/06/10/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2013/
Achieving Market Dominance through Technology Leadership -Cascade Microtech, Inc. is the leading provider of advanced probing systems, non-memory probes and sockets, from design through production
Ideal 3D Stacked Die Test - IEEE Semiconductor Wafer Test Workshop SWTW 2013Ira Feldman
My presentation from IEEE SWTW 2013 - For a full description please see my blog:
http://hightechbizdev.com/2013/06/10/ira-feldman-high-technology-business-development-ieee-semiconductor-wafer-test-workshop-2013/
Achieving Market Dominance through Technology Leadership -Cascade Microtech, Inc. is the leading provider of advanced probing systems, non-memory probes and sockets, from design through production
UVM BASED REUSABLE VERIFICATION IP FOR WISHBONE COMPLIANT SPI MASTER COREVLSICS Design
The System on Chip design industry relies heavily on functional verification to ensure that the designs are bug-free. As design engineers are coming up with increasingly dense chips with much functionality, the functional verification field has advanced to provide modern verification techniques. In this paper, we present verification of a wishbone compliant Serial Peripheral Interface (SPI) Master core using a System Verilog based standard verification methodology, the Universal Verification Methodology (UVM). The reason for using UVM factory pattern with parameterized classes is to develop a robust and reusable verification IP. SPI is a full duplex communication protocol used to interface components most likely in embedded systems. We have verified an SPI Master IP core design that is wishbone compliant and compatible with SPI protocol and bus and furnished the results of our verification. We have used QuestaSim for simulation and analysis of waveforms, Integrated Metrics Center, Cadence for coverage analysis. We also propose interesting future directions for this work in developing reliable systems.
DESIGN APPROACH FOR FAULT TOLERANCE IN FPGA ARCHITECTUREVLSICS Design
Failures of nano-metric technologies owing to defects and shrinking process tolerances give rise to significant challenges for IC testing. In recent years the application space of reconfigurable devices has grown to include many platforms with a strong need for fault tolerance. While these systems frequently contain hardware redundancy to allow for continued operation in the presence of operational faults, the need to recover faulty hardware and return it to full functionality quickly and efficiently is great. In addition to providing functional density, FPGAs provide a level of fault tolerance generally not found in mask-programmable devices by including the capability to reconfigure around operational faults in the field. Reliability and process variability are serious issues for FPGAs in the future. With advancement in process technology, the feature size is decreasing which leads to higher defect densities, more sophisticated techniques at increased costs are required to avoid defects. If nano-technology fabrication are applied the yield may go down to zero as avoiding defect during fabrication will not be a feasible option Hence, feature architecture have to be defect tolerant. In regular structure like FPGA, redundancy is commonly used for fault tolerance. In this work we present a solution in which configuration bit-stream of FPGA is modified by a hardware controller that is present on the chip itself. The technique uses redundant device for replacing faulty device and increases the yield.
Design for reliability (DFR) is an industry-wide practice and a philosophy of considering reliability in an early stage of product design and development, to achieve a highly-reliable product while with sustainable cost. Physical of Failure (PoF) is recognized as a key approach of implementing DFR in a product design and development process. The author will present a case study to illustrate predicting and identifying product failure early in the design phase with the help of a quantitative PoF model based analysis tool.
In this session, Marc Hornbeek of Spirent Communications will explain the "change-driven" method and give an overview of associated tools and actual experiences for automated, intelligent software build verification. Learn how this method enables higher test coverage during continuously varying build schedules and priorities, creating a closed-loop continuous build/test environment that is vastly more efficient than the traditional regression approaches that often lead to bottlenecks in continuous change and Agile environments.
UVM BASED REUSABLE VERIFICATION IP FOR WISHBONE COMPLIANT SPI MASTER COREVLSICS Design
The System on Chip design industry relies heavily on functional verification to ensure that the designs are bug-free. As design engineers are coming up with increasingly dense chips with much functionality, the functional verification field has advanced to provide modern verification techniques. In this paper, we present verification of a wishbone compliant Serial Peripheral Interface (SPI) Master core using a System Verilog based standard verification methodology, the Universal Verification Methodology (UVM). The reason for using UVM factory pattern with parameterized classes is to develop a robust and reusable verification IP. SPI is a full duplex communication protocol used to interface components most likely in embedded systems. We have verified an SPI Master IP core design that is wishbone compliant and compatible with SPI protocol and bus and furnished the results of our verification. We have used QuestaSim for simulation and analysis of waveforms, Integrated Metrics Center, Cadence for coverage analysis. We also propose interesting future directions for this work in developing reliable systems.
DESIGN APPROACH FOR FAULT TOLERANCE IN FPGA ARCHITECTUREVLSICS Design
Failures of nano-metric technologies owing to defects and shrinking process tolerances give rise to significant challenges for IC testing. In recent years the application space of reconfigurable devices has grown to include many platforms with a strong need for fault tolerance. While these systems frequently contain hardware redundancy to allow for continued operation in the presence of operational faults, the need to recover faulty hardware and return it to full functionality quickly and efficiently is great. In addition to providing functional density, FPGAs provide a level of fault tolerance generally not found in mask-programmable devices by including the capability to reconfigure around operational faults in the field. Reliability and process variability are serious issues for FPGAs in the future. With advancement in process technology, the feature size is decreasing which leads to higher defect densities, more sophisticated techniques at increased costs are required to avoid defects. If nano-technology fabrication are applied the yield may go down to zero as avoiding defect during fabrication will not be a feasible option Hence, feature architecture have to be defect tolerant. In regular structure like FPGA, redundancy is commonly used for fault tolerance. In this work we present a solution in which configuration bit-stream of FPGA is modified by a hardware controller that is present on the chip itself. The technique uses redundant device for replacing faulty device and increases the yield.
Design for reliability (DFR) is an industry-wide practice and a philosophy of considering reliability in an early stage of product design and development, to achieve a highly-reliable product while with sustainable cost. Physical of Failure (PoF) is recognized as a key approach of implementing DFR in a product design and development process. The author will present a case study to illustrate predicting and identifying product failure early in the design phase with the help of a quantitative PoF model based analysis tool.
In this session, Marc Hornbeek of Spirent Communications will explain the "change-driven" method and give an overview of associated tools and actual experiences for automated, intelligent software build verification. Learn how this method enables higher test coverage during continuously varying build schedules and priorities, creating a closed-loop continuous build/test environment that is vastly more efficient than the traditional regression approaches that often lead to bottlenecks in continuous change and Agile environments.
Description of the base capabilities of Vimercate site and its operating Electronic Company SEM (Services for Electronic Manufacturing) from mgirani@semtechnologies.it
The cable harness tester has an important role in bringing in the quality and reliability of electrical cable assemblies that are used in many industries, such as aerospace, automotive, defence, and manufacturing. This is one of the most important functions of cable harness assembly as it helps in finding defects, ensuring the connectivity is right, and testing the on-field performance of the harnesses.
MaxEye Technologies provides complete STB test solution using National Instruments PXI hardware and MaxEye Software. The complete solution is developed using single PXI instrument.
Experienced Test Lead Engineer with a demonstrated history of working in the Embedded Systems .Strong engineering professional skilled in Set Top Box / TV.
Challenges in Assessing Single Event Upset Impact on Processor SystemsWojciech Koszek
Abstract—This paper presents a test methodology developed at Xilinx for real-time soft-error rate testing as well as the software framework in which Device-Under-Test (DUT) and controlling computer are both synchronized with the proton beam controls and run experiments automatically in a predictable manner. The method presented has been successfully used for Zynq®-7000 All Programmable SoC testing at the UC Davis Crocker Nuclear Lab. Presented are the issues and challenges encountered during design and implementation of the framework, as well as lessons learned from the in-house experiments and bootstrapping tests performed with Thorium Foil. The method presented has helped Xilinx to deliver high-quality experimental data and to optimize time spent in the testing facility.
Keywords—Error detection, soft error, architectural vulnerability, statistical error, confidence level, beam facility control
Explore our most comprehensive guide on lookback analysis at SafePaaS, covering access governance and how it can transform modern ERP audits. Browse now!
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Putting the SPARK into Virtual Training.pptxCynthia Clay
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Falcon stands out as a top-tier P2P Invoice Discounting platform in India, bridging esteemed blue-chip companies and eager investors. Our goal is to transform the investment landscape in India by establishing a comprehensive destination for borrowers and investors with diverse profiles and needs, all while minimizing risk. What sets Falcon apart is the elimination of intermediaries such as commercial banks and depository institutions, allowing investors to enjoy higher yields.
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Who might benefit? Anyone and everyone leading folks from the shop floor to top floor.
Dr. William Harvey is a seasoned Operations Leader with extensive experience in chemical processing, manufacturing, and operations management. At Michelman, he currently oversees multiple sites, leading teams in strategic planning and coaching/practicing continuous improvement. William is set to start his eighth year of teaching at the University of Cincinnati where he teaches marketing, finance, and management. William holds various certifications in change management, quality, leadership, operational excellence, team building, and DiSC, among others.
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Retail media wordt gezien als het nieuwe advertising-medium en ook mediabureaus richten massaal retail media-afdelingen op. Merken die niet in de betreffende winkel liggen staan ook nog niet in de rij om op de retail media netwerken te adverteren. Marvin belicht de uitdagingen die er zijn om echt aansluiting te vinden op die markt van non-endemic advertising.
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1. Test Development
SEM
Bench Tester Development
for
Structural & Functional Test
2. Full development service - customer oriented –
The Test Solution Development Laboratory is a strategic part of the services that SEM (Services
for Electronic Manufacturing) offers to Customers. The skills of our team of Engineers are based on 15 years of experience, matured
within IBM and Celestica history.
The services proposed support different market segments ranging from medical to electronics and military, telecom and consumer.
Availability of skilled resources and wide span of markets and applications we served make SEM the ideal partner for
Customers, looking for integrated assemblies, test services and a customized stand alone test solutions.
Our offer covers both the structural test (InCircuit with bed of nails and Flying probe, Boundary Scan, X-Ray, AOI) and the functional
test (digital, analogue and RF). The services are completed by DFM and DFT analysis.
“Test oriented” project development
Our analysis skill and experience applied to customer data develop and release
a detailed product testability report providing suggestions / feedbacks and
project modifications to obtain and optimize test process efficiency.
Testability analysis ( DFT ):
- Physical DFT that perform physical access verification to allow strong
structural test development ( In Circuit and Boundary Scan )
-Electrical DFT that perform electrical access verification to allow strong
electrical test development ( logical, JTAG, data bus... )
Available Development SFTW and Technique:
• Test way
Optical Inspection “AOI”
Automatic Optical inspection capability includes a various set of verifications
like component presence, correct positioning, polarity, but also solder joint
analysis, correct shape verification, missing solder or shorts.
AOI is performed on prototypes, before product is stable enough to develop
structural test.
On high volume production AOI is used when accessibility of board under test
cannot be achieved with a different methodology.
Available Equipment:
• Orbotech AOI
X-Ray Inspection “5DX”
X-Ray test is performed to verify solder joint . Specifically fo BGA components
and sockets, since here optical inspection is not possible.
X-Ray test is based on laminography technique and provide the capability to
verify solder joints on both sides of the board in one test run.
High efficiency can be achieved on fine pitch components and on all BGA
families.
Available Equipment :
• Agilent 5DX
3. Flying Probe Test
Flying probe testing provides extreme flexibility for prototypes electrical
verification. This method is specifically suited for low volume production, or
products that are not stable enough to justify investments in structural test
( InCircuit Test ).
Flying Probe Test is based on card design files.
It is also very helpful to repair defective boards in particular conditions, like:
- line & field return with obsole test process / instruments
- manufacturing line at different site.
Available Equipment:
• Scorpion FLS 550 – (4+2 shuttle, 8+2 probes, 4+2 cameras)
InCircuit Test on Agilent platform
Bed of Nails Test or In Circuit Test on Agilent platform provide test capability
for different card complexity, up to 5.000 nodes.
Our competence on this platform is excellent.
We can provide integrated test solutions embedding functional test, Bscan,
PLL and Flash programming, PLD and RAM with variable data ( VPD or MAC
Address ).
Our fixture design methodology allows dual access and dual contact stadium,
LED test, and very complex mechanical access to the board.
Available Equipment :
• HP 3070 series 3 with 5176 pins (2x) and HP 3070 series 1 with 2184 pins
• Software development is done for Unix and Win based test equipments
InCircuit Test on Teradyne platform
Bed of Nails test or In Circuit Test on Teradyne platform provide test capability
on high complexity card up to 7.000 nodes on the LX version.
This platform allows fully integrated test development for functional test, Bscan
converted from the Goepel platform, Oscillators, PLL, Flash programming, PLD
and RAM with variable data ( VPD or MAC Address ).
Mechanical fixture design allows dual level access, through connector, Scan Flex
methodology and dual side contacting, even on 18mils pads diameter.
Available Equipment :
• TS124, 228x, Stinger, Z18xx
Boundary Scan Test on Goepel platform
Boundary Scan test is based on IEEE. Access to board under test access is
done via 4/5 wire bus commonly know as JTAG.
Almost all the electronic devices available on the market are now designed to
allow JTAG access. Bscan test is commonly used in conjunction with structural
test to increase test coverage.
Our experience is based on communication and IT applications and allows us to
develop test sequences, able to verify/test and program a wide set of
components. Test sequence can be integrated to InCircuitTest, functional test,
or can be implemented on dedicated bench testers.
Available Equipment and Technique :
• Goepel Development Sw and conversion/integration to ICT ( Teradyne )
• Boundary Scan test bench
4. Functional Test
SEM Engineering Team offers and develops high quality turn key test
solutions.
The Team is focused and flexibly driven by customer needs, to provide
dedicated solutions fully satisfying all kind of specific requests.
The design of the test solution is achieved by cooperation and synergy
of the whole team throughout software, electronic, system and mechanical
engineers competencies.
TV test platform
Functional test development covers different technology areas based on the
experience grown on the following sectors:
Information Technology, with dedicated experience on Server Storage
solutions ( Database ).
Data Communication cards for electronic and optoelectronic devices,
based on bench testers in compliance with standards MSA 10Gbit/s –
300pin, XFP e Xenpak.
Consumer devices with experience on POS testing, Flat screen and
Set Top Boxes.
Power supply test for subset of or full unit verification.
High frequency devices, with experience on GSM-UMTS and RF.
Electrical stress test performed at ambient temperature or into climatic
chambers environment, at single card level, at sub-assembly level
or / with dedicated interfacing solution.
POS test station
To complete the portfolio description, SEM test development team provides
fully integrated turn key test solutions for the following areas:
Mechanical development for test bench fixtures and for all tools related to
manufacturing environment.
Software development in Windows and Linux environments, using C
and LabView languages driven with sequencers like Test Stand
or third party packages.
Interface boards electronic design for test benches or emulation of the
necessary functions to exercise / test the final product.
The experience grown through years of development of very diversified
Power Supply unit test applications, allows SEM team to be able to offer virtually all the available
test methodologies, making sure that the test bench optimization will include
the quality of deliverables, minimization of test time and capital investment.
Projects include imaging techniques for stress cameras testing, as well as
display systems and development of a standard control chart, that have
been recognized by international customers.
Optical Fiber test with thermal stress
Test Development SEM
Via Lecco, 61 - 20059 Vimercate – Mi. Tel. +39.039.639.1
Web site: www.semtechnologies.it
Reference: Ing. Leonardo Bonanomi – Tel. +39.039. 639.4778 – 5443
Info e-mail: support@semtechnologies.it