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Embedded Instrumentation: Critical to
Validation and Test in the Electronics
              Industry

         Sujan Sami, Industry Manager
             Test & Measurement
                March 10, 2010
Focus Points


 1. Introduction – Traditional vs. Virtual vs. Embedded Instrumentation


 2. Validation, Inspection and Test Technologies


 3. Existing Technical Discontinuities


 4. Embedded Instrumentation – Solving Validation, Test and Debug Problems


 5. Market Trends and Analysis


 6. Conclusion




                                                                             2
Introduction – Traditional vs. Virtual vs. Embedded Instrumentation


                                                                  Embedded




                                     Application
                                     Software




                                           Embedded
                                           Software



                                               Hardware




                   Traditional



Traditional instruments – comprised of pre-defined hardware components.
Virtual instrumentation – use of customizable software and modular instrumentation hardware.
Embedded instrumentation - a concept of entrenching and enhancing the capabilities of
traditional external test equipment as an additional resource on the chip and/or on dedicated
instrumentation chips on a circuit board.

                                                                                            3
Validation, Inspection and Test Technologies

    Oscilloscopes
                                                          In-circuit Testers (ICTs)
                                                          In-circuit Testers (ICTs)
                        Validation
   Logic analyzers
                                                          Manufacturing Defect
                                                            Analyzers (MDA)
       BERTs
                     Validation, Inspection                Flying Probe Testers
                                &                  Test    Flying Probe Testers
                      Test Technologies                   Boundary Scan Testers
                                                          Boundary Scan Testers
                                                            Functional Testers
                                      Inspectio
                                      Inspection           Functional Testers
                                          n




                          Automated optical inspection/
                          Automated X-ray inspection
                               (AOI/AXI) systems




                                                                                      4
Existing Technical Discontinuities


                                   Lack of test
                                    Lack of test
                                 access for PCB
                                                      Primary Challenges
                                                       Primary Challenges
                                  access for PCB       catering to circuit
                                    structural
                                     structural         catering to circuit
                                     testing                 boards
                                                              boards
                                       testing
                     Lack of test
                      Lack of test
                     access for
                      access for
                   signal integrity
                    signal integrity
                       testing
                        testing
    The migration to
     The migration to
   chip interconnects
    chip interconnects
    speeds in excess
     speeds in excess                                    Accessibility
       of 5 Gbps                                          Accessibility
         of 5 Gbps
                      The need for
                       The need for
                     protocol-aware
                      protocol-aware
                     high-speed I/O
                      high-speed I/O                      Complexity
                           test                            Complexity
                            test
                                         Limited
                                          Limited
                                       capacity of
                                        capacity of
                                         testers
                                          testers            Cost
                                                              Cost




                                                                              5
Embedded Instrumentation – Solving Validation, Test and Debug
              Problems
Technology Roadmap



                                                              Embedded
                                                           Instrumentation
                                                         Present and Future


                                                           LXI
                                                         2005

                                                   PXI

                                                 1998

                                           VXI
                                       1993

                           Digital Oscilloscope
                                1971
                                                                                Embedded
                                                                              Instrumentation
                     Analog Oscilloscope
                        1950s


      • Embedded instruments are IP inserted within chips to perform specific validation, test and
      debug functions.
      • Some of the test technologies that utilize embedded instrumentation include boundary scan
      test, processor-controlled test, I/O instrumentation test and core instrumentation test.
      • Examples of this embedded instrumentation include Intel®’s Interconnect Built-In Self Test
      (IBIST) for QuickPath Interconnect (QPI) and PCIe BERT/margining, and PLX Technology’s
      visionPAK™ PCIe packet generator/analyzer toolkit.

                                                                                                6
Market Trends and Analysis

                        Trend Analysis

         ...From                                  ...To
                                                                        Instruments:
        Traditional        Instruments           Embedded
                                                                        •   Collect and analyze data.
                                                                        •   Software based T&M
        Hardware              Cost               Software                   instruments.
                                                                        •   Boundary scan testing.
          GPIB             Standard          IEEE IJTAG




                                                            Standard:
Cost:                                                       •   According to Moore’s law, the number of
•   Cost-effective, agile and flexible.                         transistors on chips will double every two
•   Easy to use interface.                                      years.
•   Modular Instrumentation – software used to              •   IJTAG Family of Standards: IEEE 1149.1,
    replace prescribed hardware functionality.                  IEEE P1687, IEEE 1500, IEEE 1149.6,
                                                                IEEE 1149.7.




                                                                                                             7
Conclusion


                Future of Testing
                                                    Standard Busses    Speed (Gbps or GT/s)   Initial Adoption
                                                     PCI Express III           8.0                 2010
                                                      Serial ATA III           6.0                 2009
                                                        USB 3.0                4.8                 2008
                  Traditional    Pre
                Instruments     1980                      XAUI                3.125                2005
                                                        Intel QPI              6.4                 2008
                                                       HDMI 1.3                10.2                2006
Opportunities
 Opportunities
 in the ATE                            1980s
   in the ATE Virtual Instruments
    testing
      testing
  industry
     industry

                                                         CAPEX in downward-trend market
                                            2010
                Embedded Instruments        and          Access to chips critical
                                           beyond
                                                         Development in standards and better price-to-
                                                         performance ratio




                                                                                                                 8
“Turning Test &
                                    Measurement
                                     Inside Out”

                                          March 10, 2010
                                          Glenn Woppman
                                  ASSET President and CEO
                                “2008 EDN Innovator of the Year Finalist &
                                “2008 EDN Innovator of the Year Finalist &
                                 2009 EDN Innovation of the Year Finalist”
                                 2009 EDN Innovation of the Year Finalist”


© 2010, ASSET InterTech, Inc.         9
ASSET InterTech - origin


               Spin-off of Texas Instruments in 1995
               Boundary Scan Test Market leader*
               Leading the efforts to establish the Embedded
               Instrumentation market segment
               Company Characteristics
                      Standards oriented
                      Software focused
                      Global
                           * Frost & Sullivan report for 2007 (about 30% market share)
                                        plus Agilent & Intel endorsements

© 2010, ASSET InterTech, Inc.                          10
ASSET InterTech management


              Tim Dehne, “father” of NI’s LabVIEW and
              Virtual Instrumentation, joined our board of
              directors in June 2009
              Over a career stretching more
              than 21 years at NI, Tim Dehne
              led global marketing, and
              research and development




© 2010, ASSET InterTech, Inc.        11
What is our T&M strategy?




© 2010, ASSET InterTech, Inc.   12
What is Embedded Instrumentation?


              Any logic structure within a device with a
              purpose of:

              Design-for-Test (DFT)
              Design-for-Debug (DFD)
              Design-for-Yield (DFY)
              Test or Functional items.

              (extract from IEEE P1687 documentation)



© 2010, ASSET InterTech, Inc.         13
Diminishing test probe access


              Multi-layered boards with internal-only traces
              BGAs and other integrated packages with
              inaccessible nodes, SoC, SiP, etc.


                                                                                          ICT/MDA
                                                                                         Accessibility




          Servers                Desktops              Mobile             Ultra-mobile
                        Presented by Intel at Test Tech Forum 2008

© 2010, ASSET InterTech, Inc.                                        14
Degradation of high-speed signals


              Intrusive, probe-based systems are not able to
              measure high-speed signals without disrupting
              their integrity

              “You probe it...... you break it”




© 2010, ASSET InterTech, Inc.          15
Stacked die – no probe access

      Through-Silicon Vias            Bond Wire




© 2010, ASSET InterTech, Inc.   16
Embedded Instrumentation:
      Validation of this Technology Trend
         “Software Solutions to Hardware Problems”
           Transition of external hardware to chip IP + software




                                                 • µP emulation
                                                 • Structural Test for
                                                   printed circuit boards
                                                 • Instrumentation for
                                                   Validation
                                                 • Structural & Functional
                                                   Test & Debug for ICs


© 2010, ASSET InterTech, Inc.         17
Embedded Instrumentation:
      Re-Use at Each Level of Integration


              Any Design Validation, Test or Debug IP
              embedded in a core that can be used by
              design, test and manufacturing engineers is an
              embedded instrument




© 2010, ASSET InterTech, Inc.       18
Significant Product-Life Cycle Savings

     Re-Use Saves Time and Money…but there’s more

                    Semiconductor          PCB




© 2010, ASSET InterTech, Inc.       19
ASSET Market Opportunity and Strategy




© 2010, ASSET InterTech, Inc.   20
Intel® IBIST (Interconnect Built-In Self Test)

• An embedded instrument
  which enables high-speed
  I/O testing
• Bit Error Rate (BER) testing,
  as well as margining (eye
  diagrams)
• Resident in Intel® next-
  generation chips and
  chipsets
• Validates and tests QPI,
  PCIe, SMI and DDR3 high-
  speed buses



© 2010, ASSET InterTech, Inc.     21
IEEE P1687 (IJTAG) based solutions

 • PLX visionPAK™ is an embedded
   instrument PCIe pattern
   generator/analyzer
 • New generation of PCIe Gen 3 switch
   silicon incorporates tools for receiver
   eye capture; pattern generation; fault
   injection; and packet performance
   monitoring.
 • Used by PLX to validate its own
   products, and by its customers to
   check signal integrity and
   manufacturing quality of their board
   designs.
 • Gen 3 devices will run under ASSET
   ScanWorks®


© 2010, ASSET InterTech, Inc.                22
Non-intrusive Board Test (NBT)
• Intel® Greencity Customer
  Reference Board
• Convergence of Boundary
  Scan Test, Processor-
  Controlled Test, and Intel®
  IBIST
• Combination of three
  embedded instrumentation-
  based technologies offers
  unmatched levels of test
  coverage and cost
  reduction.

                       See the case study at http://tinyurl.com/scanworks-greencity
                        See the case study at http://tinyurl.com/scanworks-greencity


© 2010, ASSET InterTech, Inc.                        23
© 2010, ASSET InterTech, Inc.   24
Next Steps


 Register for Frost & Sullivan’s Growth Opportunity Newsletter and keep
 abreast of innovative growth opportunities
 (www.frost.com/news)

 Register for the next Chairman’s Series on Growth:
 Accelerating Growth through Vertical Market Expansion: A How-To
 Primer (April 6) (http://www.frost.com/growth)




                                                                          25
Your Feedback is Important to Us


             What would you like to see from Frost & Sullivan?

Growth Forecasts?

Competitive Structure?

Emerging Trends?

Strategic Recommendations?

Other?

                     Please inform us by taking our survey.
         Frost & Sullivan’s Growth Consulting can assist with your growth strategies

                                                                                       26
Frost & Sullivan on Twitter




           Follow Frost & Sullivan on Twitter

           http://twitter.com/Frost_Sullivan




                                                27
For Additional Information



 Sujan Sami                      Kiran Unni
 Industry Manager                Research Manager
 Test & Measurement              Measurement & Instrumentation
 +91 – 44 – 42044640             (210) 247 2495
 ssami@frost.com                 kiranunni@frost.com




 Sarah Saatzer
 Corporate Communications
 Measurement & Instrumentation
 (210) 477-8427
 sarah.saatzer@frost.com




                                                                 28

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Embedded Instrumentation: Critical to Validation and Test in the Electronics Industry

  • 1. Embedded Instrumentation: Critical to Validation and Test in the Electronics Industry Sujan Sami, Industry Manager Test & Measurement March 10, 2010
  • 2. Focus Points 1. Introduction – Traditional vs. Virtual vs. Embedded Instrumentation 2. Validation, Inspection and Test Technologies 3. Existing Technical Discontinuities 4. Embedded Instrumentation – Solving Validation, Test and Debug Problems 5. Market Trends and Analysis 6. Conclusion 2
  • 3. Introduction – Traditional vs. Virtual vs. Embedded Instrumentation Embedded Application Software Embedded Software Hardware Traditional Traditional instruments – comprised of pre-defined hardware components. Virtual instrumentation – use of customizable software and modular instrumentation hardware. Embedded instrumentation - a concept of entrenching and enhancing the capabilities of traditional external test equipment as an additional resource on the chip and/or on dedicated instrumentation chips on a circuit board. 3
  • 4. Validation, Inspection and Test Technologies Oscilloscopes In-circuit Testers (ICTs) In-circuit Testers (ICTs) Validation Logic analyzers Manufacturing Defect Analyzers (MDA) BERTs Validation, Inspection Flying Probe Testers & Test Flying Probe Testers Test Technologies Boundary Scan Testers Boundary Scan Testers Functional Testers Inspectio Inspection Functional Testers n Automated optical inspection/ Automated X-ray inspection (AOI/AXI) systems 4
  • 5. Existing Technical Discontinuities Lack of test Lack of test access for PCB Primary Challenges Primary Challenges access for PCB catering to circuit structural structural catering to circuit testing boards boards testing Lack of test Lack of test access for access for signal integrity signal integrity testing testing The migration to The migration to chip interconnects chip interconnects speeds in excess speeds in excess Accessibility of 5 Gbps Accessibility of 5 Gbps The need for The need for protocol-aware protocol-aware high-speed I/O high-speed I/O Complexity test Complexity test Limited Limited capacity of capacity of testers testers Cost Cost 5
  • 6. Embedded Instrumentation – Solving Validation, Test and Debug Problems Technology Roadmap Embedded Instrumentation Present and Future LXI 2005 PXI 1998 VXI 1993 Digital Oscilloscope 1971 Embedded Instrumentation Analog Oscilloscope 1950s • Embedded instruments are IP inserted within chips to perform specific validation, test and debug functions. • Some of the test technologies that utilize embedded instrumentation include boundary scan test, processor-controlled test, I/O instrumentation test and core instrumentation test. • Examples of this embedded instrumentation include Intel®’s Interconnect Built-In Self Test (IBIST) for QuickPath Interconnect (QPI) and PCIe BERT/margining, and PLX Technology’s visionPAK™ PCIe packet generator/analyzer toolkit. 6
  • 7. Market Trends and Analysis Trend Analysis ...From ...To Instruments: Traditional Instruments Embedded • Collect and analyze data. • Software based T&M Hardware Cost Software instruments. • Boundary scan testing. GPIB Standard IEEE IJTAG Standard: Cost: • According to Moore’s law, the number of • Cost-effective, agile and flexible. transistors on chips will double every two • Easy to use interface. years. • Modular Instrumentation – software used to • IJTAG Family of Standards: IEEE 1149.1, replace prescribed hardware functionality. IEEE P1687, IEEE 1500, IEEE 1149.6, IEEE 1149.7. 7
  • 8. Conclusion Future of Testing Standard Busses Speed (Gbps or GT/s) Initial Adoption PCI Express III 8.0 2010 Serial ATA III 6.0 2009 USB 3.0 4.8 2008 Traditional Pre Instruments 1980 XAUI 3.125 2005 Intel QPI 6.4 2008 HDMI 1.3 10.2 2006 Opportunities Opportunities in the ATE 1980s in the ATE Virtual Instruments testing testing industry industry CAPEX in downward-trend market 2010 Embedded Instruments and Access to chips critical beyond Development in standards and better price-to- performance ratio 8
  • 9. “Turning Test & Measurement Inside Out” March 10, 2010 Glenn Woppman ASSET President and CEO “2008 EDN Innovator of the Year Finalist & “2008 EDN Innovator of the Year Finalist & 2009 EDN Innovation of the Year Finalist” 2009 EDN Innovation of the Year Finalist” © 2010, ASSET InterTech, Inc. 9
  • 10. ASSET InterTech - origin Spin-off of Texas Instruments in 1995 Boundary Scan Test Market leader* Leading the efforts to establish the Embedded Instrumentation market segment Company Characteristics Standards oriented Software focused Global * Frost & Sullivan report for 2007 (about 30% market share) plus Agilent & Intel endorsements © 2010, ASSET InterTech, Inc. 10
  • 11. ASSET InterTech management Tim Dehne, “father” of NI’s LabVIEW and Virtual Instrumentation, joined our board of directors in June 2009 Over a career stretching more than 21 years at NI, Tim Dehne led global marketing, and research and development © 2010, ASSET InterTech, Inc. 11
  • 12. What is our T&M strategy? © 2010, ASSET InterTech, Inc. 12
  • 13. What is Embedded Instrumentation? Any logic structure within a device with a purpose of: Design-for-Test (DFT) Design-for-Debug (DFD) Design-for-Yield (DFY) Test or Functional items. (extract from IEEE P1687 documentation) © 2010, ASSET InterTech, Inc. 13
  • 14. Diminishing test probe access Multi-layered boards with internal-only traces BGAs and other integrated packages with inaccessible nodes, SoC, SiP, etc. ICT/MDA Accessibility Servers Desktops Mobile Ultra-mobile Presented by Intel at Test Tech Forum 2008 © 2010, ASSET InterTech, Inc. 14
  • 15. Degradation of high-speed signals Intrusive, probe-based systems are not able to measure high-speed signals without disrupting their integrity “You probe it...... you break it” © 2010, ASSET InterTech, Inc. 15
  • 16. Stacked die – no probe access Through-Silicon Vias Bond Wire © 2010, ASSET InterTech, Inc. 16
  • 17. Embedded Instrumentation: Validation of this Technology Trend “Software Solutions to Hardware Problems” Transition of external hardware to chip IP + software • µP emulation • Structural Test for printed circuit boards • Instrumentation for Validation • Structural & Functional Test & Debug for ICs © 2010, ASSET InterTech, Inc. 17
  • 18. Embedded Instrumentation: Re-Use at Each Level of Integration Any Design Validation, Test or Debug IP embedded in a core that can be used by design, test and manufacturing engineers is an embedded instrument © 2010, ASSET InterTech, Inc. 18
  • 19. Significant Product-Life Cycle Savings Re-Use Saves Time and Money…but there’s more Semiconductor PCB © 2010, ASSET InterTech, Inc. 19
  • 20. ASSET Market Opportunity and Strategy © 2010, ASSET InterTech, Inc. 20
  • 21. Intel® IBIST (Interconnect Built-In Self Test) • An embedded instrument which enables high-speed I/O testing • Bit Error Rate (BER) testing, as well as margining (eye diagrams) • Resident in Intel® next- generation chips and chipsets • Validates and tests QPI, PCIe, SMI and DDR3 high- speed buses © 2010, ASSET InterTech, Inc. 21
  • 22. IEEE P1687 (IJTAG) based solutions • PLX visionPAK™ is an embedded instrument PCIe pattern generator/analyzer • New generation of PCIe Gen 3 switch silicon incorporates tools for receiver eye capture; pattern generation; fault injection; and packet performance monitoring. • Used by PLX to validate its own products, and by its customers to check signal integrity and manufacturing quality of their board designs. • Gen 3 devices will run under ASSET ScanWorks® © 2010, ASSET InterTech, Inc. 22
  • 23. Non-intrusive Board Test (NBT) • Intel® Greencity Customer Reference Board • Convergence of Boundary Scan Test, Processor- Controlled Test, and Intel® IBIST • Combination of three embedded instrumentation- based technologies offers unmatched levels of test coverage and cost reduction. See the case study at http://tinyurl.com/scanworks-greencity See the case study at http://tinyurl.com/scanworks-greencity © 2010, ASSET InterTech, Inc. 23
  • 24. © 2010, ASSET InterTech, Inc. 24
  • 25. Next Steps Register for Frost & Sullivan’s Growth Opportunity Newsletter and keep abreast of innovative growth opportunities (www.frost.com/news) Register for the next Chairman’s Series on Growth: Accelerating Growth through Vertical Market Expansion: A How-To Primer (April 6) (http://www.frost.com/growth) 25
  • 26. Your Feedback is Important to Us What would you like to see from Frost & Sullivan? Growth Forecasts? Competitive Structure? Emerging Trends? Strategic Recommendations? Other? Please inform us by taking our survey. Frost & Sullivan’s Growth Consulting can assist with your growth strategies 26
  • 27. Frost & Sullivan on Twitter Follow Frost & Sullivan on Twitter http://twitter.com/Frost_Sullivan 27
  • 28. For Additional Information Sujan Sami Kiran Unni Industry Manager Research Manager Test & Measurement Measurement & Instrumentation +91 – 44 – 42044640 (210) 247 2495 ssami@frost.com kiranunni@frost.com Sarah Saatzer Corporate Communications Measurement & Instrumentation (210) 477-8427 sarah.saatzer@frost.com 28