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RC300E
Relong’s RC300E is commercial microwave and RF laminate
material designed with low dielectric constant and very low
loss characteristics. This ceramic-filled, woven fiberglass
reinforced PTFE composite material is use unique chemistry
formulation and processing to offer RF and Microwave
designers an advantage for improving electrical properties
and mechanical performances.RC300E provides a significant
improvement in performance stability over the current
product line and other traditional fluoropolymer-glass
laminates.
RC300E is ideal Base Station Antenna and Base Station
Power Amplifiers material for low loss and low PIM(-162
dBc). Other key features include low water absorption,
lowest Temperature Coefficient of Dielectric Constant (TCEr
=-23ppm/°C) and very low CTExyz (9, 15 and 50ppm/°C),
high copper peel strength and good dimensional and thermal
stability. It's Dielectric Constant 2.94 and tighter DK
tolerance (±0.05) is desired for achieving high antenna
efficiency and large bandwidth, and also provides a small
degree of miniaturization that is critical to the size constraints
of some antenna designs.
RC300E has very low TCEr, which enables the antenna
designs to maintain high antenna gain and performance over
wider operating temperature ranges by minimizing resonance
frequency shift and bandwidth roll off at the temperature
swings.
RC300E is compatible with the processing used for standard
PTFE based printed circuit board substrates. In addition, the
low Z-axis thermal expansion provided by the ceramic
loading, will improve plated through-hole (PTH) reliability
compared to typical PTFE based laminates.
Features:
•Excellent Thermal Coefficient of
Dielectric Constant (TCEr=-23ppm/°C)
•Excellent PIM Performance(-162
dBc)
•High Thermal Conductivity ideal for
Higher Power Designs.
•Reduced Coefficient of Thermal
Expansion in Z-direction (CTEz)
• Tightest Commercial Laminate DK
Tolerance for Impedance Control
Benefits:
• Low Dielectric Loss (Loss Tangent)
• Low Insertion Loss (S21)
• Excellent Electrical Phase
Stability vs. Temperature
• Excellent Copper Bond Strength
• Low Water Absorption
Typical Applications:
• Base Station Antennas
• Power Amplifiers (PA), Tower Mounted
Amplifiers (TMA) and Tower Mounted
Booster Amplifiers (TMB)
• Antenna Feed Networks
• RF Passive Components
• Multimedia Transmission Systems
High performance RF Antenna material
Your Source International Co Limited
Website : https://ys-intl.hk/
E-mail: dale.xiao@ys-intl.hk / dale.xiao@mail.ru
Address:Hanhaida Building, No.7 Songgagn Avenue, Songgang
Subdistrict, Baoan District,SZ 518105,China
RC300E
Results listed above are typical properties, they are not to be used as specification limits. The above information creates
no expressed or implied warranties. The properties of Relong laminates may vary depending on the design and application.
Typical Properties:
Property Units Value Test Method
1. Electrical Properties
PIM(30mil) dBc -162 50 ohm microstrip lines
Dielectric Constant
@ 10 GHz - 2.94 IPC TM-650 2.5.5.5
Dissipation Factor
@ 10 GHz - 0.0020 IPC TM-650 2.5.5.5
Temperature Coefficient of Dielectric
TCεr @ 10 GHz (-40-150°C) ppm/ºC -23 IPC TM-650 2.5.5.5
Volume Resistivity
C96/35/90 MΩ-cm 1.2 x 10 8
IPC TM-650 2.5.17.1
E24/125 MΩ-cm 1.9 x 10 8
IPC TM-650 2.5.17.1
Surface Resistivity
C96/35/90 MΩ 2.5 x 10 8
IPC TM-650 2.5.17.1
E24/125 MΩ 7.7 x 10 8
IPC TM-650 2.5.17.1
Electrical Strength Volts/mil (kV/mm) 430 (17) IPC TM-650 2.5.6.2
Dielectric Breakdown kV 30 IPC TM-650 2.5.6
Arc Resistance sec >180 IPC TM-650 2.5.1
2. Thermal Properties
Decomposition Temperature (Td)
初始 °C 500 IPC TM-650 2.4.24.6
5% °C 555 IPC TM-650 2.4.24.6
T260 min >60 IPC TM-650 2.4.24.1
T288 min >60 IPC TM-650 2.4.24.1
T300 min >60 IPC TM-650 2.4.24.1
Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 9, 15 IPC TM-650 2.4.41
Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 50 IPC TM-650 2.4.24
3. Physical Properties
Water Absorption % 0.06 IPC TM-650 2.6.2.1
Density, ambient 23ºC g/cm3 2.07 ASTM D792 Method A
Thermal Conductivity W/mK 0.5 ASTM D5470
Flammability class V0 UL-94
4. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress lb/in (N/mm) >10(1.75 ) IPC TM-650 2.4.8
At Elevated Temperatures (150º) lb/in (N/mm) >10(1.75 ) IPC TM-650 2.4.8.2
After Process Solutions lb/in (N/mm) >9(1.58) IPC TM-650 2.4.8
Young’s Modulus kpsi (MPa) 560 (3861) IPC TM-650 2.4.18.3
Flexural Strength (Machine/Cross) kpsi (MPa) 10/13 (69/90) IPC TM-650 2.4.4
Tensile Strength (Machine/Cross) kpsi (MPa) 5.9/7.6 (41/52) IPC TM-650 2.4.18.3
Poisson’s Ratio - 0.25 ASTM D-3039
RC300E
Figure 1
Demonstrates the Stability of Dielectric
Constant across Frequency. The stability
of the Dielectric Constant of RC300E at
different frequencies simplifies design
and ensures good transition and
scalability of design.
Figure 2
Demonstrates the Stability of Dissipation
Factor across Frequency. This
characteristic proves the stability of the
material across frequency, and provides a
stable platform for high frequency
applications where signal integrity is
critical to the overall performance of the
application.
Material Availability:
RC300E laminate is supplied with 0.060 ", 0.030 "thickness now. If you need the other thickness, please consult
the sales or customer service representative. The RC300E laminate offers 1/2OZ, 1OZ and 2OZ electrodeposited
copper foil on both sides. Reverse Treat ED Copper is recommended for Reduced PIM Performance.
RC300E Standard Master Sheets are 54" x 48".Common panel sizes include (not limited) :18"x 12" and 18" x
24 ".when place order, please specify dielectric thickness, cladding type, panel size and any other special
considerations.
Dielectric Constant vs. Frequency for RC300E
Dissipation Factor vs. Frequency for RC300E
Your Source International Co Limited
Website : https://ys-intl.hk/
E-mail: dale.xiao@ys-intl.hk / dale.xiao@mail.ru
Address:Hanhaida Building, No.7 Songgagn Avenue, Songgang
Subdistrict, Baoan District,SZ 518105,China

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RC300E

  • 1. RC300E Relong’s RC300E is commercial microwave and RF laminate material designed with low dielectric constant and very low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is use unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical properties and mechanical performances.RC300E provides a significant improvement in performance stability over the current product line and other traditional fluoropolymer-glass laminates. RC300E is ideal Base Station Antenna and Base Station Power Amplifiers material for low loss and low PIM(-162 dBc). Other key features include low water absorption, lowest Temperature Coefficient of Dielectric Constant (TCEr =-23ppm/°C) and very low CTExyz (9, 15 and 50ppm/°C), high copper peel strength and good dimensional and thermal stability. It's Dielectric Constant 2.94 and tighter DK tolerance (±0.05) is desired for achieving high antenna efficiency and large bandwidth, and also provides a small degree of miniaturization that is critical to the size constraints of some antenna designs. RC300E has very low TCEr, which enables the antenna designs to maintain high antenna gain and performance over wider operating temperature ranges by minimizing resonance frequency shift and bandwidth roll off at the temperature swings. RC300E is compatible with the processing used for standard PTFE based printed circuit board substrates. In addition, the low Z-axis thermal expansion provided by the ceramic loading, will improve plated through-hole (PTH) reliability compared to typical PTFE based laminates. Features: •Excellent Thermal Coefficient of Dielectric Constant (TCEr=-23ppm/°C) •Excellent PIM Performance(-162 dBc) •High Thermal Conductivity ideal for Higher Power Designs. •Reduced Coefficient of Thermal Expansion in Z-direction (CTEz) • Tightest Commercial Laminate DK Tolerance for Impedance Control Benefits: • Low Dielectric Loss (Loss Tangent) • Low Insertion Loss (S21) • Excellent Electrical Phase Stability vs. Temperature • Excellent Copper Bond Strength • Low Water Absorption Typical Applications: • Base Station Antennas • Power Amplifiers (PA), Tower Mounted Amplifiers (TMA) and Tower Mounted Booster Amplifiers (TMB) • Antenna Feed Networks • RF Passive Components • Multimedia Transmission Systems High performance RF Antenna material Your Source International Co Limited Website : https://ys-intl.hk/ E-mail: dale.xiao@ys-intl.hk / dale.xiao@mail.ru Address:Hanhaida Building, No.7 Songgagn Avenue, Songgang Subdistrict, Baoan District,SZ 518105,China
  • 2. RC300E Results listed above are typical properties, they are not to be used as specification limits. The above information creates no expressed or implied warranties. The properties of Relong laminates may vary depending on the design and application. Typical Properties: Property Units Value Test Method 1. Electrical Properties PIM(30mil) dBc -162 50 ohm microstrip lines Dielectric Constant @ 10 GHz - 2.94 IPC TM-650 2.5.5.5 Dissipation Factor @ 10 GHz - 0.0020 IPC TM-650 2.5.5.5 Temperature Coefficient of Dielectric TCεr @ 10 GHz (-40-150°C) ppm/ºC -23 IPC TM-650 2.5.5.5 Volume Resistivity C96/35/90 MΩ-cm 1.2 x 10 8 IPC TM-650 2.5.17.1 E24/125 MΩ-cm 1.9 x 10 8 IPC TM-650 2.5.17.1 Surface Resistivity C96/35/90 MΩ 2.5 x 10 8 IPC TM-650 2.5.17.1 E24/125 MΩ 7.7 x 10 8 IPC TM-650 2.5.17.1 Electrical Strength Volts/mil (kV/mm) 430 (17) IPC TM-650 2.5.6.2 Dielectric Breakdown kV 30 IPC TM-650 2.5.6 Arc Resistance sec >180 IPC TM-650 2.5.1 2. Thermal Properties Decomposition Temperature (Td) 初始 °C 500 IPC TM-650 2.4.24.6 5% °C 555 IPC TM-650 2.4.24.6 T260 min >60 IPC TM-650 2.4.24.1 T288 min >60 IPC TM-650 2.4.24.1 T300 min >60 IPC TM-650 2.4.24.1 Thermal Expansion, CTE (x,y) 50-150ºC ppm/ºC 9, 15 IPC TM-650 2.4.41 Thermal Expansion, CTE (z) 50-150ºC ppm/ºC 50 IPC TM-650 2.4.24 3. Physical Properties Water Absorption % 0.06 IPC TM-650 2.6.2.1 Density, ambient 23ºC g/cm3 2.07 ASTM D792 Method A Thermal Conductivity W/mK 0.5 ASTM D5470 Flammability class V0 UL-94 4. Mechanical Properties Peel Strength to Copper (1 oz/35 micron) After Thermal Stress lb/in (N/mm) >10(1.75 ) IPC TM-650 2.4.8 At Elevated Temperatures (150º) lb/in (N/mm) >10(1.75 ) IPC TM-650 2.4.8.2 After Process Solutions lb/in (N/mm) >9(1.58) IPC TM-650 2.4.8 Young’s Modulus kpsi (MPa) 560 (3861) IPC TM-650 2.4.18.3 Flexural Strength (Machine/Cross) kpsi (MPa) 10/13 (69/90) IPC TM-650 2.4.4 Tensile Strength (Machine/Cross) kpsi (MPa) 5.9/7.6 (41/52) IPC TM-650 2.4.18.3 Poisson’s Ratio - 0.25 ASTM D-3039
  • 3. RC300E Figure 1 Demonstrates the Stability of Dielectric Constant across Frequency. The stability of the Dielectric Constant of RC300E at different frequencies simplifies design and ensures good transition and scalability of design. Figure 2 Demonstrates the Stability of Dissipation Factor across Frequency. This characteristic proves the stability of the material across frequency, and provides a stable platform for high frequency applications where signal integrity is critical to the overall performance of the application. Material Availability: RC300E laminate is supplied with 0.060 ", 0.030 "thickness now. If you need the other thickness, please consult the sales or customer service representative. The RC300E laminate offers 1/2OZ, 1OZ and 2OZ electrodeposited copper foil on both sides. Reverse Treat ED Copper is recommended for Reduced PIM Performance. RC300E Standard Master Sheets are 54" x 48".Common panel sizes include (not limited) :18"x 12" and 18" x 24 ".when place order, please specify dielectric thickness, cladding type, panel size and any other special considerations. Dielectric Constant vs. Frequency for RC300E Dissipation Factor vs. Frequency for RC300E Your Source International Co Limited Website : https://ys-intl.hk/ E-mail: dale.xiao@ys-intl.hk / dale.xiao@mail.ru Address:Hanhaida Building, No.7 Songgagn Avenue, Songgang Subdistrict, Baoan District,SZ 518105,China