Design for manufacturability (DFM) is the procedure of proactively designing products to improve all the manufacturing features: fabrication, assembly, test, procurement, shipping, delivery, service, and repair, and guarantee the most effective cost, quality, reliability, regulatory compliance, safety, time-to-market, and client fulfillment. VayoInfo provide the best design for manufacturability, check out VayoInfo design for manufacturing at http://www.vayoinfo.com/

1. intelligent software, pleasant work
www.vayoinfo.com
DFM Expert
Intelligent DFx analysis

2. On year 2013, Hitachi
elevator free fall due to
defected board in China, a
lady was injured in this
event.
On year 2013, Chrysler
recalled >470,000 vehicles
due to defected board.
Due to abnormal
behavior of PCBA,
Taiwan high speed
train lost power on
year 2013.
Major reason of AirAsia
QZ8501 crash on year 2014
is a cracked solder joint on
PCBA.
On year 2013, GM recall
380,000 vehicles due to
defected engine control
board.
On year 2014, Mitsubishi
recall 115,000 cars due to
defect board of light switch.
It happens around us whatever you notice or not

3. Stage Defects Remark
Design
• No thermal
consideration
• Annual ring small
• Silkscreen error
• Silkscreen
incomplete
• …
>30% PCB
design
comes with
problem.
Manufacturi
ng
• Short
• Open
• Tombstone
• Cold solder
• Void
• …
>60%
defects
could be
found prior
to build
Post-sales
• Solder joint crack
• Solder joint peeloff
• …
Repair rate
for
consumer
product:
5%~37% in
initial 3
years
 Quality/reliability defects
IPC research:
80% defects could be found and resolved at NPI
stage.
Crack risk
No thermal consideration,
leads to cold solder, impact
solder strength
Silkscreen cross brings
build and rework risk
Via is too close to parts, it
leads to poor solder joint,
impact solder joint strength
NonwettingTombstone Bridge Void
Are you always willing to stay with those issues?

4. Past Yesterday Today
Vayo DFx software help you detect defects from the initial beginning.
Above issues puzzles most of us. Vayo customer solved this issue.
Ex.: Venture/SurfaceArt/Sierra/Sandisk…
They may still happen at your side.
Change from DFx

5.  Founded on Jan of 2005, headquarter in China/Shanghai;
 Dedicates to intelligent NPI software to accelerate design to manufacturing;
 Fully in-house development, owns copyrights and patents;
 Product installed >20 countries and regions worldwide;
 Strategy partnership with equipment and EDA provider: Keysight/ViTrox/TRI/Fuji/Panasonic/Altium…
>10 years dedication on NPI technology brings up the world-class product.
Company introduction

6.  Vayo software products installed in >20 countries and regions world wide
(China/USA/Mexico/Japan/Singapore/Malaysia/Thailand/Vietnam/Philippine/Russia/India/Germany/UK/Romania/Spain/Taiwan/…)
Telecom &
network
Computer Consumer
Automotive/
parts
Energy/
Security/Medical
Contract manufacturer Others Partner
Customer reference

7. Customer Testimonials
“From the selection of Vayo
solution on the year of 2007, we
are able to support these data
source whatever we receives what
kind of data from new customer,
and then quickly complete
placement programming. ”
“ Accelerator allowed us to
reduce a lot the quantity of
mistakes in the projects and the
time required for their
preparation. “
Tony Zhou
CEO, IPC board director
Sergei Fedorov
Product Director
“I was impressed by Vayo NPI
tool, it is really world class
solution in the industry!“
Murad Kurwa
Senior Vice President
Kent Kim
Vice President
“We have been impressed with
the product capabilities, their
communication and commitment
to supporting their products is
truly world class.”
“With VayoPro-Test Expert
solution and great support of
Vayo team, we could accelerate
our product review for DFT
(ICT/Boundary).”
Tong Chang
Production Associate Manager
Mohamad Azlan Ahmad,
GPEO-M PE,
“The accelerator function could
help us a lot on component
placement orientation, we don't
need to do mapping Gerber file
and check placement orientation
one by one any more.”
“Communication is important
for every filed, good conversation
shall bring joyful experience, Vayo
is such company we worked
with!”
CC Cho
Sr. Manufacturing Engineer
David Kim
Test Development Manager
“From years of experience with
DFT and CAD SW's, VayoPro-Test
Expert is the best. It is fast,
accurate and easy to use. Its DFT
report is very comprehensible for
our customers.”
Atar Mittal
General manager
“Vayo tool has been extremely
useful for us in identifying
assembly issues much ahead of
the actual assembly process. This
has drastically reduced holdups in
the production line, increasing our
productivity.”
”by introducing Vayo‘s
intelligent software tool it is now
possible for operators to perform
data conversion requiring little
skill, while reducing the work time
required to a fifth of what it
was.”
Mitsuo Imai
General manager
Eddie Chang
SMT engineer
“Vayo tool is a very intuitive and
user-friendly. You can match parts
and pds visually and new pd can be
created easily. Part Data Editor and
Parts Verification ensure every
location has correct part, size and
orientation.”
CHIA Kar Lin
Head of Innovation Centre
“We started with Vayo at year
2009 and has not been turning
back since then. What differentiate
Vayo from the rest is their
willingness to listen to
customer’s needs with fast
respond.”

8. Intelligent DFx
analysis
PCB layout Eng.,
process Eng.
NPI Eng.
Fast placement
programming, support
Fuji, Panasonic, ASM,
Juki, Yamaha…
SMT programmer
DFT/Testability,
ICT/FP/AXI/AOI
programming
Testing Eng.
DFM Expert & DRC+
Other NPI sw
SMT Expert/
Accelerator
Test Expert
Document
Expert
Work instruction
document
preparation
Process Eng.,
Industry Eng.
Board troubleshooting,
Gerber conversion,
assembly drawing, NPI
team collaboration
Debug tech,
others…
 Reduce design & mfg cycle: 30%-70%
 Reduce quality defects: 30%+
 Increase reliability: 30%+
 Increase design and mfg efficiency: 40%+
 Reduce design and mfg cost: 20% +
* NPI：New Product Introduction
Core product: Intelligent NPI software for PCBA

9. DFx is must capability for every
electronics company

10.  Predict defect opportunity,
increase manufacturing quality
and reduce cost
IPC research:
80% defects could be found and
resolved at NPI stage.
With DFx consideration:
Increase process difficulty &
steps; rapid solder/assembly
defects; increase rework rate
and work loading; lower work
efficiency and increase
manufacturing cost
Why DFx: predict/solve process issue

11.  Improve reliability, reduce
repair rate, protect brand
reputation.
Medical/automotive/military/aerospace/… product
require high reliability
Stability of consumer electronics products impacts brand loyalty
and service cost.
DFM Expert performs comprehensive
checks on solder joints to ensure high
reliability.
Increase PCBA lifecycle
Why DFx: Improve product reliability

12.  Concurrent engineering, reduce
prototyping times, shorten time-to-
market
Concurrent design process
Product design challenge
Fast product replacement
High density, smaller
Difficult to transfer knowledge & training
new people
Why DFx: reduce design cycle

13.  DFM automation software theory
Based on design data, interacts with entity parts library, respects to rich industry
standard to design & manufacturing, intelligent simulate/analysis prior to manufacturing,
find out defects & risk of design at the first time
 Traditional manual method
 Check one by one manual
 Can’t do comprehensive check
 Low work efficiency, long cycle
 Invisible report for communication
 Long cycle (time to market)
 DFM Expert software
 Comprehensive check of PCB
 Quick to final result
 Cover design, fabrication, assembly
 Improve DFM capability quickly
No DFM software
(Manual check > 2 weeks)
With Vayo Professional
DFM analysis software
Save
DFM Automation Software

14. CAD/Gerber Source
Support all CAD
Gerber/Drill import
BOM Analysis
Internal validation
BOM&CAD Validation
Support alternative part
DFM Expert
Design for Manufacturing Analysis
Component Library
Comprehensive library
Quick manual create
Detailed parts info.
Practical Rules
Standard IPC rules
Industry Experience
Configurable
PCB Fabrication Check
Validate Signal
Validate Drill
Validate Solder
 mask/Silkscreen...
Result Query & reports
Interactive check
Easy to share
Powerful/Configurable
PCB Assembly Check
Validate footprint/pad
Validate spacing/distance
Validate soldering …
Comprehensive, Automatic, Easy

15.  Check rules: 300 items
 Check content
 Signal layer
 Silkscreen layer
 Solder mask layer
 Solder paste layer
 Drill
 …
DFM Expert Scope: PCB Fabrication

16.  Checking rules: 900 items
 Check content
 Screen printing process
 Placement process
 Reflow process
 Manual insert process
 Wave soldering process
 Test & inspection
 Rework
 …
DFM Expert Scope: PCB Assembly

17. 1. Import PCB data
(CAD/Gerber)
2. Import material info.
(BOM/AVL)
3. Link part library, virtual
assembled boards
5. Interactive results
query
4. Perform analysis
with thousands rule
6. Select critical issues for
report output
DFM Expert Workflow

18.  Support all existing PCB CAD, intelligent detect file type
No CAD (File name) No CAD (File name)
1 Accel (*.pcb) 14 Mentor (Neutral)
2 Cadence Allegro (*.val, *.cad) 15 DB++ (*.tgz)
3 Cadence Allegro (*.brd) 16 ODBxml (*.xml)
4 Cadence Allegro (*.fil,*.fim) 17 OrCAD (*.min
5 CR3000 (*.BSF, *.CCF, …) 18 ODBGateway (*.odb)
6 CR5000 (*.ftf, *.pcf) 19 PCAD (*.pdf)
7 Docica (*.docica) 20 PowerPCB/PADS (*.asc)
8 Fatf (*.asc) 21 Protel (*.pcb)
9 Gencad (*.cad, *.gen) 22 Protel3/Altium (*.pcbdoc)
10 Gencam (*.gcm) 23 TopCAD (*.txf)
11 HPLink (*.plk) 24 Unidat(*.uni)
12 HP_EGS (*.df) 25 Viscadif (*.paf)
13 IPC356 (*.ipc)
 Support XY data + Gerber source
Support CAD data source

19.  Support multiple BOM Formats
 Excel, Text
 BOM .Vs. CAD Validation
 Mismatch parts quantity
 Duplicate part number
 In BOM not in CAD
 …
 Minimize human interfere errors
 BOM Comparison
Save >70%
manipulation cycle
Automatic BOM Import & Validation

20.  Under SQL Database
 Actual geometry/dimension data
of part body enables the possible
for virtual PCBA
 Based on datasheet
 Support multiple shape
(Rectangle/Circle…)
 Multi-layers body
 Detailed pin info.
(Shape, size, direction, location, …)
 2D & 3D View
 Fastest part creation approach
among the industry
 Intelligent capture info. from CAD
Rich Component Entity Library

21.  Support IPC standard
 IPC-7351
 IPC-A-600
 IPC-A-610
 IPC-TM-650
 IPC-2221
 IPC 7095
 …
 Vayo experience rules
 Thousands checking rules
 Configurable parameter
 Rule customization service
 Customer internal guideline
conversion service
Practical Checking Rule

22.  Interactive query
 Snapshot defects
 Add remark/comments
 Colorful warning level
Interactive Result Query

23.  Comprehensive Content
• Defect Level
• Defect Name
• Rule Info.
• Actual Value
• Picture
• Locations
• Layer/Side Info.
• ……
 Export Report
• Excel, PDF, …
• Customization service
Result Report Export

24. Impact
• Stop production, waste
product line resource
• Delay shipment & go-to-
market
Package not match
Missing via, small copper
size
Package not match
Package not match
Sample DFx issue: material not match PAD design

25. Impact:
• Require high precise equipment
• Risk of assembly conflict
• Difficult to rework
Sample DFx issue: components too close

26. Impact:
More via on boards, it shall be more easy
to bring short, bridge, and insufficient
solder issues.
Good design
Sample DFx issue: Via distance to pad

27. Impact:
Easy to cause weak structure; lead to crack/ broke & malfunction
in severe usage conditions.
Annual ring too small, even missingVia offset to pad
Sample DFx issue: annual ring design

28. Impact:
May cause bridge/short when PCBA goes through wave process.
Sample DFx issue: risk for via under component

29. Impact:
via in BGA pad, it might lead to weak solder joint strength because of void. It
shall impact product reliability.
Sample DFx issue: Via under BGA pad

30. Solder mask defined pad, it shall easily cause the root of solder joint crack
especially in frequently shock environment.
Sample DFx issue: BGA pad design

31. Impact:
It might cause tombstone if there is no thermal consideration. Or it might cause insufficient solder for
PTH parts, and then impact solder joint strength and product reliability.
Good designPoor design
Poor design
Sample DFx issue: no thermal consideration

32. Impact:
PTH part approach mask strip too near, easily cause solder issue
like short.
Poor design
Sample DFx issue: PTH part to mask strip

33. TP size impact contact of probe, then impact faults reject rate of test.
Sample DFx issue: poor test point design

34. Impact
• Wrong polarity during assembly
• Replace with wrong material during rework
No polarity mark Cross of part reference name
Sample DFx issue: poor silkscreen design

35. Impact
Brings offset risk during assembly
Good design
Sample DFx issue: no local fiducial for fine-pitch parts

36. Impact:
Part placement orientation shall be consistent with wave process, otherwise it may
casue bridge.
Good design Poor design
Sample DFx issue: Orientation of part pass through oven

37. Impact:
Component mismatch may leads material shortage for the work order, which leads to
production stop, waste equipment resource; Or cause excessive material purchasing
and extra inventory.
DFM Expert perform
intelligent check of BOM
content, report any
quantity mismatch error.
Sample DFx issue: BOM content error

38. Impact
Big size difference between alternative part with primary part may cause assembly
problem, solder joint defect or poor reliability.
DFM Expert compare
dimension between alternative
part with primary part, and alter
upon big size difference.
Sample DFx issue: Alternative part analysis

39. DFM
Analysis
Fabrication
300 check items, cover potential risk in those layers (signal, silk
screen, solder mask, …) & drill
Assembly
900 check items, cover the process of screen printer, pick&place,
reflow, manual insert, wave, testing, repair & etc
Data
source
CAD
Cadence Allegro/OrCAD, Mentor/PowerPCB/Pads, Altium/Protel,
Zuken CR3000/CR5000, ODB++, GenCAD, …
Gerber RS-274-D, RS-274-X
BOM Powerful parser, support varies dynamic content
Rev.
comparison
CAD rev. difference check, BOM difference check
Parts
library
Build-in library
200K parts and typical package free of charge, detail and actual
component dimension
Creation tool Easy for parts/package creation
Check
rules
Build-in rules
Support IPC standard ( IPC-7351, IPC-A-610, IPC-2221, …),
Vayo industry experience
Management
Flexible, configurable, support multiple library, access rights
control
Results
query,
reports
& output
Query Interactive query, link to PCB location
Reports Export critical issue to Excel/PDF/Html formats
3D view &
output
3D PCBA view, output DXF 3D data
Part list Output material/parts data
Affordable DFM/DFA solution!
Function & feature
DFM Expert

40.  Reduce trial-run times: 2 ~ 3 times
 Reduce quality defects: 5% ~ 10%
 Reduce manufacturing cost: 2% ~ 5%
 Reduce design cycle, time to market: 5% ~ 10%
 Save labor cost (DFM analysis): 50% ~ 80%
 Improve product stability
 Leverage Design & Manufacturing capability
Business benefit

41. Thanks!intelligent software, pleasant work
www.vayoinfo.com