Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Lithography technology and trends for « Semiconductor frontier » held by Aman...Yole Developpement
Lithography technology and trends for « Semiconductor frontier »
Mask aligners are the fastest lithography technology
Stepper technology provides the best resolution
Key requirements for Advanced Packaging
LED manufacturers use small diameter wafers (2”, 3”, 4” or 6”) and transition more rapidly than traditional semiconductor’s industry to larger diameters
WAFER SIZE
Wafer bow can reach up to 50μm for 2” wafers and 100μm for 4”, inducing pattern distortion.
WAFER BOW
2”
4”
6”
LED manufacturers can use different substrates, mostly sapphire or SiCwafers, which are transparent with light-diffusing features such as rough or patterned surfaces. Also, they can use metal wafers for vertical structures, so there’s large material variability.
Status of The Advanced Packaging Industry_Yole Développement reportYole Developpement
IoT driven semiconductor industry consolidation is reflecting into a highly dynamic Advanced Packaging landscape. Demand for advanced packaging and market size is increasing. Focus is turning
to integration and wafer level packages to enable a functionality driven roadmap and revive the cost/performance curve.
Photolithography Equipment and Materials for Advanced Packaging, MEMS and LED...Yole Developpement
Growing photolithography equipment markets in Advanced Packaging, MEMS and LEDs are attracting new players – but they have to navigate complex roadmaps.
Clear leaders and outsiders: At first glance, the projection systems industry serving the “More Moore” and the “More than Moore” markets are similar…
The semiconductor industry is very often identified by its “More Moore” players, driven by technology downscaling and cost reduction. There’s one clear leader supplying photolithography tools to the “More Moore” industry: ASML, based in The Netherlands. It’s followed by two Japanese outsiders, Nikon and Canon. Providing this market with photolithography equipment is highly complex and there are gigantic barriers to market entry. Enormous R&D investments are required as the key features to print shrink ever further. Also, the tolerances specified are very aggressive and thus equipment complexity keeps on increasing...
Equipment and Materials for Fan-Out Packaging 2019 report by Yole Développement Yole Developpement
Electronic packaging equipment and materials revenue growth is highly reliant on big players’ investments. A new killer application is needed to fuel robust growth.
More information on https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/
Silicon Photonics for Data Centers and Other Applications 2016 - Report by Yo...Yole Developpement
Exponential data growth in data centers will propel silicon photonics to take off into other applications, like lidar.
Big data is getting bigger by the second. Transporting this level of data around with existing technologies will soon reach power consumption, density and weight limits. Photons will continue to replace electrons throughout networks, including in the data center, in the rack and very soon on the board.
Silicon photonics is an exciting technology mixing optics, CMOS technology and advanced packaging. It combines silicon technology’s low cost, higher integration and interconnect density and higher number of embedded functionalities with lower power consumption and better reliability compared to legacy optics.
Massive R&D investments have been made in silicon photonics, but today there are still few products on the market. However, this technology has been strongly pushed by large Webcom companies such as Microsoft, Amazon and Facebook, with investments that will overtake the traditional service providers’ investments in a few years. These Webcom players are targeting $1/Gb prices and are principals for the development of cost-effective photonics technology for future generations of data centers.
Nano-Imprint Technology Trends for Semiconductor Applications 2019 Report by...Yole Developpement
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
More information on: https://www.i-micronews.com/products/nano-imprint-technology-trends-for-semiconductor-applications-2019/
Mems and sensors packaging technology and trends presentation held by Amandin...Yole Developpement
MEMS & sensors transitioning towards 3 main Hubs…
The inertial hub
Examples of MEMS companies with a «sensors integration» road (e.g., mCubewith iGyro, Spectral Engines with integrated spectrometer, Bosch with environmental combo sensors, AMS with optical combos, InvenSense with IMUs ….
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
MEMS & Sensors challenges & opportunities for the next decade 2016 Presentati...Yole Developpement
MEMS & Sensors enable key functionalities…
Current battleground of the industry
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
Automotive is the historical MEMS high volume market
Transition started in 2003 towards consumer products…
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Electronic circuits provide us with the ability to control the transport and storage of electrons. However, the performance of electronic circuits is now becoming rather limited when digital information needs to be sent from one point to another. Photonics offers an effective solution to this problem by implementing optical communication systems based on optical fibers and photonic circuits. Unfortunately, the micrometer-scale bulky components of photonics have limited the integration of these components into electronic chips, which are now measured in nanometers. Surface plasmon-based circuits, which merge electronics and photonics at the Nano scale, may offer a solution to this size-compatibility problem. Here we review the current status and future prospects of plasmonics in various applications including plasmonic chips, light generation, and nanolithography.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Silicon photonics is an evolving technology in which data is transferred among computer chips by optical rays. Optical rays can carry far more data in less time than electrical conductors.
This presentation gives emphasis on the basics of silicon photonics
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
Fast growing new applications will drive the EEL market to reach US$5.1B in 2024.
More information on https://www.i-micronews.com/products/edge-emitting-lasers-technology-industry-and-market-trends/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Fan-Out Packaging: Technologies and Market Trends 2019 report by Yole Dévelop...Yole Developpement
Samsung and PTI, with panel-level packaging, have entered the Fan-Out battlefield.
More information on that report at : https://www.i-micronews.com/report/product/fan-out-packaging-technologies-and-market-trends-2019.htm
GaN RF Market: Applications, Players, Technology and Substrates 2020Yole Developpement
Driven by military applications and 5G telecom infrastructure, the GaN RF market continues growing.
Learn more about the report here: https://www.i-micronews.com/products/gan-rf-market-applications-players-technology-and-substrates-2020/
Thin wafer processing and Dicing equipment market - 2016 Report by Yole Devel...Yole Developpement
Strong demand for thinner wafers and smaller die is driving the evolution of dicing technologies
Demand for thinned wafers is growing strongly!
Driven by consumer applications such as smartphones, smart cards and stacked packages, the demand for thinned wafers has increased over recent years.
We estimate that the number of thinned wafers used for MEMS devices, CMOS Image Sensors, memory and logic devices, including those with TSVs, as well as and Power devices exceeded the equivalent of 16.5 million 8-inch wafer starts per year (WSPY) in 2015. This is mainly supported by CMOS Image Sensors, followed by Power devices. We expect that this number of thinned wafers will peak at the equivalent of almost 32 million 8-inch WSPY by 2020. This would represent a 14% compound annual growth rate (CAGR) from 2015 to 2020.
Thinner wafers bring several benefits, including enabling very thin packaging, and therefore better form factors, improved electrical performance and high heat dissipation.
Miniaturization towards smaller, higher-performing, lower-cost device configurations has thinned wafers below 100 µm or even 50 µm for some applications, such as memory and power devices.
Forecasts for the number of thinned wafers by thickness and by application are analyzed in this report. It also includes insights on the number of thinning tools, breakdowns by wafer size, and technological highlights affecting the applications mentioned above...
Computing and AI technologies for mobile and consumer applications 2021 - SampleYole Developpement
Penetrating everyday products will see the market for AI technologies for the consumer market reach $5.6B in 2026.
More information : https://www.i-micronews.com/products/computing-and-ai-technologies-for-mobile-and-consumer-applications-2021/
System-in-Package Technology and Market Trends 2021 - SampleYole Developpement
Through enabling design and supply chain agility, SiP will reach $19B by 2026, with IDMs, OSATs, and foundries taking advantage of it.
More information : https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2021/
2.5D heterogeneous and 3D wafer-level stacking are reshaping the packaging landscape.
More information on that report at https://www.i-micronews.com/advanced-packaging-report/product/p2-5d-3d-tsv-wafer-level-stacking-technology-market-updates-2019.html
Status of Advanced Substrates 2019 report by Yole DéveloppementYole Developpement
Demands from the new digital age are waking up the sleeping substrate giants.
More information on https://www.i-micronews.com/products/status-of-advanced-substrates-2019/
Beyond communication, silicon photonics is penetrating consumer and automotive – heading to $1.1B in 2026.
More information: https://www.i-micronews.com/products/silicon-photonics-2021/
MEMS & Sensors challenges & opportunities for the next decade 2016 Presentati...Yole Developpement
MEMS & Sensors enable key functionalities…
Current battleground of the industry
MEMS is a semiconductor technology thus enabling miniaturization and lower cost manufacturing of existing products
Automotive is the historical MEMS high volume market
Transition started in 2003 towards consumer products…
After decreasing die size, improvements are now focused on packaging issues and use of through silicon vias (TSVs) for instance
In the ultrasound module market, CMUT and PMUT are growing two times faster in medical and consumer applications.
More information: https://www.i-micronews.com/products/ultrasound-sensing-technologies-2020/
Sony IMX400 Tri-layer Stacked CMOS Image Sensor (CIS) with Integrated DRAM an...Yole Developpement
A closer look at the impressive, industry-first, tri-layer stacked CIS.
Sony leads the global CMOS Image Sensor (CIS) market, commanding more than a third share of the industry’s total revenue. And over the years, Sony has maintained its leadership by providing innovative CIS products for original equipment manufacturers like Samsung or Apple. In 2017, Sony as a smartphone designer decided to release in its flagship the latest and potentially the greatest innovation in the past decade of CIS manufacturing.
Inside the Sony Xperia™ XZs and the XZ Premium, the latest Motion Eye™ can be found, with the new IMX400 CIS. This three-layer stacked CIS is made with the traditional pixel array and logic circuit on the same die, but also a 1Gb DRAM memory allowing slow motion at almost 960 frames per second.
This innovative CIS is Sony’s next generation technology. The CIS includes a 22 Mpixel array, a 1Gb DRAM die and a digital signal processor (DSP) on the same die footprint. This is the first tri-layer stacked CIS on the market. In this configuration, Sony can provide a fast readout image sensor with no distortion when shooting fast-moving objects thanks to the high capacity DRAM between the pixel array circuit and the DSP circuit.
Using Sony’s Exmor-RS and Xperi’s Zibond technologies, Sony has managed to integrate the three dies in a single thin, small and cost-effective sensor die. Surprisingly, the die sensor uses a unique sort of TSV at different levels to interconnect the dies.
This report includes a complete analysis of the camera module from the Sony Xperia™ XZs, featuring camera module disassembly and die analyses, processes and cross-sections. It also includes a comparison with the Samsung Galaxy S7, Apple iPhone 7 Plus, and Huawei P9 telephoto camera modules. At the CIS level, it compares the IMX400 with the IMX260, the IMX286, and the latest custom CIS for Apple from Sony’s portfolio. Finally, it contains a complete cost analysis and a selling price estimation of the CIS die.
More information on that report at http://www.i-micronews.com/reports.html
Silicon Photonics 2018 - Report by Yole Developpement Yole Developpement
Fueled by increasing internet traffic thanks to social networks, video and gaming content, increasing bandwidth will be required for inter- and intra-data center communications. As a short term answer to this possible bandwidth congestion, new photonics technology for transceivers is still pulled onto the market by Google, Apple, Facebook, Amazon and Microsoft (GAFAM) and now by Baidu, Alibaba and Tencent (BAT) in China.
More information on that report at http://www.i-micronews.com/reports.html
Acoustic MEMS and Audio Solutions 2017 - Report by Yole DeveloppementYole Developpement
The audio business is about to experience profound changes
Audio is becoming a key function of multiple existing and new products that increasingly has to be analyzed as a complete landscape compared to independent devices. From mobile phones to cars, from home assistants to drones, audio products like microphones, speakers and audio integrated circuits (ICs) are essential for all the new systems driving consumer electronic markets. The total audio business was worth more than $15B in 2016. With a compound annual growth rate (CAGR) close to 6%, in 2022, the audio device market will be worth $20B and become a key feature in all the applications it is involved in. And there’s clearly room for more added value in the audio supply and value chain, as well as other significant changes.
In 2016, Yole estimates that the MEMS microphone market has almost reached the $1B milestone, with a value of $993M. Combined with the $700M electret condenser microphone (ECM) market, now the acquisition of sound is almost a $2B value market. The µspeaker market is estimated to be worth $8.7B, (meaning speakers less than two inches in diameter). In addition to these two visible elements of the audio chain, the audio IC market, which includes codecs, digital signal processors (DSPs) and amplifiers, is estimated to be worth $4.3B in 2016.
This new Yole report describes the evolution of the three audio functions, microphones, speakers and audio ICs, technical trends, as well as the evolution of the strategies of the main players to capture a larger part of this fast-growing field.
For more information about our report, please visit our website: https://www.i-micronews.com/reports.html
Electronic circuits provide us with the ability to control the transport and storage of electrons. However, the performance of electronic circuits is now becoming rather limited when digital information needs to be sent from one point to another. Photonics offers an effective solution to this problem by implementing optical communication systems based on optical fibers and photonic circuits. Unfortunately, the micrometer-scale bulky components of photonics have limited the integration of these components into electronic chips, which are now measured in nanometers. Surface plasmon-based circuits, which merge electronics and photonics at the Nano scale, may offer a solution to this size-compatibility problem. Here we review the current status and future prospects of plasmonics in various applications including plasmonic chips, light generation, and nanolithography.
Pluggable transceivers in high volume production. Co-packaged optics in line of sight.
More information on: https://www.i-micronews.com/products/silicon-photonics-2020/
Silicon photonics is an evolving technology in which data is transferred among computer chips by optical rays. Optical rays can carry far more data in less time than electrical conductors.
This presentation gives emphasis on the basics of silicon photonics
Micromachined Electro-Mechanical Systems, also called microfabricated Systems, have evoked great interest in the scientific and engineering communities. This is primarily due to several substantive advantages that MEMS offer: orders of magnitude smaller size, better performance than other solutions, possibilities for batch fabrication and cost-effective integration with electronics, virtually zero dc power consumption and potentially large reduction in power consumption, etc.
This Seminar would give an introduction to these exciting developments and the technology and design approaches for the realization of these integrated systems. It would be followed with an introduction to the design of microsensors, such as the pressure sensor and the accelerometer, which began the MEMS revolution.
A systematic approach is developed to select manufacturing Process Chains for the generic elements of a MEMS device. A database of MEMS Process Chains and their attendant process attributes is developed from the existing literature, and used to construct Process Attribute charts. The performance requirements of MEMS beams and trenches are translated into the same set of Process Attributes. This allows for a screening of the Process Chains to obtain a list of candidate manufacturing methods.
I begin with a quick introduction to MEMS technology, micron scale and show that silicon is eminently suited for micromechanical devices and therefore the possibility of integrating MEMS with VLSI electronics. Smart cell phones and wireless enabled devices are poised to become commercial engines for the next generation of MEMS, since MEMS provide not only better functionality with smaller chip area, but also alternative transceiver architectures for improved functionality, performance and reliability.
The application domains cover microsensors and actuators for physical quantities, of which MEMS for automobile & consumer electronics forms a large segment; microfabricated subsystems for communications and computer systems.
Edge Emitting Lasers: Market and Technology Trends 2019 report by Yole Dévelo...Yole Developpement
Fast growing new applications will drive the EEL market to reach US$5.1B in 2024.
More information on https://www.i-micronews.com/products/edge-emitting-lasers-technology-industry-and-market-trends/
Bonding and Lithography Equipment Market for More than Moore Devices by Yole ...Yole Developpement
More than Moore devices fueled by megatrend applications will strongly drive the growth of the lithography, permanent bonding, and temporary bonding and debonding equipment market.
More information on that report at https://www.i-micronews.com/report/product/bonding-and-lithography-equipment-market-for-more-than-moore-devices.html
Inkjet functional and additive manufacturing for electronics 2018 Report by Y...Yole Developpement
How inkjet is building a success story drop by drop within 2.5D and 3D manufacturing?
More information on that report at https://www.i-micronews.com/report/product/inkjet-functional-and-additive-manufacturing-for-electronics.html
Emerging Printing Technologies 2019 report by Yole Développement Yole Developpement
Emerging printing technologies are filling the gap for rising applications.
More information on https://www.i-micronews.com/products/emerging-printing-technologies-2019/
Photonics applications are driving the GaAs wafer and epiwafer market into a new era.
More information on: https://www.i-micronews.com/led-report/product/vcsels-technology-industry-and-market-trends.html
New applications drive greater shipment volumes, which drive new applications, bringing the uncooled IR sensing market into a virtuous cycle.
More information on : https://www.i-micronews.com/report/product/uncooled-infrared-imagers-and-detectors-2019.html
Driven by application diversification, IPDs (integrated passive devices) continue their promising
growth.
Today, miniaturization and integration are key drivers in electronic devices. This is even more critical in several consumer applications, where thinner devices mean higher integration levels, necessitating low-profile components.
More information on that report at http://www.i-micronews.com/reports.html
Piezo printheads are accelerating commercial and industrial printing growth.
More information on https://www.i-micronews.com/products/inkjet-printheads-dispensing-technologies-market-landscape-2019/
IR LEDS and VCSELs - Technology, Applications and Industry Trends - 2017 Repo...Yole Developpement
3D imaging, gas sensing and autofocus will fuel the IR light source market to reach US$3.8B in 2027.
INFRA-RED LIGHT SOURCES: A $1.5B OPPORTUNITY IN 2022 – AND POTENTIALLY $3.8B IN 2027 – DRIVEN BY SEVERAL NEW APPLICATIONS
The market for LED and laser infra-red (IR) light sources is not new, but has evolved rapidly with the recent development of Solid State Lighting (SSL). Initially developed for optical communication applications, these technologies, mostly IR LEDs, started to be integrated into consumer applications like remote controls in the 1980s. Next, the market was driven forward by night vision applications such as surveillance cameras. But it’s only recently, with the development of smartphones, that IR LEDs and lasers have come back to prominence. And now, the market is set for growth for the next 10 years! Today, these technologies are part of a new revolution, still driven by smartphone applications. Integration of breakthrough functionalities such as 3D imaging, autofocus, iris and face recognition is triggering a strong market pull for efficient, miniaturized and complex IR illumination. This trend will also create strong market opportunities for IR lasers, mostly VCSELs, which allow more coherent and directional light than IR LEDs. In this context, we expect the IR light source market to grow from around $450M in 2016 to around $1,550M in 2022 at a compound annual growth rate of 22.7%. In addition, there are also several other applications that are emerging and for which a market boom is likely to happen in the next 10 years. These include gas sensors, LIDARs, driver monitoring systems and remote patient monitoring sensors. We expect this second wave of new applications to propel the IR light source market to around $3,800M in 2027. This report provides an in-depth analysis of all IR light source applications, including: basic principles, technology, trends, key players, and market size. It highlights the global landscape for IR light sources, including classification of applications by wavelength, market segment and function. Detailed market forecasts are given based on these classifications and with complementary analysis by light source for LEDs, edge-emitting lasers and VCSELs. Please note that optical communication applications are not analyzed in this report.
For more information please visit our website: https://www.i-micronews.com/reports.html
Piezoelectric Devices: From Bulk to Thin-Film 2019 report by Yole DéveloppementYole Developpement
How strongly will piezoelectric’s good vibrations resonate in the device market?
More information on https://www.i-micronews.com/products/piezoelectric-devices-from-bulk-to-thin-film-2019/
VCSELs – Market and Technology Trends 2019 by Yole DéveloppementYole Developpement
New functionalities in smartphone and automotive are boosting the VCSEL market.
More information on https://www.i-micronews.com/products/vcsels-market-and-technology-trends-2019/
3D Imaging & Sensing 2018 Reports by Yole DeveloppementYole Developpement
The iPhone X initiated a trend. What happens next?
More information here: https://www.i-micronews.com/category-listing/product/p3d-imaging-sensing-2018.html
LiFi - Technology, Industry, and Market Trends report by Yole DéveloppementYole Developpement
LiFi: Niche or mainstream technology?
More information on : https://www.i-micronews.com/led-report/product/lifi-technology-industry-and-market-trends.html
RF GaN Market: Applications, Players, Technology and Substrates 2019 report b...Yole Developpement
GaN RF market growth is fed by military and 5G wireless infrastructure applications.
More information on https://www.i-micronews.com/products/rf-gan-market-applications-players-technology-and-substrates-2019/
Market & Technology Trends in Materials and Equipement for Printed and Flexib...Yole Developpement
Combined flexible & printed electronic applications could reach US$1B in 2020. Multiple applications are driving growth!
TECHNICAL CHALLENGES ARE CLOSE TO BEING OVERCOME TO REACH US$1B MARKET BY 2020
Today flexible & printed electronics create a lot of hope. And a supply chain is being created to support an industrial infrastructure. In our report, we have identified and tracked the five main functionalities of flexible & printed electronics: displaying, sensing, lighting, energy generating and substrates. The different degrees of freedom in flexibility that can be obtained can be divided into:
- Conformable substrate: the flexible substrate will be shaped in a definitive way after processing
- “Bendable” substrate: they can be rolled and bent many times (even if we consider it will not be a key feature coming from customer needs)
- “Unused” flexibility: in the end, the flexibility is not an added value to the customer
We believe some applications will be more likely than other to be successful – for example, bendable applications will undergo tough stress during use and technological challenges will be hard to overcome. Our report shows the distinction between the functions (displaying, lighting, energy conversion, sensing & substrates) and the seek flexibility “degree of freedom”. We do not make the distinction in our report between organic and inorganic substrates as semiconductors can also be used as flexible substrates.
However, we believe over the next several years, the number of applications using printing processes for flexible electronics will grow (Figure on page 2).
We estimate the printed & flexible electronics market will grow from ~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value. Printed OLED displays for large size (TVs) are likely to become the largest market. For OLED lighting, we believe it will grow but remain a niche market for automotive and/ or office lighting. For PV, the market demand by 2020 will remain very low compared to the demand for rigid PV, largely below 1% of the global market demand by 2020. Sensor, smart system & polytronic applications will include sensors, touchless / touch screens, RF ID applications.
A WIDE, EXCITING RANGE OF NEW APPLICATIONS
Printed & flexible electronics is a new exiting technology with large potential market expectations. Indeed, as semiconductors move to the very small with 22nm critical dimension, printed electronics moves to the other end of the spectrum with its own material, equipment, process challenges and supply chain. Printed electronics will not kill semiconductor electronics as it will not be a replacement for CMOS silicon.
More info at http://www.i-micronews.com/reports/Flexible-Based-Printed-Electronics-Technologies/6/367/
Wafer starts for More than Moore applications 2018 Report by Yole Developpement Yole Developpement
Driven by megatrend markets, More than Moore devices’ overall wafer demand is expected to grow at an almost 10% CAGR from 2017 to 2023.
More information on that report at https://www.i-micronews.com/report/product/wafer-starts-for-more-than-moore-applications.html
InP Wafer and Epiwafer Market: Photonics and RF 2019 report by Yole Développe...Yole Developpement
Photonics (telecom, datacom, LiDAR, sensing and others...) is driving the InP wafer market.
As an old but still gold-standard member of the compound semiconductor family, InP possesses the key advantages of emission and detection capabilities over 1000 nm in the photonics domain, as well as high speed and low noise performance in high-frequency RF applications. Though it is
often overshadowed by rivals like GaAs and SiGe for mass-volume, cost-driven RF applications, InP remains a top choice for performance-driven niche markets like military communication, radar, and radiometry, as well as automatic test equipment. Moreover, different industrial actors (i.e. Skyworks, GCS, and IntelliEPI) are monitoring InP technology for the upcoming 5G move.
More information on that report at https://www.i-micronews.com/compound-semi-report/product/inp-wafer-and-epiwafer-market-photonic-and-rf-applications.html
Machine Vision for Industry and Automation 2018 Report by Yole DeveloppementYole Developpement
Machine vision is at the heart of the automation revolution.
More information on that report at https://www.i-micronews.com/report/product/machine-vision-for-industry-and-automation-2018.html
Status of Panel-Level Packaging & Manufacturing 2015 Report by Yole Developpe...Yole Developpement
Which applications will drive panel platforms?
For more than four decades, the semiconductor industry has rigorously followed Moore’s Law in scaling down CMOS technologies. However, a huge investment in new lithography solutions is required to achieve advanced nodes in a range of 20 nm. Although some packaging platforms processed on wafer, i.e. SI interposer, exhibit good performance, high cost is still the main obstacle that limits its adoption for high-volume manufacturing.
The demand for lower cost with higher performance has driven the semiconductor industry to develop innovative solutions. One new approach to reducing overall cost is to switch from wafer to a larger-size panel format. Indeed, the panel infrastructure has attracted considerable interest from the semiconductor industry and is certainly a promising market due to its cost advantages and economy of scale benefits. Panel-level manufacturing has the potential to leverage the knowledge and infrastructure of wafer-level packaging (WLP) and the PCB/Flat-Panel Display/Photovoltaic industries....
Similar to Nano-Imprint Technology Trends for Semiconductor Applications 2019 report by Yole Développement (20)
For the first time, the processor monitor is including FPGA, CPU, GPU, and APU including all the IDMs, fabless companies, and foundries in the business.
More information : https://www.i-micronews.com/products/application-processor-quarterly-market-monitor/
For the first time in its history, the automotive industry must face new industrial and technological
challenges while undergoing dramatic changes in its value chain.
More information: https://www.i-micronews.com/products/automotive-semiconductor-trends-2021/
MicroLED Displays - Market, Industry and Technology Trends 2021Yole Developpement
Strong momentum for MicroLED with progress on all fronts. Cost is the biggest challenge, but Apple and Samsung are carving paths toward the consumer.
More information; https://www.i-micronews.com/products/microled-displays-market-industry-and-technology-trends-2021/
Industrial, consumer, and automotive applications are driving the adoption of neuromorphic computing and sensing technologies. The first products are now hitting the market.
More information: https://www.i-micronews.com/products/neuromorphic-computing-and-sensing-2021/
Semiconductor technologies will enable increased mobility and communication for the soldier of the future. This market will reach $17.5B in 2030+.
More information: https://www.i-micronews.com/products/future-soldier-technologies-2021/
Intel Foveros and TSMC 3D SoIC are competing head-to-head for high-end packaging – How will Samsung react ?More information here : https://www.i-micronews.com/products/high-end-performance-packaging-3d-2-5d-integration-2020/
5G’s Impact on RF Front-End and Connectivity for Cellphones 2020Yole Developpement
An intensifying US-China competition for RF technology supremacy.
More information on: https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-and-connectivity-for-cellphones-2020/
The entrance of Chinese players and the rise of new technical solutions are poised to trigger profound changes in the memory business.
More information on: https://www.i-micronews.com/products/status-of-the-memory-industry-2020/
GaAs Wafer and Epiwafer Market: RF, Photonics, LED, Display and PV Applicatio...Yole Developpement
Photonics applications boost the GaAs wafer and epiwafer market with double digit growth.
Learn more about the report here: https://www.i-micronews.com/products/gaas-wafer-and-epiwafer-market-rf-photonics-led-display-and-pv-applications-2020/
Status of the Radar Industry: Players, Applications and Technology Trends 2020Yole Developpement
Worth more than $20B in 2019, the radar industry is experiencing a major transformation prior to entering the commercial era.
Learn more about the report here: https://www.i-micronews.com/products/status-of-the-radar-industry-players-applications-and-technology-trends-2020/
Pressure, inertial, MEMS ultrasound, microfluidic chips and other sensors are driving the growth of the life sciences and healthcare market.
More information: https://www.i-micronews.com/products/biomems-market-and-technology-2020/
Market will more than double by 2025 driven by heavy investments in data centers.
More information: https://www.i-micronews.com/products/optical-transceivers-for-datacom-telecom-2020/
COVID-19 is shaking up the diagnostics industry and will have both short- and long-term impact.
More information: https://www.i-micronews.com/products/point-of-need-2020-including-pcr-based-testing/
The one million robotic vehicle milestone will be reached by end of the decade: The industrial phase has been launched.
More information on: https://www.i-micronews.com/products/sensors-for-robotic-mobility-2020/
High-End Inertial Sensors for Defense, Aerospace and Industrial Applications ...Yole Developpement
High-end inertial sensors are the backbone of systems that will enable autonomous transportation and the new space industry.
More information on: https://www.i-micronews.com/products/high-end-inertial-sensors-for-defense-aerospace-and-industrial-applications-2020/
Emerging Non-Volatile Memory 2020 report by Yole DéveloppementYole Developpement
The stand-alone emerging NVM market keeps soaring, led by storage-class memory applications. Meanwhile, foundries are propelling the embedded business.
More info on: https://www.i-micronews.com/products/emerging-non-volatile-memory-2020/
(x)PU: High-End CPU and GPU for Datacenter Applications 2020 report by Yole D...Yole Developpement
High-Performance Computing and cloud gaming are setting the bar for leadership in the high-end CPU and GPU markets.
More info on: https://www.i-micronews.com/products/xpu-high-end-cpu-and-gpu-for-datacenter-applications-2020/
Epitaxy Growth Equipment for More Than Moore Devices Technology and Market Tr...Yole Developpement
Driven by microLED displays and power devices, epitaxy equipment shipment volumes will multiply more than threefold over the next five years.
More info on: https://www.i-micronews.com/products/epitaxy-growth-equipment-for-more-than-moore-devices-technology-and-market-trends-2020/
System-in-Package Technology and Market Trends 2020 report by Yole DéveloppementYole Developpement
How is System-in-Package capably meeting the stringent requirements of consumer applications?
More info here: https://www.i-micronews.com/products/system-in-package-technology-and-market-trends-2020/
The Metaverse and AI: how can decision-makers harness the Metaverse for their...Jen Stirrup
The Metaverse is popularized in science fiction, and now it is becoming closer to being a part of our daily lives through the use of social media and shopping companies. How can businesses survive in a world where Artificial Intelligence is becoming the present as well as the future of technology, and how does the Metaverse fit into business strategy when futurist ideas are developing into reality at accelerated rates? How do we do this when our data isn't up to scratch? How can we move towards success with our data so we are set up for the Metaverse when it arrives?
How can you help your company evolve, adapt, and succeed using Artificial Intelligence and the Metaverse to stay ahead of the competition? What are the potential issues, complications, and benefits that these technologies could bring to us and our organizations? In this session, Jen Stirrup will explain how to start thinking about these technologies as an organisation.
Welcome to the first live UiPath Community Day Dubai! Join us for this unique occasion to meet our local and global UiPath Community and leaders. You will get a full view of the MEA region's automation landscape and the AI Powered automation technology capabilities of UiPath. Also, hosted by our local partners Marc Ellis, you will enjoy a half-day packed with industry insights and automation peers networking.
📕 Curious on our agenda? Wait no more!
10:00 Welcome note - UiPath Community in Dubai
Lovely Sinha, UiPath Community Chapter Leader, UiPath MVPx3, Hyper-automation Consultant, First Abu Dhabi Bank
10:20 A UiPath cross-region MEA overview
Ashraf El Zarka, VP and Managing Director MEA, UiPath
10:35: Customer Success Journey
Deepthi Deepak, Head of Intelligent Automation CoE, First Abu Dhabi Bank
11:15 The UiPath approach to GenAI with our three principles: improve accuracy, supercharge productivity, and automate more
Boris Krumrey, Global VP, Automation Innovation, UiPath
12:15 To discover how Marc Ellis leverages tech-driven solutions in recruitment and managed services.
Brendan Lingam, Director of Sales and Business Development, Marc Ellis
Epistemic Interaction - tuning interfaces to provide information for AI supportAlan Dix
Paper presented at SYNERGY workshop at AVI 2024, Genoa, Italy. 3rd June 2024
https://alandix.com/academic/papers/synergy2024-epistemic/
As machine learning integrates deeper into human-computer interactions, the concept of epistemic interaction emerges, aiming to refine these interactions to enhance system adaptability. This approach encourages minor, intentional adjustments in user behaviour to enrich the data available for system learning. This paper introduces epistemic interaction within the context of human-system communication, illustrating how deliberate interaction design can improve system understanding and adaptation. Through concrete examples, we demonstrate the potential of epistemic interaction to significantly advance human-computer interaction by leveraging intuitive human communication strategies to inform system design and functionality, offering a novel pathway for enriching user-system engagements.
Le nuove frontiere dell'AI nell'RPA con UiPath Autopilot™UiPathCommunity
In questo evento online gratuito, organizzato dalla Community Italiana di UiPath, potrai esplorare le nuove funzionalità di Autopilot, il tool che integra l'Intelligenza Artificiale nei processi di sviluppo e utilizzo delle Automazioni.
📕 Vedremo insieme alcuni esempi dell'utilizzo di Autopilot in diversi tool della Suite UiPath:
Autopilot per Studio Web
Autopilot per Studio
Autopilot per Apps
Clipboard AI
GenAI applicata alla Document Understanding
👨🏫👨💻 Speakers:
Stefano Negro, UiPath MVPx3, RPA Tech Lead @ BSP Consultant
Flavio Martinelli, UiPath MVP 2023, Technical Account Manager @UiPath
Andrei Tasca, RPA Solutions Team Lead @NTT Data
Securing your Kubernetes cluster_ a step-by-step guide to success !KatiaHIMEUR1
Today, after several years of existence, an extremely active community and an ultra-dynamic ecosystem, Kubernetes has established itself as the de facto standard in container orchestration. Thanks to a wide range of managed services, it has never been so easy to set up a ready-to-use Kubernetes cluster.
However, this ease of use means that the subject of security in Kubernetes is often left for later, or even neglected. This exposes companies to significant risks.
In this talk, I'll show you step-by-step how to secure your Kubernetes cluster for greater peace of mind and reliability.
In his public lecture, Christian Timmerer provides insights into the fascinating history of video streaming, starting from its humble beginnings before YouTube to the groundbreaking technologies that now dominate platforms like Netflix and ORF ON. Timmerer also presents provocative contributions of his own that have significantly influenced the industry. He concludes by looking at future challenges and invites the audience to join in a discussion.
Observability Concepts EVERY Developer Should Know -- DeveloperWeek Europe.pdfPaige Cruz
Monitoring and observability aren’t traditionally found in software curriculums and many of us cobble this knowledge together from whatever vendor or ecosystem we were first introduced to and whatever is a part of your current company’s observability stack.
While the dev and ops silo continues to crumble….many organizations still relegate monitoring & observability as the purview of ops, infra and SRE teams. This is a mistake - achieving a highly observable system requires collaboration up and down the stack.
I, a former op, would like to extend an invitation to all application developers to join the observability party will share these foundational concepts to build on:
Encryption in Microsoft 365 - ExpertsLive Netherlands 2024Albert Hoitingh
In this session I delve into the encryption technology used in Microsoft 365 and Microsoft Purview. Including the concepts of Customer Key and Double Key Encryption.
DevOps and Testing slides at DASA ConnectKari Kakkonen
My and Rik Marselis slides at 30.5.2024 DASA Connect conference. We discuss about what is testing, then what is agile testing and finally what is Testing in DevOps. Finally we had lovely workshop with the participants trying to find out different ways to think about quality and testing in different parts of the DevOps infinity loop.
zkStudyClub - Reef: Fast Succinct Non-Interactive Zero-Knowledge Regex ProofsAlex Pruden
This paper presents Reef, a system for generating publicly verifiable succinct non-interactive zero-knowledge proofs that a committed document matches or does not match a regular expression. We describe applications such as proving the strength of passwords, the provenance of email despite redactions, the validity of oblivious DNS queries, and the existence of mutations in DNA. Reef supports the Perl Compatible Regular Expression syntax, including wildcards, alternation, ranges, capture groups, Kleene star, negations, and lookarounds. Reef introduces a new type of automata, Skipping Alternating Finite Automata (SAFA), that skips irrelevant parts of a document when producing proofs without undermining soundness, and instantiates SAFA with a lookup argument. Our experimental evaluation confirms that Reef can generate proofs for documents with 32M characters; the proofs are small and cheap to verify (under a second).
Paper: https://eprint.iacr.org/2023/1886
Why You Should Replace Windows 11 with Nitrux Linux 3.5.0 for enhanced perfor...SOFTTECHHUB
The choice of an operating system plays a pivotal role in shaping our computing experience. For decades, Microsoft's Windows has dominated the market, offering a familiar and widely adopted platform for personal and professional use. However, as technological advancements continue to push the boundaries of innovation, alternative operating systems have emerged, challenging the status quo and offering users a fresh perspective on computing.
One such alternative that has garnered significant attention and acclaim is Nitrux Linux 3.5.0, a sleek, powerful, and user-friendly Linux distribution that promises to redefine the way we interact with our devices. With its focus on performance, security, and customization, Nitrux Linux presents a compelling case for those seeking to break free from the constraints of proprietary software and embrace the freedom and flexibility of open-source computing.
26. Nano-Imprint Lithography (NIL) has already
been implemented for some non-semiconductor
applications, mostly at the research level.
Semiconductor devices mostly require
photolithography technology. However, the
emergence of new semiconductor devices demands
tighter nanoscale resolution, complex shapes and
more cost-effective lithography solutions. This has
triggered the need for new patterning processes.
Producers are therefore regaining interest in
NIL, which is based on mechanical replication.
The technology is especially relevant to photonic
elements, biochips and front-end 3D NAND
memory, as it enables nanoscale structures below
20 nm over large surfaces and provides complex
patterning capabilities.
On the photonics side, NIL technology realizes
complex pattern shapes in a periodic way.
For life science, the same technology ensures
biocompatibility and solves the challenges of
increasing complexity of biotechnology devices
while enabling finer feature sizes. In the memory
business, NIL could represent a cost-effective
solution to achieving high-resolution feature sizes.
However, there are still some big barriers that
prevent NIL from entering mass production.
Generally speaking, the master fabrication process
appears to be a critical step that increases the
Cost of Ownership (CoO) of the NIL process.
Additionally, stamp lifetime and finding a trade-off
between overlay, defect levels and throughput are
issues that are holding back of NIL in high volume
manufacturing.
Solving all these limitations could be a game-changer
for NIL in the semiconductor industry. This report
offers a technical description of the different NIL
technologies, their drivers and main challenges.
NANO-IMPRINT TECHNOLOGY TRENDS FOR
SEMICONDUCTOR APPLICATIONS 2019
Market & Technology Report - June 2019
Nano-Imprint Lithography is revived by photonics and biochips as well as front-end memory applications.
REPORT KEY FEATURES
• Detailed analysis of NIL
technologies in three major
semiconductor applications:
photonics, biochips and front-end
memories (3D NAND)
• Key players and supply chain
• 2018-2024 NIL equipment market
forecast: breakdown by device type
and end-application segment
• 2018 global NIL equipment market
share in the semiconductor
applications
• 2018 NIL equipment suppliers by
device type
• Overview of the players using NIL
technology, by device and end-
applications
• Roadmap for NIL technology
adoption by semiconductor device
(Yole Développement, June 2019)
2018 - 2024 Nano-Imprint Lithography (NIL) equipment market size
NIL’S BENEFITS COULD DISRUPT SEMICONDUCTOR APPLICATIONS
Total Nano-Imprint Lithography equipment market
for semiconductor applications *
BioChips
Photonics elements (diffractive optical elements, refractive optical elements)
3D NAND memories - Market segment developed after 2018
~$90M
CAGR +19%
~$145M
CAGR 20%
~$28M
$10M
~$38M
2018
2024
CAGR2018-2024
: ~20%
$27M
~$28M
CAGR +22%
*Pilot or production tools (excluding RD tools)
Excitement about NIL technologies has grown
exponentially since 2014, when Canon completed
its acquisition of Molecular Imprints, a start-up
provider of nano-patterning systems for the hard
disk drive and semiconductor sector.
Numerous companies with different business
models have now invested in NIL technology.
They include photonic element manufacturers,
epi-house foundries, microfluidic foundries or
integrated device manufacturers. Their applications
span augmented reality, 3D sensing and datacom/
telecommunications. This paves the way for a
significant boost to NIL.
Increasing demand for lower cost lithography
solutions, integration of complex shapes and patterns
and nanoscale structures is expected to offer many
opportunities for NIL technologies. This will drive the
NIL equipment market in the next few years.
Although the NIL equipment business is still a
niche market for semiconductor applications, it
is expected to explode. Its revenue compound
annual growth rate from 2018-2024 (CAGR2018-
2024) will reach an impressive 20% from, making
the market worth $145M by 2024.
Now the questions are: “Which semiconductor
devices will revive NIL into the next-game
SEMICONDUCTOR MANUFACTURING COMPLEXITY BRINGS NEW BUSINESS
OPPORTUNITIES IN THE NIL EQUIPMENT MARKET
27. NANO-IMPRINT TECHNOLOGY TRENDS FOR SEMICONDUCTOR APPLICATIONS 2019
Nano-Imprint Lithography (NIL) technology: key market drivers
(Yole Développement, June 2019)
changer?” and “For which applications will NIL
be used?” Currently, the real boost for the NIL
equipment market is expected in photonic elements,
driven by Augmented Reality (AR), 3D sensing as well
as datacom/telecommunication. NIL offers the ability
to imprint diffractive optical elements (DOEs) in the
nanoscale. This includes optical gratings and photonic
crystals to create waveguides, light shaping elements
and pattern generators.
Specific to biochips for the life science space, NIL
technology has already been implemented for
imprinting DNA sequencing devices in the nanoscale
regime. Yole Développement (Yole) forecasts
further investment in NIL from different players
involved in DNA sequencing. Yole also anticipates
the breakthrough of NIL processes for point of care
and organs-on-chips in the next three years. This is
led by a strong trend towards miniaturization and
controlled systems delivery with respect to transport
and manipulation of biological fluids.
Last but not least, NIL equipment from Canon has been
evaluated by Toshiba to replace steppers for the next
generation of 3D NAND memories and potentially
other front-end memories in a longer term. It would
enable a cost-effective process at higher resolution
feature size, and is currently in a RD phase.
This report provides the NIL equipment market
forecast for three large-application semiconductor
markets: photonics, biochips and 3D NAND memory.
In addition, it outlines Yole’s understanding of current
market dynamics and outlook on the future evolution
of NIL technologies.
(Yole Développement, June 2019)
Master supplier
Stamp
supplier
Resin
supplier
Equipment
supplier Users
*Non-exhaustive list of companies
Nano-Imprint Lithography (NIL) supply chain*
The NIL market is fragmented into different business
models and numerous players.
From the equipment perspective, the NIL equipment
market for optical photonic elements driven
by augmented reality, 3D sensing and datacom
applications is highly diversified. This sector is
fragmented, with equipment suppliers including
EV Group (EVG), SUSS MicroTec and Obducat.
By contrast, the biochip and memories markets
are effectively monopolies, with EVG and Canon
respectively active in those markets. Most companies
have developed expertise in optical photonic
elements or biochips, but not all of them. Canon is
the only system vendor that has developed expertise
in the storage memory space.
For each feature size range, there is a clear leading
NIL supplier. In the nanometer range EVG is
dominant, especially in DOEs. SUSS MicroTec has a
strong market share in the micrometer range.
A few material suppliers officially provide resin
materials specific to NIL processes, such as Micro
Resist Technology and DiC Color Comfort.
However, some vendors come from a different
material industry, such as providing temporary
bonding material or photoresist. They are currently
leveraging their knowledge and capabilities to expand
their product portfolios towards NIL materials.
Manufacturers of NIL equipment, materials or
processes use different strategies to drive forward in
the NIL market for semiconductor applications:
NIL TECHNOLOGY’S BENEFITS WILL ATTRACT MORE MANUFACTURING
PLAYERS
Front-end stepper
(extreme UV
lithography)
Laser interferometry
Electron-beam lithography
Mask aligner,
laser ablation,
laser direct imaging
Injection molding
COMPLEX
NANOPATTERNING
PROCESS
HIGH RESOLUTION
CAPABILITIES
(50NM)
COST EFFECTIVE
SOLUTION
NIL*
optimum market
access conditions
*NIL : Nano-Imprint Lithography
28. MARKET TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)
AMO, Akonia Holographics, AustriaMicrosystems, Canon, Dai Nippon Printing (DNP), Daqri,
DELO, Digilens, Dispelix, EVG Group, Himax, IMS Chips, IQE, Luminit, Konica Minolta, Micro
Resist Technology, NIL Technology, Stensborg, SUSS MicroTec, MagicLeap, Microsoft, Obducat,
Rockwell Collins, Sony, TOK, Toppan,Toshiba, TruLifeOptics, Trumpf, Viavi Solutions, Vuzix,
WaveOptics and more…
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AUTHOR
TABLE OF CONTENTS (complete content on i-Micronews.com)
Introduction, definition and methodology 7
Executive summary 17
Introduction to Nano-Imprint Lithography (NIL)
technologies
Lithography technologies - overview
NIL definition
NIL principle
NIL technologies classification
Consumables in the NIL process
NIL technologies - benefits and drivers
SWOT analysis
NIL market segment and applications 58
NIL at a glance
NIL applicability in the semiconductor field
NIL drivers by end application
SWOT analysis of the NIL technology by
application
NIL suppliers: competitive landscape 78
Overview of the major NIL semiconductor
equipment suppliers
NIL equipment positioning, by application
NIL equipment players’ market share and revenue
Master suppliers
Mold suppliers
2018 - 2024 NIL equipment market
forecast 102
NIL equipment market forecast breakdown, by
end-application
In-depth analysis of NIL technologies,
by end application 110
NIL for optical photonics elements
NIL for Augmented Reality (AR)
NIL for 3D Sensing
NIL for datacom/telecom
NIL for biochips
NIL for LED
Conclusions and perspectives 223
Appendix 231
Company presentation 247
REPORT OBJECTIVES
• Detailed analysis of NIL technologies for semiconductor applications
• Give the current status of NIL adoption and the various technologies available on the
semiconductor market
• Provide an overview of NIL technological trends for semiconductor applications
• How does the NIL technique differ from the other lithography solutions?
• What are the key NIL drivers for photonics, BioChips and front-end memories (3D NAND)
• Understand what are the remaining challenges to implementation of NIL technology in the field of
semiconductor applications
• Offer market metrics at NIL equipment market level for semiconductor applications from 2018-2024
• Evaluate market developments in terms of market volume and value by semiconductor device and
end-application
• Provide a competitive landscape by identifying key players in technology development and
manufacturing
• Gives an overview of who is doing what, and specifics of each market
Amandine Pizzagalli is a Technology
Market Analyst, Equipment Materials
- Semiconductor Manufacturing, at
Yole Développement (Yole). Amandine
is part of the development of the
Semiconductor Software division of
Yole with the production of reports
and custom consulting projects. She is
in charge of comprehensive analyses
focused on semiconductor equipment,
materials and manufacturing processes.
Previously, Amandine worked as Process
engineer on CVD and ALD processes for
semiconductor applications at Air Liquide.
Amandine was based in Japan during one
year to manage these projects. Amandine
graduatedfromtheengineeringschool,CPE
Lyon (France), with a technical expertise in
Semiconductor Nano-Electronics and
holds an electronics engineering degree
followed by a master’s in semiconductor
manufacturing technology from KTH
Royal institute of technology (Sweden).
She has spoken in numerous international
conferences and has authored or co-
authored more than 10 papers.
• Seeking to evolve toward greater diversification,
some NIL players have acquired other
companies. Magic Leap’s acquisition of Molecular
Imprint allowed it to explore NIL capabilities and
leverage the technology in its products.
• In the hopes of acquiring market share in other
regions, some vendors have developed turnkey
cluster solutions, including coating and baking
systems in NIL tools. Some suppliers have
remodeled their wafer bonder tool to turn them
into NIL systems.
• Other companies, like SCIL Nanoimprint
Solutions, a Philips subsidiary, or Stensborg,
provide an overall working solution to the
NIL industry comprising the production tool,
materials and the special stamp associated with
the process.
The report quantifies and details the competitive
landscape and major NIL equipment supplier
market in both micro and nanoscale feature
ranges.
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Nano-Imprint Technology Trends for Semiconductor Applications 2019
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