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R07DS0321EJ0200 Rev.2.00 Page 1 of 6
May 26, 2011
Preliminary Datasheet
RJP63F3DPP-M0
Silicon N Channel IGBT
High Speed Power Switching
Features
• Trench gate and thin wafer technology (G6H series)
• Low collector to emitter saturation voltage VCE(sat) = 1.7 V typ
• High speed switching tf = 100 ns typ
• Low leak current ICES = 1 μA max
• Isolated package TO-220FL
Outline
RENESAS Package code: PRSS0003AF-A)
(Package name: TO-220FL)
1
2 3
1. Gate
2. Collector
3. Emitter
C
G
E
Absolute Maximum Ratings
(Ta = 25°C)
Item Symbol Ratings Unit
Collector to emitter voltage VCES 630 V
Gate to emitter voltage VGES ±30 V
Collector current IC 40 A
Collector peak current ic(peak)
Note1
200 A
Collector dissipation PC
Note2
30 W
Junction to case thermal impedance θj-c 4.17 °C/ W
Junction temperature Tj 150 °C
Storage temperature Tstg –55 to +150 °C
Notes: 1. PW ≤ 10 μs, duty cycle ≤ 1%
2. Tc = 25°C
R07DS0321EJ0200
Rev.2.00
May 26, 2011
RJP63F3DPP-M0 Preliminary
R07DS0321EJ0200 Rev.2.00 Page 2 of 6
May 26, 2011
Electrical Characteristics
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Zero gate voltage collector current ICES — — 1 μA VCE = 630 V, VGE = 0
Gate to emitter leak current IGES — — ±100 nA VGE = ±30 V, VCE = 0
Gate to emitter cutoff voltage VGE(off) 2.5 — 5 V VCE = 10 V, IC = 1 mA
Collector to emitter saturation voltage VCE(sat) — 1.7 2.2 V IC = 40 A, VGE = 15 V
Note3
Input capacitance Cies — 1250 — pF
Output capacitance Coes — 48 — pF
Reveres transfer capacitance Cres — 22 — pF
VCE = 25 V
VGE = 0
f = 1 MHz
Total gate charge Qg — 36 — nC
Gate to emitter charge Qge — 7 — nC
Gate to collector charge Qgc — 10 — nC
VGE = 15 V
VCE = 300 V
IC = 40 A
td(on) — 0.02 — μs
tr — 0.07 — μs
td(off) — 0.05 — μs
Switching time
tf — 0.1 — μs
IC = 40 A
RL = 7.5 Ω
VGE = 15 V
Rg = 5 Ω
Notes: 3. Pulse test.
RJP63F3DPP-M0 Preliminary
R07DS0321EJ0200 Rev.2.00 Page 3 of 6
May 26, 2011
Main Characteristics
Typical Output Characteristics (2) Typical Transfer Characteristics
200
160
120
80
40
2 4 6 8 10
Typical Output Characteristics (1)
100
80
60
40
20
1 2 3 4 5
CollectorCurrentIC(A)CollectorCurrentIC(A)
CollectorCurrentIC(A)
Collector Current IC (A)
CollectorCurrentIC(A)
Maximum Safe Operation Area
1000
100
10
1 10 100
1
0.01
0.1
1000
0
20
40
60
80
100
0
0
0
0
0
2 4 6 8 10
PW
=
100
μs
10 μs
0
2
6
4
8
0 4 8 12 2016
Collector to Emitter Saturation Voltage
vs. Gate to Emitter Voltage (Typical)
Collector to Emitter Saturation Voltage
vs. Collector Current (Typical)
CollectortoEmitterSaturationVoltage
VCE(sat)(V)
CollectortoEmitterSaturationVoltage
VCE(sat)(V)
80 A
40 A
0.1
1
10
1 10 100
75°C
Tc = 125°C
Pulse Test
Ta = 25°C
VGE = 15 V
Pulse Test
VCE = 10 V
Pulse Test
Collector to Emitter Voltage VCE (V) Collector to Emitter Voltage VCE (V)
Collector to Emitter Voltage VCE (V)
Gate to Emitter Voltage VGE (V)
Gate to Emitter Voltage VGE (V)
Ta = 25°C
1 shot pulse
75°C
Pulse Test
Ta = 25°C
Pulse Test
Ta = 25°C
6 V
5.5 V
VGE = 5 V
VGE = 5 V
6 V
6.5 V
5.5 V
7 V
7.5 V
8.5 V
8 V
10 V
15 V
9 V
6.5 V
7.5 V
8 V
7 V
15 V
10 V
IC = 120 A
Tc = 125°C
25°C
12 V
25°C
RJP63F3DPP-M0 Preliminary
R07DS0321EJ0200 Rev.2.00 Page 4 of 6
May 26, 2011
CapacitanceC(pF)
1
10
100
1000
10000
0 20 40 60 80 100
Cies
Coes
Cres
Gate Charge Qg (nc)
Dynamic Input Characteristics (Typical)
Typical Capacitance vs.
Collector to Emitter Voltage (Typical)
800
600
400
200
0
0
16
12
8
4
0
8 16 24 32 40
IC = 40 A
VGE
VCE
VCE = 500 V
300 V
VCE = 500 V
300 V
Switching Characteristics (Typical) (1)
1 10 100 1 10 100
Switching Characteristics (Typical) (2)
10
100
1000
10
100
1000
Switching Characteristics (Typical) (3)
10
100
1000
0 25 50 75 100 125 150
IC = 40 A, RL = 7.5 Ω
VGE = 15 V, Ta = 25°C
IC = 40 A, RL = 7.5 Ω
VGE = 15 V, Rg = 5 Ω
td(on)
td(off)
td(on)
tf
tr
td(off)
td(on)
tf
tr
VGE = 0 V
f = 1 MHz
Ta = 25°C
Collector to Emitter Voltage VCE (V)
Collector Current IC (A) Gate Resistance Rg (Ω)
SwitchingTimet(ns)SwitchingTimet(ns)
SwitchingTimet(ns)CollectortoEmitterVoltageVCE(V)
GatetoEmitterVoltageVGE(V)
Case Temperature Tc (°C)
VCC = 300 V, VGE = 15 V
Rg = 5 Ω, Ta = 25°C
td(off)
tf
tr
RJP63F3DPP-M0 Preliminary
R07DS0321EJ0200 Rev.2.00 Page 5 of 6
May 26, 2011
1 m 10 m 100 m 1 10
Pulse Width PW (s)
1
0.3
3
0.1
0.03
0.01
10
0.001
0.003
D = 1
0.5
1shot pulse
0.2
0.1
0.05
0.02
0.01
Tc = 25°C
Normalized Transient Thermal Impedance vs. Pulse Width
PDM
PW
T
D =
PW
T
Switching Time Test Circuit Waveform
Ic Monitor
Vin Monitor
D.U.T.
Rg
Vin = 15 V
VCC
10%
tftr
td(off)td(on)
Ic
Vin
90%
90%90%
10%
10%
ton toff
RL
RJP63F3DPP-M0 Preliminary
R07DS0321EJ0200 Rev.2.00 Page 6 of 6
May 26, 2011
Package Dimension
Unit: mm
Previous Code
PRSS0003AF-A TO-220FL
MASS[Typ.]
1.5g⎯
RENESAS CodeJEITA Package CodePackage Name
TO-220FL
3.6±0.3
15.0±0.312.5±0.5
10.0 ± 0.3
6.5±0.3
3.2 ± 0.2
0.75 ± 0.15
1.15 ± 0.2
2.54 ± 0.252.54 ± 0.25
2.6±0.2
4.5±0.2
0.40 ± 0.15
2.8 ± 0.2
1.15 ± 0.2
3.0±0.3
Ordering Information
Orderable Part No. Quantity Shipping Container
RJP63F3DPP-M0-T2 600 pcs Box (Tube)
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas
Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to
be disclosed by Renesas Electronics such as that disclosed through our website.
2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and
regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to
the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations.
6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
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8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
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use of Renesas Electronics products beyond such specified ranges.
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malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
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please evaluate the safety of the final products or system manufactured by you.
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products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
Refer to "http://www.renesas.com/" for the latest and detailed information.
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Original IGBT IC RJP63F3 63F3 TO-220 New Renesas

  • 1. R07DS0321EJ0200 Rev.2.00 Page 1 of 6 May 26, 2011 Preliminary Datasheet RJP63F3DPP-M0 Silicon N Channel IGBT High Speed Power Switching Features • Trench gate and thin wafer technology (G6H series) • Low collector to emitter saturation voltage VCE(sat) = 1.7 V typ • High speed switching tf = 100 ns typ • Low leak current ICES = 1 μA max • Isolated package TO-220FL Outline RENESAS Package code: PRSS0003AF-A) (Package name: TO-220FL) 1 2 3 1. Gate 2. Collector 3. Emitter C G E Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Collector to emitter voltage VCES 630 V Gate to emitter voltage VGES ±30 V Collector current IC 40 A Collector peak current ic(peak) Note1 200 A Collector dissipation PC Note2 30 W Junction to case thermal impedance θj-c 4.17 °C/ W Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C Notes: 1. PW ≤ 10 μs, duty cycle ≤ 1% 2. Tc = 25°C R07DS0321EJ0200 Rev.2.00 May 26, 2011
  • 2. RJP63F3DPP-M0 Preliminary R07DS0321EJ0200 Rev.2.00 Page 2 of 6 May 26, 2011 Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Zero gate voltage collector current ICES — — 1 μA VCE = 630 V, VGE = 0 Gate to emitter leak current IGES — — ±100 nA VGE = ±30 V, VCE = 0 Gate to emitter cutoff voltage VGE(off) 2.5 — 5 V VCE = 10 V, IC = 1 mA Collector to emitter saturation voltage VCE(sat) — 1.7 2.2 V IC = 40 A, VGE = 15 V Note3 Input capacitance Cies — 1250 — pF Output capacitance Coes — 48 — pF Reveres transfer capacitance Cres — 22 — pF VCE = 25 V VGE = 0 f = 1 MHz Total gate charge Qg — 36 — nC Gate to emitter charge Qge — 7 — nC Gate to collector charge Qgc — 10 — nC VGE = 15 V VCE = 300 V IC = 40 A td(on) — 0.02 — μs tr — 0.07 — μs td(off) — 0.05 — μs Switching time tf — 0.1 — μs IC = 40 A RL = 7.5 Ω VGE = 15 V Rg = 5 Ω Notes: 3. Pulse test.
  • 3. RJP63F3DPP-M0 Preliminary R07DS0321EJ0200 Rev.2.00 Page 3 of 6 May 26, 2011 Main Characteristics Typical Output Characteristics (2) Typical Transfer Characteristics 200 160 120 80 40 2 4 6 8 10 Typical Output Characteristics (1) 100 80 60 40 20 1 2 3 4 5 CollectorCurrentIC(A)CollectorCurrentIC(A) CollectorCurrentIC(A) Collector Current IC (A) CollectorCurrentIC(A) Maximum Safe Operation Area 1000 100 10 1 10 100 1 0.01 0.1 1000 0 20 40 60 80 100 0 0 0 0 0 2 4 6 8 10 PW = 100 μs 10 μs 0 2 6 4 8 0 4 8 12 2016 Collector to Emitter Saturation Voltage vs. Gate to Emitter Voltage (Typical) Collector to Emitter Saturation Voltage vs. Collector Current (Typical) CollectortoEmitterSaturationVoltage VCE(sat)(V) CollectortoEmitterSaturationVoltage VCE(sat)(V) 80 A 40 A 0.1 1 10 1 10 100 75°C Tc = 125°C Pulse Test Ta = 25°C VGE = 15 V Pulse Test VCE = 10 V Pulse Test Collector to Emitter Voltage VCE (V) Collector to Emitter Voltage VCE (V) Collector to Emitter Voltage VCE (V) Gate to Emitter Voltage VGE (V) Gate to Emitter Voltage VGE (V) Ta = 25°C 1 shot pulse 75°C Pulse Test Ta = 25°C Pulse Test Ta = 25°C 6 V 5.5 V VGE = 5 V VGE = 5 V 6 V 6.5 V 5.5 V 7 V 7.5 V 8.5 V 8 V 10 V 15 V 9 V 6.5 V 7.5 V 8 V 7 V 15 V 10 V IC = 120 A Tc = 125°C 25°C 12 V 25°C
  • 4. RJP63F3DPP-M0 Preliminary R07DS0321EJ0200 Rev.2.00 Page 4 of 6 May 26, 2011 CapacitanceC(pF) 1 10 100 1000 10000 0 20 40 60 80 100 Cies Coes Cres Gate Charge Qg (nc) Dynamic Input Characteristics (Typical) Typical Capacitance vs. Collector to Emitter Voltage (Typical) 800 600 400 200 0 0 16 12 8 4 0 8 16 24 32 40 IC = 40 A VGE VCE VCE = 500 V 300 V VCE = 500 V 300 V Switching Characteristics (Typical) (1) 1 10 100 1 10 100 Switching Characteristics (Typical) (2) 10 100 1000 10 100 1000 Switching Characteristics (Typical) (3) 10 100 1000 0 25 50 75 100 125 150 IC = 40 A, RL = 7.5 Ω VGE = 15 V, Ta = 25°C IC = 40 A, RL = 7.5 Ω VGE = 15 V, Rg = 5 Ω td(on) td(off) td(on) tf tr td(off) td(on) tf tr VGE = 0 V f = 1 MHz Ta = 25°C Collector to Emitter Voltage VCE (V) Collector Current IC (A) Gate Resistance Rg (Ω) SwitchingTimet(ns)SwitchingTimet(ns) SwitchingTimet(ns)CollectortoEmitterVoltageVCE(V) GatetoEmitterVoltageVGE(V) Case Temperature Tc (°C) VCC = 300 V, VGE = 15 V Rg = 5 Ω, Ta = 25°C td(off) tf tr
  • 5. RJP63F3DPP-M0 Preliminary R07DS0321EJ0200 Rev.2.00 Page 5 of 6 May 26, 2011 1 m 10 m 100 m 1 10 Pulse Width PW (s) 1 0.3 3 0.1 0.03 0.01 10 0.001 0.003 D = 1 0.5 1shot pulse 0.2 0.1 0.05 0.02 0.01 Tc = 25°C Normalized Transient Thermal Impedance vs. Pulse Width PDM PW T D = PW T Switching Time Test Circuit Waveform Ic Monitor Vin Monitor D.U.T. Rg Vin = 15 V VCC 10% tftr td(off)td(on) Ic Vin 90% 90%90% 10% 10% ton toff RL
  • 6. RJP63F3DPP-M0 Preliminary R07DS0321EJ0200 Rev.2.00 Page 6 of 6 May 26, 2011 Package Dimension Unit: mm Previous Code PRSS0003AF-A TO-220FL MASS[Typ.] 1.5g⎯ RENESAS CodeJEITA Package CodePackage Name TO-220FL 3.6±0.3 15.0±0.312.5±0.5 10.0 ± 0.3 6.5±0.3 3.2 ± 0.2 0.75 ± 0.15 1.15 ± 0.2 2.54 ± 0.252.54 ± 0.25 2.6±0.2 4.5±0.2 0.40 ± 0.15 2.8 ± 0.2 1.15 ± 0.2 3.0±0.3 Ordering Information Orderable Part No. Quantity Shipping Container RJP63F3DPP-M0-T2 600 pcs Box (Tube)
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