The OMAP SoC family from Texas Instruments integrates an ARM processor with a digital signal processor (DSP) to create a power-efficient platform for multimedia applications, especially in mobile devices. The OMAP family is categorized into three groups based on performance, targeting different application needs from basic multimedia to high-performance processors for smartphones and advanced mobile internet devices. Key features include support for various multimedia codecs, advanced imaging capabilities, and enhanced security, making OMAP suitable for a wide range of consumer electronics.

1. Open Multimedia Applications Platform
(OMAP)

2. • The OMAP SOC family is based on a two processor system, an ARM
processor combined with a Texas Instruments (TI) DSP.
• It is a series of image / video processors
• The ARM processor is a general purpose processor designed with a reduced
instruction set (RISC) architecture.
INTRODUCTION

3. • The TI DSP has an instruction set optimized for digital signal processing
applications.
• The GPP and the DSP provide processors with complimentary
instruction sets,
• the GPP is suited for general purpose data processing and
communication tasks, the DSP supports operations for signal and image
processing.
• The combination of these two processors creates a power efficient
platform for applications that must perform complex signal processing
algorithms and communicate the results to network and human
interfaces
DSP with ARM

4. The OMAP family consists of three product groups classified by
performance and intended applications:
OMAP FAMILY
1) Integrated modem and applications processors
2) Basic multimedia applications processors
3) High-performance applications processors

5. integrated modem and applications processors
These are marketed only used by handset
manufacturers. Many of the newer versions are
highly integrated for use in very low cost cell
phones
Example – Toshiba G710 (OMAP- V 1030)

6. various integrated modems and application of OMAP
processors
PROCESSOR APPLICATION
OMAPV1035 Single-chip EDGE
OMAPV1030 ARM926TEJ, GSM/GPRS/EDGE
OMAP850 200 MHz ARM926EJ-S + GSM/GPRS digital baseband + stacked
EDGE co-processor
OMAP750 200 MHz ARM926EJ-S + GSM/GPRS digital baseband + DDR
Memory support
OMAP733 200 MHz ARM926EJ-S + GSM/GPRS digital baseband + stacked
SDRAM
OMAP730 200 MHz ARM926EJ-S + GSM/GPRS digital baseband + SDRAM
Memory support
OMAP710 133 MHz ARM925 + GSM/GPRS digital baseband

8. OMAPV1030 features and specifications
Integrated, digital baseband combines ARM926TEJ
and TI DSP
 GSM/GPRS/EDGE Class 12 capable
 Includes single-chip analog companion device:
Full power management
Audio codecs
Analog drivers
 Supports a wide range of image codecs:
JPEG
GIF87a, GIF89a
PNG
BMP, WBMP
Video record, playback and streaming downloads:
Up to QCIF 30 fps or CIF 15 fps
Up to 15 fps (MPEG4 and WB-AMR decode)
 Digital audio processing:
Decode/Encode with streaming support
Audio treatment (mono-stereo, equalizer)
Full range of audio codecs:
MP3
AAC
MIDI 64 polyphonics
ADPCM

9. 2D and 3D gaming
Enhanced connectivity options including
Bluetooth, WLAN, A-GPS
Complete hardware and software smart
phone reference design
Supports Nucleus and Embedded Linux
3 UARTs
SDRAM, NAND Flash, NOR Flash
SIM, USIM, EMV smart card controller
 IrDA support including SIR, MIR, FIR
Hardware and software security protection:
Secure boot loader
Acceleration for security
standards and random number generation
Security software library
Full range of hardware accelerators
 USB OTG
 Manufactured in TI’s 90-nm advanced CMOS
process technology
 Roadmap includes integration of RF functions
in digital CMOS
OMAPV1030 features and specifications

10. • These are marketed only to handset manufacturers. They are intended to be highly
integrated, low cost chips for consumer products.
• The OMAP-DM series are intended to be used as digital media coprocessors for
mobile devices with high megapixel digital still and video cameras
• The Image Signal Processor (ISP) is used to accelerate processing of camera
images.
Basic multimedia application processors

11. Processor Application
OMAP-DM270 ARM7 + C54x DSP
OMAP-DM299 ARM7 + Image Signal Processor (ISP) + stacked mDDR
SDRAM
OMAP-DM500 ARM7 + ISP + stacked mDDR SDRAM
OMAP-DM510 ARM926 + ISP + 128 MB stacked mDDR SDRAM
OMAP-DM515 ARM926 + ISP + 256 MB stacked mDDR SDRAM
OMAP-DM525 ARM926 + ISP + 256 MB stacked mDDR SDRAM
Various Basic multimedia application processors

12. OMAP DM 5x family

13. Integrated video coprocessor
• Supports up to 25-fps MPEG4 (WVGA),
• H.264 (WVGA) encode and decode
• High quality 720p H.264 camcorder
• Video stabilization and noise filtering
Integrated Image Signal Processor (ISP)
• JPEG compression up to 90 megapixels per second
• Supports up to 20-megapixel camera sensors
Advanced image and video features
• Red eye reduction, face tracking, image
• stabilization, backlight compensation
Hardware imaging noise filter
• Ajustable 1-3200 ISO noise filter Increase image
processing speed
Flexible interfaces
• Various types of CMOS sensor interfaces
• Signal conditioning circuits
• Power management
• Mobile DDR-SDRAM
• Shutter, iris and auto-focus motor controls
Integrated composite and S video output to TV
with digital overlay
• Easily connect to external TV
• Easily view content with others
OMAP DM 5x family key feature

15. • High performance application processors are used in smart phones which are
powerful enough to run significant operating systems such as Linux, Android,
Symbian ,
• support connectivity to personal computers and support various audio and video
applications.
• These high performance application processors include different OMAP serieses
(OMAP1, OMAP2, OMAP3, OMAP4, OMAP5)
High performance application processors

16. • The OMAP1 family started with a TI enhanced ARM core and then changed to a
standard ARM926 core. It included many variants, most easily distinguished
according to manufacturing technology, CPU, peripheral set and distribution
channel
• Products using OMAP1 processors include hundreds of cell phone models, and
the Nokia 770, Internet tablets
OMAP 1

17. Procssor Application
OMAP171x 220 MHz ARM926EJ-S + C55x DSP, low-
voltage 90 nm technology
OMAP162x 204 MHz ARM926EJ-S + C55x DSP + 2 MB internal
SRAM, 130 nm technology
OMAP161x 204 MHz ARM926EJ-S + C55x DSP, 130 nm technology
OMAP1510 168 MHz ARM925T (TI-enhanced) + C55x DSP
Various OMAP 1 processors

18. OMP1710 BLOCK DIAGRAM

19. • Advanced 90 nanometer CMOS Technology
• Low-voltage 90 nm technology
• 1.05 - 1.3V cores; 1.8V I/O
• Consumes less than 10 µA in standby mode
• Split power supplies for application processing, digital baseband and real-time clock enable precise
control over power consumption
• Optimized clocking and power management: only two clocks required at 13 MHz and 32 kHz
• TMS320C55x DSP core subsystem
• Up to 220 MHz (maximum frequency)
• 32K x 16-bit on-chip dual-access RAM (DARAM) (64 KB)
• 48K x 16-bit on-chip single-access RAM (SARAM) (96 KB)
• 24 KB I-cache
• One/two instructions executed per cycle
• Video hardware accelerators for DCT, iDCT, pixel interpolation, and motion estimation for video
compression
Key features

20. • ARM926TEJ core subsystem
• Up to 220 MHz ARM926TEJ V5 architecture (maximum frequency)
• 32KB I-cache; 16KB D-cache
• Java acceleration
• Support for 32-bit and 16-bit (thumb mode) instruction sets
• Data and program MMUs
• Two 64-entry translation look-aside buffers (TLBs) for MMUs
• 17-word write buffer
• Security Acceleration in Hardware
• Secure bootloader
• 48 kB of secure ROM
• 16 kB of secure RAM
• Hardware acceleration for security standards and random number generator
• Unique die ID cell
• Third-party Security software library

21. • Memory Traffic Controller (TC)
• 16-bit EMIFS external memory interface
• 16-bit EMIFF external memory interface
• Application Subsystem
• Supports leading operating systems
• DMA with 4 physical and 17 logical channels and a dedicated
2D graphics engine
• USB On-the-Go (OTG)
• Two SD/MMC/SDIO ports
• Two high-speed 3.68 MHz UARTs
• I2C controller
• Two high-speed 3.68 MHz UARTs

22. • CompactFlash
• Parallel and compact camera ports
• Enhanced Debug Trace (ETM) for debug
• Fast IrDA (FIR)
• SPI
• LCD controller
• Comprehensive memory controller for interfaces to:
• 128 MB of mobile SDRAM and mobile DDR
• 256 MB Flash (for burst, programmable NOR flash)
• 289-ball, 12 mm x 12 mm MicroStar BGA™ Package

23. Processors Application
OMAP2431 330 MHz ARM1136 + 220 MHz C64x DSP
OMAP2430 330 MHz ARM1136 + 220 MHz C64x DSP
+ PowerVR MBX lite GPU, 90 nm technology
OMAP2420 330 MHz ARM1136 + 220 MHz C55x DSP + PowerVR
MBX GPU, 90 nm technology
OMAP 2
These parts were marketed only to handset vendors which include both internet tablets and mobile
phones

24. OMAP 2420

25. • ARM1136 at 330 MHz
• TMS320C55x™ DSP at 220 MHz
• 2D/3D hardware MBX/VGP accelerators, up
to 2 Million polygons/sec
• Cross-bar high-speed, low-latency
interconnect
• LCD and camera interfaces
• 32/32 KB caches
• Integrated memory controllers
• Complete peripheral set
• Hardware security platform
• Hardware accelerated camera and LCD
interfaces
• Imaging and Video Accelerator:
– Boosts still pictures> 4 Mpixels
– Full motion video encoding or decoding at
rates up to 30 frames per second Up to VGA
resolution
• 5 Mbit internal SRAM supporting a VGA
display
 Video out supporting an external TV display
• 325 ball, 12 mm x 12 mm package
• DDR system in package
• memory stacking (512 Mb and 768 Mb
options)
OMAP2420 Processor specification

26. • The OMAP™ 3 family of multimedia applications processors from
Texas Instruments (TI) introduces a new level of performance that
enables laptop-like productivity and advanced entertainment in
multimedia-enabled handsets. OMAP 3 devices support all levels of
handsets, from the entry-level multimedia-enabled handsets to high-
end Mobile Internet Devices (MIDs).
OMAP3

27. OMAP3 GROUPS

28. • Combines mobile entertainment and high-
performance productivity applications
• Integrates the advanced Superscalar ARM
Cortex-A8 RISC core, enabling up to 3x gain in
performance versus ARM11.
• Designed in 45-nm (OMAP36x platform) and
65-nm (OMAP34x platform) CMOS process
technologies for less power consumption and
increased device performance.
• Includes integrated IVA hardware accelerators
to enable multi-standard encode decode up
to HD resolution
• Packaging: 12 mm x 12 mm or 14 mm x 14
mm MicroStar BGA™ integrated circuit
packages, memory-stackable.
• Available integrated image signal processor
(ISP) enables faster, higher quality image
capture, lower system cost and lower power
consumption.
• Provides seamless connectivity to hard
diskdrive (HDD) devices for mass storage
• Assures mobile security with M-Shield™
mobile security technology capability
enhanced with ARM Trust Zone support.
• Shares fully scalable software solution with all
OMAP 2 processor
• Supports all high-level OSs for customizable
interfaces, including Linux, Microsoft
Windows Mobile, Open Handset Alliance
Android and Symbian.
Key features

29. OMAP4
At the heart of the OMAP 4 platform is a powerful system-on-chip that includes the perfect balance
of power efficiency and high performance.The OMAP 4 processor balances processing across four main engines: a
programmable multimedia engine based on TI’s C64x DSP andpower-efficient, multi-format hardware accelerators;
general-purpose processing based on
the dual-core ARM® Cortex™-A9 MPCore™ supporting symmetric multiprocessing (SMP) and capable of speeds of
more than 1 GHz per core;
a high-performance programmable graphics engine; and an Image Signal Processor (ISP) for
unparalleled video and imaging performance.

30. Variants OMAP4

31. OMAP 44X(70)

32. • Highly-optimized mobile applications platform including: applications processors, multimedia
software and power management to drive Smartphones and MIDs
• IVA 3 accelerator enables full HD 1080p, multi-standard video encode/decode
• Integrated Image Signal Processor (ISP) for faster, higher-quality image and video capture with
digital SLR-like 20-megapixel imaging
• Integrated POWERVR™ SGX540 graphics accelerator drives next-generation, 3D user interfaces
with larger displays, life-like graphics and intuitive touch screens
• Dual-core ARM® Cortex™-A9 MPCore™ with SMP for higher mobile computing performance and
PC-like, no compromise web browsing experience
• Support for leading mobile operating systems including Symbian™, Microsoft® Windows Mobile®,
Linux® (Android, LiMo)
OMAP 4 key feature

33. • Programmability and performance headroom to support new and emerging applications and
standards
• Pre-integrated connectivity solutions from TI’s portfolio of WiLink™, BlueLink™ and NaviLink™
mobile connectivity solutions and pre-validated modem interface software to connect with any
external modem
• Industry-leading power management and SmartReflex™ 2 technologies delivers more than 10
hours of 1080p HD video playback, 4+ hours of 1080p HD video recording and 140+ hours of CD
quality audio playback
• Designed in mobile 45-nm CMOS process technology for less power consumption and increased
device performance
• M-Shield™ capability enhanced with ARM TrustZone™ support ensures mobile security
• Packaging: 12 mm x 12 mm, 0.4 mm pitch PoP (Package-on-Package)

34. • TI’s OMAP 5 platform transforms the concept of “mobile” to deliver truly unique mobile
experiences.
• The OMAP 5 platform sets the stage for future mobile devices to transform from content
consumption devices to primary computing devices.
• This includes support for content creation and editing, as well as supporting advanced
experiencessuch as immersive 3D gaming, gesture recognition and augmented reality applications.
• The OMAP 5 system-on-chip (SoC) is the first featuring ARM®’s Cortex™-A15 MPCore™ onthe
market, as TI worked closely with ARM as the Advanced Lead Partner on the Cortex-
A15’sdevelopment.
OMAP 5

35. • The fifth generation OMAP(OMAP5) SoC uses a dual core ARM Cortex-A15 CPU with 2
additional Cortex-M4 cores to offload the A15s in lesscomputationally intensive tasks to increase
powerefficiency, two powerVR SGX544MP graphics
• cores and a dedicated TI 2D graphics accelerator, a multiple sub systems and a signal processor.
They respectively support 24 and 20 megapixel cameras for front and rear 3D HD video recording.
The chip also supports up to 8GB of dual channel LPDDR2/DDR3 memory, output to four HD 3D
displays and 3D HDMI 1.4 video output.OMAP5
• also includes three USB 2.0 ports, one USB 3.0 OTG and a SATA 2.0 controller

36. 28 nano meter CMOS low-power process
The highest levels of processor performance and lowest power consumption
Smart multicore architecture with Symmetric Multiprocessing (SMP) including two ARM Cortex-
A15 MP Core processors for SMP and two Cortex-M4 processors for low-power offload and real-
time control
Higher mobile computing performance
2-3x higher performance versus previous generation
Faster user interfaces and less power consumption
Scalable performance activates only the cores that are needed for a particular process
Hardware virtualization through Hypervisor allows power and performance-efficient, multiple
operating system (OS) support
Key features

37. IVA 3 HD multimedia accelerator
Full high definition 1080p60 multi-standard video encode/decode and stereoscopic 3D
encode/decode at 1080p30
Imagination Technologies‘ POWERVR™ SGX544 graphics core
5x performance increase versus previous generation enables compelling 2D and 3D interfaces and
screens
Multi-core imaging and vision processing unit
• High-quality, high-megapixel digital SLR-like images at upto 24 MP (or 12 MP S3D)
• On-the-fly support with real-time face detection, stabilization, noise filtering and 3D optimization
to replace digital still cameras
SmartReflex™ 3 technology
• Dynamically controlled voltage, frequency and power based on device activity, modes of
operation and temperature
Low Power audio
• Provides up to 140+ hours of CD-quality audio playback

38. TI proprietary M-Shield™ mobile security technology enhanced with ARM TrustZone® support and
based on open APIs
• Unprecedented security capable of supporting enterprise andeven premium content streaming
applications on the go
High-bandwidth memory interface with 8.5 GB/s
• OMAP5430 – 2-channel LPDDR2 @532 MHz
• OMAP5432 – 2-channel DDR3 @532 MHz
Flexible system support
• Supports up to 4 displays: three high-resolution LCD displays and external HDMI 1.4a HDTV output
• Enhanced, higher-speed industry-standard interfaces:
• USB3, MIPI CSI-3/UniPort-M/LLI
Backwards compatibility
• Begin development with the OMAP 4 platform and migrate easily later to the OMAP 5 platform

39. Block diagram OMAP 5430

41. OMAP device line up

42. OMAP family core performance

43. The OMAP in TI's mobile market processor products

44. REFERENCES
• http://processors.wiki.ti.com/index.php/OMAP
• http://www.ti.com/general/docs/wtbu/wtbuproductcontent.tsp?tem
plateId=6123&navigationId=11991&path=templatedata/cm/product/
data/omap_1710
• A review on OMAP processors in embedded applications
Venkatarami reddy, 2D Sowjanya reddy .
• https://en.wikipedia.org/wiki/OMAP