Chian Ming Ngo is a senior staff equipment engineer at United Microelectronics Corporation with over 17 years of experience. He holds a bachelor's degree in electrical/electronic engineering from Oklahoma State University. As a senior staff engineer, his responsibilities include managing engineers to maintain machine uptime, advising on process troubleshooting, managing costs, and planning manpower. He has led several projects that improved productivity, reduced costs and improved yield. These include a project that improved CMP productivity and saved over $10 million. He is proficient in English, Chinese and Bahasa Malaysia and seeks a role in Singapore or Malaysia.

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Expected Salary:
Chian Ming Ngo
Senior Staff Equipment Engineer (CMP) at United Microelectronics
Corporation (S)
(+65) 94234481 | nchian@hotmail.com | 39 years old | Johor Bahru, Johor
Experience 17 years
Previous CMP EquipmentEngineer
Chartered Semiconductor Manufacturing
Education Oklahoma State University
Bach Degree,E&E Engineering (1998)
Nationality Malaysian / Singapore PR
Experience
Aug 2004 - Present
(10 years 6 months )
Senior Staff Equipment Engineer (CMP)
United Microelectronics Corporation (S) | Singapore, Singapore
Monthly Salary
Duties:
Holding responsibility as Senior Staff engineer in Chemical Mechanical Polishing (CMP).
Job Scope include:
- Managing one group of engineers to maintain & improve machine uptime.
- Advice on process defect troubleshooting and improvement
- Module cost driver. Managing parts usage (commodity, upkeep & slurry) and module spending in order to
meet module cost target.
- Manpow er planning. Arranging manpow er support forline coverage and preventive maintenance activity,
and managing yearly annualshutdow n project to make sure all the tools are able to recover ontime and
w ithout any defect issues.
- Scrap monitoring & improvement
- Develop UMC first TPM project (Total product maintenance) , include OPL (one point lessen) & 5S
maintain
Accomplishment:
Productivity Improvement & Cost down :
1. Improve BEOL CMP productivity : (2nd prize w inner of 2012 Taiw an Competition)
1.1 Uptime time improve from75% to 86.5%
- PE optimization and extension
- Defect pilot rules enhancement, optimize defect scan recipe and scan flow
- Streamline plan of daily monitoring event
1.2 Throughput improvement from17w ph to25wph
- PE optimize and shorten recipe step
- P2 P1 polishing time balancing through APC to reduce w aiting time to minimum
1.3 Cost benefit
- Throughput improvement w ith current tools quantity (20tools), cost benefit
approximately -over US$10milliom
2. CMP retaining re-use on different process, cost saving NT4.3mil
3. Backside chemical bypass project for BEOL CMP process, annualcost saving USD850K
4. LK tools cleaner quick exchanger hardware modification to prolong service cycle from
6months to 12months.

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5. Contribute in blanket w afer reclaimproject, such as PA w aferrecycling flow enhancement to achieve cost
Saving. Cost saving of USD1.8mil per year.
Yield Improvement:
1. Scratch improvement:
1.1 Through analysis of scratch pattern ( physicaldimension, location, distribution) to determine scratch
Sources. Focus on particular source takes corresponded action to reduce micro and macro-scratch.
2. Residue improvement (Fall on/Slurry) :
2.1 Air flow management
2.2 Chemical conductivity control
2.3 pad clean enhancement, Atomizer design of slurry armspray nozzle
3. Removal stability controlto prevent over polish issue:
3.1 Pad conditional arm online vibration controlto prevent by product accumulate effect to cause removal
Rate drift
3.2 Pad condition disk cutting rate controlby SPC control
Tool and Parts management :
1. PMM systemsetup and implementation
1.1 Systematic controlPM schedule and PM items to avoid PM skip/delay and make sure all PM items has
been carried out and done in time to prevent excursion
2. E-parts management :parts management and eCOA management
2.1 Parts management: serialno controlof parts, part's status traceability and w arranty control
2.2 eCOA management : SPC controlof part's criticalparameter, such as flatness, hardness, cutting rate,
Grove depth, torque, vibration level...
3. ECMS (Equipment Constant Management System) :
Online checkmachine EC before every lots job in to prevent user/vendor human error to cause huge
Scrapped
4. Equipment SPC (PDS/FDC) controlenhancement :
Through recipe step and define important parameters at main and sub steps to achieve effectivemonitor of
Process condition
Tool improvement:
1. Condition monitoring of tool's health condition :
1.1 Collaborated w ith localvendor to develop economy high speed vibration sensor to detect vibration
behavior of machine moving parts, such as robot, transfer arm, pad conditioner arm and bearing
condition
1.2 Early detection project : Online extra sensor to realtime monitor of equipment criticalparameter w ith
SPC control
2. Tool's criticalparts enhancement and modification
2.1 Replace of bearing type of LK tool's quick exchanger to prolong part's lifetime, and increase cleaning
Efficiency by low idle torque
2.2 Replaced metal sealw ith O-ring to prevent DIW seek into spindle bearing compartment to induce rusty
take place, to cause scratch issue
2.3 Cross cover latch design to prevent w arpage induce rubbing to cause scratch issue
2.4 Reflexion tool's w afer roller assembly modification, design w ith plug/unplug concept to prevent
helicoids damage and reduce changing time from3 hrs to 15mins. And integrated w afer idler design
to detect actual w afer rotation speed to prevent wafer rotation unsmooth issue
2.5 CULKCMP UPS bypass to prevent systemre-boot due to UPS battery issue and prevent w afer
scrapped due to software restart itself
Special project:
1. Setup pilot line for specialprocess BSI(Backside illumination)
Jul 2000 - Aug 2004
(4 years 1 month )
CMP Equipment Engineer
Chartered Semiconductor Manufacturing
Monthly Salary
Duties:

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Troubleshooting the m/c, installation new m/c, forecosting allthe neccessaryparts, second sourcesfinding,
evaluation on new consumables and monitoring the production move.
Accomplishment:
Forecasting all spare parts, troubleshooting the m/c, installation new equipment and completed some cost
saving project.
Reason for leaving:
Wish to learn new technology (90um), new type of machine (low K CMP machine).
Sep 1998 - Jul 2000
(1 year 9 months )
Sales and Service Engineer
Maruko (M) Sdn. Bhd.
Monthly Salary MYR 1,800
Duties:
Sales, installation and servicing ITC components.
Accomplishment:
Incharged a project in Chunghua Picture Tude (M).
Education
1998 Oklahoma State University
Bachelor's Degree in Engineering (Electrical/Electronic) | United States
Major Computer and Electronic
CGPA 2.67/4
1993 Foon Yew High School
Diploma in Science & Technology | Malaysia
Grade Grade B/2nd Class Upper
Skills
Advanced project handling
Intermediate Forecast managing, Lotus Notes, MS Office, MS DOS, Window s 2000, Window s95/98, AutoCad, MatLab
Basic C Language, DBASE, UNIX, Window s NT4.0, Java Applets
Languages
Proficiencylevel: 0 - Poor, 10 - Excellent
Language Spoken Written Relevant Certificates
Chinese 10 10 -
English 7 7 -
Bahasa Malaysia 5 5 -
Japanese 2 0 -

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Additional Info
Expected Salary
Preferred WorkLocation Anywherein Singapore, Anywhere in Malaysia
About Me
Gender Male
Telephone Number (+60) 12-7761981
Address (local)
Address (Oversea)
Date of birth
Nationality
26 Riverina Walk, Singapore 518332
6, Jalan Jati, Taman Melodies,, 80250, Johor Bahru, Johor, Malaysia
24 June 1975
Malaysian / Singapore PR