Electroless plating of solid metals from a solution onto a catalytically active surface has been widely used in the printed circuit board industry for production of wiring layers and inter-layer (via) connections. More recently, this body of knowledge has been applied to producing metal interconnect films in the integrated circuit substrate (IC substrate) industry. Proper surface activation (through a catalyst) is the key to electroless plating, however there are difficulties in controlling the uniformity of the catalyst coverage. For smooth substrate surfaces, like polyimide (PI) which is used in flexible electronics applications, there is an additional challenge for the electrolessly plated metal to adhere to the surface. Although traditional methods such as plasma and desmearing processes have been used to “roughen” the surface for greater adhesion through an interlock mechanism, electroless metal deposited on a rough substrate would result in signal loss in high speed high frequency applications, such as 5G communication electronics. It is therefore desirable to develop new chemistries that can be used for planarization of the substrate to generate a smooth metal-substrate interface, but with an enhanced adhesion strength of the deposited metal, therefore eliminating the need for an interlocking rough interface. The mussel-inspired adhesive moiety, dopamine, is known to be a universal adhesive on a wide range of inorganic and organic surfaces.1 The mechanism of such strong adhesion is still under investigation; however, catechols and amines are known to induce strong interactions with substrates and self-polymerization.1 Our recent work on dopamine-functionalized polymers demonstrated that the dopamine end group stabilized ultrathin (5-10 nm) polymer films and formed conformal coatings on planar and non-planar surfaces.2 Moreover, another mussel-inspired adhesive moiety, histamine, is known to form an ionic bond with metals, which can be useful in the coordination of the ionic catalyst. Therefore, by utilizing a random copolymer of histamine and dopamine moieties with a water-soluble poly (ethylene oxide) backbone (PEO-PHis-PDopa), we can facilitate adhesion between smooth substrates and also enable the planarization of copper in electroless copper plating. When the copolymer is deposited on a substrate surface, the Dopa moiety reacts with the substrate and adheres to it, the polymer chain extends and folds to generate a smoother outer surface through minimizing the surface energy, while the histamine moiety coordinates with the ionic catalyst (Pd). Fig.1 shows a schematic where the PEO-PHis-PDopa layer plays two roles: an adhesion promoter and a surface smoother at the same time.