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Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
MUSSEL INSPIRED POLYMERS FOR
FLEXIBLE ELECTRONICS APPLICATIONS
Hellen Papananou,1 Reika Katsumata,1 Rubayn Goh1,
Feng Liu2, Mingqi Li2, Peter Trefonas2, Rachel Segalman1,3
1 Materials Research Laboratory, University of California, Santa Barbara, California, U.S.A
2 DuPont Specialty Products Division–Electronics & Imaging, Marlborough, Massachusetts, U.S.A.
3 Department of Chemical Engineering, University of California, Santa Barbara, California, U.S.A
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Vias, holes, connections and contacts: Cu
2
Deposition achieved through an auto
catalytic reaction via a reducing agent
Electrolysis which uses direct electric
current to dissolve a copper rod and
transport the copper ions to the substrate
Conventional Circuit Board
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
No adhesion between Cu and substrate
Substrate: Polyimide (PI)
Copper
Substrate
Electroless Copper
Substrate
Adhesive
Non-conductive Electroless plating
Electroless Copper
Substrate
Adhesive
Electrolytic Copper
3
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Additional requirements from application perspective
1. Cost effective
2. Process should be no longer than several min
3. Moderate temperatures: from R.T. to 50 °C
4. Water-based system
4
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Adhesive moieties: inspiration
5
Dopamine
Histamine
Catechol
Imidazole
Single-molecule mechanics of mussel adhesion
Haeshin Lee, Norbert F. Scherer, and Phillip B. Messersmith
PNAS, 2006 103 (35) 12999-13003
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
6
POLYMER
PEO-stat-AGE
Poly(ethylene oxide)-allyl glycidyl ether
Mw=20.000
AGE%~5%
PEO-HISTA
Water soluble
Tailorability
Thiol-ene
reaction
+
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
7
POLYMER
PEO-stat-AGE
Poly(ethylene oxide)-allyl glycidyl ether
Thiol-ene
reaction
Mw=20.000
AGE%~5%
PEO-DOPA
Water soluble
Tailorability
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Copper plating process
Rinse
1 min
Microetch
H2SO4/
Na2SO4 aq.
R.T.
1.5 min
Pre-dip
HNO3 aq.
R.T.
0.5 min
Rinse
2 min
Rinse
1 min
Reducer
DMAB/
B(OH)3 aq.
32 °C
1 min
Pre-
treatment of
substrates
This studyConventional process “Control”
Cationic polymer
PIPI
– +
+
+ +
++
–
– –
Polymer
PI PI
OHOH NH
8
UVO
treatment
R.T.
5 min
PI PI
OHOH OH
Ionic
catalyst
CP 6530
40 °C
1 min
Polymer
PI
Pd Pd2+
Pd2+
Polymer
PI
Copper
Pd
Rinse
2 min
N2 dryRinse
1 min
Plating
CP 6550
43 °C
6 min
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Goal
1. Achieve smooth surface of copper
2. Enhance adhesion between PI and copper and
understand the mechanism of adhesion promotion and
planarization
9
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Cu Plating with PEO-Hista
10
PH=3 PH=5.5 PH=6.5 PH=8
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Cu Plating with PEO-Dopa
11
PH=3 PH=5.5 PH=8 PH=9
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Smooth surface
DOW CONTROL PEO-HISTA PEO-DOPA
RMS=16nm RMS=9nm RMS=7.5nm
12
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Goal
1. Achieve smooth surface of copper
2. Enhance adhesion between PI and copper and
understand the mechanism of adhesion promotion and
planarization
Goal
 Achieve smooth surface of copper
2. Enhance adhesion between PI and copper and
Understand the mechanism of adhesion promotion and
planarization
13
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Scotch tape test
14
Adhesion on Passed/times Failed/times
CONTROL  10 0
PEO-HISTA  5 0
PEO-DOPA  4 1
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Step-by-step study of roughness (AFM)
15
0
2
4
6
8
10
12
14
16
18
20
As received Plasma Polymer Microetch Catalyst Cu
RMSroughness2µm×2µm
(nm)
Control PEO-HISTA PEO-DOPA
PIPI
PEO-PDOPA
PI
PEO-PDOPA
PI
Pd
PEO-PDOPA
PI
Copper
Pd
PEO-PDOPA
PI
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
16
XPS STUDY
N1s
Cu2p
Focusofthepeak
Pd3d
C1s
O1s
PEO-PDOPAPEO-PDOPA
Plasma
Treatment
Polymer Micro etch Pre-dip Ionic catalyst Reducer Plating
PI PI PI PI
PEO-PDOPA
PI
Pd
PEO-PDOPA
PI
Copper
Pd
PEO-PDOPA
PI
Pd
PEO-PDOPA
PI
Kapton
As received
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
17
Dupont recipe
P(EO-His)
pH = 3
Pretreatment
C1s
O
O
O
m n
S
HN
O
NH
N
P(EO-Dopa)
pH = 3
?
285.0 C-C, C-H
286.5 C-O-C, C-OH
288.0 C=O
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
18
Dupont recipe
P(EO-His)
pH = 3
Pretreatment
N1s
O
O
O
m n
S
HN
O
NH
N
P(EO-Dopa)
pH = 3
?
399.0 N-H
400.7 ?
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
19
Dupont recipe
P(EO-His)
pH = 3
Pd3d
O
O
O
m n
S
HN
O
NH
N
P(EO-Dopa)
pH = 3
?
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
20
Dupont recipe
P(EO-His)
pH = 3
Cu2p
O
O
O
m n
S
HN
O
NH
N
P(EO-Dopa)
pH = 3
?
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Which interface is failing?
21
PEO-HISTA
PI PI
OHOH NH
PEO-HISTA
PI
Pd Pd2+
Pd2+
PEO-DOPA
PI PI
OHOH NH
PEO-DOPA
PI
Pd Pd2+
Pd2+
?
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Future:
PEO-stat-HISTA-stat-DOPA
22
Good adhesion to
the substrate
Better quality of
plated copper
Mw of PEO % AGE
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
Conclusions
23
Both polymers
successfully acted
as an adhesive
during electroless
plating
We were able to
synthesize water
soluble polymers
with mussel inspired
moieties
One of our polymers
exhibits the same
adhesion strength
as control
Both polymers had
better quality of
plated copper than
control
Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group
24
Acknowledgements
• Patent application has been filed.
• Team
• Dr. Feng Liu (DuPont)
• Dr. Mingqi Li (DuPont)
• Dr. Peter Trefonas (DuPont)
• Prof. Reika Katsumata
• Prof. Rachel A. Segalman
• Special thanks to…
• Dr. Segolene Antoine
• Rubayn Goh
• Nicole Michenfelder-Schauser

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Mussel inspired polymers for flexible electronics applications

  • 1. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group MUSSEL INSPIRED POLYMERS FOR FLEXIBLE ELECTRONICS APPLICATIONS Hellen Papananou,1 Reika Katsumata,1 Rubayn Goh1, Feng Liu2, Mingqi Li2, Peter Trefonas2, Rachel Segalman1,3 1 Materials Research Laboratory, University of California, Santa Barbara, California, U.S.A 2 DuPont Specialty Products Division–Electronics & Imaging, Marlborough, Massachusetts, U.S.A. 3 Department of Chemical Engineering, University of California, Santa Barbara, California, U.S.A
  • 2. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Vias, holes, connections and contacts: Cu 2 Deposition achieved through an auto catalytic reaction via a reducing agent Electrolysis which uses direct electric current to dissolve a copper rod and transport the copper ions to the substrate Conventional Circuit Board
  • 3. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group No adhesion between Cu and substrate Substrate: Polyimide (PI) Copper Substrate Electroless Copper Substrate Adhesive Non-conductive Electroless plating Electroless Copper Substrate Adhesive Electrolytic Copper 3
  • 4. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Additional requirements from application perspective 1. Cost effective 2. Process should be no longer than several min 3. Moderate temperatures: from R.T. to 50 °C 4. Water-based system 4
  • 5. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Adhesive moieties: inspiration 5 Dopamine Histamine Catechol Imidazole Single-molecule mechanics of mussel adhesion Haeshin Lee, Norbert F. Scherer, and Phillip B. Messersmith PNAS, 2006 103 (35) 12999-13003
  • 6. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 6 POLYMER PEO-stat-AGE Poly(ethylene oxide)-allyl glycidyl ether Mw=20.000 AGE%~5% PEO-HISTA Water soluble Tailorability Thiol-ene reaction +
  • 7. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 7 POLYMER PEO-stat-AGE Poly(ethylene oxide)-allyl glycidyl ether Thiol-ene reaction Mw=20.000 AGE%~5% PEO-DOPA Water soluble Tailorability
  • 8. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Copper plating process Rinse 1 min Microetch H2SO4/ Na2SO4 aq. R.T. 1.5 min Pre-dip HNO3 aq. R.T. 0.5 min Rinse 2 min Rinse 1 min Reducer DMAB/ B(OH)3 aq. 32 °C 1 min Pre- treatment of substrates This studyConventional process “Control” Cationic polymer PIPI – + + + + ++ – – – Polymer PI PI OHOH NH 8 UVO treatment R.T. 5 min PI PI OHOH OH Ionic catalyst CP 6530 40 °C 1 min Polymer PI Pd Pd2+ Pd2+ Polymer PI Copper Pd Rinse 2 min N2 dryRinse 1 min Plating CP 6550 43 °C 6 min
  • 9. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Goal 1. Achieve smooth surface of copper 2. Enhance adhesion between PI and copper and understand the mechanism of adhesion promotion and planarization 9
  • 10. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Cu Plating with PEO-Hista 10 PH=3 PH=5.5 PH=6.5 PH=8
  • 11. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Cu Plating with PEO-Dopa 11 PH=3 PH=5.5 PH=8 PH=9
  • 12. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Smooth surface DOW CONTROL PEO-HISTA PEO-DOPA RMS=16nm RMS=9nm RMS=7.5nm 12
  • 13. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Goal 1. Achieve smooth surface of copper 2. Enhance adhesion between PI and copper and understand the mechanism of adhesion promotion and planarization Goal  Achieve smooth surface of copper 2. Enhance adhesion between PI and copper and Understand the mechanism of adhesion promotion and planarization 13
  • 14. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Scotch tape test 14 Adhesion on Passed/times Failed/times CONTROL  10 0 PEO-HISTA  5 0 PEO-DOPA  4 1
  • 15. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Step-by-step study of roughness (AFM) 15 0 2 4 6 8 10 12 14 16 18 20 As received Plasma Polymer Microetch Catalyst Cu RMSroughness2µm×2µm (nm) Control PEO-HISTA PEO-DOPA PIPI PEO-PDOPA PI PEO-PDOPA PI Pd PEO-PDOPA PI Copper Pd PEO-PDOPA PI
  • 16. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 16 XPS STUDY N1s Cu2p Focusofthepeak Pd3d C1s O1s PEO-PDOPAPEO-PDOPA Plasma Treatment Polymer Micro etch Pre-dip Ionic catalyst Reducer Plating PI PI PI PI PEO-PDOPA PI Pd PEO-PDOPA PI Copper Pd PEO-PDOPA PI Pd PEO-PDOPA PI Kapton As received
  • 17. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 17 Dupont recipe P(EO-His) pH = 3 Pretreatment C1s O O O m n S HN O NH N P(EO-Dopa) pH = 3 ? 285.0 C-C, C-H 286.5 C-O-C, C-OH 288.0 C=O
  • 18. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 18 Dupont recipe P(EO-His) pH = 3 Pretreatment N1s O O O m n S HN O NH N P(EO-Dopa) pH = 3 ? 399.0 N-H 400.7 ?
  • 19. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 19 Dupont recipe P(EO-His) pH = 3 Pd3d O O O m n S HN O NH N P(EO-Dopa) pH = 3 ?
  • 20. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 20 Dupont recipe P(EO-His) pH = 3 Cu2p O O O m n S HN O NH N P(EO-Dopa) pH = 3 ?
  • 21. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Which interface is failing? 21 PEO-HISTA PI PI OHOH NH PEO-HISTA PI Pd Pd2+ Pd2+ PEO-DOPA PI PI OHOH NH PEO-DOPA PI Pd Pd2+ Pd2+ ?
  • 22. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Future: PEO-stat-HISTA-stat-DOPA 22 Good adhesion to the substrate Better quality of plated copper Mw of PEO % AGE
  • 23. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group Conclusions 23 Both polymers successfully acted as an adhesive during electroless plating We were able to synthesize water soluble polymers with mussel inspired moieties One of our polymers exhibits the same adhesion strength as control Both polymers had better quality of plated copper than control
  • 24. Eleni Papananou EPF CONFERENCE 19_06_11Segalman Group 24 Acknowledgements • Patent application has been filed. • Team • Dr. Feng Liu (DuPont) • Dr. Mingqi Li (DuPont) • Dr. Peter Trefonas (DuPont) • Prof. Reika Katsumata • Prof. Rachel A. Segalman • Special thanks to… • Dr. Segolene Antoine • Rubayn Goh • Nicole Michenfelder-Schauser