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Presentation includes design and testing of analog and mixed-signal integrated circuits such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs with on-chip BICS
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(CERN-INFN) per il ricoprimento di cavità 1,5GHz. Sono state utilizzate due diverse
configurazioni di magnetron e tutti i film ottenuti sono stati analizzati dal punto di vista delle proprietà superconduttive (temperatura critica, resistività e resistenza,), strutturali (diffrazione di raggi X) e morfologiche (microscopio a forza atomica). Lo studio ha comportato la deposizione di un numero elevato di campioni (13 serie per un totale di circa
140 substrati) e la messa a punto di tecniche di analisi.
3D-packaging technology is a cost-competitive solution to manage the increasingly limited \'real estate\' available in consumer applications. One major challenge is through silicon via (TSV) formation using the Bosch process. The alternating and repeated use of etching and passivation chemistries poses various challenges to photoresist design, such as excellent resolution, vertical profiles, high etch resistance, and simple removal. We discuss lithographic properties and performance of a new negative resist concept designed for full compatibility with the Bosch process with excellent coating uniformity over a film thickness range from < 10 to > 120 um and aspect ratios exceeding 5:1. The material combines short process times with excellent etch resistance and residue-free removal with standard strippers, thus facilitating the most challenging process of advanced 3D-packaging concepts.
Presentation includes design and testing of analog and mixed-signal integrated circuits such as an operational amplifier, 12-bit charge scaling architecture based digital-to-analog converter (DAC), 12-bit recycling architecture based analog-to-digital converter (ADC) and operational amplifier with floating gate inputs with on-chip BICS
Il lavoro di questa tesi si propone di studiare il problema delle cavità di niobio su rame, partendo dalla caratterizzazione dettagliata dei film depositati per magnetron sputtering lungo una cavità 1,5GHz per finire studiando l’influenza che l’angolo di deposizione e la porosità hanno sulla degradazione delle proprietà superconduttive. Lo studio è stato condotto in maniera sistematica, effettuando numerose deposizioni su substrati di quarzo e rame, utilizzando i parametri di processo e la procedura standard
(CERN-INFN) per il ricoprimento di cavità 1,5GHz. Sono state utilizzate due diverse
configurazioni di magnetron e tutti i film ottenuti sono stati analizzati dal punto di vista delle proprietà superconduttive (temperatura critica, resistività e resistenza,), strutturali (diffrazione di raggi X) e morfologiche (microscopio a forza atomica). Lo studio ha comportato la deposizione di un numero elevato di campioni (13 serie per un totale di circa
140 substrati) e la messa a punto di tecniche di analisi.
3D-packaging technology is a cost-competitive solution to manage the increasingly limited \'real estate\' available in consumer applications. One major challenge is through silicon via (TSV) formation using the Bosch process. The alternating and repeated use of etching and passivation chemistries poses various challenges to photoresist design, such as excellent resolution, vertical profiles, high etch resistance, and simple removal. We discuss lithographic properties and performance of a new negative resist concept designed for full compatibility with the Bosch process with excellent coating uniformity over a film thickness range from < 10 to > 120 um and aspect ratios exceeding 5:1. The material combines short process times with excellent etch resistance and residue-free removal with standard strippers, thus facilitating the most challenging process of advanced 3D-packaging concepts.
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Download Link > https://ertekprojects.com/gurdal-ertek-publications/blog/simulation-modeling-for-quality-and-productivity-in-steel-cord-manufacturing/
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Similar to Roll-to roll printing; making new forms of displays, solar cells and other technologies economically feasible
In this presentation on LED Basics we will look at a few topics in semiconductor lighting such as light generation from a semiconductor material, LED chip technology, structure of an LED, creating white light in an LED package and finally some definitions of CCT and CRI.
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Download Link > https://ertekprojects.com/gurdal-ertek-publications/blog/simulation-modeling-for-quality-and-productivity-in-steel-cord-manufacturing/
We describe the application of simulation modeling to estimate and improve quality and productivity performance of a steel cord manufacturing system. We describe the typical steel cord manufacturing plant, emphasize its distinguishing characteristics, identify various production settings and discuss applicability of simulation as a management decision support tool. Besides presenting the general structure of the developed simulation model, we focus on wire fractures, which can be an important source of system disruption.
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2. This is the Fifth Session in MT5009
Session Technology
1 Objectives and overview of course
2 Two types of improvements: 1) Creating materials that
better exploit physical phenomena; 2) Geometrical scaling
3 Semiconductors, ICs, electronic systems
4 MEMS and Bio-electronic ICs
5 Lighting and Displays (also roll-to roll printing)
6 Nanotechnology, 3D printing and DNA sequencing
7 Human-computer interfaces
8 Superconductivity, fusion, energy storage
9 Solar cells, wind turbines
10 Telecommunications and Internet
3. Roll to Roll Printing
Relevant for many technologies
Organic displays including flexible ones
Organic solar cells
Integrated Circuits (maybe with organic materials)
Advantages
Very low cost
Disadvantages
Much lower resolution than some techniques such as
photolithography
Challenges
Find materials that can be easily roll printed and that have
the necessary electronic and other characteristics
For example, nano-particles are a major topic
4.
5.
6.
7. Roll-to roll (R2R) printing
Introduction to Printed Electronics and Intelligence, Jukka Hast
8. R2R Process for Manufacturing Active Matrix Backplanes
Based on Plasma Processing and Self-Aligned Imprint Lithography
deposition imprint etch
Vacuum deposition of Multiple mask
Patterning completed
metals, dielectrics, & levels imprinted
w/ wet & dry
semiconductors as single 3D
processes
structure
5μ
Conventional Photo-Lithography SAIL
deposit deposit imprint etch
strip/clean spin resist
align/expose etch
etch
mask
develop
Source: Roll-to-Roll Manufacturing
of Flexible Displays, Hewlett Packard, Phicott
9. SAIL solves alignment problem & saves money
Web cost
Strip-off 2P
RIE etch oxide
Multiple Under-cut Al (1-3 um)
RIE etch n+
photoresist applications Wet etch Cr
R2R SAIL
Thin down 2P (clear gate-pad)
dominate photolithography RIE etch n+&Si&SIN
Pre-Cr-etch Cleaning
process materials costs Thin down 2P (clear gate-pad)
Plasma etch Al
RIE etch oxide
RIE etch n+&Si&SIN
Wet etch Cr
Imprint SAIL structure
SD metal deposition (Cr)
PECVD oxide/nitride/Si/N+ deposition
Gate metal deposition (Al)
Condition web (de-hydro)
Backplane materials costs $0.0 $0.5 $1.0 $1.5 $2.0 $2.5
for R2R photolith & SAIL Web cost
$18.00
Cost of Patterning Align and Expose
R2R photolith (AGI)
$16.00 Sputter Dep Interconnect
$14.00
cost per ft2
Align and Expose
$12.00 Sputter Dep/ ITO
$10.00 Align and Expose
$8.00 Ultrasonic Clean
Si RIE & Resist Strip
$6.00
Align and Expose
$4.00
SiN, a-Si, N+ dep
$2.00
Align and Expose
$0.00
Sputter Gate 1 Metal
Photolithography SAIL Web preparation
$0.0 $0.5 $1.0 $1.5 $2.0 $2.5 $3.0
10. Equipment Cost Comparison for Different Levels of Scale
(comparison made at equal throughput)
equipment cost scaling comparison: panel stepper vs R2R imprinter
0
10
equipment cost [M$] / throughput [cm 2 / S]
-1
10
-2
10
100 mm R2R imprinter
330 mm R2R imprinter
-3
10
2 3 4 5 6 7 8 9 10
generation
Scaling similar for R2R printer and panel stepper; cost much lower for R2R
Source: Roll-to-Roll Manufacturing of Flexible Displays, Hewlett Packard, Phicott
11. PECVD Scaling: R2R photovoltaic compared to LCD panel
(comparison made at equal throughput)
0
equipment cost scaling comparison: panel CVD vs R2R CVD
10
equipment cost [M$] / throughput [cm2 / S]
-1
10
330 mm R2R PECVD
1 m R2R PECVD
-2
10
1 2 3 4 5 6 7 8 9 10
generation
PECVD: plasma enhanced chemical vapor deposition. Again; benefits from scaling
similar for R2R and panel; cost much lower for R2R
Source: Roll-to-Roll Manufacturing of Flexible Displays, Hewlett Packard, Phicott
12. R2R (L) equipment is still smaller than flat panel display ones (R)
330mm imprint system Gen10 cluster tool
Source: Roll-to-Roll Manufacturing of Flexible Displays, Hewlett Packard, Phicott
13. Evolution of R2R tool development
13” production solar cell
deposition
13” wet etcher
13” imprinter
4” imprinter
10” drum PECVD
13” RIE
2005 2006 2007 2008 2009
14. Conclusions and Relevant Questions for
Your Projects
Roll-to roll printing can be much cheaper than other forms
of printing (e.g., photolithographic) and its performance is
undergoing rapid improvements
These advantages will increase as the scale of R2R printers
are increased
What do these trends mean for
Organic displays including flexible ones
Organic solar Cells
Integrated Circuits (maybe with organic materials)
Other applications?
How will roll-to roll printing impact on the cost and thus
the usage of these technologies?
22. What kinds of materials
can be roll printed?
Do these materials have the
right characteristics for the
electronic product?
Applications: flexible
displays, organic solar cells,
amorphous silicon thin-
film transistors, liquid
crystal displays, or solar-
powered flexible displays