1. The document discusses various topics in VLSI physical design automation including different design styles like FPGA, standard cell, and structured ASIC.
2. It compares the design styles based on factors like cell size, placement, routing, area, performance, and cost. FPGA is described as having fixed and programmable logic and interconnect resources.
3. The document also covers FPGA architecture including logic modules, routing resources, and I/O modules. It describes the physical design process of partitioning, placement, and routing for FPGAs which has different challenges compared to other design styles.
System on Chip is a an IC that integrates all the components of an electronic system. This presentation is based on the current trends and challenges in the IP based SOC design.
Performance and Flexibility for Mmultiple-Processor SoC DesignYalagoud Patil
Concepts, limitations of traditional ASIC design
Extensible processors as an alternative to RTL
Toward multiple-processor SoCs
Processors and disruptive technology
Conclusions
Evaluating UCIe based multi-die SoC to meet timing and power Deepak Shankar
Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide high bandwidth to transfer massive amounts of data, and deliver error-free operation. The distribution of cores, deep neural networks and AI engines across these dies makes it extremely hard to predict the expected end-to-end latency, power spikes and effective bandwidth. Moreover, Multi-die architectures have evolved from proprietary to industry standard UCIe.
This Webinar looks at the system-wide view of performance and power in a multi-die SOC. We will be showcasing a few use cases that combines various types of processing engines across PCIe and interconnected UCIe. This modeling effort will present the user with different system performance and system architecture models and a guide on how to best bring different aspects of their design together in a holistic way that is optimized for power, timing and functionality.
During the Webinar, users can follow along using VisualSim Cloud. To get started with VisualSim Cloud, users can register and receive a login at https://www.mirabilisdesign.com/visualsim-cloud-login/. Once you receive the login, follow the instructions, and open the models provided in the Template pull-down. More instructions will be provided at the start of the Webinar.
System on Chip is a an IC that integrates all the components of an electronic system. This presentation is based on the current trends and challenges in the IP based SOC design.
Performance and Flexibility for Mmultiple-Processor SoC DesignYalagoud Patil
Concepts, limitations of traditional ASIC design
Extensible processors as an alternative to RTL
Toward multiple-processor SoCs
Processors and disruptive technology
Conclusions
Evaluating UCIe based multi-die SoC to meet timing and power Deepak Shankar
Multi-die designs allow systems engineering to pack more functionality with different timing and power constraints into a single package. Older generation multi-die split the dies into high-speed and low speed. Newer, high-performance multi-die System-on-Chip (SoC) requires interaction between memories across the die-to-die interfaces. Connections between dies must be power efficient, have low latency, provide high bandwidth to transfer massive amounts of data, and deliver error-free operation. The distribution of cores, deep neural networks and AI engines across these dies makes it extremely hard to predict the expected end-to-end latency, power spikes and effective bandwidth. Moreover, Multi-die architectures have evolved from proprietary to industry standard UCIe.
This Webinar looks at the system-wide view of performance and power in a multi-die SOC. We will be showcasing a few use cases that combines various types of processing engines across PCIe and interconnected UCIe. This modeling effort will present the user with different system performance and system architecture models and a guide on how to best bring different aspects of their design together in a holistic way that is optimized for power, timing and functionality.
During the Webinar, users can follow along using VisualSim Cloud. To get started with VisualSim Cloud, users can register and receive a login at https://www.mirabilisdesign.com/visualsim-cloud-login/. Once you receive the login, follow the instructions, and open the models provided in the Template pull-down. More instructions will be provided at the start of the Webinar.
About
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
Technical Specifications
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
Key Features
Indigenized remote control interface card suitable for MAFI system CCR equipment. Compatible for IDM8000 CCR. Backplane mounted serial and TCP/Ethernet communication module for CCR remote access. IDM 8000 CCR remote control on serial and TCP protocol.
• Remote control: Parallel or serial interface
• Compatible with MAFI CCR system
• Copatiable with IDM8000 CCR
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
Application
• Remote control: Parallel or serial interface.
• Compatible with MAFI CCR system.
• Compatible with IDM8000 CCR.
• Compatible with Backplane mount serial communication.
• Compatible with commercial and Defence aviation CCR system.
• Remote control system for accessing CCR and allied system over serial or TCP.
• Indigenized local Support/presence in India.
• Easy in configuration using DIP switches.
6th International Conference on Machine Learning & Applications (CMLA 2024)ClaraZara1
6th International Conference on Machine Learning & Applications (CMLA 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of on Machine Learning & Applications.
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Sachpazis:Terzaghi Bearing Capacity Estimation in simple terms with Calculati...Dr.Costas Sachpazis
Terzaghi's soil bearing capacity theory, developed by Karl Terzaghi, is a fundamental principle in geotechnical engineering used to determine the bearing capacity of shallow foundations. This theory provides a method to calculate the ultimate bearing capacity of soil, which is the maximum load per unit area that the soil can support without undergoing shear failure. The Calculation HTML Code included.
Welcome to WIPAC Monthly the magazine brought to you by the LinkedIn Group Water Industry Process Automation & Control.
In this month's edition, along with this month's industry news to celebrate the 13 years since the group was created we have articles including
A case study of the used of Advanced Process Control at the Wastewater Treatment works at Lleida in Spain
A look back on an article on smart wastewater networks in order to see how the industry has measured up in the interim around the adoption of Digital Transformation in the Water Industry.
CW RADAR, FMCW RADAR, FMCW ALTIMETER, AND THEIR PARAMETERSveerababupersonal22
It consists of cw radar and fmcw radar ,range measurement,if amplifier and fmcw altimeterThe CW radar operates using continuous wave transmission, while the FMCW radar employs frequency-modulated continuous wave technology. Range measurement is a crucial aspect of radar systems, providing information about the distance to a target. The IF amplifier plays a key role in signal processing, amplifying intermediate frequency signals for further analysis. The FMCW altimeter utilizes frequency-modulated continuous wave technology to accurately measure altitude above a reference point.
Tutorial for 16S rRNA Gene Analysis with QIIME2.pdf
lecture25_fpga-conclude.ppt
1. 1/1/2023 1
VLSI Physical Design Automation
Prof. David Pan
dpan@ece.utexas.edu
Office: ACES 5.434
Misc. Topics and Conclusion
2. 2
1/1/2023
Other Design Styles: FPGA
• Field Programmable Gate Array
• First introduced by Xilinx in 1984.
• Pre-fabricated devices and interconnect, which are
programmable by user.
• Advantages:
– short turnaround time.
– low manufacturing cost.
– fully testable.
– re-programmable.
• Particularly suitable for prototyping, low or medium-
volume production, device controllers, etc.
3. 3
1/1/2023
Comparison of Design Styles
Full-Custom
Standard
Cell
Gate Array FPGA
Cell size variable fixed height fixed fixed
Cell type variable variable fixed
programma
ble
Cell placement variable in row fixed fixed
Interconnections variable variable variable
programma
ble
Fabrication
layers
all layers
all
layers
routing
layers only no layers
4. 4
1/1/2023
Comparison of Design Styles
Full-Custom Standard Cell Gate Array FPGA
Area compact
compact to
moderate
moderate large
Performance high
high
to moderate
moderate low
Design cost high medium medium low
Time-to-market long medium medium short
5. 5
1/1/2023
Programming Technologies
• SRAM to control pass transistor / multiplexer
• EPROM – UV light Erasable PROM
• EEPROM – Electrically Erasable PROM
• Antifuses – One time programmable
• They are different in ease of manufacturing,
manufacturing reliability, area, ON and OFF
resistance, parasitic capacitance, power consumption,
re-programmability.
8. 8
1/1/2023
Two Types of Logic Modules
Look-Up Table (LUT) based:
• A block of RAM to store the truth table.
• A k-input 1-output functions needs 2k bits.
• k is usually 5 or 6.
Multiplexer based: e.g., f=ABC+ABC
C
B
A
A
B
f
12. 12
1/1/2023
Comparison of Segmentation Models
• The segmented model provides better utilization of
routing resources.
• However, segmented model uses more fuses or
programmable switches.
• The delay of a net is directly proportional to the # of
fuses or programmable switches in the route
– Manhattan-distance based delay model does NOT work
anymore
– The segmented model is slower in general
13. 13
1/1/2023
Physical Design of FPGAs
• Very different from other design styles
• Architecture dependent:
– LUT or Multiplexer in logic modules
– Type of switchboxes used
– Type of segmentation model used
– ......
• Physical Design:
– Partitioning
– Floorplanning/Placement
– Routing
14. 14
1/1/2023
Partitioning
• Want to partition the circuit such that each partition
(cluster) can be implemented by a logic module.
• Also called Clustering.
• # of I/O pins, not cluster sizes, is important.
(For multiplexer based logic modules, functionality of
clusters is also important.)
Example:
Using 4-LUTs
16. 16
1/1/2023
Routing
• Global routing:
– Similar to global routing in other design styles.
– Minimize wire length and balance densities.
• Detailed routing:
– Very different from other design styles.
– Different algorithms for different segmentation models.
– Channels and switchboxes have fixed capacities.
17. 17
1/1/2023
Structured ASIC
• New buzz word, but essentially gate array
– Mask reconfigurable
– Not field reconfigurable
• Between FPGA and standard cells
– Balance delay/performance and mask cost
• Only programmable once
– by vias (e.g., Via-Programmable Gate Array – VPGA)
19. 19
1/1/2023
MCM and SiP
• Multi-Chip Module
• System in package (SiP)
– Different package styles
– Thermal consideration for 3D
• Alternative packaging approach for high performance
systems.
• Similar to PCB and IC layout problems, but
– PCB layout tools cannot handle the dense and complex wiring
structure of MCM.
– IC layout tools cannot handle the complex electrical, thermal
and geometrical constraints.
21. 21
1/1/2023
Partitioning
• Partitioning a circuit so that each sub-circuit can be
implemented into a chip.
• MCM may contain as many as 100 chips.
• Need to consider timing constraints and thermal
constraints
• In addition, also need to consider traditional I/O
constraints and area constraints.
22. 22
1/1/2023
Placement
• # of components is much less as compared to IC
placement.
• However, need to consider timing constraints and
thermal constraints (as bare chips are placed close to
each other).
• Routing is done in routing layers, not between chips.
• So no routing region needs to be allocated.
23. 23
1/1/2023
Routing
• Main objective is to satisfy timing constraints.
• Another objective is to minimize # of routing layers, not to
minimize routing area.
– Cost is directly proportional to # of layers
• Crosstalk, skin effect and parasitic effect are important
considerations.
• Wires are of smaller pitch and more dense than PCB layout.
25. 25
1/1/2023
What Have Been Taught?
• Introduced different problems in Physical Design.
• Numerous algorithms which are different in terms of
– design styles
– objectives
– constraints
– techniques
– optimality
– efficiency
– robustness
– .....
26. 26
1/1/2023
What Is Important?
• Understand the problems
– How to formulate the problems, represent the constraints,
solutions, etc.
– Reasonable assumptions/abstractions
• Know fundamental algorithms to solve the problems.
• However, the world keeps on changing:
– technology
– objectives
– constraints
– requirement on solution quality
– computational power
• It is more important to learn how to think
– formulate the problem
– solve it smartly
31. 31
1/1/2023
Technology Trend and Challenges
Source:
ITRS’03
Interconnect determines the overall performance
In addition: noise, power => Design closure
Furthermore: manufacturability => Manufacturing closure
32. 32
1/1/2023
New Trends in Physical Design
• For nanometer IC designs, interconnect dominates
• New physical effects
– Noise: coupling, P/G noise
– Power: leakage, power/voltage islands
– Manufacturability: yield, printability
– Reliability, …
• More and more vertical integration
– Logic synthesis coupled with physical design
– Interconnect optimizations & design planning
– Physical design as a bridge between lower level modeling and
higher level optimization/planning
• Existing CAD algorithms are far away from optimal
33. 33
1/1/2023
Check points
Problem solving skills on underlying physical
design algorithms
Know what’s behind the scene of CAD tools
Know the trend and critique ability if given a new
research paper
Project study of a topic of your choice and
implementation (through class project)
Presentation skill
Paper writing and job preparation