Intel® Xeon® Processor E5-2600 v4 Tech Computing Applications Showcase

Intel® Xeon® ProcessorE5-2600v4ProductFamilyApplicationsShowcase
Performance Orchestration security
Technical
Computing
March 2016

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SoftwarePartnersEnablingontheIntel® Xeon® processorE5-2600v4Family

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platformvalueproposition
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Intel®Xeon®
processorE5-2600v4
productfamily
Intel®SSDDCFamily
D3700/3600&P3320
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OR
Intel®omni-path
architecture
TheNew2016PlatformOptimizedfortheCloud

Intel® Xeon® ProcessorE5-2600v4ProductFamily
NewProcessorTechnologies
• New Features and Enhancements
• Intel® Transactional Synchronization Extensions (TSX)
• Optimized Intel® AVX 2.0
• Gather Improvements
• Posted Interrupts
• Page Modification Logging
• VM Enter/Exit latency Reduction
Performance
• New Capabilities
• Cache Monitoring Technology (introduced on Xeon® E5-2600 v3)
• Cache Allocation Technology
• Code and Data Prioritization
• Memory Bandwidth Monitoring
Orchestration
• New Features
• Crypto Speedup
• New Random Seed Generator (RDSEED)
• #VE (Processor Virtualization exception)
• Supervisor Mode Access Protection (SMAP)
Security
Performance info
Orchestration info
Security info
Intel®Resource
DirectorTechnology

* Other Names and Brands May Be Claimed as the Property of Others
Softwareplatformvalueproposition
Intel®Xeon®ProcessorE5-2600v4productFamily
6
With software solutions running on the Intel® Xeon® processor E5-2600 v4
product family, you can:
 Accelerate cloud deployments through a robust portfolio of capabilities in the
software defined infrastructure space, to better manage shared platform resources.
See how new features such as Intel® RDT can offer higher throughput for higher priority
workloads for better utilization overall.
 Catalyze business innovation with cloud-based service and application delivery
models that increase efficiency and lower TCO. Learn how software optimizations for
this latest generation processor can deliver improved user experiences.
 Break through the “performance wall” with the Intel Xeon processor E5-2600 v4
product family for many High Performance Computing applications, as seen here.
 Stay competitive by enabling the IT organization to be more agile, flexible and
responsive to evolving business needs and to scale on demand.

Technicalcomputing

TechnicalComputing
8
Telecom.
& Cloud
Up to
Faster1
5.54X
Financial
Services &
Security
Big Data
Analytics
Core Business
Enterprise
Database
Break Down Your “Performance Wall”
Whether you’re designing a product,
identifying a disease marker, or exploring the
subsurface, faster access to deeper insight is a
major advantage. The Intel® Xeon® processor
E5-2600 v4 product family with Intel®
Advanced Vector Extensions 2.0 (Intel® AVX
2.0) delivers significant gains in performance,
density, and efficiency. In combination with
Intel innovations across the HPC platform,
these processors offer a powerful new
resource for accelerating discovery.
View the following slides to see how
compelling the performance gains can be.
1 – Demonstrated with LAMMPS* proof point, slide 9.

0
1
2
3
4
5
NormalizedPerformance
2S Intel® Xeon® processor E5-2697 v3
2S Intel® Xeon® processor E5-2697 v4 and Intel® AVX2 Optimizations
Up to 30%
faster!!
LAMMPS increased performance by up to 5.54X with
the 2S Intel® Xeon® processor E5-2697 v4
and Intel® AVX2
LAMMPS*
Large-Scale Atomic/Molecular Massively Parallel Simulator
“The new Intel® Xeon® processor E5-2697 V4, combined with software
optimizations to exploit Intel® AVX2, produces impressive speedups for LAMMPS,
allowing scientists to perform more realistic simulations with molecular
dynamics.”
Steve Plimpton – Distinguished Member of Technical Staff, Sandia National
Laboratories
9
http://lammps.sandia.gov/
 Optimizations to exploit Intel® AVX2 give simulation rates that are up to 5.54X
faster1
 Improved memory bandwidth and increased core counts allow unmodified code
in LAMMPS to perform simulations up to 30% faster on E5-2697v4 processors
without an increase in the processor TDP2
 Optimizations are available in the USER-INTEL package provided with LAMMPS*
Technical Computing - Life Sciences
1,2 - Testing conducted on LAMMPS* software comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by Intel® corporation. For complete testing configuration details, SEE SLIDE 31.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations
and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when
combined with other products. For more complete information visit http://www.intel.com/performance.
Intel® Xeon® Processor E5-2600 v4 Product Family
More realistic simulations help develop better
therapeutics
Up to
5.54X
faster!
Workload: LAMMPS* Stillinger-Weber Silicon Benchmark – 512K
atoms.
Intel Better Together: XEON + AVX2

0
1
2
2S Intel® Xeon® processor E5-2697 v3 + HDD
2S Intel® Xeon® processor E5-2699 v4 + Intel SSD DC
INTES PERMAS increased performance by up to 2.81X
with the 2S Intel® Xeon® processor E5-2699 v4 and Intel®
SSD DC P3600 Series
INTES*
PERMAS
“The combination of the new Intel® Xeon® processor E5-2699 v4 with Intel® AVX2
and Intel® Solid State Drives provides a new level of PERMAS application
performance. This allows our customers to run more complex simulations in the
same time to achieve better product designs.”1
Dr Reinhard Helfrich – CEO, INTES
10
https://www.intes.de/
 General improvements: The Intel® Xeon® processor E5-2600 v4 increased
memory bandwidth, allows better utilization of computational resources, and
significantly improved run time.
 PERMAS time-based application benefits using Intel® SSD Data Center Family for
NVMe* from lower latency and increased efficiency leading to much higher I/O
throughput and better parallelization with additional significant run time savings.
 The Intel® Xeon® processor E5-2697 v4 delivers about 10%2 improvement in
performance compared to E5-2697 v3.
Technical Computing - Manufacturing
Up to
2.81X
faster
1 - Testing conducted on ISV* software comparing 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2697 v3. 2 – Estimated improvement for Intel® Xeon® Processor E5-2697 v4 compared to 2S Intel® Xeon® Processor E5-2697 v3. Testing
done by Intel. For complete testing configuration details, SEE SLIDE 31. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your
contemplated purchases, including the performance of that product when combined with other products. For more complete information visit http://www.intel.com/performance.
Intel Better Together: XEON + SSD
Intel® Xeon® processor E5-2699 v4 with Intel® SSD Data
Center Family reduce manufacturing runtimes Workload: Permas processing time.
E5-2697 v4
est. ~ 1.10X

0
1
Product increased performance with 2S Intel® Xeon®
processor E5-2600 v4
ANSYS*
Mechanical* 17
“ANSYS helps customers turn their design concepts into successful, innovative
products. The combination of ANSYS Mechanical software running on the Intel®
Xeon® processor E5-2697 v4 and taking advantage of both the Intel® Solid State
Drive and the Intel® AVX2 really boosted performance to amazing levels
compared to the previous generation processors.”
Dr. Wim Slagter – Director of HPC and Cloud Marketing, ANSYS
11
 ANSYS Mechanical 17.0 has improved scalability to leverage more cores and
achieve higher performance on the newest Intel® Xeon® processors
 With higher core counts and more on-board memory, users can employ higher
fidelity models to achieve more accurate and detailed results.
 Higher memory bandwidth helps to maintain per-core performance even with a
higher core density on socket
 Higher performance means a shorter turn-around time on structural analysis
and the ability to cover more design points in design optimization.
Up to
70%
faster
1 - Testing conducted on ISV* software comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Turn high-fidelity models into products faster Workload: V17SP-5 - Core Solver Rating.
www.ansys.com
Intel® Xeon® + Intel® AVX2 + Intel® SSD

0
1
2S Intel® Xeon® processor E5-2697 v3 (28 cores)
Up to
32%
faster
ANSYS*
Fluent* 17 Computational Fluid Dynamics
““Thanks to latest Intel® Xeon® processor E5-2600 v4 product family, ANSYS
Fluent* is able to achieve performance levels beyond our expectations. Its
unrivaled performance enables our customers to simulate higher-fidelity models
without having to expand their cluster nodes.”1
Dr. Wim Slagter – Director of HPC and cloud marketing, ANSYS
12
 The Intel® Xeon® E5-2699 v4 provides higher Fluent performance compared to
the previous generation processor, resulting in faster turn-around times.
 Benefitting from Intel® MPI, Fluent scales out to fully utilize all available server
cores.
 Better performance allows for higher fidelity simulations and higher quality flow
visualizations.
 Coupled with the ANSYS Workbench* for parametric studies, design engineers
can cover more design space in the product design cycle.
Up to
49%
faster
1 - Testing conducted on ANSYS Fluent* comparing 2S Intel® Xeon® Processor E5-2697 v4 and 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing by Intel. For complete testing configuration details, SEE SLIDE 31.
Up to 49% better performance over the previous
generation Intel® Xeon® server Workload: Exhaust_system_33m, a 33 million cell vehicle exhaust
system model, part of the Fluent benchmarking suite.
ANSYS Fluent* 17.0 solver rating increased by up to
1.49X with the 2S Intel® Xeon® E5-2699 v4
www.ansys.com
Intel® Xeon® + Intel® MPI

2226.8
3462.9
0
500
1000
1500
2000
2500
3000
3500
0 288 576 864 1152
SolverRating
Number of Cores, 36 cores per node
Intel® Xeon® E5-2697 v4
with FDR InfiniBand* Fabric
with Intel® Omni-Path Architecture
ANSYS Fluent* 17 solver rating increased by up to
1.55X with Intel® Omni-Path Architecture scaling on a
32-node cluster
ANSYS*
Fluent* 17 Computational Fluid Dynamics
“Thanks to Intel® OPA and the latest Intel® Xeon® processor E5-2600 v4 product
family, ANSYS Fluent* is able to achieve performance levels beyond our
expectations. Its unrivaled performance enables our customers to simulate
higher-fidelity models without having to expand their cluster nodes.”
Dr. Wim Slagter – Director of HPC and cloud marketing, ANSYS
13
www.ansys.com
 Intel® Omni-Path Architecture (Intel® OPA) is a powerful low latency
communications interface specifically designed for High Performance
Computing.
 Cluster users will get better utilization of cluster nodes through better scaling.
 Cluster performance means better time-to-solution on CFD simulations.
 Coupled with Intel® MPI, and utilizing standard Fluent runtime options to access
TMI, Fluent is ready and proven for out-of-the-box performance on Intel OPA-
ready clusters.
Technical Computing
Up to 55% better
1 - Testing conducted on ISV* software on 2S Intel® Xeon® Processor E5-2697 v4 comparing Intel® OPA to FDR InfiniBand* fabric. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Up to 55% performance advantage with Intel® OPA
compared to FDR fabric on a 32 node cluster Workload: 12 million cell combustor model, part of the Fluent
benchmarking suite. Fluent 17.0

0
1
ANSYS*
CFX* 17 - Computational Fluid Dynamics
“Hardware and software improvements should go hand in hand. The latest
combination of ANSYS CFX 17.0 and the Intel® Xeon® processor E5-2600 v4
product family is a clearly testament of significant performance gains achieved
for customers who wants to increase their engineering productivity.”
Dr. Wim Slagter – Director of HPC and Cloud Marketing, ANSYS
14
 The transition from CFX15 on the Intel® Xeon® processor E5-2697 v3 to the
latest CFX17 and Intel® Xeon® processor E5-2697 v4 produces up to 1.61X
higher performance for solving a computational fluid dynamics workload1
 For end-users, this means faster turnaround or solving larger tasks with the
same resources along with lower TCO.
Up to 61%
faster
1 - Testing conducted on ANSYS CFX* comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Large tasks completed quicker with the latest software
and hardware Workload: Sysbench OLTP
.
ANSYS CFX 15 increased performance by up to 1.61X
with ANSYS CFX 17 and the 2S Intel® Xeon® processor
E5-2697 v4
www.ansys.com

0
1
S&I HiFUN* reduced analysis time by up to 1.44X
with the 2S Intel® Xeon® processor E5-2697 v4
S&I Engineering Solutions Pvt. Ltd.*
S&I High Resolution Flow Solver on Unstructured Meshes* (HiFUN)
“It is exciting to see the availability of a larger cache in the Intel® Xeon®
processor E5-2697 v4 narrowing the gap between processor and memory
access speeds, thereby improving the single process performance of HiFUN*.
And the higher core-density per processor means compact parallel cluster and
improved intra-node parallel performance. These factors add up to increase
productivity for our clients.”
Nikhil Vijay Shende - Director, SandI Engineering Solutions
.
15
 The Intel® Xeon® processor E5-2697 v4 reduced HiFUN* Computational Fluid
Dynamics analysis time up to 1.44X faster1; increased productivity for
companies
 The Intel® Xeon® processor E5-2697 v4 larger cache & cores paired with a
highly scalable algorithm allows better utilization of computational resources,
and significantly improved intra-node scalability and runtimes
Up to 44%
faster
1 - Testing conducted on HiFUN* comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by S&I and Intel. For complete testing configuration details, SEE SLIDE 31. Software and workloads used in performance
tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those
factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete
information visit http://www.intel.com/performance.
Boost your CFD performance with HiFUN fluid flow analysis
on Intel® Xeon® processor E5-2697 v4 by up to 44%
Workload: Aerospace CFD
http://sandi.co.in/

0
1
Simulia Abaqus/Explicit increased performance by up
to 1.37X with the 2S Intel® Xeon® processor
E5-2697 v4
Simulia*
Abaqus/Explicit - Machine Intelligence* for the Enterprise
“Computational Engineering and Biology are two of the most compute-intensive
domains bottlenecking businesses today. The over 35% performance
improvements we’ve seen with the Intel® Xeon® processor E5-2697 v4 can directly
translate into better products and reduced time to market for our customers. And
with Intel® AVX2, we’ve seen an additional performance boost. In the future,
performance improvements will be measured in number of lives saved.”
Steve Levine - PhD. Executive Director, The Living Heart Project
16
www.3ds.com/products-services/simulia/
 End-Users can benefit from this application by getting a lower TCO and faster
time to analysis, up to 1.37X faster1.
 General improvements: The Intel® Xeon® processor E5-2697 v4, with higher
peak floating-point performance and increased DRAM bandwidth, allows better
utilization of computational resources and significantly improved runtimes.
Up to
37%
faster
1 - Testing conducted on ISV* software comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by ISV. For complete testing configuration details, SEE SLIDE 31.
Leading auto manufacturers go to market faster
Workload: e5 benchmark (blast loaded plate)
Normalizedperformance
Intel® Xeon® + Intel® AVX2

0
1
Up to 32%
faster
LSTC LS-DYNA increased performance by up to 1.32X
Livermore Software Tech Corp*
LS-DYNA*
“We are excited about LS-DYNA performance on the new Intel® Xeon® processor
E5-2697 v4. On the Explicit workload, our benchmark testing showed up to a
32% speed up in run times, leading to faster and more productive results for our
LS-DYNA users. This performance will accelerate crash results in the automotive
design phase, reducing time to market.”1
Nathan A. Hallquist – Systems Software Specialist, LSTC
17
 Intel® AVX2, Intel® Fast Memory Access (Intel® FMA), and better memory
bandwidth are delivering significant speed up in element processing and
contact algorithms which are very floating point intensive.
 LS-DYNA is the leading product in the crash simulation market. It is used by the
automobile, aerospace, construction, military, manufacturing, and
bioengineering industries in worldwide.
Technical Computing
Accelerated crash results in the design phase reduces
time-to-market for LS-DYNA users Workload: Topcrunch.org 3-cars model crash simulation.
www.lstc.com
Intel® Xeon® + Intel® AVX2 + Intel® FMA

26570
14047
7588
4093
2736
0
5000
10000
15000
20000
25000
1 2 4 8 16
Elapsedtime,seconds-Lowerisbetter
Nodes
LSTC LS-DYNA MPP performance - Effect of
increasing core count for an Intel® Xeon® processor
E5-2690 v4 cluster
Livermore Software Tech Corp*
LS-DYNA*
“We are excited about LS-DYNA performance on the new Intel® Xeon® processor
E5-2600 v4 product family. Our benchmark testing showed a significant speed up
in run times, leading to faster and more productive results for LS-DYNA users.
This performance will accelerate crash results in the automotive design phase,
reducing time to market.”1
Nathan A. Hallquist – Systems Software Specialist, LSTC
18
 Intel® AVX2, Intel® Fast Memory Access (Intel® FMA), and better memory
bandwidth are delivering significant speed up in element processing and
contact algorithms which are very floating point intensive.
 LS-DYNA is the leading product in the crash simulation market. It is used by the
automobile, aerospace, construction, military, manufacturing, and
bioengineering industries in worldwide.
1 - Testing conducted on LS-DYNA* software on 2S Intel® Xeon® Processor E5-2690 v4 16-node cluster. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Accelerated crash results in the design phase reduces
time-to-market for LS-DYNA users Workload: Topcrunch.org car2car model crash simulation.
www.lstc.com
Cluster Result!
Intel® Xeon® + Intel® AVX2 +
Intel® FMA

0
1
Paradigm EarthStudy 360 increased performance by
up to 1.43X with the 2S Intel® Xeon® processor
E5-2699 v41
Paradigm®
EarthStudy 360® - Full-azimuth angle domain seismic imaging
“Our continued investment in the optimization of the EarthStudy 360® seismic
imaging software, benefitting from the Intel® Compilers and the Intel® MKL library,
enables our customers to take immediate advantage of this latest generation of
Intel® Xeon® processors.”
Duane Dopkin - Executive Vice President of Geoscience
19
 EarthStudy 360® is an HPC solution that maximizes the information that can be
extracted from recorded seismic data by decomposing that data into full-
azimuth, angle-dependent reflectivities and directional (dip and azimuth) data
components. These components can be combined to produce improved
seismic images, wave propagation models and subsurface velocity models,
providing a deeper insight into the subsurface.
 Customer benefits: Geophysicists can choose to apply the scalable performance
improvements to produce higher resolution subsurface images or to improve
existing workload throughput.
Technical Computing - Geoscience
1 - Testing conducted on Paradigm software comparing 2S Intel® Xeon® Processor E5-2697 v4 and 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Paradigm EarthStudy 360® benefits from multicore code
enablement to take full advantage of the latest generation of Intel
HPC servers!
Up to
43%
more
www.pdgm.com
Workload: Paradigm EPOS_geodepth - migration time
Up to
25%
more
Intel® Xeon® + Intel® MKL

0
1
iconCFD increased performance by up to 1.3X with
the 2S Intel® Xeon® processor E5-2699 v4
ICON Technology & Process Consulting*
Numerical Simulation in Fluid Dynamics
“The increased number of cores and increased memory bandwidth compared to
the previous generation have shown up to 30% performance gain on iconCFD
solvers.”1
Jacques Papper – Technical Director, ICON
20
www.iconcfd.com
 Additional cores offer increased parallelization and faster results per node
 Users will usually see a significant reduction in simulation runtimes due to the
additional cores and larger memory bandwidth
 General improvements: The Intel® Xeon® processor E5-2699 v4 increased
memory bandwidth, allows better utilization of computational resources, and
significantly improved runtimes
Up to 30%
faster
ICON and Intel work together to drive down engineering
analysis turnaround time Workload: Automotive Shape Optimization

0
1
Autodesk vRED improved performance by up to 1.28X
Autodesk*
vRED*
“Autodesk vRED Professional 2017 (v9.0) saw a significant performance increase
for 3D visualization and virtual prototyping, up to 28%, with the Intel® Xeon®
processor E5-2699 v4 compared to the previous generation processor. This
reduces the time-to-market for vehicle creation by major auto manufactures and
is a great benefit for our customers.”1
Michael Russell – Automotive Business Line Manager, Autodesk
21
www.autodesk.com
 Autodesk vRED Professional 2017 (v9.0) 3D visualization and virtual prototyping
reduced rendering time by up to 1.28X
 Autodesk vRED is used by industry-leading automotive manufacturers and the
performance increase realized by the Intel® Xeon® processor E5-2699 v4 is a
meaningful benefit
 The new processor has more cores, more cache and supports faster memory
speeds which reduces overall processing time compared to the previous
generation processor
Up to 28%
faster
1 - Testing conducted on Autodesk vRED* software comparing 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
Reduces the time-to-market for vehicle creation Workload: vRED Professional 2017 v9.0 geomean.

0
1
Software Cradle scSTREAM increased performance by
up to 1.27X with the 2S Intel® Xeon® processor
E5-2697 v4
Software Cradle Co., Ltd.
scSTREAM*
“scSTREAM powered by the Intel® Xeon® processor E5-2697 v4 showed a speed-
up by a factor of 1.27X compared to the previous generation processor. This
power is available for everyone and no doubt expands the possibility for compute
simulation more and more. It is our pleasure to be able to contribute to the
speed-up of our customers' product development through scSCTREAM.
Hiroyuki Kuroishi – Deputy General Manager, Software Engineering Dept.,
Software Cradle Co., Ltd.
22
 The Intel® Xeon® processor E5-2697 v4 reduced scSTREAM processing time
from 164 to 129 seconds, up to 1.27X faster.
 scSTREAM is an industry-leading structured mesh computational thermal fluid
(CFD) analysis system for use with systems such as heating, ventilation, air
conditioning, electrical & electronic equipment and environment engineering.
 The Intel® Xeon® processor E5-2697 v4 increased memory bandwidth allows
better utilization of computational resources, and significantly improved intra-
node scalability and runtimes.
Up to 27%
faster
1 - Testing conducted on ISV* software comparing 2S Intel® Xeon® Processor E5-2697 v4 to 2S Intel® Xeon® Processor E5-2697 v3. Testing done by Software Cradle and Intel. For complete testing configuration details, SEE SLIDE 31.
Boost your CFD performance with scSTREAM on Intel®
Xeon® processor E5-2697 v4 Workload: Aero_10M
Normalizedperformance
www.cradle-cfd.com

0
1
Up to 27%
faster
STAR-CCM+ increased performance by up to 1.27X
CD-adapco*
STAR-CCM+ Multi-Disciplinary Engineering Analysis Tool*
“By working closely with Intel, we can ensure that STAR-CCM+ provides optimal
performance on the very latest Intel® Xeon® processor technologies.”
Keith Foston – Product Manager, CD-adapco
23
 The STAR-CCM+ multi-disciplinary engineering analysis tool benefits from the
increased memory bandwidth and the improved computational resources of the
Intel® Xeon® processor E5-2699 v4, significantly improving run times.
 Users will usually see significant reduction in simulation runtimes due to the
additional cores and larger memory bandwidth.
 The tested system with two Intel® Xeon® processor E5-2699 v4 generated up to
1.27X speedup1 for STAR-CCM+ compared to a system based on the previous
generation processor. This reduces the simulation/prototyping time and
reduces the manufacturing time-to-market.
CD-adapco and Intel work together to drive down
engineering analysis turnaround time
Workload: STAR-CCM+ 10.06.010 simulation run time.
www.cd-adapco.com/

0
1
Up to 25%
faster
Altair RADIOSS increased performance by up to
1.25X with the 2S Intel® Xeon® processor E5-2699 v4
Altair*
RADIOSS*
“The Intel® Xeon® processor E5-2600 v4 product family offers amazing
computing power for running Altair HyperWorks* solvers and especially RADIOSS.
Altair is very pleased it is now available to our customers.”
Eric Lequiniou – HPC Director, Altair
24
 The increased memory bandwidth of the Intel® Xeon® E5-2699 v4 allows better
utilization of its computational resources, significantly improving run times.
 In addition to the larger memory bandwidth, users will see a reduction in
simulation runtimes due to the additional cores.
 System with two E5-2699V4 processors brings up to 1.27x speedup compared
to the previous generation processor, diminishing the simulation/prototyping
time and reducing the time-to-market for manufacturers.
1 - Testing conducted on RADIOSS* software comparing 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete testing configuration details, SEE SLIDE 31.
More memory bandwidth and more cores means faster
runtimes and quicker time-to-market scenarios
Workload: Altair RADIOSS - Neon 8ms total time.
www.altair.com/

0
1
Up to 20%
more
Neusoft CT increased transactions/second by up to
1.2X with the 2S Intel® Xeon® processor E5-2699 v4
Neusoft*
CT*
“Based on the Intel® Xeon® processor E5-2699 v4, Neusoft CT showed a great
performance boost compared with the previous generation processor. This will
give our Neusoft CT customers a better user experience and improve the clinical
efficiency. It is one of our preferred platforms.”1
Shanshan Lou – CT Physics & Image Reconstruction Manager
25
 The Intel® Xeon® processor E5-2699 v4 improved Neusoft CT transactions per
second from 6.85 to 8.24, up to 1.2X more.
 Neusoft is the leading software solution and service provider in China. Neusoft
CT (X-ray computed tomography) is its key digital health solution focusing on
medical image processing, i.e. computing the axial images of the target using
specific complicated algorithms.
 The Intel® Xeon® processor E5-2699 v4 computing capability helps Neusoft CT
to finish CT image processing faster.
Technical Computing - Healthcare
1 - Testing conducted on ISV* software comparing 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2699 v3. Testing done by Neusoft and Intel. For complete testing configuration details, SEE SLIDE 31.
Improved clinical efficiency helps deliver patient services
faster
Workload: Transactions per second.
http://medical.neusoft.com

Software Performance Optimization
First Institute of Oceanography Parallel Ocean Program* (POP)
““As a key HPC application of FIO-ESM, POP has high requirement for performance. Great to see a performance
improvement on the Intel® Xeon® Processor E5-2699 v4 compared to previous generation processor, and the new
Intel® AVX2 also contributes to the performance gain. This new platform helps our application to deliver better
service to its endusers.”1
Zhenya Song – Associate Professor
1,2,3 - Testing conducted on ISV applications comparing 2S Intel® Xeon® Processor E5-2699 v4 to 2S Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete configuration details, SEE SLIDE 31.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software,
operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product
when combined with other products. For more complete information visit http://www.intel.com/performance.
www.fio.org.cn
PerkinElmer Acapella*
PerkinElmer Acapella showed performance improvement with the Intel® Xeon® processor E-2699 v4
compared to the previous generation processor.2
www.perkinelmer.com
Dassault Systemes BIOVIA*
Dassault Systemes BIOVIA showed performance improvement with the Intel® Xeon® processor E-
2699 v4 compared to the previous generation processor. Powered by the 3DEXPERIENCE* platform,
BIOVIA provides global, collaborative product lifecycle experiences to transform scientific innovation.3 www.3ds.com/products-services/biovia
Leading Solutions Providers Rely on Intel® Xeon® Processors to Deliver Results!

2x2andBettertogetherstories
27

ReliableandAccurateFluidDynamicsSolutions
withANSYS*CFXandIntel®Xeon®ProcessorE5-2697v4
28
Solving Fluid Flow problems faster, more reliably and accurately
2014 2016
Software Upgrade
ANSYS CFX v17
Enhanced features for:
 3-D Blade Design Tool
 2-D Through-Flow Analysis
 Advanced Meshing
Hardware Upgrade
Intel® Xeon® processor E5-2697 v4
 Increased parallelism - up to 22 cores, up to 2-sockets per server
natively
 Up to 1.5TB of DDR4 memory supported per socket1
 Reduce transaction bottlenecks with newer
Intel® SSD Data Center Series
Software
Baseline
 ANSYS CFX
v15
Better Together
 Up to 1.6X more simulations per cluster per day2
 Intel® and ANSYS* CFX enables faster turnaround
or solving larger tasks with the same resources
Software and workloads used in performance tests may have been optimized for performance
only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions.
Any change to any of those factors may cause the results to vary. You should consult other
information and performance tests to assist you in fully evaluating your contemplated
purchases, including the performance of that product when combined with other products.
1 Up to 3TB of memory supported per 2-socket server. Each socket supports 4 memory
channels @ 3 DIMMs per channel = 12 DIMM slots per socket. Using 128GB memory DIMMS =
1.5TB per socket = 3 TB of memory per 2P server.
2 Up to 1.6x more simulations per cluster per day comparing baseline Intel® Server platform
with two Intel® Xeon® processor E5-2697 v3, 128GB Memory (to an Intel® Server platform with
two Intel® Xeon® processor E5-2697 v4, 128GB Memory (source: ANSYS* internal testing).
For more information, visit intel.com/performance
Hardware
Baseline
 Intel® Xeon®
processor
E5-2697 v3
*Other names and brands may be claimed as the property of others.
Benchmark : Sysbench OLTP
+

92.94
57.44
0
10
20
30
40
50
60
70
80
90
100
E5-2697 v3 + ANSYS* CFX v15 E5-2697 v4 + ANSYS* CFX v17
GeoTime
ReliableandAccurateFluidDynamicsSolutionswith
ANSYS*CFXandIntel®Xeon®ProcessorE5-2697v4
29
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to
vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product
when combined with other products. Configuration details on next slide.
For more complete information visit http://www.intel.com/performance.
Lower is better
Up to 1.6X more
Simulations per
cluster
per day
+

ConfigurationDetails
30
Processor
(14 cores, 28 threads)
(18 Cores, 36 Threads)
Memory 128GB (8x 16GB 2133)
OS Distribution Red Hat* Enterprise Linux 6.4
ANSYS* CFX Version v15 v17
Geo time 92.94 57.44
Source ANSYS* Internal Testing
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and
MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results
to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that
product when combined with other products.
For more complete information visit http://www.intel.com/performance.
+Reliable and Accurate Fluid Dynamics Solutions with ANSYS* CFX and Intel® Xeon®
Processor E5-2697 v4

ProofpointConfigurationDetails:
LAMMPS*: LAMMPS Stillinger-Weber Silicon Benchmark – 512K atoms workload. Testing by Intel, 3/21/2016
BASELINE: Intel® Xeon®Processor E5-2697 v3 on Grantley-EP (Wellsburg), with 64 GB Total Memory, 8 slots / 8 GB / 2133MT/s / DDR4 RDIMM, HT on, on Red Hat EnterpriseLinux* 6.5 kernel
2.6.32-431, LAMMPS: (25 Sep 2015+ LOCAL),compilers_and_libraries_2016.0.109,mpi5.1.2.RC1, Request Number: 2196
NEW: Intel® Xeon®Processor E5-2697 v4 on Grantley-EP (Wellsburg), with 64 GB Total Memory, 8 slots / 8 GB / 2400MT/s / DDR4 RDIMM, HT on, on Red Hat EnterpriseLinux* 6.5 kernel
2.6.32-431, LAMMPS: (25 Sep 2015+ LOCAL),compilers_and_libraries_2016.0.109,mpi5.1.2.RC1, Request Number: 2196
Intes PERMAS*: Total processing time workload. Testing by Intel, 2/16/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 256 GB Total Memory, 16 slots / 16 GB / 1866 MT/s / DDR4 RDIMM, 4x Seagate R10K 1TB, turbo
on, on Red Hat Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 1939
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 256 GB Total Memory, 16 slots / 16 GB / 2133 MT/s / DDR4 RDIMM, 4x Intel SSD P3600 1.6TB, turbo on,
on Red Hat Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 1939
Ansys Mechanical* v17.0: V17SP-5 - Core Solver Rating. Testing done by Intel, 2/23/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2133 MT/s / DDR4 RDIMM / Home Snoop (default), IEEL
Lustre connected via 1 GE ethernet (cluster storge device), HT and turbo on, on Red Hat Enterprise Linux* 6.4 kernel 2.6.32-358, Intel MPI 5.0.3 (default). Data Source: Request Number: 1997
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM / Home Snoop (default), IEEL Lustre
connected via 1 GbE ethernet (cluster storge device), HT and turbo on, on Red Hat Enterprise Linux* 6.4 kernel 2.6.32-358, Intel MPI 5.0.3 (default). Data Source: Request Number: 1997
ANSYS Fluent 17.0: Exhaust_system_33m, a 33 million cell vehicle exhaust system model, part of the Fluent benchmarking suite. Testing by Intel, 3/10/2016.
BASELINE: Intel® Xeon® processor E5-2697 v4, 2.3 GHz, 36 cores, Grantley-EP (Wellsburg),128GB DDR4/2400 DIMM, Mellanox FDR HCA, Lustre cluster file system used, 36 cores per cluster
node used (fully subscribed), Intel® MPI 5.0.3 as distributed with ANSYS Fluent, home snoop, HT and turbo on, Red Hat Enterprise Linux* 6.4kernel 2.6.32-358, Request Number: 1907
NEW: Intel® Xeon® processor E5-2697 v4, 2.3 GHz, 36 cores, Grantley-EP (Wellsburg),128GB DDR4/2400 DIMM, Intel® OPA® interconnect, Lustre cluster file system used, 36 cores per cluster
ANSYS Fluent 17.0: Combustor_12m workload; Intel OPA vs. FDR. Testing by Intel, 3/10/2016.
BASELINE: Intel® Xeon® processor E5-2697 v4, 2.3 GHz, 36 cores, Grantley-EP (Wellsburg),128GB DDR4/2400 DIMM, Mellanox FDR HCA, Lustre cluster file system used, 36 cores per cluster
NEW: Intel® Xeon® processor E5-2697 v4, 2.3 GHz, 36 cores, Grantley-EP (Wellsburg),128GB DDR4/2400 DIMM, Intel® OPA® interconnect, Lustre cluster file system used, 36 cores per cluster
ANSYS CFX* 17: Sysbench OLTP workload, CFX 15 on E5-2697 v3 compared to CFX 17 on E5-2697 v4. Testing by ANSYS, February 15, 2016.
BASELINE: Red Hat Enterprise Linux Server release 6.4, 2 Intel® Xeon® processors E5-2697 v3, 2.6GHz, 14 cores, on Grantley-EP (Wellsburg), 64GB DDR3/2133, regular DIMM, Request
Number: 1906
NEW: Red Hat Enterprise Linux Server release 6.4, 2 Intel® Xeon® processors E5-2697 v4, 2.3GHz, 18 cores, 64GB DDR4/2133, regular DIMM, Request Number: 1906
32

S&I HiFUN*: Aerospace CFD workload. Testing by SandI and Intel, 2/16/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 32 GB Total Memory, 4 slots / 8 GB / 2133 MT/s / DDR4 RDIMM / 32 GB, HT and turbo on, on Red
Hat Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 1960
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg) with 32 GB Total Memory, 4 slots / 8 GB / 2133 MT/s / DDR4 RDIMM / 32 GB, HT and turbo on, on Red Hat
Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 196
Simulia Abaqus v2016.0: e5 benchmark (blast loaded plate). Testing by Intel, 1/22/2016
BASELINE: Intel® Xeon® Processor E5-2697 v3, (35M Cache, 2.60 GHz) Grantley-EP (Wellsburg), 128 GB Total Memory, 16 slots / 8 GB / 2133 MT/s /DDR4 RDIMM, Intel SSD DC, turbo on, on
Red Hat Enterprise Linux* 6.4kernel 2.6.32-358, Request Number: 1979
NEW: Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg), 64 GB Total Memory, 8 slots / 8 GB / 2400 MT/s /DDR4 RDIMM, Intel SSD DC, turbo on, on Red Hat Enterprise Linux*
6.4kernel 2.6.32-358, Request Number: 1979
LSTC LS-Dyna*: 3-cars model crash simulation workload. Testing by Intel, 2/22/2016
BASELINE: Intel® Xeon® Processor E5-2697 v3 (35M Cache, 2.60 GHz) Grantley-EP (Wellsburg), 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s /DDR4 RDIMM, HT and turbo on, on Red Hat
Enterprise Linux* 6.4 kernel 2.6.32-358, Data Source: Request Number: 1941
NEW: Intel® Xeon® Processor E5-2697 v4 (45M Cache, 2.30 GHz) Grantley-EP (Wellsburg), 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s /DDR4 RDIMM, 1 SSD, turbo on, on Red Hat
Enterprise Linux* 6.4 kernel 2.6.32-358, Data Source: Request Number: 1941
LSTC LS-Dyna*: LS-DYNA R7.1.2, Topcrunch.org car2car model crash simulation core scaling workload. Testing by Intel, 2/22/2016
SYSTEM TESTED: Intel® Xeon® Processor E5-2690 v4 Grantley-EP (Wellsburg), 128GB total memory, 8 slots / 8 GB / 2400 MT/s / DDR4 RDIMM, turbo on, on Red Hat Enterprise Linux* 6.5
kernel 3.10.0, Request Number: 1992
Paradigm EPOS_GeoDepth*: Migration time workload. Testing done by Turbo Systems and Intel, 2/21/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, HT and turbo on, on Red Hat
NEXT GEN: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, HT and turbo on, on Red Hat
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, HT and turbo on, on Red Hat
33

iconCFD*: Camaro Shape Optimization workload. Testing by Intel, 2/16/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, HT and turbo on, on Red Hat
Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1936
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, HT and turbo on, on Red Hat
Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1936
Autodesk vRED* Professional v9.0: 3D visualization and virtual prototyping using Autodesk VRED Professional v9.0 workload. Testing by Intel, 2/24/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 32 GB Total Memory, 4 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, HT and turbo on, on Windows 7
Professional 64-bit. Data Source: Request Number: 1908
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 32 GB Total Memory, 4 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, HT and turbo on, on Windows 7
Professional 64-bit. Data Source: Request Number: 1908
Software scSTREAM: Aero_10M workload. Testing by Software Cradle and Intel, 2/11/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, turbo on, on RHEL release 6.6
(updated kernel) 3.10.0-327.0.el6.x86_64.knl1. Data Source: Request Number: 1963
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, turbo on, on RHEL release 6.6
(updated kernel) 3.10.0-327.0.el6.x86_64.knl1. Data Source: Request Number: 1963
CD-Adapco Star-CCM+: STAR-CCM+ 10.06.010 simulation run time. Testing by Intel, 2/16/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, SSD SSDSC2BA80, turbo on, on
Red Hat Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1977
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, SSD SSDSC2BA80, turbo on, on Red
Hat Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1977
Altair RADIOSS*: Neon 8ms total time workload. Testing by Intel, 2/16/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, SSD SSDSC2BA80, CoD = enable,
HT and turbo on, on Red Hat Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1903
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, SSD SSDSC2BA80, CoD = enable, HT
and turbo on, on Red Hat Enterprise Linux* 7.2-kernel 3.10.0-327. Data Source: Request Number: 1903
34

Neusoft CT: Transactions per second workload. Testing done by Neusoft and Intel, 1/28/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, HDD: 1TB SATA ST9500424AS,
NIC: Intel I350, HT and turbo on Windows Server* 2012 R2 Standard using Visual Studio 2012, Intel Parallel Studio XE 2013. Data Source: Request Number: 1950
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4 RDIMM, HDD: 1TB SATA ST9500424AS, NIC:
Intel I350, HT and turbo on Windows Server* 2012 R2 Standard using Visual Studio 2012, Intel Parallel Studio XE 2013. Data Source: Request Number: 1950
First Institute of Oceanography POP: Parallel Ocean Program version 2.0 workload. Testing by Intel, 1/28/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2133 MT/s / DDR4 RDIMM, BIOS version:
SE5C610.86B.01.01.0008.021120151325, turbo on, on Red Hat Enterprise Linux* 6.5 kernel 2.6.32-431 using AVX 2.0. Data Source: Request Number: 1924
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM, BIOS version:
GRRFSDP1.86B.0271.R00.1510301446, turbo on, on CentOS* 2.6.32-573.el6.x86_64 CentOS release 6.7using using AVX 2.0. Data Source: Request Number: 1924
PerkinElmer Acapella: Medical imaging workload. Testing by Intel, 1/21/2016
BASELINE: Intel® Xeon® Processor E5-2699 v3 on Grantley-EP (Wellsburg), with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4RDIMM / NUMA off, HT and turbo on, on Red Hat
Enterprise Linux* 7.1 kernel3.10.0-229, Request Number: 1954
NEW: Intel® Xeon® Processor E5-2699 v4 on Grantley-EP (Wellsburg), with 64 GB Total Memory, 8 slots / 8 GB / 2133 MT/s / DDR4RDIMM / NUMA off, HT and turbo on, on Red Hat Enterprise
Linux* 6.4 kernel2.6.32-358, Request Number: 1954
Dassault Systemes BIOVIA*: CASTEP/Forcite workload. Testing by Intel, 2/23/2016
BASELINE: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v3 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2133 MT/s / DDR4 RDIMM / Dual rank, 1 HDD, 1TB, SATA,
turbo on, on Red Hat Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 1998
NEW: 1-Node, 2 x Intel® Xeon® Processor E5-2697 v4 on Grantley-EP (Wellsburg) with 128 GB Total Memory, 8 slots / 16 GB / 2400 MT/s / DDR4 RDIMM / Dual rank, 1 HDD, 1TB, SATA, turbo
on, on Red Hat Enterprise Linux* 7.1 kernel 3.10.0-229. Data Source: Request Number: 1998
35

LegalNoticesandDisclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation.
Learn more at intel.com, or from the OEM or retailer.
No computer system can be absolutely secure.
Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will
affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete
information about performance and benchmark results, visit http://www.intel.com/performance.
Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and
configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction.
This document contains information on products, services and/or processes in development. All information provided here is subject to change
without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Statements in this document that refer to Intel’s plans and expectations for the quarter, the year, and the future, are forward-looking statements
that involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel’s results and plans is included in
Intel’s SEC filings, including the annual report on Form 10-K.
Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web
site and confirm whether referenced data are accurate.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance
tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any
change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully
evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete
information visit http://www.intel.com/performance.
Intel, the Intel logo and others are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed
as the property of others.
© 2016 Intel Corporation.
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