Intel® Xeon® Processor E5-2600 v3 Product Family Application Showcase - Technical Computing

Intel Confidential — Do Not Forward
Intel® Xeon® Processor E5-2600 v3 Product Family
The Fast Lane to Better Performance†
Application Showcase:
Technical Computing
November 2015
How fast do you want to go?
† Better Performance is demonstrated through proof points in this presentation.
New
Proof
Points

System Visibility for
Monitoring and Control
The New
Foundation for
Software-Defined
Infrastructure
2
Common Architecture for
Compute, Storage and Network
Efficient, High Performance
Building Blocks
The Intel® Xeon® processor E5-2600 v3 product family is at
the heart of your agile, efficient data center, meeting your
needs for compute, storage, and network.
These energy-efficient marvels are designed to deliver the
best combination of performance, built-in capabilities, and
cost-effectiveness and are designed with technical
computing, cloud deployments, intelligent storage, design
automation and data analytics in mind.
Safeguard your data and infrastructure with foundational
technology for greater security. Break challenging data
management performance bottlenecks with 40 gigabit Intel®
Ethernet, DDR4 support and innovative storage features that
make Intel-powered platforms the smart choice for a
software defined world.
You only have to remember one thing: It’s what’s inside that
counts.
Copyright © 2015 Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others.

 Up to Up to 6X increase in
performance with Intel® AVX25
 Up to 3X increase in virtual
machine density6,7
 Up to 3X increase in memory
bandwidth with DDR48
3
Delivering Leadership Performance
27 New World Records1
!
 Up to 3X performance
improvement for efficient, high
performance building blocks3
 Up to 6X throughput
with the latest Intel® DC SSD4
 Up to 40GbE to improve
network virtualization
The World’s Most Energy Efficient Server2
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to
vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance Intel does not control or audit third-party benchmark data or the
web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate.
*Other names and brands may be claimed as the property of others.
1. Twenty-seven performance world records based on two-socket configurations. Source as of September 8, 2014. Full details available at: http://www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-v3/xeon-e5-2600-v3-summary.html
2. Comparison based on SPECpower_ssj2008results published as of August 26, 2014. New configuration: Sugon I620-G20platform with two Intel Xeon Processor E5-2699v3, 8x16GBDDR4-2133 DR-RDIMM, Microsoft Windows Server 2008 R2, IBM J9 VM, 10,599overall ssj_ops/watt. Source
Other names and brands may be claimed as the property of others.
3. Source as of September 8, 2014. New configuration: Hewlett-Packard Company HP ProLiant ML350Gen9 platform with two Intel® Xeon® Processor E5-2699 v3, Oracle Java Standard Edition 8 update 11, 190,674SPECjbb2013-MultiJVM max-jOPS, 47,139SPECjbb2013-MultiJVM critical-jOPS. Source. Baseline: Cisco Systems Cisco UCS
C240 M3 platform with two Intel® Xeon® Processor E5-2697v2, Oracle Java Standard Edition 7 update 45, 63,079 SPECjbb2013-MultiJVMmax-jOPS , 23,797SPECjbb2013-MultiJVM critical-jOPS. Source.
4. Comparisons based by Intel on publicly available specification sheet data &/or white papers
5. Source as of August 2015on Linpack*. Supermicro* X8DTN+ with two Intel® Xeon® processor X5690, RHEL* 6.1, 12x4GB DDR3-1333, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, SMP Linpack 10.3.5. Intel internal measurements TR#1236. Score: 159.36 GFlops. New configuration: Intel® Server System
R2208WTTYS with two Intel® Xeon® Processor E5-2699 v3, Intel® HT Technology disabled, Intel® Turbo Boost Technology enabled, 8x16GB DDR4-2133, RHEL* 6.4, Intel® MKL 11.1.1. Intel internal measurements TR#3034. Score: 1,012 GFlops.
6. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate
and reflect performance of systems available for purchase.
7. Source as of September 8, 2014. Baseline: Fujitsu PRIMENERGY RX300 S6 with two Intel® Xeon® Processor X5690, VMware ESXi 4.1 U1, VMmark* v2.1.1 score: 7.59 @ 7 tiles, source. New Configuration: Fujitsu PRIMERGY RX2540 M1platform with two Intel® Xeon® Processor E5-2699v3, VMware ESXi 5.5.0 U2, VMmark v2.5.2 score:
26.48@ 22 tiles, source. VMware® VMmark® is a product of VMware, Inc.
8. Source as of August 2015TR#3044 on STREAM (triad): Supermicro X8DTN+ platform with two Intel® Xeon® Processor X5680, 18x8GBDDR3-800 score: 26.5 GB/sec. New Configuration: Intel® Server System R2208WTTYSwith two Intel® Xeon® Processor E5-2699v3, 24x16GB DDR4-2133@ 1600MHz DR-RDIMM, score: 85.2 GB/sec.

Common Architecture Enhancements
1st DDR4 Memory
Implementation
Intel® Advanced
Vector Extensions 2.0
Intel® Data Direct I/O
Intel® Intelligent
Storage Acceleration
Library
Intel® QuickAssist
Technology
Intel® Data Plane
Development Kit v1.7
Compute Storage Network
4

Intel Confidential – NDA Only *Other names and brands may be claimed as the property of others.
Up to
Faster1
Technical Computing
NO COMPROMISE PERFORMANCE ARCHITECTURE
Accelerate discovery and innovation in manufacturing, life sciences and healthcare,
energy and media/entertainment. The Intel® Xeon® processor E5-2600 v3 product
family delivers major gains in performance, density, and energy-efficiency, to support
larger models and faster iterations, all at lower cost. When paired with the Intel® Solid-
State Drive Data Center Series, meaningful performance gains are realized for these
compute-intensive applications. Whether it’s advanced simulation and modeling
applications that transforms the way companies create and test new product designs or
faster imaging for more efficient drug discovery and deeper genomic analysis by health
care organizations and bio-medical research teams, a new generation of Intel products
is helping to increase the speed and performance of vital applications. See the following
slides for details. See the following slides to learn more and to see more impressive
results.
5
4.23X
Maximize software investments
with the latest Intel hardware
1. Demonstrated through the MSC* proof point in this presentation.
Go to www.intel.com/XeonE5softwaresolutions to see each
Application Showcase!
6 Application Showcases!
Over 60 proof points
and solutions!
with Intel® Xeon® Processor E5-2600 v3
product family and Intel® SSD DC P3700

Intel Confidential – NDA Only *Other names and brands may be claimed as the property of others.
• Eleven proof points are Intel® Better Together results.1
• Some show how software and Intel products work better together, such
as the Intel® Xeon® processor E5-2600 v3 product family with the Intel®
Solid-State Drive Data Center P3700 Series and with Intel® Software
Development Tools.2
• Some show impressive out-of-the-box processor improvement
compared to the previous processor generation.3
Look Inside to see how leading software companies generated improved performances and
how other software companies can benefit from Intel products.
1,2,3: Demonstrated through proof points in this presentation.
Proof Points in this Application Showcase:
6

7
Speed Time to Market for High Quality Products
Advanced simulation and modeling applications are transforming the way
companies create and test new product designs. Server platforms based
on the Intel® Xeon® processor E5-2600 v3 product family provide 50
percent more cores and cache and increased processing efficiency for
floating point, vector, and integer calculations. As shown in the following
slides, these advances are helping leading software vendors and their
customers accelerate their workflows so they can get higher quality
products to market faster and at lower cost.
MANUFACTURING

0
1
2
3
4
SOL103 SOL111 AMLS
Intel® Xeon® processor E5-2697 v2 + Intel®
SSD DC S3700
8
MSC Software*
MSC Nastran* SOL103, SOL111, AMLS
Better together with Intel hardware, technology and software!
 Nastran* is a major CAE implicit FEA app and direct sparse solver used
by 900 of the top 1000 manufacturers in the world, including:
 Aerospace & Defense
 Automotive & Transportation
 Heavy Machinery
 Medical Devices
 Oil and Gas
 Nastran performance improved, up to 4.23X1, with:
 Intel® Xeon® processor E5-2697 v3; more memory bandwidth and
more cores.
 Intel® AVX2 and Intel® FMA; delivers significant factoring speedup2.
 Intel® Solid-State Drive Data Center Family for PCIe* (Intel® SSD DC
P3700 Series); delivers improved I/O performance.
28 Cores, Intel® AVX2, Intel® FMA, Intel® QuickPath
Interconnect, 128GB DDR4, and Intel® SSD DC P3700 Series
helps improve MSC Nastran* performance by up to 323%!
Manufacturing
www.mscsoftware.com
MSC Nastran* SOL103 performance increase with Intel® Xeon®
processor E5-2697 v3 and Intel® SSD DC S3700 and P3700
Up to
323%
faster!
1,2 - Testing conducted on MSC Nastran* SOL103, SOL111, AMLS, comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series.
Testing done by Intel. For complete configuration details, see slide 53.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems,
components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated
purchases, including the performance of that product when combined with other products.
XPerformanceIncrease
Up to
217%
faster!
Up to
121%
faster!
Intel Better Together:
XEON + AVX2 + SSD
N E W

0
1
2
3
SSD DC S3700
9
Dassault Systèmes*
SIMULIA Abaqus*
 Abaqus is a major CAE implicit FEA app and direct sparse solver.
 Most Fortune 500 companies rely on Abaqus* within the SIMULIA Multiphysics
suite* as one of their go-to tools for engineering product development.
Applications of SIMULIA Multiphysics include, thermo-mechanical durability of
automobile engines, fatigue and fracture of composite structures, tire-soil
interaction, inlet manifold thermomechanical durability, and electro-acoustic
cutting of tissue. Performance improved, up to 3.38X1, with:
 Intel® Xeon® processor E5-2697 v3; more memory bandwidth and more cores.
 Intel® Solid-State Drive Data Center Family for PCIe* (Intel® SSD DC P3700
Series); delivers improved I/O performance.
Sophisticated engineering problems solved quickly, with great
detail, and faster than ever!
Manufacturing
 The SIMULIA Abaqus Unified FEA* product suite is used by leading companies to
consolidate their processes and tools, reduce costs and inefficiencies, and gain a
competitive advantage, and it offers powerful and complete solutions for both
routine and sophisticated engineering problems covering a vast spectrum of
industrial applications.
www.3ds.com
SIMULIA Abaqus* performance increase with Intel®
Xeon® processor E5-2697 v3 and Intel® SSD DC
S3700 and P3700
Up to
238%
faster
1,2 - Testing conducted on Dassault Systemes SIMLIA Abaqus* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing done by Intel. For
complete configuration details, see slide 53.
Up to
190%
faster
XEON + AVX2 + SSD
N E W

0
1
2
SSD DC S3700
LS-DYNA* IMPLICIT performance increase with Intel®
Xeon® processor E5-2697 v3, Intel® AVX2, and Intel®
SSD DC P3700
LSTC*
LS-DYNA* IMPLICIT
 LS-DYNA is a major CAE implicit FEA app and direct sparse solver.
 LS-DYNA is a general-purpose finite element program capable of simulating
complex real world problems. It is used by the automobile, aerospace,
construction, military, manufacturing, and bioengineering industries. LS-DYNA is
optimized for shared and distributed memory Unix, Linux, and Windows based,
platforms.
 In a given simulation, any of LS-DYNA's many features can be combined to model a
wide range of physical events. An example of a simulation, which involves a unique
combination of features, is the NASA JPL Mars Pathfinder landing simulation which
simulated the space probe's use of airbags to aid in its landing. LS-DYNA is one of
the most flexible finite element analysis software packages available.
 Performance improved, up to 2.36X1, with:
 Intel® Xeon® processor E5-2697 v3; more memory bandwidth and more cores.
 Intel® Solid-State Drive Data Center Family for PCIe* (Intel® SSD DC P3700
Series); delivers improved I/O performance.
10
Intel® Xeon® processor E5-2697 v3, Intel® AVX2, Intel® FMA, and
Intel® SSD DC provide a significant boost for LS-DYNA*
Manufacturing
Up to
136%
faster!!
www.lstc.com
1,2 - Testing conducted on LSTC LS-DYNA comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing done by Intel. For
XEON + AVX2 + SSD
N E W

COMSOL*
COMSOL MULTIPHYSICS* 4.4; Simulation of stress and load of a wheel
rim
“Once again, it is evident that Intel has released even more revolutionary
technology to the market. As clock speeds plateau, it bodes well for the CAE
industry that Intel invests and develops superior technology, such as the E5-
2600 v3, to support effective and exceptional parallel processing. COMSOL
is a proud partner of Intel and backs its promotion of high-performance
computing both technically and through its informational and outreach
programs.”
Phil Kinnane – Vice President of Business Development, COMSOL
11
Simulation is going parallel and the Intel® Xeon® Processor E5-
2600 v3 product family empowers this!
Manufacturing
 Benchmarks show that the runtimes of COMSOL Multiphysics benefit
greatly from the Intel® Xeon® processor E5-2697 v3.
 Results show improvements up to 2.19X, especially when using
COMSOL’s hybrid parallel approach.
 This new Intel processor generation has the potential to unleash the
power of multicore processing for CAE applications, especially within
mathematical simulations.
http://www.comsol.com/
0
1
2
Intel® Xeon® processor E5-…
Intel® Xeon® processor E5-…
COMSOL Multiphysics* performance increase (579
to 264 seconds processing time) with Intel® Xeon®
processor E5-2697 v3
1 - Testing conducted on COMSOL Multiphysics* 4.4 comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 53.
Up to
119%
faster!
N E W

12
SSG Application Showcase – Data Center Server Demo:
DownUnder GeoSystems*
DownUnder GeoSystems Insight* is optimized with Intel® Software Development Tools for the Intel®
processor Xeon® E5-2600 v3 and Intel® Xeon Phi™ coprocessors, providing oil and gas industry with the
tools and functionality required to perform standard oil and gas workflows more efficiently and to
interactively manipulate and migrate data and to achieve results in minutes that previously took hours or
days1. See the demo here.
N E W
Intel Better Together
Hardware
Intel® Xeon Phi™ coprocessor
Intel® Xeon® E5-2600 v3 processor
Intel® Solid-State Drives
Software
Intel® Solutions for Lustre* software

13
Texas Advanced Computing Center*
This demo presented by the Texas Advanced Computing Center* (TACC) combines CT scan and simulation
data to analyze aquifer permeability in order to protect freshwater supplies in Florida. It runs on Intel®
Xeon® processors, and features visualization techniques made possible by ray tracing kernels. See the
demo at here.
N E W
Hardware
Intel® Xeon® processor E5-2600 v3 processors
Intel® Solid-State Drive Data Center for PCIe*
SMC Cluster
Intel® Xeon® processor E5-2600 v3
Intel® True Scale Fabric Infiniband* switch
Cluster Nodes
Intel® Truescale HCA
Cluster Software
Intel® Parallel Studio XE 2105
Intel SPMD Program Compiler 1.7.0
Intel® True Scale Fabric Host
Software Stack
Intel® MPI Library

14
Fujitsu HPC Gateway*
The Fujitsu HPC Gateway* is an extendable Web desktop that provides easy access to HPC capabilities.
This demo features the Intel® Xeon® processor E5-2600 v3 powering this integrated and intuitive HPC
environment that can be adapted by organizations to meet specific requirements, such as access policies
and licensing. See the demo at here.
N E W
Hardware
Intel® Xeon Phi™ coprocessor 7120P
Intel® True Scale Fabric
Software
Intel® Solutions for Lustre* software

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Elapsed time decrease (2.78 hours to 1.56 hours)
with Intel® Xeon® processor E5-2697 v3, Intel®
AVX2, and Intel® SSD DC P3700
LSTC* - Intel® Better Together
LS-DYNA IMPLICIT HYBRID* R7.1.1 DP - MPP mode, LSTC cylc1e6
benchmark workload
“With the combination of Intel® Xeon® processor E5-2697 v3 and Intel®
Advanced Vector Extensions 2 (Intel® AVX2), Hybrid* users will see a
significant performance boost when running Implicit workloads. In our test
cases, we saw a 78% improvement, delivering results faster for more
efficient product designs.”1
Nathan Hallquist – Senior Developer LSTC
15
 Leading performance with Intel® AVX2 with Fused Multiply Add boost.
Intel® SSD for PCIe* delivers super I/O performance due to low I/O latency
and high I/O bandwidth.2
 Intel® AVX2 delivers significant speedup in factoring and solving FE
assembly equations matrix which are floating point intensive.
 LS-DYNA is a leading product in the Computer-Aided-Engineering market.
It is used by the automobile, aerospace, construction, military,
manufacturing, and bioengineering industries in worldwide.
Intel® AVX2 + Intel® SSD for PCIe* + DDR4 + QPI + 22nm = WOW
Manufacturing
Up to
78%
faster!!
www.lstc.com
1,2 - Testing conducted on LSTC LS-DYAN Hybrid* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing done by
Intel. For complete configuration details, see slide 54.
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Elapsed time decrease (12.56 hours to 8.07 hours)
with Intel® Xeon® processor E5-2697 v3 and Intel®
SSD DC P3700.3
16
LSTC* - Intel® Better Together
LS-DYNA MPP* R7.1.1 SP - MPP mode, LSTC topcrunch benchmark
workload
“We are excited about the LS-DYNA* performance on the new Intel® Xeon®
processor E5-2697 v3. On the Explicit workload, our benchmark testing
showed a 50% speed up in run times, leading to faster and more productive
results for our LS-DYNA users. This performance will accelerate crash
results in the automotive design phase, reducing time-to-market.”1
Nathan Hallquist – Senior Developer LSTC
Intel® AVX2 + DDR4 + QPI + 22nm = FAST!
Manufacturing
 LS-DYNA* performance increases with Intel® Advanced Vector Extensions 2
(Intel® AVX2) Fused Multiply Add and memory bandwidth boost. These
improvements are delivering significant speed-up in element processing
and contact algorithm, which are floating point intensive.2
 The benchmark for this data is massively parallel processing LS-DYNA
explicit workload car2car (2.5M shell 16 element).
 LS-DYNA is a leading product in the Computer-Aided-Engineering market. It
is used by the automobile, aerospace, construction, military, manufacturing,
and bioengineering industries worldwide.
Up to
50%
faster!
www.lstc.com
1,2,3 - Testing conducted on LSTC LS-DYAN MPP* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD S3700 series with Intel® SSD P3700 series. Testing done by Intel. For
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
17
MSC Software* – Intel® Better Together
Nastran* - Non-Linear analysis workload
“MSC Nastran* uses a combination of distributed and shared memory
parallel methods on large non-linear runs on the new Intel® Xeon®
processor E5-2697 v3. More cores and the Intel® Advanced Vector
Extensions 2 (Intel® AVX2) resulted in a 46% faster run time over the
previous processor generation”1
Travis Austin - High Performance Computing Manager, MSC Software
Nastran* improved up to 1.46X with Intel® Xeon®
processor E5-2600 v3 and Intel® AVX2 parallelism!
Manufacturing
 Problem size: 2.0 Million Degree-Of-Freedom set definitions.
 Observation: The Intel® Xeon® processor E5-2697 v3 allowed an
effective use of distributed and shared parallel on large nonlinear
analyses in SOL 400. Significant benefit was also achieved due to dense
matrix methods benefiting from Intel® AVX2.2
www.mscsoftware.com
MSC Nastran* non-linear analysis increased
performance (4.19 to 2.87 hours) with Intel®
Xeon® processor E5-2697 v3, Intel® AVX2, and
Intel® SSD DC P3700
Up to
46%
Faster!
1,2 - Testing conducted on MSC Nastran* non-linear analysis comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing
done by Intel. For complete configuration details, see slide 54.
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
18
Nastran* - Static analysis workload
“MSC Nastran* takes advantage of the extra cores Intel® Xeon® processor
E5-2697 v3 through the Intel® MKL library, and faster performance with the
Intel® Solid-State Drive Data Center P3700 resulting in a 43% faster run
time over the previous generation processor”1
Up to 43% faster, more cores, increased bandwidth,
improved run times! What’s Not to Like?
Manufacturing
 Problem Size: 8 Million Degree-Of-Freedom set definitions.
 Observation: MSC Nastran* utilizes most available cores in a Linear Static
analysis especially by accelerating the decomposition using the Intel®
AVX2 instructions.
 The Intel® Xeon® processor E5-2697 v3 increased memory bandwidth,
allows better utilization of computational resources, and significantly
improved run times.2
www.mscsoftware.com
MSC Nastran* static analysis increased
performance (21.43 to 15 minutes) with Intel®
Up to
43%
faster!
1,2 - Testing conducted on MSC Nastran* static analysis comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing done by
Intel. For complete configuration details, see slide 54.
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Intel® Xeon® processor E5-2697 v2, 24 cores
19
Altair*
Radioss* the standard behind Crash, Safety and Impact - NEON model
car crash 80ms simulation workload
“With the Intel® Xeon® Processor E5-2697 v3, we observe a fantastic
performance increase compared to the previous processor generation.
Working closely with Intel, Altair is very pleased to continuously improve
performance of our compute-intensive solvers and offer even higher levels
of efficiency to our customers.”
Eric Lequiniou - HPC Director, ALTAIR
Tremendous performance speedup (1.43X) over
previous Intel® processor generation.
Manufacturing
 Hybrid parallelism using Intel® MPI Library and OpenMP* allows
RADIOSS*, a widely used application for car crash simulation, to take full
advantage of Intel® Xeon® processor E5-2697 v3.
 Exceptional speedups - over 1.4X - achieved compared to the previous
processor generation. Manufacturing customers benefit from improved
performance and lower TCO.
www.altair.com
Altair Radioss* improved performance (elapsed
time from 19 to 13.25 minutes) with Intel® Xeon®
Up to
43%
faster!
1,2 - Testing conducted on Altair Radioss* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 54.
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
Intel® Xeon® processor E5-2697 V2
20
Synopsys*
Proteus* Electronic Design Automation Tool - Computational lithography
workload
“The Intel® Xeon® processor E5-2600 v3 product family demonstrates a
substantial throughput performance multiple when compared to the
previous generation in HPC applications. On Synopsys’ highly scalable
Proteus Computational Lithography* engine, which analyzes and modifies
full chip design databases prior to manufacturing, Intel® Xeon® processor E5-
2697 v3 shows 1.43X improvement in throughput compared to the previous
processor generation. Proteus users are able to improve their turn-around-
time while keeping the cost of ownership low by avoiding expensive custom
hardware solutions.”1
Dr. Howard Ko - Sr. VP & GM, Silicon Engineering Group, Synopsys, Inc.
Significant throughput gain for industry-leading
Synopsys Proteus* application with Intel® Xeon®
processor E5-2600 v3 product family!
 Increased memory speed reduces communications overhead; Intel®
Hyper-Threading Technology and Intel® Turbo Boost Technology provide
much higher price performance.
www.synopsys.com
Synopsys Proteus* increased throughput
performance with Intel® Xeon® processor E5-2697
v3, based on 4 workloads
Up to
43%
faster!
Performanceincrease
1 - Testing conducted on Synopsys Proteus* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 55.
Manufacturing

0
0.2
0.4
0.6
0.8
1
1.2
1.4
Intel® Xeon® processor E5-2697 v2, 2S 24 core
Intel® Xeon® processor E5-2697 v3, 2S 28 core
ANSYS Mechanical* V15, DMP solver, in-core, Intel
MPI, 10 workloads performance increase (geomean
solve time went from 4.05 to 2.94 minutes)
21
www.ansys.com
 The addition of Intel® Advanced Vector Extensions 2 (Intel® AVX2) with it’s
extension to 256 bit wide instructions and enhanced vectorization, along
with additional cores and faster memory, combined to create a 1.38X
improvement vs. the previous processor generation.
 ANSYS Mechanical* allows customers to simulate every structural aspect
of a product using linear and nonlinear static analysis or mechanisms
analysis. Faster run times allow customers to run larger, higher-fidelity
models and more iterations within set times and cost constraints,
increasing innovation and improving overall product quality.
A Powerhouse. Intel® AVX2 makes HPC even more
beneficial for customers and engineering.
Manufacturing
ANSYS*
Mechanical* v15.0 - 10 DMP modes workload
“ANSYS and Intel have worked together to help our customers run larger,
higher-fidelity models on the new Intel® Xeon® Processor E5-2600 v3
product family. With 1.38X higher performance than the prior generation,
this platform is a powerhouse for most workflows. It helps to make HPC
even more strategic for design and engineering teams.“1
Joe Solecki - Vice President, Physics Business Unit, ANSYS, Inc.
Up to
38%
faster
1 - Testing conducted on ANSYS Mechanical* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 55.
Performanceincrease

22
CD-adapco*
STAR-CCM+* Multi-Disciplinary Engineering Analysis Tool –
Aerodynamic simulation of Lemans car, ~17 million cells workload; 36
Cores
"By working closely with Intel we can ensure that STAR-CCM+ provides
optimal performance on the very latest Intel® Xeon® processor technologies“
Keith Foston – Performance Manager, CD-adapco
Faster simulation/prototyping time, reducing
manufacturing time-to-market!
Manufacturing
 The Intel® Xeon® processor E5-2699 v3 increased memory bandwidth
allows better utilization of computational resources, significantly
improving run times.
 Users will usually see significant reduction in simulation run times due to
the additional cores and larger memory bandwidth.
 The system with two Intel® Xeon® processor E5-2699 v3 processors
produced up to 1.35X speed-up compared to a similar system based on
the previous generation processors.1
www.cd-adapco.com
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Intel® Xeon® Processor E5-2697 V2, 12 cores
Intel® Xeon® Processor E5-2699 V3, 18 cores
CD-adapco* Lemans auto simulation – 18 core
increased performance with Intel® Xeon®
Up to
35%
faster!
Performanceincrease
1 - Testing conducted on CD-adapco STAR-CCM+* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete configuration details, see slide 55.

23
SUPCON*
APC-Sensor* - Supcon APC Suite* calculation module workload
“As a computing-intensive solution, Supcon APC-Sensor* needs a high-
performance platform to satisfy the increasing customer requirements. With
Intel® Xeon® Processor E5-2697 V3, APC achieves record breaking
performance - a 1.34X performance boost - compared to the previous
processor generation. It is amazing! The new Intel® Xeon® processor E5-2600
E5 v3 is certainly one of the most preferable platforms for our product and
the performance will certainly impress our customers greatly.”1
Pan Jun - Supcon VP
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Intel® Xeon® Processor E5-2697 V2
Supcon APC-Sensor* increased throughput module
processed (2.84 to 3.81 per second) performance
with Intel® Xeon® processor E5-2697 v3
Up to
34%
faster!
Record-breaking performance! Customers impressed
and demands met.
Manufacturing
 Supcon APC* gains record-breaking performance with Intel® Xeon®
processor E5-2600 v3 product family: 1.34X performance improvement
compared to the Intel® Xeon® Processor E5-2600 v2.
 The improved performance of Intel® Xeon® processor E5-2600 v3
product family allows Supcon APC to handle and control sensor data in a
more accurate and efficient way, improving the manufacturers’
productivity.
www.supcon.com
Performanceincrease
1 - Testing conducted on Supcon APC-Sensor* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 55.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
24
Software Cradle Co., Ltd.*
scSTREAM* - Structured mesh CFD analysis with large elements workload
“Indeed, scSTREAM* powered by the Intel® Xeon® processor E5-2697 v3
showed speed-up of 1.30X faster than the previous generation processor.
This fact will enhance the efficiency of the simulation tasks and give a great
advantage and benefit to our customers.”
Hiroyuki Kuroishi – Assistant General Manager, Software Cradle Co., Ltd.
Boost your CFD performance with scSTREAM*
on Intel® Xeon® processor E5-2697 v3
Manufacturing
 scSTREAM* is an industry-leading structured mesh computational
thermal fluid (CFD) analysis system used in heating, ventilation, air
conditioning, electrical and electronic equipment and environment
engineering.
improved intra-node scalability and run times.
www.cradle-cfd.com
Geomean speedup of 3 scSTREAM* workloads
Performanceincrease
1 - Testing conducted on Software Cradle scSTREAM* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Software Cradle. For complete configuration details, see slide 55.
Up to
30%
faster!

0
0.2
0.4
0.6
0.8
1
1.2
1.4
25
Mentor Graphics*
Calibre nmDRC* and nmOPC* - Design rule check and physical
verification workload
“Intel® Xeon® processor E5-2697 v3 offers 1.28X multi-job throughput
increase over Intel® Xeon E5-2697 v2 running Calibre nmDRC*. Calibre
nmDRC is highly scalable and is the IC industry leader for design rule
checking and physical verification.
Michael White - Director of Product Marketing, Calibre Physical
Verification Products, Mentor Graphics
Intel® Xeon® processor E5-2697 v3 offers 1.28X multi-job throughput
increase over Intel® Xeon® processor E5-2697 v2 running Calibre nmOPC*.
Calibre nmOPC is the core of Mentor’s computational lithography solutions
and the leading tool in IC manufacturing”1
James Word - Director of Product Marketing, Calibre Mask Synthesis
Solutions, Mentor Graphics
Mentor Graphics industry-leading Calibre nmDRC* and
nmOPC* see significant throughput gain with Intel® Xeon®
processor E5-2600 v3!
Manufacturing
www.mentor.com
Calibre nmDRC* and Calibre nmOPC*
increased performance (geomean run time of 8
test cases) with Intel® Xeon® processor E5-2697
v3 (hyper-threading off)2
Up to
28%
faster
Performanceincrease
1,2 - Testing conducted on Mentor Graphics Calibre nmDRC and nmOPC* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Mentor Graphics. For complete configuration details, see slide 56.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
26
Nastran* - Normal mode analysis workload
“MSC Nastran* takes advantage of the Intel® Advanced Vector Extensions 2
(Intel® AVX2) technology on the Intel® Xeon® processor E5-2600 v3 and
faster performance with the Intel® Solid State Drive (Intel® SSD) P3700,
resulting in a 23% faster run time over the previous processor generation”1
Up to 23% faster, more cores, increased bandwidth,
improved run times!
Manufacturing
 Problem Size: 2.6 Million Degree-Of-Freedom set definitions.
 Observation: MSC Nastran* utilizes the available cores in a normal
modes analysis. Significant improvements were observed in the FBS
due to Intel® AVX2.2
improved run times.3
www.mscsoftware.com
MSC Nastran* normal mode increased
performance (1.3 hours to 50 minutes) with Intel®
Up to
23%
faster!
1,2,3 - Testing conducted on MSC Nastran* normal mode comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3, and Intel® SSD DC S3700 series with Intel® SSD DC P3700 series. Testing done
by Intel. For complete configuration details, see slide 56.
Performanceincrease

27
Dassault Systèmes*
SIMULIA Abaqus*/Explicit v6.13-1 - Six workloads representative of
typical Abaqus/Explicit applications
“The increased capacity of the new Intel® Xeon® processor E5-2697 v3
enables more efficient execution of larger problems in less time on a single
machine. These improvements provide significant value for our customers.”
Matt Dunbar - Software Architecture Director, Dassault Systèmes
Sophisticated engineering problems solved quickly and
with great detail!
Manufacturing
 The SIMULIA Abaqus Unified FEA* product suite is used by leading
companies to consolidate their processes and tools, reduce costs and
inefficiencies, and gain a competitive advantage, and it offers powerful and
complete solutions for both routine and sophisticated engineering
problems covering a vast spectrum of industrial applications.
 The Intel® Xeon® processor E5-2697 v3 boosted performance by 1.22X
compared to the previous processor generation.1 In the automotive
industry engineering work groups are able to consider full vehicle loads,
dynamic vibration, multibody systems, impact/crash, nonlinear static,
thermal coupling, and acoustic-structural coupling using a common model
data structure and integrated solver technology.
www.3ds.com
0
0.2
0.4
0.6
0.8
1
1.2
Elapsed time decrease (4.45 to 3.65 minutes) with
Up to
22%
faster
Performanceincrease
1,2 - Testing conducted on Dassault Systemes SIMLIA* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 56.

0
0.2
0.4
0.6
0.8
1
1.2
Up to
19%
faster
ANSYS*
CFX* 15.0 CFD – Various CFD models workload
“ANSYS* and Intel have worked together to help our customers run larger,
this platform is a powerhouse for most workflows. It helps to make HPC an
even more strategic technology for design and engineering teams.“1
ANSYS CFX* improvement (geomean 77.11 to 64.8
seconds) with Intel® Xeon® processor E5-2600 v3
28
www.ansys.com
 ANSYS CFX* is a general purpose fluid dynamics program. The Intel®
Xeon® Processor E5-2697 v3 delivers great scalability and more
operations per clock, allowing standard servers to achieve levels of
performance previously associated with supercomputers.
 For end-users, 1.19x improved performance compared to the previous
generation processor means faster turnaround or solving larger tasks with
the same resources, and with lower TCO.
Performance previously associated with clusters of
high performance compute nodes.
Manufacturing
Performanceincrease
1 - Testing conducted on ANSYS CFX* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 56.

0.0
0.2
0.4
0.6
0.8
1.0
1.2
Intel® Xeon® processor E5-2697 v2, 24 core
Intel® Xeon® processor E5-2697 v3, 28 core
29
ANSYS*
Fluent* v15.0 - Standard Fluent 12/13/14/15 set workload
“ANSYS* and Intel have worked together to help our customers run larger,
this platform is a powerhouse for Fluent*.”1
Faster innovation and improved product quality.
Manufacturing
 ANSYS Fluent* is a fully-featured fluid dynamics solution for modeling flow
and other physical phenomena. Engineers gain deep insight into their
designs by simulating the effects of design parameters on aerodynamic drag,
lift, and vibration.
 Intel® Xeon® Processor E5-2697 v3 improved parallelism and faster memory
speeds, combining to create a 1.19X improvement compared to the
previous processor generation.2
 Faster run times allow customers to run larger, higher-fidelity models and
more iterations within set times & cost constraints, increasing innovation
and improving overall product quality.
www.ansys.com
Ansys Fluent* performance gain with Intel® Xeon®
Up to
19%
faster
Performanceincrease
1,2 - Testing conducted on ANSYS Fluent* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 56.

Cadence*
Spectre* Electronic Design Automation Tool - Analog and RF circuit
simulation workload
“We have seen 1.15X performance throughput gain for Cadence Spectre*
application on Intel® Xeon® processor E5-2697 v3 compared to the previous
processor generation, and 1.13X performance throughput benefit with
Hyper-threading on Intel® Xeon® processor E5-2697 v3-based servers.”1
Steve MacQuiddy – IT Director, Cadence Design Systems, Inc.
30
Manufacturing
Cadence* has seen better throughput and hyper-
threading improvement with Intel® Xeon® processor
E5-2697 v3 for their industry-leading Spectre*
application.
0
0.2
0.4
0.6
0.8
1
1.2
Up to
15%
faster
www.cadence.com
Spectre* throughput improvement with Intel®
Xeon® processor E5-2697 v3
 Spectre* saw a 13% hyper-threading improvement and a 15%
throughput improvement with Intel® Xeon® processor E5-2697 v3
compared to the previous processor generation.
 Better throughput for Spectre gets jobs done faster, accelerating design.
Performanceincrease
1 - Testing conducted on Cadence Spectre* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Cadence. For complete configuration details, see slide 57.

31
LIFE SCIENCES & HEALTHCARE
Transforming Health Care
From better diagnostics to
faster drug discovery and
deeper genomic analysis,
health care organizations and
bio-medical research teams are
making major advances in how
we understand and treat
disease. View the following
slides to see how the Intel®
product family is helping
leading software vendors and
research organizations achieve
better, faster results to
improve medical outcomes
and accelerate the transition
toward personalized, data-
driven health care.

0
10
20
30
40
50
60
70
80
Intel® Xeon® processor X5690, 2x Emulex Corporation
OneConnect* 10Gb NIC (rev 02)
2S Intel® Xeon® processor E5-2650 v2, 2x Intel® Ethernel
Converged Network Adapter X520-DA2 (10GbE), 12x Intel®
S3700 DC SSDs, Intel® DPDK
2S Intel® Xeon® processor E5-2697 v3, 2x Intel® Ethernet
Controller XL710 (40GbE), 5x Intel® SSDs DC P3700, Intel®
DPDK, Intel® AES-NI
32
Aspera*, an IBM* company
Aspera FASP* - High-Speed Transport for Large Unstructured Data
“The collaboration between Aspera* and Intel addresses, head-on, the classical
barriers to collaboration and scientific discovery – distance and data size –
delivering on the promise of Science DMZ, making it practical to transmit
massive datasets across the WAN, removing all constraints on where the data,
the analytics, and the expertise reside.”
Michelle Munson - CEO and Co-Founder, Aspera, an IBM company
Life Sciences & Healthcare
 Aspera FASP* consistently delivers high-throughput WAN data transmission,
independent of file size, distance or network latency.
 The Intel® Xeon® processor E5-2697 v3 with Intel® AES-NI GCM encryption
provides 1.93X faster inline data encryption for Aspera end-customers,
securely transporting sensitive workloads from enterprise to cloud.1
 Intel® Data Plane Development Kit, Intel® XL710 40GbE, Intel® NVMe Solid-
State Drives and Intel® Xeon® E5-2697 v3 processors significantly boost
overall system performance by moving data closer to the processor, avoiding
unnecessary memory copies, and reducing protocol-related latencies.
www.asperasoft.com
Aspera FASP* (zero copy WAN transfer workload) Gb per second
improvement with Intel® Xeon® processor E5-2697 v3, Intel®
Ethernet Controller, Intel® SSDs, Intel® DPDK, Intel® AES-NI
Up to 93%
faster
throughput
than v2!
Aspera* and Intel optimized solutions for Science DMZ ‒
moving the world’s data at maximum speed!
1,2 - Testing conducted on Aspera FASP* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Aspera. For complete configuration details, see slide 57.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Intel® Xeon® Processor E5-2697 V2, Intel® AVX
Intel® Xeon® Processor E5-2699 V3, Intel® AVX2
33
Neusoft*
Neusoft CT* - Images processed within one second workload
“The Intel® Xeon® Processor E5-2699 v3 generates complex CT images
about 47% faster than the previous Intel® Xeon® Processor E5-2697 v2, and
72% faster after utilizing Intel® AVX2 shipped with Intel® Xeon® Processor
E5-2697 v3. This is absolutely a preferred hardware platform for Neusoft
CT.”1
Shuangxue Li - Vice President of Neusoft Medical Systems Co., Ltd.,
General Manager of Radiology Imaging Systems Division
CT images up to 72% faster! Improved clinical
efficiency and a better patient experience!
 Neusoft is the largest IT Solutions and Services provider in China.
 Neusoft CT* gains record-breaking performance with the Intel® Xeon®
processor E5-2699 v3: 1.47X out-of-the-box performance improvement
compared to the Intel® Xeon® processor E5-2697 v2.2
 Intel® Advanced Vector Extensions 2 (Intel® AVX2) instruction on Intel®
Xeon® processor E5-2699 v3 helps Neusoft CT* gain an additional 1.17X
performance improvement.3
www.neusoft.com
Neusoft CT* increased performance (219
images/sec to 322 images/sec) with Intel® Xeon®
processor E5-2699 v3 and Intel® AVX2
Up to
72%
faster!
1,2,3 - Testing conducted on Neusoft CT* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete configuration details, see slide 57.
Performanceincrease

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
34
Vital Images*
VitreaAdvanced* 3D Medical Imaging - VitreaAdvanced workload
“The Intel® Xeon® processor E5-2697 v3 provides better scalability than the
previous processor generation for our customers needing larger numbers of
concurrent users, and alleviates limits often imposed by PCIe* slot count
when utilizing discrete graphics cards. This enables more physicians to
simultaneously access the critical imaging information they need, when
and where they need it.”
Tim Dawson - Senior Director of Software Engineering
Small to mid-sized imaging organizations can leverage this
technology to expand and improve productivity.
 Vital Images* solutions provide 2D, 3D, and 4D images of human anatomy
to determine the presence and extent of disease.
 Higher user density enabled by increased core count and memory capacity.
 Lower administrative and licensing costs than separate workstations
 A single system can now support more than double the amount of
simultaneous users, increasing productivity which helps improve patient
care.
www.vitalimages.com
Vital Images VitreaAdvanced* performance increase
(concurrent users from 5 to 8) with Intel® Xeon®
Up to
60%
faster
Performanceincrease
1,2 - Testing conducted on Vital Images VitreaAdvanced* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2699 v3. Testing done by Vital Images. For complete configuration details, see slide 57.

35
PerkinElmer*
Acapella* 3.3.0
“The Intel® Xeon® processor E5-2600 v3 improved the performance of
Acapella* significantly. Segmentation of cellular images is the most critical
step in high content screening for novel drugs. It requires high performance
computing to test millions of drug candidates a against millions of living
cells”
Seungtaek Lee – Global Product Manager, PerkinElmer
Test millions of drug candidates. Speed up discovery of
better drugs!
 High speed cell image analysis to calculate the phenotypes of living
cells in functional and small molecule screening.
 High content screening is used all along the preclinical drug discovery
pipeline to identify and validate new drug targets or new lead
compounds, to predict in vivo toxicity, and to suggest pathways or
molecular targets of orphan compounds.
improved runtimes.
http://www.perkinelmer.com/
0
1
Intel® Xeon® processor E5-2600 v2, Intel® AVX
Intel® Xeon® processor E5-2600 v3, Intel® AVX2
PerkinElmer Acapella* increased performance with
Intel® Xeon® processor E5-2600 v3 and Intel® AVX21
Up to
41%
Faster
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer
systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating
your contemplated purchases, including the performance of that product when combined with other products.
Performanceincrease
1 - Testing conducted on Acapella 3.3.0 comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Ülo Mets, PerkinElmer. For complete configuration details see slide 58.
XEON + AVX2
N E W

0
0.2
0.4
0.6
0.8
1
1.2
1.4
36
CLC bio, a QIAGEN Company*
CLC Genomics Workbench* workload
“The Intel® Xeon® E5-2699 v3 processor with Intel® AVX2, DDR4 memory
and Intel® SSDs deliver increased performance when analyzing genomic
data. This enables faster turnaround - from patient sample to actionable
insights - of critical importance in the healthcare industry.”1
Mikael Flensborg - Director Global Partner Relations, CLC bio, a QIAGEN
company
The Intel® Xeon® processor E5-2699 v3 delivers higher
performance and lower power consumption with CLC bio’s
optimized software for genomic analysis.
 CLC Genomics Workbench* is an application for analyzing and visualizing next
generation sequencing data including cutting-edge algorithms optimized for
Intel® Xeon® processors.
 To revolutionize cancer diagnostics, performance is crucial to genomic
scientists. A decreased “time to result” allows faster initiation in personalized,
targeted patient treatment.
 World-leading software developers at CLC bio provide analysis that’s
seamlessly optimized across server and desktop offering immediate user
friendly access to data calculations necessary for scientific decisions.
www.clcbio.com
CLC Genomics Workbench* performance assembling
human genome (elapsed time from 2,352.3 to 1,682
seconds) with Intel® Xeon® processor E5-2699 v3,
DDR4 memory and Intel® SSDs2
Up to
40%
faster
Performanceincrease
Illumina Platinum Genome HiSeq 2000
human genome subset (NA12878)
1,2 - Testing conducted on CLC Genomic Workbench* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2699 v3. Testing done by Intel. For complete configuration details, see slide 58.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
37
AMBER*
AMBER 14* - Cellulose NPT and FactorIX NPT biomolecular simulations /
AMBER PME workloads
“Intel® Xeon® processor E5-2697 v3 accelerates the AMBER* MD simulations
by 37% over the previous processor generation, which helps scientists to
accelerate their work. With specific optimizations from the SDSC IPCC
focused on AMBER development, this performance boost is likely to increase
even further.”1
Ross Walker - Associate Research Professor, San Diego Supercomputer Center
Scientists accelerate their work, better simulations and
convergence, and better investment return!
 A 37% performance improvement has two major impacts. First, it allows
simulation of the same protein for a longer period of time, giving better
convergence. Second, it allows simulation of larger proteins for the same
amount of real-time investment.
 Given the wide scale usage of AMBER on all hardware classes from desktops
to group/departmental clusters - all the way to national supercomputers - it
is clear that the Intel® Xeon® processor E5-2697 v3 performance will have
significant impact (scientific work) and reach (end-users: pharmaceutical
companies, individual scientists, professors, grad students).
www.ambermd.org
AMBER 14* increased performance with
Up to
37%
faster
Performanceincrease
1 - Testing conducted on AMBER 14* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2699 v3. Testing done by SDSC. For complete configuration details, see slide 58.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
38
Dassault Systèmes*
(Formerly Accelrys*) BIOVIA CASTEP* - 3000 homology models of
average sized proteins in parallel workload
“BIOVIA’s CASTEP* modeling software benefits from the Intel® Xeon®
processor E5-2600 v3 with a 32% boost in performance, allowing our users
greater productivity and faster results.”1
Michael Doyle – Director of Materials Studio Marketing, BIOVIA
BIOVIA* and Intel are working together to achieve
optimal performance!
 BIOVIA* solutions create an unmatched scientific management
environment that can help science-driven companies create and connect
biological, chemical, and material innovations.
allows better utilization of its computational resources, significantly
improving run times.
 The system with two Intel® Xeon® processor E5-2697 v3 brings up to 1.2
to 1.32X speed-up compared to a similar system based on previous
generation processors, diminishing the simulation/prototyping time and
reducing the time-to-market in manufacturing.2
www.3ds.com
BIOVIA CASTEP* increased performance (1,956
models to 2,569 models) with Intel® Xeon®
Up to
32%
faster
Performanceincrease
1,2 - Testing conducted on Dassault Systemes BIOVIA* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by BIOVIA. For complete configuration details, see slide 58.

39
Up to
26%
faster!
0
0.2
0.4
0.6
0.8
1
1.2
1.4
BWA-ALN* 0.5.10 faster throughput (50.08 to 39.66
seconds) with Intel® Xeon® processor E5-2697 v3
BGI*
A technological leader in the field of DNA, RNA and protein analysis –
Drosophila genome workload
“Taking advantage of the great features and powerful capability of the Intel®
Xeon® Processor E5-2697 v3, we see a great 1.26X performance boost on
BWA-ALN* 0.5.10 compared with the previous generation, which helps BGI to
conduct more analysis requests within less response time and to improve our
service quality. It is amazing!”1
BingQiang Wang - PhD, Head of BGI HPC
 Out-of-the-box 26% performance improvement.2
 BWA-ALN* 0.5.10 is a popular software package for mapping low-
divergent sequences against a large reference genome, such as the
human genome. BWA is used in healthcare to assist the diagnosis and
treatment of genomic related diseases. The testing workload is developed
by BGI to benchmark BWA performance. It uses the drosophila genome
and a drosophila reference genome to simulate typical BWA operation.
The performance indicator is the time to finish the genome alignment.
One of the largest genomics centers provides
analytics faster than ever!
www.bgiamericas.com
Performanceincrease
1,2 - Testing conducted on BWA-ALN 0.5.10* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 58.

40
ENERGY
Knowledge is Power
Accurate, high-performing simulation and modeling software has become an essential foundation for efficient exploration
and extraction in the oil and gas industry. The Intel® Xeon® processor E5-2600 v3 product family enables faster time-to-
results using smaller and more manageable server clusters. View the following slides to see the leap in performance these
new platforms are providing for three organizations that are continuously developing better ways to find and extract
energy resources.

 Customer benefits: Geophysicists can choose to apply the scalable
performance improvements to produce higher resolution images of the
subsurface or to improved throughput of their existing workload.
 The 2D FWI (Full Waveform Inversion) implementation uses finite-
difference time-domain forward modeling and a quasi-Newton (with L-
BFGS algorithm) optimization scheme for the model parameters update.
Parallelization achieved through standard MPI shot gathers distribution
and OpenMP for domain decomposition.
0
0.2
0.4
0.6
0.8
1
1.2
1.4
41
MINES ParisTech*
Full Waveform Inversion (FWI) : 2-D seismic modeling and inversion for
seismic imaging - Seismic wave modeling workload
“Intel® Xeon® processor E5-2697 v3 shows 1.38X improvement in
throughput when compared to the previous generation, while keeping the
cost of ownership very low. This performance improvement allowed us to
invest in the optimization and modernization of the FWI2D* seismic
imaging software, thanks also to the valuable support of the Intel® Energy
Engineering staff.”
Daniela Donno - Senior Geophysicist, MINES ParisTech
Improved performance leads to code modernization!
Energy
www.mines-paristech.fr
FWI increased performance with Intel®
Up to
38%
faster
Performanceincrease
1 - Testing conducted on MINES ParisTech FWI* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 59.

0
0.2
0.4
0.6
0.8
1
1.2
1.4
 GeoDepth® is the leading system for 3D and 2D velocity model
building and seismic imaging in time and depth. Through the
integration of interpretation, velocity analysis, model building, model
updating, model validation, depth imaging and time-to-depth
conversion, GeoDepth® provides the continuity needed to produce
high-quality, interpretable images consistent with other available data.
 Customer benefits: Geophysicists can choose to apply the scalable
performance improvements to produce higher resolution subsurface
images or to improve existing workload throughput.
42
Paradigm®
GeoDepth® Seismic Imaging - Common shot full wave migration workload
“Our continued investment in the optimization of the GeoDepth® seismic
imaging software, leveraging the Intel® Compliers and the Intel® MKL library,
enables our customers to take immediate advantage of this latest
generation of Intel® Xeon® processors.”
Duane Dopkin - Executive Vice President of Geoscience
Paradigm GeoDepth® delivers better data, high-
resolution images, and faster throughput!
Energy
www.pdgm.com
Paradigm GeoDepth® increased
performance (1.69 to 2.17 shots/minute)
Up to
28%
faster
Performanceincrease
1 - Testing conducted on Paradigm GeoDepth® comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel. For complete configuration details, see slide 59.

CMG*
IMEX* 2014.10 RC1 Reservoir Simulator – IMEX models workload
“With multi-$100 million of reservoirs in play, the Intel® Xeon® processor E5-
2697 v3 enables significant performance improvements for our end-users,
maximizing their engineering and software investments to make better
decisions sooner, using higher fidelity models and running more 'what if's'
than before.”1
Ken Dedeluk - President & CEO, CMG
Up to
26%
faster
0
0.2
0.4
0.6
0.8
1
1.2
1.4
IMEX* 2014.10 RC1 reduced run time (29.9
minutes to 23.7 minutes) with
43
 Well-engineered reservoir plan means millions of dollars to the net
present value.
 Reduce run times from days to hours, multiple runs, even computer-aided
optimization (100’s of runs).
 Performance uplift translates directly to optimal recovery factors and
earlier cash flows.
 Shortest possible CMG* run times ever seen for 2S machines.
Intel® Xeon® processor E5-2600 v3 provides up to
26% leverage on engineering, software and reservoir
investments.
www.cmgl.ca
Energy
Performanceincrease
1 - Testing conducted on CMG IMEX* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by CMG. For complete configuration details, see slide 59.

44
MEDIA & ENTERTAINMENT

0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Up to
47%
faster
Kakadu Software*
SDK Media* - Kakadu KDU-S7.5 (speed-pack) digital camera
compression/expansion workload; 36 Cores
“Under test lab conditions, the latest versions of the Kakadu Software*
library, leveraging features of Intel® Xeon® processor E5-2699 v3, was able
to deliver an average 1.47X benefit for 2K and 4K digital cinema workloads,
compared to the previous processor generation.”1
Graham Morton - Manager, Kakadu Software Kakadu Software SDK* average frames per second
speed-up (141.8 to 207.8) with Intel® Xeon®
45
 The Kakadu Software SDK*, developed at the UNSW Australia, is the
world’s leading JPEG2000 developer toolkit. The SDK is a complete
implementation of the JPEG2000 standard, Part 1, plus much of Parts 2, 3
and 9.
 The SDK’s multi-threading support enables the application to make full
use of all cores and efficiently utilize the processor caches, delivering
throughputs as high as 5Gsamples/s with low delay (4 frames in these
tests) on high precision content.
Intel® Xeon® processor E5-2699 v3 means: Faster
performance, high-quality digital cinema, and faster time
to market.
www.kakadusoftware.com
Media & Entertainment
Performanceincrease
1 - Testing conducted on Kakadu Software SDK* comparing Intel® Xeon® Processor E5-2697 v2 with Intel® Xeon® Processor E5-2697 v3. Testing done by Intel and Kakadu Software. For complete configuration details, see slide 59.

46
 Manufacturing:
• COMSOL Multiphysics* (Demo video)
• DownUnder GeoSolutions Insight* (Demo video)
• Fujitsu HPC Gateway* (Demo video)
• Texas Advanced Computing Center* (Demo video)
• Altair RADIOSS* (PDF)
• ANSYS Fluent* (PDF)
• ANSYS Mechanical (PDF)
• MSC Software* (PDF)
 Weather
• University of Tennessee (Demo video)
 Life Sciences
• Aspera FASP* (Demo video)
• CLC Bio*/Aspera demo (Demo video)
• CLC Bio Delivers Personal Medicine (Video)
See more Technical Computing and Intel® Xeon® processor E5-2600 v3 stories
at www.intel.com/XeonE5SoftwareSolutions
INTEL CONFIDENTIAL – USE UNDER NDA ONLY *Other names and brands may be claimed as the property of others

47
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of
those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to
http://www.intel.com/performance Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate.
1. Source as of September 8, 2014. New configuration: Hewlett-Packard Company HP ProLiant ML350 Gen9 platform with two Intel® Xeon® Processor E5-2699 v3, Oracle Java Standard Edition 8 update 11, 190,674 SPECjbb2013-MultiJVM max-jOPS, 47,139 SPECjbb2013-MultiJVM critical-jOPS.
Source. Baseline: Cisco Systems Cisco UCS C240 M3 platform with two Intel® Xeon® Processor E5-2697 v2, Oracle Java Standard Edition 7 update 45, 63,079 SPECjbb2013-MultiJVM max-jOPS , 23,797 SPECjbb2013-MultiJVM critical-jOPS. Source.
Accelerating Business Transformation
Up to 3.0X performance improvement1 for
efficient, high performance solutions
Common architecture for
compute, storage and networks
Monitoring and control for
improved system visibility
The Foundation for the
Software-Defined Infrastructure
Intel® Xeon® Processor. Intel® Solid-State Drives. Intel® Ethernet Solutions. Intel®
Software Development Tools

Product and Support Pages
 Intel® Xeon® processor E5 v3 product family:
• Product page: http://www.intel.com/content/www/us/en/processors/xeon/xeon-
processor-e5-family.html
• Support page: http://www.intel.com/p/en_US/support/highlights/processors/xp-e5-2600
 Intel® Solid-State Drive Data Center P3700:
• Product Page: http://www.intel.com/content/www/us/en/solid-state-drives/intel-ssd-dc-
family-for-pcie.html
• Support Page: http://www.intel.com/p/en_US/support/highlights/ssdc/ssd-dc-p3700
 Intel® Ethernet Solutions:
• Product Page: http://www.intel.com/content/www/us/en/network-adapters/converged-
network-adapters.html
• Support Page: http://www.intel.com/p/en_US/support/highlights/network/xl710
 Intel® Server Software for Code Vectorization, Parallelism and Optimization:
• Product Page: https://software.intel.com/en-us/intel-mkl
• Product Page: https://software.intel.com/en-us/intel-parallel-studio-xe
23

49
All products, computer systems, dates, and figures specified are
preliminary based on current expectations, and are subject to
change without notice.
Intel processor numbers are not a measure of
performance. Processor numbers differentiate features within each
processor family, not across different processor families. Go to:
http://www.intel.com/products/processor_number
Intel, processors, chipsets, and desktop boards may contain design
defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata
are available on request.
SPEC, SPECpower, and SPECjbb are trademarks of the Standard
Performance Evaluation
Corporation. See http://www.spec.org (http://www.spec.org/) for
more information.
TPC Benchmark is a trademark of the Transaction Processing
Council. See http://www.tpc.org for more information.
Requires a system with Intel® Turbo Boost Technology. Intel Turbo
Boost Technology and Intel Turbo Boost Technology 2.0 are only
available on select Intel® processors. Consult your PC manufacturer.
Performance varies depending on hardware, software, and system
configuration. For more information, visit
http://www.intel.com/go/turbo
Intel, Intel Xeon, the Intel Xeon logo, Intel Atom and the Intel logo
are trademarks or registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries. Other names
and brands may be claimed as the property of others.
Copyright © 2015, Intel Corporation. All rights reserved.
Legal Disclaimer

50
Legal Disclaimers: Performance
Performance tests and ratings are measured using specific
computer systems and/or components and reflect the
approximate performance of Intel products as measured by
those tests. Any difference in system hardware or software
design or configuration may affect actual performance. Buyers
should consult other sources of information to evaluate the
performance of systems or components they are considering
purchasing. For more information on performance tests and on
the performance of Intel products, Go to:
http://www.intel.com/performance/resources/benchmark_limit
ations.htm. and www.intel.com/software/products
Intel does not control or audit the design or implementation of
third party benchmarks or Web sites referenced in this
document. Intel encourages all of its customers to visit the
referenced Web sites or others where similar performance
benchmarks are reported and confirm whether the referenced
benchmarks are accurate and reflect performance of systems
available for purchase.
Relative performance is calculated by assigning a baseline
value of 1.0 to one benchmark result, and then dividing the
actual benchmark result for the baseline platform into each of
the specific benchmark results of each of the other platforms,
and assigning them a relative performance number that
correlates with the performance improvements reported.
INFORMATION IN THIS DOCUMENT IS PROVIDED “AS IS”. NO
LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO
ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT. INTEL ASSUMES NO LIABILITY WHATSOEVER AND
INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO THIS INFORMATION INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

51
Intel® Advanced Vector Extensions 2 (Intel® AVX2): Intel® Advanced
Vector Extensions 2 (Intel® AVX2) provides higher throughput to
certain processor operations. Due to varying processor power
characteristics, utilizing AVX instructions may cause a) some parts
to operate at less than the rated frequency and b) some parts with
Intel® Turbo Boost Technology 2.0 to not achieve any or maximum
turbo frequencies. Performance varies depending on hardware,
software, and system configuration and you can learn more at
http://www.intel.com/go/turbo.
Legal Disclaimers: Performance
Intel® Hyper-Threading Technology (Intel® HT Technology): Available
on select Intel® processors. Requires an Intel® HT Technology-
enabled system. Your performance varies depending on the specific
hardware and software you use. Learn more by visiting
http://www.intel.com/info/hyperthreading.

52
Optimization Notice
Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are
not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSSE3 instruction sets and other
optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on
microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for
use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel
microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the
specific instruction sets covered by this notice.
Notice revision #20110804

53
MSC Software*: Nastran* SOL103, SOL111, AMLS
Baseline configuration: MSC Software Nastran* on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 64GB/1867, DDR3, Intel DC S3700
SSD, 1Gb network, Source is Intel internal as of August 26, 2014.
New configuration: MSC Software Nastran* on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 128GB/2133, DDR4, Intel DC
S3700/P3700 SSD, 1Gb network, Source is Intel internal as of August 26, 2014.
Dassault Systèmes SIMULIA Abaqus*
Baseline configuration: Dassault Systèmes SIMULIA Abaqus* on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 64GB/1867, DDR3, Intel
DC S3700 SSD, 1Gb network, Source is Intel internal as of August 26, 2014.
New configuration: Dassault Systèmes SIMULIA Abaqus* on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 128GB/2133, DDR4, Intel DC
LSTC LS-DYNA* IMPLICIT
Baseline configuration: LSTC LS-DYNA* IMPLICIT on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 64GB/1867, DDR3, Intel DC S3700
SSD, 1Gb network, Source is Intel internal as of August 26, 2014.
New configuration: LSTC LS-DYNA* IMPLICIT on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 128GB/2133, DDR4, Intel DC
COMSOL Multiphysics* 4.4: Simulation of stress and load of a wheel rim.
Baseline configuration: COMSOL Multiphysics* 4.4 on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.6GHz, 10 cores, 64GB/1866, DIMM, SSD, 40Gb
network, Source is Intel internal as of August 19, 2014.
New configuration: COMSOL Multiphysics* 4.4 on RHEL* 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 64GB/2133, DIMM, SSD, 40Gb network,
Source is Intel internal as of August 19, 2014.

54
Configuration Details:
LSTC*: LSTC cylc1e6 benchmark workload (Implicit; MPP mode).
Baseline configuration: LS-DYNA Implicit Hybrid* R7.1.1 DP on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB
DDR3/1866, regular DIMM, Intel® SSD DC P3700 800GB, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: LS-DYNA Implicit Hybrid* R7.1.1 DP on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB
DDR4/2133, regular DIMM, Intel® SSD DC P3700 800GB, 1Gb network, Source is Intel internal as of July 14, 2014.
LSTC*: LSTC Toprcunch benchmark set workload; MPP mode.
Baseline configuration: LS-DYNA MPP R7.1.1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB DDR3/1866,
regular DIMM, Intel® SSD DC P3700 800GB, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: LS-DYNA MPP R7.1.1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB DDR4/2133,
MSC SOFTWARE*: MSC Software Nastran* static analysis (Non-Linear analysis workload).
Baseline configuration: MSC Nastran* 2015 beta on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB
DDR3/1863, Intel® SSD DC S3700, Intel® 10 Gigabit PCIe* Network Driver, 1Gb network, Intel® MKL uses Intel® AVX1, Source is Intel internal as of 7/29/14.
New configuration: MSC Nastran* 2015 beta on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB DDR4/1867,
Intel® SSD DC P3700, Intel® 10 Gigabit PCIe* Network Driver, 1Gb network, Intel® MKL uses Intel® AVX2, Source is Intel internal as of July 29, 2014.
MSC SOFTWARE*: MSC Software Nastran* static analysis (Static analysis workload).
DDR3/1863, Intel® SSD DC S3700, Intel® 10 Gigabit PCIe* Network Driver , 1Gb network, Intel® MKL uses Intel® AVX1, Source is Intel internal as of 7/29/14.
Intel® SSD DC P3700, Intel® 10 Gigabit PCIe* Network Driver , 1Gb network, Intel® MKL uses Intel® AVX2, Source is Intel internal as of July 29, 2014.
ALTAIR*: NEON model car crash 80ms simulation.
Baseline configuration: Altair Radioss* on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 64GB/1866
LVDIMM/Regular DIMM, Source is Intel internal as of August 31, 2014.
New configuration: Altair Radioss* on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2699 v3, 2.3GHz, 18 cores, 64GB/2133 Regular DIMM,
Source is Intel internal as of August 31, 2014.

55
SYNOPSYS*: Proteus* electronic design automation tool computational lithography workload.
Baseline configuration: Synopsys Proteus* on SUSE* SLES11 SP2, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 128GB/1600 regular DIMM, 1
SATA/7200RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: Synopsys Proteus* on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2699 v3, 2.3GHz, 28 cores, 64GB/2133 regular DIMM, 1
SATA/7200RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
ANSYS MECHANICAL*: 10 workloads run in DMP mode. These workloads are the Ansys* 15.0 Benchmark set. They include structural analysis, modal
analysis, thermal analysis, coupled field analysis.
Baseline configuration: ANSYS Mechanical* 15.0 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 128GB
DDR3/1866, Intel® SSD DC S3700 800GB, 1Gb network, Intel® AVX1 and Intel® AVX2 enabled by Intel® MKL, Source is Intel internal as of July 14, 2014.
New configuration: ANSYS Mechanical* 15.0 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB DDR4/2133,
Intel® SSD DC S3700 800GB, 1Gb network, Intel® AVX1 and Intel® AVX2 enabled by Intel® MKL, Source is Intel internal as of July 14, 2014.
CD-adapco*: Aerodynamic simulation of Lemans car, ~17 million cells.
Baseline configuration: STAR-CCM+* 9.04.009 on Red Hat* Enterprise Linux 7, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 64GB DDR3/1866, 1
SATA HDD, 1Gb network, Source is Intel internal as of July 23, 2014.
New configuration: STAR-CCM+* 9.04.009 on Red Hat* Enterprise Linux 7, 2 Intel® Xeon® processor E5-2699 v3, 2.3GHz, 18 cores, 64GB DDR4/2133, 1
SATA HDD, 1Gb network, Source is Intel internal as of July 23, 2014.
SUPCON*: Supcon APC* workload is focused on the main calculation module in Supcon APC Suite and composed of a series of operations on very large
matrix. The performance is measured by throughput, which is the number of modules (matrix) processed within one second.
Baseline configuration: Supcon APC* v2.0 on Windows 2008 R2 Enterprise* SP1, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 32GB/1600 DDR3,
1 SATA, 1Gb network, Source is Intel internal as of June 3, 2014.
New configuration: Supcon APC* v2.0 on Windows 2008 R2 Enterprise* SP1, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 32GB/2133 DDR4, 1
SATA, 1Gb network, Source is Intel internal as of June 3, 2014.
SOFTWARE CRADLE*: Structured mesh CFD analysis with very large elements.
Baseline configuration: scSTREAM* v11, 2 Intel® Xeon® processor E5-2695 v2, 2.4GHz, 24 cores, 64GB/1866 DDR3, 1 SATA HDD, Source is Intel internal as
of July 30, 2014.
New configuration: scSTREAM* v11, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133 DDR4, 1 SATA HDD, Source is Intel internal as of
July 30, 2014.

56
MENTOR GRAPHICS*: Calibre* nmOPC and nmDRC design rule check and physical verification.
Baseline configuration: nmDRC v2013.2_18, nmOPC v2013.2_24, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 128GB/1600 DDR3 regular DIMM,
1 SATA/7200 RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: scSTREAM* v11, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB/2133 DDR4 regular DIMM, 1 SATA/7200 RPM, 1Gb
network, Source is Intel internal as of July 14, 2014.
MSC SOFTWARE*: MSC Software Nastran* static analysis (Normal analysis workload).
DDR3/1863, Intel® SSD DC S3700, Intel® 10 Gigabit PCIe* Network Driver , 1Gb network, Intel® MKL uses Intel® AVX1, Source is Intel internal as of 7/29/14.
Intel® SSD DC P3700, Intel® 10 Gigabit PCIe* Network Driver , 1Gb network, Intel® MKL uses Intel® AVX2, Source is Intel internal as of July 29, 2014.
DASSAULT SYSTÈMES*: The benchmark is a suite of 6 workloads that are representative of typical Abaqus/Explicit applications including high-speed
dynamic impact events and quasi-static events with complicated contact conditions.
Baseline configuration: Abaqus/Explicit v6.13-1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1866
New configuration: Abaqus/Explicit v6.13-1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB/2133 regular
DIMM, Intel® SSD DC S3700 800GB, 1Gb network, Source is Intel internal as of July 31, 2014.
ANSYS CFX*: Various CFD models (AirFoil, LeMansCar, Pump).
Baseline configuration: ANSYS CFX* 15.0 on Red Hat* Enterprise Linux 6.4 (x64), 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1867, 1
SATA HDD, 1Gb network, Source is Intel internal as of June 23, 2014.
New configuration: ANSYS CFX* 15.0 on Red Hat* Enterprise Linux 6.4 (x64), 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133, 1 SATA
HDD, 1Gb network, Source is Intel internal as of June 23, 2014.
ANSYS FLUENT*: 6 workloads. These workloads are the standard Fluent* 12/13/14/15 set. They include aircraft aerodynamics, automobile aerodynamics,
turbo-machinery, and large eddy simulation.
Baseline configuration: ANSYS Fluent* 15.0 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1866 DDR3,
Lustre* cluster network file system, Source is Intel internal as of July 14, 2014.
New configuration: ANSYS Fluent* 15.0 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133 DDR4, Lustre*
cluster network file system, Source is Intel internal as of July 14, 2014.

57
CADENCE*: Analog and RF Circuit Simulation.
Baseline configuration: Spectre* version13.1.0.110.isr2 32bit on Red Hat* Enterprise Linux 5.1, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores,
128GB/1600 DDR3, 1 SATA/7200 RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: Spectre* version13.1.0.110.isr2 32bit on Red Hat* Enterprise Linux 5.1, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores,
128GB/2133 DDR4, 1 SATA/7200 RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
ASPERA*, AN IBM* COMPANY: Zero copy WAN transfer using Intel 40g NIC, AES, DPDK, and NVMe.
Baseline configuration: Aspera Enterprise Server* 2.9 on Red Hat* Enterprise Linux 5, 2 Intel® Xeon® processor X5690, 3.46 GHz, 6 cores, 24GB/1333 DDR3,
RAID bus controller: LSI Logic* / Symbios Logic MegaRAID* SAS 9240 (rev 03), 2x Emulex Corporation OneConnect*10Gb NIC (rev 02) (dual-port NIC - 4
ports total), 10GbE x 2 x 2 network, Source is Intel internal as of September 2, 2014.
Intermediate configuration: Aspera* A3 (based on Fasp* 3) on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2650 v2, 2.7 GHz, 8 cores,
128GB/1333 DDR3, Intel® Integrated RAID adapter RMS25PB080 (PCIe* 2 x8 with direct attach to disk), 12 Intel® SSD DC S3700 Series 800GB, 2x Intel®
X520-DA2 (dual-port 10G NIC - 4 ports total), 10GbE x 2 x 2 network, Source is Intel internal as of September 2, 2014.
New configuration: Aspera* A4 (based on Fasp* 4) on Fedora* 20 with custom kernel, 2 Intel® Xeon® processor E5-2697 v3, 2.6 GHz, 14 cores, 128GB/2133
DDR4, 5 Intel® SSD DC P3700 Series 800GB, 2x Intel® Ethernet Controller XL710 (dual-port 40GbE NICs - 4 ports total), 40GbE x 2 x 2 network, Source is
Intel internal as of September 2, 2014.
NEUSOFT*: Neusoft CT CPU-Reconstruction Module* includes 3 typical processing steps (computation intensive) in CT: Convolution, MatrixTranspose and
BackProjection. This workload will detect the number of logical processors and start the same number of threads to do the processing. Performance metrics
is measured by the number of images processed within one second. The workload has already been optimized for SSE4.
Baseline configuration: Neusoft CT* on Windows Server* 2012 R2, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1600 DDR3, Intel® AVX1
enabled, 1 SATA HDD, 1Gb network, Source is Intel internal as of July 29, 2014.
New configuration: Neusoft CT* on Windows Server* 2012 R2, 2 Intel® Xeon® processor E5-2699 v3, 2.3GHz, 36 cores, 128GB/2133 DDR4, , Intel® AVX2
enabled, 1 SATA HDD, 1Gb network, Source is Intel internal as of July 29, 2014.
VITAL IMAGES*: VitreaAdvanced* is a 3D medical imaging software package comprising of approximately two dozen clinical applications, each involving 3D
image processing algorithms and 3D volumetric rendering.
Baseline configuration: VitreaAdvanced* 6.6.2 on Windows* 7 Professional SP1 (x64), 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1600, 1
SATA HDD 7200 RPM, Intel® Ethernet Server Adapter I350, 1Gb network, Source is Intel internal as of June 27, 2014.
New configuration: VitreaAdvanced* 6.6.2 on Windows* 7 Professional SP1 (x64), 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133, 1
SATA HDD 7200 RPM, Intel® Ethernet Controller X540-AT2, 1Gb network, Source is Intel internal as of June 27, 2014.

58
PERKINELMER ACAPELLA* 3.3.0: Database transactions workload.
Baseline configuration: PerkinElmer Acapella* 3.3.0 on RHEL* 7.0, 2 Intel® Xeon® processor E5-2697 v2, 3.0GHz (turbo enabled), 12 cores, 32GB/1867,
Regular DIMM, Fiber Channel, 1Gb network, Source is Intel internal as of April 15, 2015.
New configuration: PerkinElmer Acapella* 3.3.0 on RHEL* 7.0, 2 Intel® Xeon® processor E5-2697 v3, 3.1GHz (turbo enabled), 14 cores, 64GB/2133, LVDIMM,
Fiber Channel, 1Gb network, Source is Intel internal as of April 15, 2015.
CLC BIO*: Illumina* benchmark: mapping 100M Illumina reads (100bp) of Homo Sapiens, sample from
http://ccr.coriell.org/Sections/Search/Sample_Detail.aspx?Ref=GM12878.
Baseline configuration: CLC bio* read mapper on Red Hat* Enterprise Linux 7, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1863 DDR3, 1
SATA HDD 7200 RPM, Intel® Ethernet Server Adapter I350, 1Gb network, Source is Intel internal as of August 25, 2014.
New configuration: CLC bio* read mapper on Red Hat* Enterprise Linux 7, 2 Intel® Xeon® processor E5-2699 v3, 2.6GHz, 36 cores, 64GB/2133 DDR4, Intel®
AVX2 enabled, Intel® SSD DC P3700 Series 800GB, Intel® Ethernet Controller X540-AT2, 1Gb network, Source is Intel internal as of 8/25/14.
AMBER*: Amber* 14 (Benchmark names: FactorIX* NPT and Cellulose* NPT). The benchmarks use the PME (Particle Mesh Ewald) Amber algorithm. This is
the mostly-used algorithm.
Baseline configuration: Amber* 14 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1866 regular DIMM, 1
SATA HDD, Intel® Ethernet Server Adapter I350, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133 regular DIMM, Intel® AVX2
enabled, Intel® Ethernet Controller X540-AT2, 1Gb network, Source is Intel internal as of July 14, 2014.
DASSAULT SYSTÈMES ACCELRYS/BIOVIA*: Speed based on building 3,000 homology models of average sized (230 residue) proteins in parallel across the
number of logical cores.
Baseline configuration: Accelrys Discovery Studio* Version 4.1 on Windows Server* 2008 R2, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores,
16GB/1066 DDR3, 1 SATA HDD 1TB, Intel® Ethernet Server Adapter I350, 1Gb network, Source is Intel internal as of July 1, 2014.
New configuration: Accelrys Discovery Studio* on Windows Server* 2012 R2, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 64GB/2133 DDR4
LVDIMM, 1 SATA HDD 1TB, Intel® Ethernet Controller X540-AT2, 1Gb network, Source is Intel internal as of July 1, 2014.
BGI*: Genome of drosophila.
Baseline configuration: BWA-ALN* 0.5.10 on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 32GB/1600, 1 SATA
HDD, 1Gb network, Source is Intel internal as of June 9, 2014.
New configuration: BWA-ALN* 0.5.10 on Red Hat* Enterprise Linux 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 32GB/2133, 1 SATA HDD,
1Gb network, Source is Intel internal as of June 9, 2014.

59
MINES PARIS TECH*: Seismic wave modeling is using as a tool for seismic acquisition design, or seismic wave phenomena analysis or as the first stage of
seismic imaging as FWI
Baseline configuration: FWI* on CentOS* 6.5, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1867 DDR3, 1 SATA HDD 7200 RPM, Intel®
Ethernet Server Adapter I350, 1Gb network, Source is Intel internal as of June 14, 2014.
New configuration: FWI* on CentOS* 6.5, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 64GB/2133 DDR4, 1 SATA HDD 7200 RPM, Intel® Ethernet
Controller X540-AT2, 1Gb network, Source is Intel internal as of June 14, 2014.
PARADIGM*: The Common Shot Full Wave Migration (CSFWMig) is a methodology that provides high-resolution imaging and reconstruction of seismic
reflectivity in areas where complex wave-propagation occurs and is the preferred solution when irregular acquisition geometries are needed.
Baseline configuration: Paradigm 14* on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 64GB/1867 DDR3, 1
SATA/7200 RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: Paradigm 14* on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB/2133 DDR4, 1
SATA/7200 RPM, 1Gb network, Source is Intel internal as of July 14, 2014.
CMG*: IMEX* models multiple PVT and equilibrium regions as well as multiple rock types and has flexible relative permeability choices. Regardless of the
size or complexity of your reservoir problem, IMEX is an effective tool for a broad range of reservoir management issues.
Baseline configuration: CMG IMEX* 2014.10 RC1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 24 cores, 128GB/1866
regular DIMM, 3 SAS HDD 7200 RPM, LSI* SAS2308 RAID controller, 1Gb network, Source is Intel internal as of July 14, 2014.
New configuration: CMG IMEX* 2014.10 RC1 on Red Hat* Enterprise Linux 6.4, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 28 cores, 128GB/2133 regular
DIMM, 3 SAS HDD 7200 RPM, LSI SAS MagaRaid* controller, 1Gb network, Source is Intel internal as of July 14, 2014.
KAKADU SOFTWARE*: 1. Compression of 4K (4096x1714, XYZ, 12 bits/sample) and 2K (2048x857, XYZ, 12 bits/sample) content to full digital cinema spec
at 10.4Mbits/frame. Four and eight (2K) parallel processing engines, each with many parallel threads of execution interacting tightly. Latency=4 and 8 (2K)
frames on all platforms. 2. Decompression of 4K (4096x1714, XYZ, 12 bits/sample) and 2K (2048x857, XYZ, 12 bits/sample) content from full digital cinema
spec at 10.4Mbits/frame, with render to frame buffer. Four and eight (2K) parallel processing engines, each with many parallel threads of execution
interacting tightly. Latency=4 and 8 (2K) frames on all platforms.
Baseline configuration: Kakadu* KDU-S7.5 (speed-pack) on Windows Server* 2012 R2, 2 Intel® Xeon® processor E5-2697 v2, 2.7GHz, 12 cores, 32GB/1066
regular DIMM, 1 SATA HDD, 1Gb network, Source is Intel internal as of August 18, 2014.
New configuration: Kakadu* KDU-S7.5 (speed-pack) on Windows Server* 2012 R2, 2 Intel® Xeon® processor E5-2697 v3, 2.6GHz, 14 cores, 64GB/2133
LVDIMM/regular DIMM, 1 SATA HDD, 1Gb network, Source is Intel internal as of August 18, 2014.

REVISION 1.0 GOLD
Copyright © 2015 Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others.Copyright © 2015 Intel Corporation. All rights reserved. *Other names and brands may be claimed as the property of others.

Intel® Xeon® Processor E5-2600 v3 Product Family Application Showcase - Technical Computing

More Related Content

What's hot

Similar to Intel® Xeon® Processor E5-2600 v3 Product Family Application Showcase - Technical Computing

More from Intel IT Center

Recently uploaded

Intel® Xeon® Processor E5-2600 v3 Product Family Application Showcase - Technical Computing

Editor's Notes