Clayton Harlan Lantz has over 20 years of experience as a technical engineer, with expertise in photolithography, metrology, and etch toolsets. He has led sustaining engineering groups and process improvement task forces at Intel, and served as a seed engineer facilitating new technology transitions. As a senior applications engineer and group leader at ASML, he provided customer support and new product introduction assistance. Lantz has strong skills in statistical analysis, process optimization, and tool matching across multiple technology generations and vendors.

1. Clayton Harlan Lantz
claytonhlantz@gmail.com | 602-369-4563
Professional Summary:
Proven, experienced, technical engineer with over 20 years’ experience solving
problems in a fluid, high-paced environment. Organized, data-driven and detail-oriented with
excellent project management skills and experience. Performs well as a team leader, team
member or an individual player with excellent written and verbal communication skills.
Professional Skills and Competencies:
SAS Perl Matlab Excel/VB
PCA JMP Lean Six Sigma Optical Design
SQL MBPS Data Visualization SPC/PCS
Lean Mfg Metrology Data Mining Project Mgt
Professional Experience:
Senior Process Engineer/Individual Contributor, Intel Corporation 10/00-02/16
 Lead sustaining engineering groups responsible for maintaining a >$2B capitol
equipment set in a state-of-the-art semiconductor fabrication facility, with a
specialization in Photolithography, Metrology, and Etch toolsets.
 Used statistical analysis to maintain tool matching on Critical Success
Indicators (CSI) such as tool availability and output, defects levels, and Cpk.
 Lead and supported cross-disciplinary factory task forces related to integrated
process and yield issues, and implemented process architecture fixes to
improve yields. Authored whitepapers to document process improvements.
 Maintained Engineering Ownership (EO) of Photolithography scanners across
several generations of toolsets and technologies. Responsible for all aspects of
scanner performance, including process yield, availability and throughput, and
defect performance. Coordinated repair and upgrade plans with vendors. Tool
ownership included multiple generations of steppers, scanners, and 20W-90W
lasers.
 Served as a Seed Engineer across multiple process technologies and Lithography
toolsets, facilitating the processes by which semiconductor technology generations go
from Development to High Volume Manufacturing.
 Trained Engineering and Manufacturing personnel on new technologies,
including process changes, new equipment, and process integration.
 Developed software and automation infrastructure required to start up factories
on new technologies. Supervised hardware installation and acceptance testing.
 Responsible for all aspects of first silicon matching to development fab.
 Responsible for optimization of optical performance and matching of Lithography
scanners across multiple technology generations and multiple vendors.
 Developed and maintained Zernike-based tool databases for optimization and
matching of Lithography scanners across a world-wide fleet. Performed tool

2. optimizations and drove matching improvement indicators as a Continuous
Improvement (CI) effort at a world-wide corporate level.
Senior Applications Engineer and Imaging Group Leader, ASML Corporation
04/97-10/00
 Provided Applications Support for all US customers, including offsite escalation
support and onsite project management.
 Provided escalation consultative support for field engineers, including
developing test plans, technical data analysis, hardware performance
evaluations, and process simulation support.
 Supervised Joint Development Projects and sustaining projects at customer
sites in cooperation with local field application engineers, the US Demo Lab,
and Factory Support and Development in the Netherlands.
 Supervised a support group (Imaging Group) responsible for customer support of all
imaging-related technical issues in North America
 Planned and delegated support and project responsibilities for all personnel
involved in the Imaging Competency program in North America.
 Developed training and continuing education programs for the Imaging
Competency Program and maintained a working knowledge library.
 Provided onsite New Product Introduction support for all US customers.
 Delivered technical education and training, and tool installation and acceptance
testing support for new products.
 Provided technical assistance integrating new equipment into existing factories.
 Supported first-of-a-kind equipment installations at customer sites related to the
stepper-to-scanner transition as well as the 248nm-193nm transition.
Education:
Master of Science, Metallurgical and Materials Engineering, Concentration in Advanced
Ceramics, Colorado School of Mines, Golden, Colorado. June, 1994
Bachelor of Science, Metallurgical and Materials Engineering, California Polytechnic
State University, San Luis Obispo, California. December, 1992