This document describes a DARPA project to develop highly integrated silicon-based RF electronics to achieve unprecedented levels of integration for RF, microwave, and mm-wave modules using silicon CMOS technology. The project aims to develop Ka-band transmit/receive integrated circuits less than 7 mm^2 comprising a transceiver module for applications like MIMO radar, electronic warfare systems, and sensing systems. Critical circuit blocks were demonstrated at a technology readiness level of 4-5 and the silicon process used has a manufacturing readiness level of 9. The integrated circuits could transform the design of systems like AESA radars by reducing costs, size, weight and power compared to existing discrete component approaches.
Building carrier-class LTE networks is a complex undertaking and the initial planning stage, where the business case is defined and the budget is allocated, is critical for setting a solid foundation for the success of the initiative.
During this webinar, participants will learn a holistic, iterative approach to developing business cases for LTE Networks. Participants will also get exposure to various tools available as well as best practices used in network planning.
Og 103 test and analysis of gsm electromagnetic background issue1.0Ketut Widya
In the GSM system, to extend the capacity, perform frequency reuse. If the frequency reuse is more aggressive, the network capacity becomes more large. If the reuse distance is shorter, the interference becomes stronger.
The interference has obvious impacts on call quality, call drop rate, handover, and congestion. If there is a strong interference in the band, clear frequency or apply for new frequency.
Building carrier-class LTE networks is a complex undertaking and the initial planning stage, where the business case is defined and the budget is allocated, is critical for setting a solid foundation for the success of the initiative.
During this webinar, participants will learn a holistic, iterative approach to developing business cases for LTE Networks. Participants will also get exposure to various tools available as well as best practices used in network planning.
Og 103 test and analysis of gsm electromagnetic background issue1.0Ketut Widya
In the GSM system, to extend the capacity, perform frequency reuse. If the frequency reuse is more aggressive, the network capacity becomes more large. If the reuse distance is shorter, the interference becomes stronger.
The interference has obvious impacts on call quality, call drop rate, handover, and congestion. If there is a strong interference in the band, clear frequency or apply for new frequency.
Og 102 site survey and layout of bts issue1.5Ketut Widya
The survey and layout of BTS is the basis of construction for radio mobile network. It has the following functions:
Showing the system design of the network planning
Determining the structure of future network
Determining the quality of network operation
Thus, the proper survey and layout of BTS can ensure the installation, maintenance, and network planning
3GPP LTE-A Standardisation in Release 12 and Beyond - Jan 2013 Eiko Seidel, C...Eiko Seidel
Quite some time ago major improvements have been made to LTE with LTE-Advanced as part of 3GPP Release 10. Unquestionably, LTE-A will be the leading global 4G standard fulfilling the defined ITU-R requirements [1] on IMT-Advanced such as peak data rates beyond 1Gbps. While further enhancements to LTE-Advanced have just been completed in 3GPP Release 11, the new technology trends become visible to serve the continuously growing traffic demand. This White Paper, based on Nomor’s attendance of 3GPP, provides an outlook on 3GPP standardisation for the forthcoming years. Besides a summary of general trends and a projected release schedule, it includes an overview of the work and study items of Release 12 in the Radio Working Groups. New key technologies that Release 12 will address are: Small Cell Enhancements, a New Carrier Type, 3D-MIMO Beamforming, Machine-Type-Communication, LTE-WiFi Integration at radio level and Public Safety incl. Device-to-Device communication. While the completion of Release 12 is expected mid of 2014, deployments might be seen around the end of 2015 and later. NoMoR is active in different related research projects and offers consultancy services for related research, standardisation, simulation, early prototyping and technology training.
Since Release 8 Long-Term Evolution (LTE) by the 3rd Generation Partnership Project (3GPP), the uplink control channel called the physical uplink control channel (PUCCH) is specified. In this paper, we propose a new multi-user joint receiver processing for LTE PUCCH that counteracts the intra-cell interference (ICI). Using the fact that the received signal in PUCCH signaling follows a constrained tensor model, a multi-user receiver based on an iterative joint channel/code estimation and symbol detection is proposed. The interest in such a challenging setting relies on the overhead reduction synchronization errors defined by time offset and inaccuracies of timing align. Simulation results show remarkable performance gains of the proposed receiver compared to the conventional time-frequency decorrelator based receiver under the same conditions.
3GPP Overview
TSG Plenary Status for 5G
New Services and Markets Technology Enablers
Architecture for Next Generation System
Next Generation Radio Access Technology
TSG Plenary Status for LTE-Advanced Pro
References
LTE mobile system coverage, capacity and quality and its application to commu...Comms Connect
SAT has recently undertaken a number of impartial coverage drive tests for the new generation of mobile phone system (4G LTE) in the metropolitan areas. The findings are interesting and it shows the early stages of rollout from the centre of the cities are established. Coverage of the outer suburbs is not there yet as of February 2013 however the carriers do have an aggressive rollout plan to provide capital city coverage to ~98% of the populous by around the end of 2013. The outcomes from the studies also show the variance from different network providers. SAT has also done some comparison testing to the 3G networks and discusses the benefits of using public networks versus private networks for various applications.
Dale Stacey, Technical Director, SAT Pty
Og 002 service flow of radio network planning issue1.1Ketut Widya
Know the flow of radio network planning
Grasp the key parts of the stages of radio network planning
Make the radio network planning be more standard and controllable
Universal software defined radio development platformBertalan EGED
Award winning presentation at a NATO RTO IST symposium in 2006 on Universal Software Defined Radio (SDR) Development Platform and its use for prototyping radar system and spectrum monitoring receiver. Till this time I made several presentations on the topic, but this is the original version from 2006.
Og 102 site survey and layout of bts issue1.5Ketut Widya
The survey and layout of BTS is the basis of construction for radio mobile network. It has the following functions:
Showing the system design of the network planning
Determining the structure of future network
Determining the quality of network operation
Thus, the proper survey and layout of BTS can ensure the installation, maintenance, and network planning
3GPP LTE-A Standardisation in Release 12 and Beyond - Jan 2013 Eiko Seidel, C...Eiko Seidel
Quite some time ago major improvements have been made to LTE with LTE-Advanced as part of 3GPP Release 10. Unquestionably, LTE-A will be the leading global 4G standard fulfilling the defined ITU-R requirements [1] on IMT-Advanced such as peak data rates beyond 1Gbps. While further enhancements to LTE-Advanced have just been completed in 3GPP Release 11, the new technology trends become visible to serve the continuously growing traffic demand. This White Paper, based on Nomor’s attendance of 3GPP, provides an outlook on 3GPP standardisation for the forthcoming years. Besides a summary of general trends and a projected release schedule, it includes an overview of the work and study items of Release 12 in the Radio Working Groups. New key technologies that Release 12 will address are: Small Cell Enhancements, a New Carrier Type, 3D-MIMO Beamforming, Machine-Type-Communication, LTE-WiFi Integration at radio level and Public Safety incl. Device-to-Device communication. While the completion of Release 12 is expected mid of 2014, deployments might be seen around the end of 2015 and later. NoMoR is active in different related research projects and offers consultancy services for related research, standardisation, simulation, early prototyping and technology training.
Since Release 8 Long-Term Evolution (LTE) by the 3rd Generation Partnership Project (3GPP), the uplink control channel called the physical uplink control channel (PUCCH) is specified. In this paper, we propose a new multi-user joint receiver processing for LTE PUCCH that counteracts the intra-cell interference (ICI). Using the fact that the received signal in PUCCH signaling follows a constrained tensor model, a multi-user receiver based on an iterative joint channel/code estimation and symbol detection is proposed. The interest in such a challenging setting relies on the overhead reduction synchronization errors defined by time offset and inaccuracies of timing align. Simulation results show remarkable performance gains of the proposed receiver compared to the conventional time-frequency decorrelator based receiver under the same conditions.
3GPP Overview
TSG Plenary Status for 5G
New Services and Markets Technology Enablers
Architecture for Next Generation System
Next Generation Radio Access Technology
TSG Plenary Status for LTE-Advanced Pro
References
LTE mobile system coverage, capacity and quality and its application to commu...Comms Connect
SAT has recently undertaken a number of impartial coverage drive tests for the new generation of mobile phone system (4G LTE) in the metropolitan areas. The findings are interesting and it shows the early stages of rollout from the centre of the cities are established. Coverage of the outer suburbs is not there yet as of February 2013 however the carriers do have an aggressive rollout plan to provide capital city coverage to ~98% of the populous by around the end of 2013. The outcomes from the studies also show the variance from different network providers. SAT has also done some comparison testing to the 3G networks and discusses the benefits of using public networks versus private networks for various applications.
Dale Stacey, Technical Director, SAT Pty
Og 002 service flow of radio network planning issue1.1Ketut Widya
Know the flow of radio network planning
Grasp the key parts of the stages of radio network planning
Make the radio network planning be more standard and controllable
Universal software defined radio development platformBertalan EGED
Award winning presentation at a NATO RTO IST symposium in 2006 on Universal Software Defined Radio (SDR) Development Platform and its use for prototyping radar system and spectrum monitoring receiver. Till this time I made several presentations on the topic, but this is the original version from 2006.
This is a self-contained three-day short course on the fundamentals of tactical missile design. It provides a system-level, integrated method for missile aerodynamic configuration/propulsion design and analysis and addresses the broad range of alternatives in meeting cost and performance requirements. The methods presented are generally simple closed-form analytical expressions that are physics-based, to provide insight into the primary driving parameters. Configuration sizing examples are presented for rocket-powered, ramjet-powered, and turbojet-powered baseline missiles. Typical values of missile parameters and the characteristics of current operational missiles are discussed, as well as the enabling subsystems and technologies for tactical missiles, the development process, and the current/projected state-of-the-art. The attendees will vote on the relative emphasis of the topics. Over thirty videos illustrate missile development activities and missile performance. Finally, each attendee may design, build, and fly an air-powered rocket that illustrates some of the course design methods.
Implementation of Algorithms For Multi-Channel Digital Monitoring ReceiverIOSR Journals
Abstract: Monitoring Receivers form an important constituent of the Electronic support. In Monitoring
Receiver we can monitor, demodulate or scan the multiple channels.
In this project, the Implementation of algorithm for multi channel digital monitoring receiver. The
implementation will carry out the channelization by the way of Digital down Converters (DDCs) and Digital
Base band Demodulation. The Intermediate Frequency (IF) at 10.7 MHz will be digitalized using Analog to
Digital Converter (ADC) with sampling frequency 52.5 MHz and further converted to Base band using DDCs.
Virtually all the digital receivers perform channel access using a DDC. The Base band data will be streamed to
the appropriate demodulators. Matlab Simulink will be used to simulate the logic modules before the
implementation. This system will be prototyped on an FPGA based COTS (Commercial-off-the-shelf)
development board. Xilinx System Generator will be used for the implementation of the algorithms.
Keywords: DDC, ADC, Digital Base band demodulation, IF, Monitoring Receiver.
This is an overview of the Gigalight company, including the Gigalight optical interconnect solutions such as high-speed optical transceivers from 25G to 400G and active optical cables, as well as passive optical components (WDM, CWDM, DWDM, PLC splitters etc.).
Shenzhen Sinovo Telecom co.,limited offers the next generation optical interconnect solutions for datacenter.We develop and manufacture innovative optical network devices, interconnection solutions, IDC optical modules and test equipment. The complete Series of 10G XFP,SFP+,GPON,100G CFP and 40G QSFP+ modules,and AOC Cables and other low rate modules,which widely used in fixed telecommunication networks, large Cloud computing and datacenter, IDC ,storage Computing network ,Video transmission, integrating systems,which meet various application requirements.
LINKSTAR TECHNOLOGIES LIMITED, based in the USA, with Worldwide Distribution and Sales office in Hongkong is a synergy in Communications Technology, with Design, Development & EMS Facilities (Electronics & Telecommunications) in India. Linkstar provides solutions and value to Manufacturers and System Integrators. LINKSTAR has expertise and resources to design, develop & manufacture “Electronics & Communication” products from concept for System Integrators and OEMs.
Our areas of expertise range from Services in the “Design and Development” (Electronics and Telecommunication”), and EMS (Electronics Manufacturing Services) for OEMs.
We invite Regional Distributors & Channel Partners for our products and services.
MIPI DevCon 2020 | MIPI A-PHY: Laying the Groundwork for MIPI’s Automotive Se...MIPI Alliance
MIPI board member Ariel Lasry and A-PHY subgroup vice lead Edo Cohen share technical details of MIPI A-PHY, the cornerstone of MIPI Automotive SerDes Solutions (MASS).
1. DARPA SBIR/STTR Phase II Project Description
Highly Integrated Silicon Based RF Electronics
Distribution Statement A: Approved for Public Release; – Distribution is unlimited Page 1
Company Web Site URL: www.advtecheng.org
Point of Contact Name: Frank Lucchesi
Phone Number: 952-465-6009 Email: F.Lucchesi@AdvTechEng.com
DARPA Topic Number/Title: Highly Integrated Silicon Based RF Electronics / SB082-044
DARPA Project Contract Number: W91-W91CRB-10-C-0078
Phase II SBIR/STTR Project Period of Performance: 26 April 2010 - 25 June 2012
Technical challenge being addressed: Achieve unprecedented levels of integration for highly complex RF
microwave, mm-wave and analog/digital/mixed-signal modules using Silicon Complementary Metal Oxide
Semiconductor (CMOS) technology to support emerging DoD-critical applications such as wafer-scale phase array
mono-static radars, bi-static radars, MIMO radars, direction finding (DF) signals intelligence (SIGINT), highly-
integrated electronic warfare systems, or compact sensing systems
Prototype Description: Wide bandwidth, Ka-band, Si-based Transmit/Receive (T/R) integrated circuits (ICs) in a
form factor less than 7 mm
2
, comprising a T/R module that can be placed immediately behind each radiating
element, in much higher numbers than are currently realized. Today’s systems use discrete III-V semiconductor
components that consume more power and are more costly to manufacture. ATEI’s level of silicon integration, the
critical circuits of which were demonstrated in Phase II, can completely transform the design approach of AESA
based systems including MIMO radar, digital radar, communications and electronic combat systems (see these and
other applications below).
Prototype Availability Date and Projected Technology Readiness Level (TRL) and Manufacturing Readiness Level
(MRL): Critical Transmit and Receive circuit blocks - TRL: ~ 4-5 (demo/tested July 2012). Table 1 below shows the
allocated circuit block requirements and associated test results for critical RF front end RFIC circuit blocks. The
prototype results exceeds our expectations and satisfies the first step to fully validate the highly integrated RF
front end architecture for AESA MMW and MIMO radar implementation; The associated 8HP SiGe process MRL 9;
TRL of the complete MIMO radar RFFE Architecture: 3-4.
Table 1 - Critical or Key 28-30 GHz RFIC Circuit Blocks Simulated, Fabricated and Tested
Manufacturing Innovation (Technology and Processes)/Challenges being addressed: The MRL for the IBM 8HP
SiGe IC fabrication process used in ATEI’s Phase II project is 9
Potential Markets/Operational environments/Applications/End-users: missile RF Seekers; missile forward/side
looking fuse; surveillance radar; tactical radar; digital radar; MIMO radar; electronic warfare system; information
operations systems; bi-static radar; UAS or RPA sense and avoid RF sensor; RF data links; SIGINT systems;
information warfare systems; satellite mono-static or multi-static RF sensors; low visibility precision landing
sensors; compact sensing systems. Other applications include domestic RPA sense and avoid system; compact
automobile sense and avoid; high frequency WiMax; ground portable high resolution radar; unattended ground
sensor; compact sensing systems.
Systems Integration: ATEI's technology is applicable to many platforms and sponsors. These include: (1) advanced
low cost MMW radar seekers: JAGM - future upgrades, CTMS Transceiver, Small Diameter Bomb, missile or dumb
bomb fuzes; (2) advanced AESA Radars & Seekers: SM II(x), SM V(x), Tomahawk Blk IVA MMW seeker, Extended
NATO Sea Sparrow, Fighter Radars, Surveillance Radars, Tactical Radars, and UAS RF Payloads; and (3) advanced
communication: SM III Block 2/b, UAS communications. Other opportunities include: F/A-35 Joint Strike Fighter –
spec test chip perf. spec test chip perf. units
Gain 30 32.4 10 6 dB
NF 3.5 3.45 15 5 ±1.5 dB
IP1dB -30 -26.6 -5 +1 dBm
IIP3 -20 -18 5 14 dBm
S11 < -10 -15 < -10 -20.2 dB
S22 < -10 -13.5 < -10 -15.8 dB
Parameter
High Gain Low Gain
Rx RF Front-End 2 stage LNA
PA Parameter Spec / Goal
Simulated
Test Chip Perf
Measured units
Output 1 dBCP 15 (20) 14.8 17 dBm
OIP3 25 (30) 27.5 31.7 dBm
S11 < -10 -17 -30 dB
S22 < -10 -15 -15 dB
Power Amplifier Variant 2
2. DARPA SBIR/STTR Phase II Project Description
Highly Integrated Silicon Based RF Electronics
Distribution Statement A: Approved for Public Release; – Distribution is unlimited Page 2
SIGINT pod - direct conversion receiver, RPA/UAS RF radar payloads; RPA/UAS sense and avoid radar; GPS denied
and or navigational aid; LPD/LPI data links; ground based radars; airborne tactical radars
Advantages/Value: Actively Electronic Scanned Arrays (AESA) based systems use semiconductor-based
transmit/receive modules for their circuits. These systems have relied on numerous III-V MMICs and discrete
components for RF and base-band sections. Each of these blocks requires their own peripheral circuits and
numerous interfaces that drives overall array cost, size, weight and power (CSW&P). In addition, the required
transmit power per element are on the order of 10’s of Watts depending on operational frequency and range
requirements, driving the need for new or exotic materials and high performance cooling solutions to address
higher output power amplifiers and increasing LNA dissipation. The advantage of ATEI's highly integrated silicon
based RF electronics solution is that is collapses the entire RF front-end electronics consisting of numerous discrete
MMIC components, ancillary peripheral circuits, modules/boards, and associated interfaces into a single RF
integrated circuit or chip (RFIC). The elimination of numerous analog components, ancillary circuits, and associated
interfaces per element results in significant (> 10x) reductions in cost, size, weight and power (CSW& P). The single
RFIC solution also improves performance through the elimination of numerous discrete component and interfaces
which contributes to channel loss, gain variation and phase errors. This also has the added benefit of removing
additional discrete components that would be otherwise be required to calibrate out gain and phase imbalances.
The elimination of numerous discrete components and reducing the overall footprint of the T/R module ensures
on-grid integration with array elements which eliminates the need for a dilation layer between the array elements
and T/R module. This further improves CSW&P and performance by reducing transmit loss and noise figure
(improved sensitivity), respectively.
Technical and Manufacturing Risk and Mitigation: ATEI has developed an effective process to systematically
review and audit the quality of the ICs described above and daily support operations to meet customer/contract
requirements . As part of this process, we identify the required elements of each task, as well as the capabilities
necessary to perform the task, and ensure the availability of the resources required to support each task at the
highest possible standard. Each project team and all team personnel are periodically reviewed to ensure that
technical requirements and quality assurance objectives are met, with no decline in quality or performance at any
level.
Research and Development (R&D) Road Map Overview: To complete development of an RFIC T/R module for a
prototype Ka-band seeker (Tomahawk Block IV+, for example), the cost is estimated to be approx. $3M over 24
months. This activity would include transitioning circuit blocks to an actual transition platform architecture, RFIC
design, fabrication, and testing. The estimated cost reduction is approx. 30% to 50% per array element. To
perform a complete system analysis and optimally design transmit and receive circuit blocks to the new system-
level specs, including 2 fabrication spins, the design and characterization of a fully integrated Ka band transceiver
are estimated to cost approximately $5M - $6.5M over 36 months to complete.
Business model(s): Professional services; in-house system/subsystem concept, design and development;
licensing; manufacturing/fabrication.
Company Business Readiness: Since 2008, ATEI’s management and technical team has been providing advanced
technology products and services to government and industry customers with the highest business ethics and
technical standards. ATEI implements various policies, plans and procedures which include: ATEI Company Policy,
ATEI System Security Plan, ATEI Security Standard Practice Procedures and ATEI Information Security Profile. ATEI
has successfully passed government accounting and annual defense security audits by the DCAA and Defense
Security Service (DSS), respectively.
The views expressed are those of the author and do not reflect the official policy or position of the Department
of Defense or the U.S. Government.
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