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Diode Theory
Gujarat Technological University (GTU)
Branch: Electronics and Communication Engineering (ECE) Branch code : 11
Subject: Basic Electronics (3110016)
* Course would be applicable for all branches during 1st year of engineering
Types of semiconductor Materials
2
Intrinsic
Semiconductors
Extrinsic
P-type
N-type
Intrinsic Semiconductor
- Pure form of Ge and Si
- Very pure materials
- ne = nh
Types of Semiconductors
Extrinsic Semiconductor
- Impure materials
- P-type and N-type
3
“
4
P-type Semiconductors
A p-type semiconductor is an extrinsic type of
semiconductor. When a trivalent impurity (like Boron,
Aluminum etc.) is added to an intrinsic or pure
semiconductor (silicon or germanium), it is said to be a p-
type semiconductor.
Trivalent impurities such as boron (B), gallium (Ga),
indium (In), aluminum (Al) etc. are called acceptor
impurity. 5
P-type Semiconductors
⊹ p-type semiconductors are the impure or extrinsic
semiconductors.
⊹ Trivalent atoms are doped with intrinsic semiconductors to
produce p-type semiconductors.
⊹ Concentration of holes is greater than the concentration of
electrons in p-type semiconductors.
⊹ p-type semiconductors have greater conductivity than the
pure or intrinsic semiconductors.
6
N-type Semiconductors
⊹ An N-type semiconductor is a impurity mixed
semiconductor material used in electronics.
⊹ The pentavalent impure atoms
like phosphorus, arsenic, antimony or some other chemical
element are used to produce n-type semiconductors.
⊹ These impure atoms are called donor impurities because
they give free electrons to a semiconductor.
7
N-type semiconductor
⊹ n-type semiconductors are not the pure semiconductors.
They are extrinsic semiconductors.
⊹ To get n-type semiconductor, pentavalent atoms like Arsenic
(As), Phosphorus (P) are doped in an intrinsic semiconductor
like Si, Ge etc.
⊹ Majority carriers in n-type semiconductors are free electrons.
That means concentration of free electrons in n-type
semiconductor is greater than the concentration of holes.
8
9
Formation of Depletion region in PN Diode
10
11
Forward Biased Diode:
⊹ P-region is connected to positive terminal of battery and N-region is connected with
negative terminal.
⊹ Current flowing through forward biasing – IF (Forward current in few mA)
⊹ With increase in external vtg >>> Width of depletion region will reduce >>> Barrier
Potential decrease
⊹ RF = Forward resistance (10 to 100Ω )
⊹ VF = Vtg drop across the diode (0.7 for Si, 0.3 for Ge) (Due to barrier potential and
internal resistance)
12
Reverse Biased Diode:
⊹ P-region is connected to -ve terminal of battery and N-region is connected with +ve
terminal.
⊹ Current flowing through reverse biasing – IS (Reverse current in few mA)
⊹ With increase in external vtg >>> Width of depletion region will increase >>> Barrier
Potential increase
⊹ Rr = Reverse biased resistance (few 100kΩ )
Fig-A – Forward biased diode Fig – b – Reverse Biased Diode
13
Breakdown Mechanism in Reverse Biased Diode
14
15
Zener Breakdown Avalanche Breakdown
⊹ Occurs in heavily doped,
narrow depletion layers
⊹ Very strong E-field across
narrow layer (108 V/m)
⊹ Occurs due to heavy
electric field is applied
across the junction
⊹ Temp coeff -ve
⊹ Occurs in lightly doped,
wide depletion layers
⊹ E-field is not too strong
⊹ Occurs due to collision of
electrons inside PN
junction
⊹ Temp coeff +ve
16
1. How many junction/s do a diode consist?
a) 0
b) 1
c) 2
d) 3
2. If the positive terminal of the battery is connected to the anode of the
diode, then it is known as
a) Forward biased
b) Reverse biased
c) Equilibrium
d) Schottky barrier
3. During reverse bias, a small current develops known as
a) Forward current
b) Reverse current
c) Reverse saturation current
d) Active current
17
A PN junction has a thickness of the order
1.1 cm
2.1 mm
3.10-6 m
4.10-12 cm
In a semiconductor, current conduction is due to …
•Only holes
•Only free electrons
•Holes and free electrons
•None of the above
18
A forward biased pn junction diode has a resistance of the
order of
•Ω
•kΩ
•MΩ
•None of the above
A pn junction acts as a ……….
•Controlled switch
•Bidirectional switch
•Unidirectional switch
•None of the above
19
20
21
22
Ideal Diode Equations
Boltzman’s Constant
⊹ k = 1.3806 ˟ 10-23 J/K
⊹ k = 8.617 ˟ 10-5 eV/K
23
Surface Mount Diode (SMD)
24
• Surface-mount technology (SMT) is a method in
which the electrical components are mounted
directly onto the surface of a printed circuit
board (PCB).
• Surface mounting was originally called "planar
mounting"
25
26
• A small outline transistor (SOT) is a family of surface
mount transistor commonly used in consumer electronics.
• The most common SOT are SOT23 variations, also
manufacturers offer the nearly identical thin small outline
transistor (TSOT) package, where lower height is important.
SOT Package
27
Test Your knowledge on
Diode Theory
When PN junction is in forward bias, by
increasing the battery voltage -
A. Circuit resistance increases
B. Current through PN junction increases
C. Current through PN junction decreases
D. None of the above
29
1
When a PN junction is reverse biased
A. Holes and electrons tend to concentrate
towards the junction
B. The barrier tends to break down
C. Holes and electrons tend to move away
from the junction
D. None of these
30
2
A PN junction
A. Has low resistance in forward as well as
reverse directions
B. Has high resistance in forward as well as
reverse directions
C. Conductors in the forward direction only
D. Conducts in the reverse direction only
31
3
A PN junction is said to be forward-
biased when
A. The positive terminal of the battery is connected
to P-side and the negative side to the N-side
B. Junction is earthed
C. N-side is connected directly to the p-side
D. The positive terminal of the battery is connected
to N-side and the negative side to the P-side.
32
4
PN junction failure below 8 V is caused
primarily by
A. Avalanche breakdown
B. Zener breakdown
C. Either (a) or (b)
D. None of the above
33
5
How many junction/s do a diode consist?
A. 1
B. 2
C. 3
D. 0
34
6
During reverse bias, a small current
develops known as
A. Forward current
B. Reverse current
C. Reverse Saturation current
D. Zener current
35
7
If the voltage of the potential barrier is V0.
A voltage V is applied to the input, at
what moment will the barrier disappear?
A. V < V0
B. V = V0
C. V > V0
D. None
36
8
The most widely used semiconductor
material in an electronics devices is -
A. Germaniun
B. Silicon
C. Copper
D. Carbon
37
9
The leakage current of PN junction diode
is caused by -
A. Heat Energy
B. Chemical Energy
C. Barrier Potential
D. Majority carriers
38
10
The leakage current of PN junction diode
is caused by -
A. Heat Energy
B. Chemical Energy
C. Barrier Potential
D. Majority carriers
39
10
Electronics components which are made
of a semiconductor material are often
called ____ devices.
A. Silicon
B. Solid State
C. Germanium
D. Intrinsic
40
11
Any voltage that is connected across the
PN junction is called -
A. Barrier
B. Breakdown
C. Reverse
D. Bias
41
12
The area within a semiconductor diode
where no mobile current carrier exists
when it is formed is called ___ region.
A. Saturation
B. Depletion
C. Potential barrier
D. None
42
13
Major part of a current in an intrinsic
semiconductor is due to -
A. Conduction band electrons
B. Valence band electrons
C. Holes in valance bond
D. Thermally generated electrons
43
14
The process of adding impurities to a
pure semiconductor is known as -
A. Mixing
B. Refining
C. Diffusing
D. Doping
44
15
A forward resistance of a diode is
A. Few Ω
B. Few kΩ
C. Few MΩ
45
16
The arrowhead in the diode symbol
points the direction of -
A. Electron current
B. Conventional current
C. Reverse saturation current
D. None
46
17
When the diode current is large, the
bias is -
A. Forward
B. Inverse
C. Poor
D. Reverse
47
18
In reverse bias current through diode is
very ______
A. Large
B. Small
C. Moderate
D. Poor
48
19
Knee voltage of germanium diode is ____
than silicon diode.
A. Less
B. More
C. Very high
D. Can’t say
49
20
In the reverse breakdown region, the
power dissipation is -
A. Very small
B. Very high
C. Moderate
D. Can’t say
50
21
N-type silicon is obtained by doping
silicon with -
A. Germanium
B. Aluminium
C. Phosphorus
D. Boron
51
22
Consider the following type of semicondutors –
1. n-type 2. p-type
3. Intrinsic 4. Extrinsic
Which of these type of semicontuctors are
formed by doping germanium with gallium ?
A. 1 & 3
B. 2 & 4
C. 1 & 4
D. 2 & 3
52
23
Consider the following statements for PN
junction diode:
1. It is an active component
2. Depletion layer width decreases with forward
biasing
3. In reverse biasing case saturation current
increases with increasing temperature
Which of the statements given above are
correct?
A. 1 , 2 & 3
B. 1 & 2 only
C. 2 & 3 only
D. 1 & 3 only 53
24
For a germanium PN junction, the
maximum value of barrier potential is -
A. 0.3V
B. 0.7V
C. 1.3V
D. 1.7V
54
25

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Unit 1-PN junction Diode.pptx

  • 1. Diode Theory Gujarat Technological University (GTU) Branch: Electronics and Communication Engineering (ECE) Branch code : 11 Subject: Basic Electronics (3110016) * Course would be applicable for all branches during 1st year of engineering
  • 2. Types of semiconductor Materials 2 Intrinsic Semiconductors Extrinsic P-type N-type
  • 3. Intrinsic Semiconductor - Pure form of Ge and Si - Very pure materials - ne = nh Types of Semiconductors Extrinsic Semiconductor - Impure materials - P-type and N-type 3
  • 5. P-type Semiconductors A p-type semiconductor is an extrinsic type of semiconductor. When a trivalent impurity (like Boron, Aluminum etc.) is added to an intrinsic or pure semiconductor (silicon or germanium), it is said to be a p- type semiconductor. Trivalent impurities such as boron (B), gallium (Ga), indium (In), aluminum (Al) etc. are called acceptor impurity. 5
  • 6. P-type Semiconductors ⊹ p-type semiconductors are the impure or extrinsic semiconductors. ⊹ Trivalent atoms are doped with intrinsic semiconductors to produce p-type semiconductors. ⊹ Concentration of holes is greater than the concentration of electrons in p-type semiconductors. ⊹ p-type semiconductors have greater conductivity than the pure or intrinsic semiconductors. 6
  • 7. N-type Semiconductors ⊹ An N-type semiconductor is a impurity mixed semiconductor material used in electronics. ⊹ The pentavalent impure atoms like phosphorus, arsenic, antimony or some other chemical element are used to produce n-type semiconductors. ⊹ These impure atoms are called donor impurities because they give free electrons to a semiconductor. 7
  • 8. N-type semiconductor ⊹ n-type semiconductors are not the pure semiconductors. They are extrinsic semiconductors. ⊹ To get n-type semiconductor, pentavalent atoms like Arsenic (As), Phosphorus (P) are doped in an intrinsic semiconductor like Si, Ge etc. ⊹ Majority carriers in n-type semiconductors are free electrons. That means concentration of free electrons in n-type semiconductor is greater than the concentration of holes. 8
  • 9. 9
  • 10. Formation of Depletion region in PN Diode 10
  • 11. 11 Forward Biased Diode: ⊹ P-region is connected to positive terminal of battery and N-region is connected with negative terminal. ⊹ Current flowing through forward biasing – IF (Forward current in few mA) ⊹ With increase in external vtg >>> Width of depletion region will reduce >>> Barrier Potential decrease ⊹ RF = Forward resistance (10 to 100Ω ) ⊹ VF = Vtg drop across the diode (0.7 for Si, 0.3 for Ge) (Due to barrier potential and internal resistance)
  • 12. 12 Reverse Biased Diode: ⊹ P-region is connected to -ve terminal of battery and N-region is connected with +ve terminal. ⊹ Current flowing through reverse biasing – IS (Reverse current in few mA) ⊹ With increase in external vtg >>> Width of depletion region will increase >>> Barrier Potential increase ⊹ Rr = Reverse biased resistance (few 100kΩ )
  • 13. Fig-A – Forward biased diode Fig – b – Reverse Biased Diode 13
  • 14. Breakdown Mechanism in Reverse Biased Diode 14
  • 15. 15 Zener Breakdown Avalanche Breakdown ⊹ Occurs in heavily doped, narrow depletion layers ⊹ Very strong E-field across narrow layer (108 V/m) ⊹ Occurs due to heavy electric field is applied across the junction ⊹ Temp coeff -ve ⊹ Occurs in lightly doped, wide depletion layers ⊹ E-field is not too strong ⊹ Occurs due to collision of electrons inside PN junction ⊹ Temp coeff +ve
  • 16. 16 1. How many junction/s do a diode consist? a) 0 b) 1 c) 2 d) 3 2. If the positive terminal of the battery is connected to the anode of the diode, then it is known as a) Forward biased b) Reverse biased c) Equilibrium d) Schottky barrier 3. During reverse bias, a small current develops known as a) Forward current b) Reverse current c) Reverse saturation current d) Active current
  • 17. 17 A PN junction has a thickness of the order 1.1 cm 2.1 mm 3.10-6 m 4.10-12 cm In a semiconductor, current conduction is due to … •Only holes •Only free electrons •Holes and free electrons •None of the above
  • 18. 18 A forward biased pn junction diode has a resistance of the order of •Ω •kΩ •MΩ •None of the above A pn junction acts as a ………. •Controlled switch •Bidirectional switch •Unidirectional switch •None of the above
  • 19. 19
  • 20. 20
  • 21. 21
  • 23. Boltzman’s Constant ⊹ k = 1.3806 ˟ 10-23 J/K ⊹ k = 8.617 ˟ 10-5 eV/K 23
  • 24. Surface Mount Diode (SMD) 24 • Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). • Surface mounting was originally called "planar mounting"
  • 25. 25
  • 26. 26 • A small outline transistor (SOT) is a family of surface mount transistor commonly used in consumer electronics. • The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where lower height is important. SOT Package
  • 27. 27
  • 28. Test Your knowledge on Diode Theory
  • 29. When PN junction is in forward bias, by increasing the battery voltage - A. Circuit resistance increases B. Current through PN junction increases C. Current through PN junction decreases D. None of the above 29 1
  • 30. When a PN junction is reverse biased A. Holes and electrons tend to concentrate towards the junction B. The barrier tends to break down C. Holes and electrons tend to move away from the junction D. None of these 30 2
  • 31. A PN junction A. Has low resistance in forward as well as reverse directions B. Has high resistance in forward as well as reverse directions C. Conductors in the forward direction only D. Conducts in the reverse direction only 31 3
  • 32. A PN junction is said to be forward- biased when A. The positive terminal of the battery is connected to P-side and the negative side to the N-side B. Junction is earthed C. N-side is connected directly to the p-side D. The positive terminal of the battery is connected to N-side and the negative side to the P-side. 32 4
  • 33. PN junction failure below 8 V is caused primarily by A. Avalanche breakdown B. Zener breakdown C. Either (a) or (b) D. None of the above 33 5
  • 34. How many junction/s do a diode consist? A. 1 B. 2 C. 3 D. 0 34 6
  • 35. During reverse bias, a small current develops known as A. Forward current B. Reverse current C. Reverse Saturation current D. Zener current 35 7
  • 36. If the voltage of the potential barrier is V0. A voltage V is applied to the input, at what moment will the barrier disappear? A. V < V0 B. V = V0 C. V > V0 D. None 36 8
  • 37. The most widely used semiconductor material in an electronics devices is - A. Germaniun B. Silicon C. Copper D. Carbon 37 9
  • 38. The leakage current of PN junction diode is caused by - A. Heat Energy B. Chemical Energy C. Barrier Potential D. Majority carriers 38 10
  • 39. The leakage current of PN junction diode is caused by - A. Heat Energy B. Chemical Energy C. Barrier Potential D. Majority carriers 39 10
  • 40. Electronics components which are made of a semiconductor material are often called ____ devices. A. Silicon B. Solid State C. Germanium D. Intrinsic 40 11
  • 41. Any voltage that is connected across the PN junction is called - A. Barrier B. Breakdown C. Reverse D. Bias 41 12
  • 42. The area within a semiconductor diode where no mobile current carrier exists when it is formed is called ___ region. A. Saturation B. Depletion C. Potential barrier D. None 42 13
  • 43. Major part of a current in an intrinsic semiconductor is due to - A. Conduction band electrons B. Valence band electrons C. Holes in valance bond D. Thermally generated electrons 43 14
  • 44. The process of adding impurities to a pure semiconductor is known as - A. Mixing B. Refining C. Diffusing D. Doping 44 15
  • 45. A forward resistance of a diode is A. Few Ω B. Few kΩ C. Few MΩ 45 16
  • 46. The arrowhead in the diode symbol points the direction of - A. Electron current B. Conventional current C. Reverse saturation current D. None 46 17
  • 47. When the diode current is large, the bias is - A. Forward B. Inverse C. Poor D. Reverse 47 18
  • 48. In reverse bias current through diode is very ______ A. Large B. Small C. Moderate D. Poor 48 19
  • 49. Knee voltage of germanium diode is ____ than silicon diode. A. Less B. More C. Very high D. Can’t say 49 20
  • 50. In the reverse breakdown region, the power dissipation is - A. Very small B. Very high C. Moderate D. Can’t say 50 21
  • 51. N-type silicon is obtained by doping silicon with - A. Germanium B. Aluminium C. Phosphorus D. Boron 51 22
  • 52. Consider the following type of semicondutors – 1. n-type 2. p-type 3. Intrinsic 4. Extrinsic Which of these type of semicontuctors are formed by doping germanium with gallium ? A. 1 & 3 B. 2 & 4 C. 1 & 4 D. 2 & 3 52 23
  • 53. Consider the following statements for PN junction diode: 1. It is an active component 2. Depletion layer width decreases with forward biasing 3. In reverse biasing case saturation current increases with increasing temperature Which of the statements given above are correct? A. 1 , 2 & 3 B. 1 & 2 only C. 2 & 3 only D. 1 & 3 only 53 24
  • 54. For a germanium PN junction, the maximum value of barrier potential is - A. 0.3V B. 0.7V C. 1.3V D. 1.7V 54 25

Editor's Notes

  1. Ev = 1.602*10-19 Joule