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Silicon Wafer Bonding for Use
in Fuel Cells
Slobodan Petrovic, Bryan McGinnes, and Chetan Chaudhari
Arizona State University
MOTIVATION
 Support creation of manufacturing process for silicon-based
fuel cell
 Develop comprehensive methodology for polymer bond
evaluation
 Enable fast and reliable screening of candidate bonding
materials
 Designed bonding
 Develop practical products and processes
 Goal for this presentation: connect wafer bonding with
important field of energy
HYDROGEN ECONOMY: SOLAR-
HYDROGEN CYCLE
H2O H2
Fuel Cell
Electricity Generation
Transportation Stationary
Residential Commercial Industry
H2O
Storage
Electrolyser
FUEL CELLS
 Fuel cells are devices that convert chemical energy of fuel
into electricity
H+
H+
H2  2H+
+ 2e-
2H+
+ ½ O2 + 2e-
 H2O
LOAD
e-
H2
O2
CHEMICAL ENERGY
OF FUEL
ELECTRICAL ENERGY
THERMAL
ENERGY
MECHANICAL
ENERGY
Cell Reaction: 2H2 + O2 = 2H2O + Electricity + Heat
FUEL CELL CLASSIFICATION
FUEL CELL
SYSTEM
TEMPERATURE
RANGE
EFFICIENCY ELECTROLYTE APPLICATION
AREAS
Alkaline
(AFC)
60-900
C 50-60% 35-50% KOH Space
Traction
Polymer
Electrolyte
(PAFC)
50-800
C 50-60% Polymer
membrane
(Nafion, Dow)
Space
Phosphoric
Acid
(PAFC)
160-2200
C 55% H3PO4 (conc.) Dispersed power
Molten
Carbonate
(MCFC)
620-6600
C 60-65% LiCO3/Na2CO3 Power generation
Solid Oxide
(SOFC)
800-10000
C 55-65% ZrO2/Y2O3 Power generation
PEM FUEL CELLS
(CF2CF2)X - (CFCF2) -
O
(CF2CF)n- (CF2)m - SO-
3H+
CF3
Membrane material
Carbon support
Pt catalyst
H2
O2
Water
ANODE
Polymer
Electrolyte
Membrane
H+
CATHODE
Proton exchange membrane: Nafion type
Catalyst layer: Pt
Electrode substrate- backing layer: carbon
Flow field plate - carbon
Gas
channels
Gas
channels
MEMBRANE
CARBONPAPERORCLOTH
CARBONPAPERORCLOTH
FUEL CELL MARKET TIMING
 Fuel cell technology is not market ready.
 Fuel cell cost must be drastically reduced while performance
improves.
100,000
10,000
1,000
100
10
Systemprice,$/kW
2000 2010 2020 2030
Remote
Stationary
Residential
CHP
Automotive
Mass
markets
Portable
Backup
UPS
SILICON-BASED FUEL CELLS
 Silicon substrate
 High thermal conductivity
 Low density
 High corrosion resistance
 High thermal stability
 High pattern stability
 Very low gas permeability
 Adjustable electronic conductivity
 High-volume manufacturing
Proton exchange membrane: PBI
Catalyst
layer: Pt
Flow field plate - Silicon
Gas
channels
H2
H+
e-
BULK MEMBRANE
H+
e-
e-
9
SCALABILITY OF SILICON
BASED FUEL CELLS
kW range
W range
PROCESS STEPS
CH3OH
Nafion
WAFER BONDING
SIGNIFICANCE
Air in
H2 inH2 out
Air out
ANODE
CATHODE
BondingBond
Catalyst
Catalyst
MEMBRANE
Au
Au
Si
Si
Next cell
Bond
EXPERIMENTAL STRATEGY
 Bonding material requirements:
 Low-temperature curing
 Excellent dielectric properties
 Low permeability for gases
 Good mechanical properties
 No change in properties:
• Bias
• Elevated temperature
• Moisture
• Acidic environment
 Bond evaluation using Electrochemical Impedance
Spectroscopy
 “No-bias voltage” evaluation for basic bond integrity
 Evaluation under bias voltage
 Evaluation after exposure to acidic medium
 Elevated temperature
CATHODE 3H2O2 + 6e-
+ 6H+
 6H2O
ANODE CH3OH + H2O  6H+
+ 6e-
+ CO2
H+
through electrolyte
LOAD
Electrons flow round
the external circuit
POLYMER BONDING MATERIALS
Compound Supplier Chemical
type
Curing
conditions
Dielectric
Constant
Dielectric
Strength
Dissipation
factor
Volume
resistivity
Elastosil
LR3003/50
Wacker
Silicones
Division
Polydimethyl
siloxane
115°C for
1 hour
3.1 @
50Hz
23 kV /
1mm
0.003
@50Hz
5x10^15
ohm-cm
Sylgard 184 Dow
Corning
Corp
Silicone
Elastomer
at 80°C for
1.5 hours
2.65
@100Hz,
540V / mil 0.0005@100
Hz
1.2x10^14
ohm-cm
EPO-TEK
301-2
Dow
Corning
Corp
epoxy resin 80°C for
1.5 hour
3.1-3.67
@100kHz
500 V/mil, 0.012
@1kHz
2x10^12
ohm-cm
EPO-TEK
353
Dow
Corning
Corp
thixotropic
epoxy
80°C for
30 minutes
3.1 @
1kHz
18kV/mm 0.003
@1kHz
4x10^12
ohm-cm
EPO-TEK
377
Dow
Corning
Corp
high Tg,
epoxy
adhesive
150°C for
1 hour
3.36 @
1kHz
/ 0.005
@1khz
1x10^13
ohm-cm
ELECTROCHEMICAL
IMPEDANCE SPECTROSCOPY
Bode Plot
EXPERIMENTAL
Compound Res. = Measured Sample Res.
– Copper Res. – Silicon Res.
ELECTROCHEMICAL SYSTEM
EIS WITH “NO-BIAS”
Blue LR3003
Light Blue Sylgard
Green EPO-TEK301
Light Green EPO-TEK353
Red EPO-TEK377
EIS WITH BIAS VOLTAGE -
EXAMPLE
 LR3003/50
Blue 0.7V
Light Blue 0.8V
Green 0.9V
Light Green 1.0V
Red 1.1V
Light Red 1.2V
SAMPLES UNDER BIAS
0.7 V
Light Blue LR3003
Blue Sylgard
Green EPOTEK301
Light Green EPOTEK353
Red EPOTEK377
EIS UNDER BIAS AND HUMIDITY
- EXAMPLE
 EPO-TEK353
Blue No bias, no humidity
Green 0.7V bias
Light Green 1.2V bias
Red 0.7V with humidity
Light Red 1.2V with humidity
SAMPLES UNDER BIAS AND
HUMIDITY CONDITIONS
0.7 V
Blue Sylgard
Light Blue LR3003
Green EPO-TEK301
Light Green EPO-TEK353
Red EPO-TEK377
CONCLUSIONS
 First part of a comprehensive protocol was developed
 Using EIS, differences in polymer material behavior under
bias and humidity conditions were detected
 One polymer exhibited very good performance
 Two polymers showed poor performance
 PDMS materials show better performance than epoxy
materials
 EIS is a very suitable technique to study complete
properties of bond polymers for use in fuel cells
 Using this technique and expanded protocol, suitable
candidate materials can be found that will have predictable
performance when used in fuel cells
FUTURE WORK
 Continue work under bias and humidity
 Elevated temperature pressure
 Other fuels: e.g. methanol
 Mechanical testing: “pull-test”, hardness
 Permeability testing
 Polymer decomposition
 Equivalent circuit model for wafer bond
 Designed bonding

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Si wafer bonding for use in fuel cells

  • 1. Silicon Wafer Bonding for Use in Fuel Cells Slobodan Petrovic, Bryan McGinnes, and Chetan Chaudhari Arizona State University
  • 2. MOTIVATION  Support creation of manufacturing process for silicon-based fuel cell  Develop comprehensive methodology for polymer bond evaluation  Enable fast and reliable screening of candidate bonding materials  Designed bonding  Develop practical products and processes  Goal for this presentation: connect wafer bonding with important field of energy
  • 3. HYDROGEN ECONOMY: SOLAR- HYDROGEN CYCLE H2O H2 Fuel Cell Electricity Generation Transportation Stationary Residential Commercial Industry H2O Storage Electrolyser
  • 4. FUEL CELLS  Fuel cells are devices that convert chemical energy of fuel into electricity H+ H+ H2  2H+ + 2e- 2H+ + ½ O2 + 2e-  H2O LOAD e- H2 O2 CHEMICAL ENERGY OF FUEL ELECTRICAL ENERGY THERMAL ENERGY MECHANICAL ENERGY Cell Reaction: 2H2 + O2 = 2H2O + Electricity + Heat
  • 5. FUEL CELL CLASSIFICATION FUEL CELL SYSTEM TEMPERATURE RANGE EFFICIENCY ELECTROLYTE APPLICATION AREAS Alkaline (AFC) 60-900 C 50-60% 35-50% KOH Space Traction Polymer Electrolyte (PAFC) 50-800 C 50-60% Polymer membrane (Nafion, Dow) Space Phosphoric Acid (PAFC) 160-2200 C 55% H3PO4 (conc.) Dispersed power Molten Carbonate (MCFC) 620-6600 C 60-65% LiCO3/Na2CO3 Power generation Solid Oxide (SOFC) 800-10000 C 55-65% ZrO2/Y2O3 Power generation
  • 6. PEM FUEL CELLS (CF2CF2)X - (CFCF2) - O (CF2CF)n- (CF2)m - SO- 3H+ CF3 Membrane material Carbon support Pt catalyst H2 O2 Water ANODE Polymer Electrolyte Membrane H+ CATHODE Proton exchange membrane: Nafion type Catalyst layer: Pt Electrode substrate- backing layer: carbon Flow field plate - carbon Gas channels Gas channels MEMBRANE CARBONPAPERORCLOTH CARBONPAPERORCLOTH
  • 7. FUEL CELL MARKET TIMING  Fuel cell technology is not market ready.  Fuel cell cost must be drastically reduced while performance improves. 100,000 10,000 1,000 100 10 Systemprice,$/kW 2000 2010 2020 2030 Remote Stationary Residential CHP Automotive Mass markets Portable Backup UPS
  • 8. SILICON-BASED FUEL CELLS  Silicon substrate  High thermal conductivity  Low density  High corrosion resistance  High thermal stability  High pattern stability  Very low gas permeability  Adjustable electronic conductivity  High-volume manufacturing Proton exchange membrane: PBI Catalyst layer: Pt Flow field plate - Silicon Gas channels H2 H+ e- BULK MEMBRANE H+ e- e-
  • 9. 9 SCALABILITY OF SILICON BASED FUEL CELLS kW range W range
  • 11. WAFER BONDING SIGNIFICANCE Air in H2 inH2 out Air out ANODE CATHODE BondingBond Catalyst Catalyst MEMBRANE Au Au Si Si Next cell Bond
  • 12. EXPERIMENTAL STRATEGY  Bonding material requirements:  Low-temperature curing  Excellent dielectric properties  Low permeability for gases  Good mechanical properties  No change in properties: • Bias • Elevated temperature • Moisture • Acidic environment  Bond evaluation using Electrochemical Impedance Spectroscopy  “No-bias voltage” evaluation for basic bond integrity  Evaluation under bias voltage  Evaluation after exposure to acidic medium  Elevated temperature CATHODE 3H2O2 + 6e- + 6H+  6H2O ANODE CH3OH + H2O  6H+ + 6e- + CO2 H+ through electrolyte LOAD Electrons flow round the external circuit
  • 13. POLYMER BONDING MATERIALS Compound Supplier Chemical type Curing conditions Dielectric Constant Dielectric Strength Dissipation factor Volume resistivity Elastosil LR3003/50 Wacker Silicones Division Polydimethyl siloxane 115°C for 1 hour 3.1 @ 50Hz 23 kV / 1mm 0.003 @50Hz 5x10^15 ohm-cm Sylgard 184 Dow Corning Corp Silicone Elastomer at 80°C for 1.5 hours 2.65 @100Hz, 540V / mil 0.0005@100 Hz 1.2x10^14 ohm-cm EPO-TEK 301-2 Dow Corning Corp epoxy resin 80°C for 1.5 hour 3.1-3.67 @100kHz 500 V/mil, 0.012 @1kHz 2x10^12 ohm-cm EPO-TEK 353 Dow Corning Corp thixotropic epoxy 80°C for 30 minutes 3.1 @ 1kHz 18kV/mm 0.003 @1kHz 4x10^12 ohm-cm EPO-TEK 377 Dow Corning Corp high Tg, epoxy adhesive 150°C for 1 hour 3.36 @ 1kHz / 0.005 @1khz 1x10^13 ohm-cm
  • 15. EXPERIMENTAL Compound Res. = Measured Sample Res. – Copper Res. – Silicon Res.
  • 17. EIS WITH “NO-BIAS” Blue LR3003 Light Blue Sylgard Green EPO-TEK301 Light Green EPO-TEK353 Red EPO-TEK377
  • 18. EIS WITH BIAS VOLTAGE - EXAMPLE  LR3003/50 Blue 0.7V Light Blue 0.8V Green 0.9V Light Green 1.0V Red 1.1V Light Red 1.2V
  • 19. SAMPLES UNDER BIAS 0.7 V Light Blue LR3003 Blue Sylgard Green EPOTEK301 Light Green EPOTEK353 Red EPOTEK377
  • 20. EIS UNDER BIAS AND HUMIDITY - EXAMPLE  EPO-TEK353 Blue No bias, no humidity Green 0.7V bias Light Green 1.2V bias Red 0.7V with humidity Light Red 1.2V with humidity
  • 21. SAMPLES UNDER BIAS AND HUMIDITY CONDITIONS 0.7 V Blue Sylgard Light Blue LR3003 Green EPO-TEK301 Light Green EPO-TEK353 Red EPO-TEK377
  • 22. CONCLUSIONS  First part of a comprehensive protocol was developed  Using EIS, differences in polymer material behavior under bias and humidity conditions were detected  One polymer exhibited very good performance  Two polymers showed poor performance  PDMS materials show better performance than epoxy materials  EIS is a very suitable technique to study complete properties of bond polymers for use in fuel cells  Using this technique and expanded protocol, suitable candidate materials can be found that will have predictable performance when used in fuel cells
  • 23. FUTURE WORK  Continue work under bias and humidity  Elevated temperature pressure  Other fuels: e.g. methanol  Mechanical testing: “pull-test”, hardness  Permeability testing  Polymer decomposition  Equivalent circuit model for wafer bond  Designed bonding