Wire bonding is used to electrically interconnect integrated circuits to packages so they can be handled, tested, and used in electronic products. There are two main types of wire bonding: ball bonding and wedge bonding. Ball bonding uses a capillary tool to form a ball bond on the chip and substrate, while wedge bonding uses a wedge tool. Wire bonding allows for high-speed, economical connections and is the most common interconnection method. It enables signals and power to be distributed from the packaged IC to the rest of the system while also providing mechanical support and environmental protection.

1. WIRE BONDING
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2. Why Wire Bonding?
 Enable an IC to be electrically interconnected
to the package, and to allow that IC to be
handled, tested and “burnt-in”
 Such “qualified” IC used in electronic
product.
 Interconnected to other ICs, passives, flat
panel displays, keyboards, sensors,
connectors, antennas, switches, etc.
 PRIMARY purpose – enable ICs to be
interconnected with rest of the system.
 Primary functions of IC assembly:
(1) To provide signal and power distribution of
the packaged IC to the system. Another way to bonding: Tape
automated bonding (TAB)
(2) To provide mechanical support to fragile IC Flip chip
(3) To provide environmental protection of the
IC

3. Introduction
 Used in interconnecting the Die to various substrates
 … The most popular interconnection method
 Wire bonding is a SOLID phase welding process where the
two metallic materials, a thin wire and the metallization on
Pad surface are brought into intimate contact under a
combination of heat, pressure, and/or ultrasonic energy…..

4. Types of Wire Bonding
 Wire bonding is made using two types of tools:
 A Wedge- Called Wedge bonding
 B: Capillary- Called ball bonding
 Very inexpensive- A penny per pin

5. Bonding Tools

6. Ball Bonding
 Process Steps
 Capillary loaded with Au wire
 EFO wand generates a spark to melt the Au wire at the
tip
 Apply pressure and ultrasonic energy, heat to form ball
bond at bond pad on chip side
 Bonding on substrate pad
 Loop formation
 Package bond pad formation by stitch bonding
 Wire break-off to finish process

10. Wedge Bonding

11. Al Is More Suitable For Wedge
Bonding

12.  Process Steps
 Wedge tool loaded
with wire
 Apply pressure and
ultrasonic energy to
form wedge
 Bonding on substrate
pad
 Loop formation
 Package bond pad
formation
 Wire break-off to
finish process

14. Features of Wire Bonding Method
 High speed( Bonding time 40ms: 2-4 wires/ sec)
 Economical
 Strong bond
 Larger Bonding pad (0,2mm gold wire: 0,5*0,5 mm
pad)
 Ultrasonic can be used

15. (Dis)advantages
 The advantages of wirebonding:
 Highly flexible chip-to-package interconnection process
 Low defect rates or high yield interconnection processing
 Easily programmed
 High reliability interconnection structure
 Very large industry infrastructure supporting the technology
 Rapid advances in equipment, tools, and material technology
 The disadvantages of wirebonding:
 Slower interconnection rates due to point-to-point processing
of each wirebond
 Long chip-to-package interconnection lengths, degrading
electrical performance
 Larger footprint required for chip to package interconnection

16. Summary
 Function of Wire Bonding
 Types of Wire Bonding
 Ball Bonding
 Wedge Bonding
 Advantages and Disadvantages

17. References
 Wikipedia
 http://en.wikipedia.org/wiki/Wire_bonding
 http://en.wikipedia.org/wiki/Ball_bonding
 Youtube
 http://r1---sn-o097zuel.c.youtube.com/videoplayback

18. THANK YOU FOR LISTENING !
Nano- Electronic
Materials
Group-HUST