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NanoFone
Microphone Company
2 July, 2019
Executive Summary
• NanoFone Limited is a UK company established in 2017 to commercialize
MEMS microphone technology breakthrough at Bilkent University, Turkey to
address the rapidly growing mobile microphone market
• NanoFone is a fabless company
• Prototype of NanoFone MCM (MicroMachined Capacitive Microphone) is
based on new MEMS electroacoustic transduction technology and has been
demonstrated to have far superior specifications compared to the existing
MEMS and electret based products
• Higher SNR
• Smaller footprint
• Robust product due to sealed technology
• Lower cost, die production, testing, packagimg
• Addressable OEM markets for NanoFone includes; mobile phones; smart
speakers (Amazon Echo; Google Home; headphones with total market size
approximately 7.5bn units)
• Technology is protected by 2 patents (one allowed, one application), at
present
• NanoFone’s shareholders include world class academics and a serial
entrepreneur. Nanofone
MCM die
Bilkent University Technopark
NanoFone IP on MCM
• Issue Date: May 7, 2019
• PCT pending
• Sealed gap
• Circular geometry-best sensitivity per
area
• Specified for best sensitivity: radius,
membrane thickness, gap height, for all
materials and combinations
• Entire useful dimension space covered
• Method claims ext.(continuation):
• March 2019
HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONEUS
U.S. Pat. No: 10,284,963
tg
100 110
120
130140
150 α
ti2
ti1
tm te
0.01
0.1
1
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
a_n_min
Vdc/Vc
Fb/Fg
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.01
0.1
1
10
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
tm_n_min
Vdc/Vc
Fb/Fg
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
1
2
3
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7
8
9
10
11
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
tge_n
Fb/Fg
tge_n
IP ownership for all shapes
• U.S. and PCT Pending
• square, regular convex polygons,
ellipse, rectangle and elliptic convex
polygons covered (inferior to circle)
• Useful dimension space covered
• Rules and principles for scaling
HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE WITH VARIOUS GAP
GEOMETRIES
US App.# 16241164 -January 2019
a2 (or ae2)
r41
r42
a1 (or ae1)
r82
r81
200
210
220
0
1
2
3
4
5
6
7
8
1 2 3 4 5 6 7 8 9 10
a2/a
a2/a1
ellipsearea/seedcirclearea
a1/a
NanoFone SNR and LNA SOLUTION
• Produced in CMOS IC process = Lowest production cost
• SNR is inherently high because NO AIR FRICTION and NO SQUEZEE FILM:
• the gap is vacuum, not pressure compensated:
• air can not move in &out of the gap as membrane vibrates and no squeeze film effect
• both ECM (electret) and MEMS microphones are pressure compensated
• High self-noise because of air friction, while air moves in and out of the gap
• SNR limited by the preamplifier noise (not by the microphone)
• Highest SNR Levels of commercial microphones is possible with existing COTS LNA:
• the electronic noise of preamp is insignificant compared to the noise of MEMS mics and ECM
• CMOS VLNA (Very Low Noise Amp) designs for < 20kHz is possible and we
implemented on the die
• Very high SNR (> 75 dB) is possible, with larger footprint
NanoFone - additional advantages
• IP = Ingress Proof (not protection!)
• Sealed gap: ingress proof, water proof
• Waterproof or Water-resistant?
• None of contender technologies are waterproof: none covered by warranty
• Some are IP67: water resistance are defined by the producer
• Piezotechnology (VESPER): requires approx. 1 day drying process
• Very small minimum area requirement
• 0.032 mm2 sensor minimum footprint for 14V operation
• Footprint - performance trade-off
• Waterborne microphony (or hydrophony) as well as airborne microphony
• Beamforming to receive signals at very long range
• Noise & interference cancellation in low noise environments
Manufacturing NanoFone
• In CMOS IC Processes, electronics on the same die
• Minimum post-processing
• Device has simple geometry- no special processes required
• Expected yield is close to 100% due to simple geometry and sealed gap
• No need for intricate packaging
• Wafer level packaging
• Sealed vacuum gap
• Shielded die
• No need for front and back chamber in the package
Addressable Microphone market size
• Mature, competitive market with strong and well trenched contenders
• NanoFone - strong differentiation with potential to disrupt market ;
• Very high SNR
• Sealed gap
• Important to enter the market as a well funded serious player
Market Positioning
Nanofone Product Status
• Prototype manufactured 2016:
• large size – 2 mm radius, 80 mm thick
membrane, 6.5 mm deep gap
• designed for other purpose
(transmission)
• very low loss
• exploitation of charging on insulator
layer, SiO
• Second generation proof-of-concept
prototype 2017
• 72V design: 564 mm radius (1mm sq), 16
mm thick plate, 4.3 mm deep gap
• 6 masks, 4” wafer
• Etching, Depostion (insulator,
metal:Cr+Pt+Au), bonding, etching,
dicing, testing
• No custom LNA: measurements with
COTS electronics
Nanofone
first microphone
(MCM) Mask and
samples
Verification of concept:
Sensitivity and THD measurements
• Characterization:
• impedance measurements
• Resonance frequency
• Sensitivity measurements
• THD measurements
Manufacturability in CMOS IC process
• MCM + electronics on the die
• Minimum post processing
• Very low cost
Design for production in a 0.6mm CMOS shuttle run
• 15 V bias voltage
• SNR > 62 dB
• On March 2019 shuttle
• Samples available: July
2019
• MCM and low noise
preamp on the die
• 1.8 mm2 die
• Searching for other
suitable CMOS
processes
First Commercial Product Features & Specs
Based on present practice:
• Produced in 0.6mm CMOS IC process, electronics on the die
• 6” wafer, approx. 5700 die/wafer
• Analog Microphone: MEMS + Preamp+ Voltage converter
• 10-14 V bias voltage
• SNR > 60 dB for 1mm sq. footprint
• higher SNR for larger footprint
• very small min. microphone area for lower SNR
• Minimal packaging: e.g. no back or front chamber requirement (bottom port)
• IP = Ingress Proof (not protection!)
• Sealed gap: ingress proof, water proof
Yavuz Ahiska PhD : Board Member
□ Serial entrepreneur; 8 start ups, 7 have achieved world class successes;
□ Co-founded 3Dlabs Inc; 3D chips pioneer ; ex-NASDAQ listed TDDDF ; sold for $170M with 176 patents
□ Founded Approxy Inc in CA in 2012 ; Cloud Gaming technology; Sold to Numecent Inc, 6 patents
□ Co-Founded Stericool Ltd manufacturer of advance plasma sterilizers; sold to Getinge in 2015 for €7m; 3 US patents
□ Founded Grandeye Ltd, UK, pioneer of 360 deg Camera (2008 CES Las Vegas most innovative product), 24 patents
□ visiOprime Ltd, UK ; Network is the CCTV; sold it to Honeywell for $9.3m
□ Co-founded DoguTip, to provide medical imaging services ; sold to Gulf Capital for €9m
□ benchMark Technologies: pioneer of 2D imaging in creative arts ( techniology behind Roger Rabit film) sold to DuPont for US $12M in 1988,75 patents
Hayrettin Köymen, PhD – President CEO
□ Principal Inventor of Nanofone technology
□ Professor of electronics, Bilkent University, Ankara, Turkey, since 1990.
□ Worked in Marine Sciences Institute (Mersin) and EEE Dept. (Ankara ) of METU, 1979-1990, and in EEE Department of Bilkent
university Founded Kardiosis Ltd n 1988, which pioneered PC based ECG i. Kardiosis became market leader in Turkey in 1998 and
captured market share in EU; Sold his shares in 1998 in an exit
□ Koymen carried out many large scale research and engineering projects in fields including transduction, oceanography underwater
acoustics, biomedical instrumentation, communications, ultrasonic imaging.
Abdullah Atalar PhD : Board Member
□ Rector of Bilkent University
□ M.S. and Ph.D. degrees in EE from Stanford University, Stanford, CA, in 1976 and 1978 , respectively
□ Founded the EE Eng. Department in 1986 and served as a Professor since; special interest in micromachined devices and microwave electronics.
□ Visiting Professor of Stanford University during 1995
□ Fellow of IEEE. He was awarded the Science Award of TUBITAK in 1994
□ Assistant Professor at the faculty of the Middle East Technical University From 1980 to 1986
□ Hewlett Packard Labs, Palo Alto in 1979 -1980
Nanofone Board members
Nanofone Technical Team
• Prof Hayrettin Koymen – CEO, CTO
• MSc EEE - design, simulation, production, testing
• PhD ME - production
• MSc EEE - SW, simulation, testing, admin
• PhD EEE - simulation, production, testing
__________
• Prof Abdullah Atalar (Technical advisory)
Thank You

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Nanofone Microphone Company

  • 2. Executive Summary • NanoFone Limited is a UK company established in 2017 to commercialize MEMS microphone technology breakthrough at Bilkent University, Turkey to address the rapidly growing mobile microphone market • NanoFone is a fabless company • Prototype of NanoFone MCM (MicroMachined Capacitive Microphone) is based on new MEMS electroacoustic transduction technology and has been demonstrated to have far superior specifications compared to the existing MEMS and electret based products • Higher SNR • Smaller footprint • Robust product due to sealed technology • Lower cost, die production, testing, packagimg • Addressable OEM markets for NanoFone includes; mobile phones; smart speakers (Amazon Echo; Google Home; headphones with total market size approximately 7.5bn units) • Technology is protected by 2 patents (one allowed, one application), at present • NanoFone’s shareholders include world class academics and a serial entrepreneur. Nanofone MCM die Bilkent University Technopark
  • 3. NanoFone IP on MCM • Issue Date: May 7, 2019 • PCT pending • Sealed gap • Circular geometry-best sensitivity per area • Specified for best sensitivity: radius, membrane thickness, gap height, for all materials and combinations • Entire useful dimension space covered • Method claims ext.(continuation): • March 2019 HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONEUS U.S. Pat. No: 10,284,963 tg 100 110 120 130140 150 α ti2 ti1 tm te 0.01 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 a_n_min Vdc/Vc Fb/Fg 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.01 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 tm_n_min Vdc/Vc Fb/Fg 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 1 2 3 4 5 6 7 8 9 10 11 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 tge_n Fb/Fg tge_n
  • 4. IP ownership for all shapes • U.S. and PCT Pending • square, regular convex polygons, ellipse, rectangle and elliptic convex polygons covered (inferior to circle) • Useful dimension space covered • Rules and principles for scaling HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE WITH VARIOUS GAP GEOMETRIES US App.# 16241164 -January 2019 a2 (or ae2) r41 r42 a1 (or ae1) r82 r81 200 210 220 0 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 10 a2/a a2/a1 ellipsearea/seedcirclearea a1/a
  • 5. NanoFone SNR and LNA SOLUTION • Produced in CMOS IC process = Lowest production cost • SNR is inherently high because NO AIR FRICTION and NO SQUEZEE FILM: • the gap is vacuum, not pressure compensated: • air can not move in &out of the gap as membrane vibrates and no squeeze film effect • both ECM (electret) and MEMS microphones are pressure compensated • High self-noise because of air friction, while air moves in and out of the gap • SNR limited by the preamplifier noise (not by the microphone) • Highest SNR Levels of commercial microphones is possible with existing COTS LNA: • the electronic noise of preamp is insignificant compared to the noise of MEMS mics and ECM • CMOS VLNA (Very Low Noise Amp) designs for < 20kHz is possible and we implemented on the die • Very high SNR (> 75 dB) is possible, with larger footprint
  • 6. NanoFone - additional advantages • IP = Ingress Proof (not protection!) • Sealed gap: ingress proof, water proof • Waterproof or Water-resistant? • None of contender technologies are waterproof: none covered by warranty • Some are IP67: water resistance are defined by the producer • Piezotechnology (VESPER): requires approx. 1 day drying process • Very small minimum area requirement • 0.032 mm2 sensor minimum footprint for 14V operation • Footprint - performance trade-off • Waterborne microphony (or hydrophony) as well as airborne microphony • Beamforming to receive signals at very long range • Noise & interference cancellation in low noise environments
  • 7. Manufacturing NanoFone • In CMOS IC Processes, electronics on the same die • Minimum post-processing • Device has simple geometry- no special processes required • Expected yield is close to 100% due to simple geometry and sealed gap • No need for intricate packaging • Wafer level packaging • Sealed vacuum gap • Shielded die • No need for front and back chamber in the package
  • 9. • Mature, competitive market with strong and well trenched contenders • NanoFone - strong differentiation with potential to disrupt market ; • Very high SNR • Sealed gap • Important to enter the market as a well funded serious player Market Positioning
  • 10. Nanofone Product Status • Prototype manufactured 2016: • large size – 2 mm radius, 80 mm thick membrane, 6.5 mm deep gap • designed for other purpose (transmission) • very low loss • exploitation of charging on insulator layer, SiO • Second generation proof-of-concept prototype 2017 • 72V design: 564 mm radius (1mm sq), 16 mm thick plate, 4.3 mm deep gap • 6 masks, 4” wafer • Etching, Depostion (insulator, metal:Cr+Pt+Au), bonding, etching, dicing, testing • No custom LNA: measurements with COTS electronics Nanofone first microphone (MCM) Mask and samples
  • 11. Verification of concept: Sensitivity and THD measurements • Characterization: • impedance measurements • Resonance frequency • Sensitivity measurements • THD measurements
  • 12. Manufacturability in CMOS IC process • MCM + electronics on the die • Minimum post processing • Very low cost Design for production in a 0.6mm CMOS shuttle run • 15 V bias voltage • SNR > 62 dB • On March 2019 shuttle • Samples available: July 2019 • MCM and low noise preamp on the die • 1.8 mm2 die • Searching for other suitable CMOS processes
  • 13. First Commercial Product Features & Specs Based on present practice: • Produced in 0.6mm CMOS IC process, electronics on the die • 6” wafer, approx. 5700 die/wafer • Analog Microphone: MEMS + Preamp+ Voltage converter • 10-14 V bias voltage • SNR > 60 dB for 1mm sq. footprint • higher SNR for larger footprint • very small min. microphone area for lower SNR • Minimal packaging: e.g. no back or front chamber requirement (bottom port) • IP = Ingress Proof (not protection!) • Sealed gap: ingress proof, water proof
  • 14. Yavuz Ahiska PhD : Board Member □ Serial entrepreneur; 8 start ups, 7 have achieved world class successes; □ Co-founded 3Dlabs Inc; 3D chips pioneer ; ex-NASDAQ listed TDDDF ; sold for $170M with 176 patents □ Founded Approxy Inc in CA in 2012 ; Cloud Gaming technology; Sold to Numecent Inc, 6 patents □ Co-Founded Stericool Ltd manufacturer of advance plasma sterilizers; sold to Getinge in 2015 for €7m; 3 US patents □ Founded Grandeye Ltd, UK, pioneer of 360 deg Camera (2008 CES Las Vegas most innovative product), 24 patents □ visiOprime Ltd, UK ; Network is the CCTV; sold it to Honeywell for $9.3m □ Co-founded DoguTip, to provide medical imaging services ; sold to Gulf Capital for €9m □ benchMark Technologies: pioneer of 2D imaging in creative arts ( techniology behind Roger Rabit film) sold to DuPont for US $12M in 1988,75 patents Hayrettin Köymen, PhD – President CEO □ Principal Inventor of Nanofone technology □ Professor of electronics, Bilkent University, Ankara, Turkey, since 1990. □ Worked in Marine Sciences Institute (Mersin) and EEE Dept. (Ankara ) of METU, 1979-1990, and in EEE Department of Bilkent university Founded Kardiosis Ltd n 1988, which pioneered PC based ECG i. Kardiosis became market leader in Turkey in 1998 and captured market share in EU; Sold his shares in 1998 in an exit □ Koymen carried out many large scale research and engineering projects in fields including transduction, oceanography underwater acoustics, biomedical instrumentation, communications, ultrasonic imaging. Abdullah Atalar PhD : Board Member □ Rector of Bilkent University □ M.S. and Ph.D. degrees in EE from Stanford University, Stanford, CA, in 1976 and 1978 , respectively □ Founded the EE Eng. Department in 1986 and served as a Professor since; special interest in micromachined devices and microwave electronics. □ Visiting Professor of Stanford University during 1995 □ Fellow of IEEE. He was awarded the Science Award of TUBITAK in 1994 □ Assistant Professor at the faculty of the Middle East Technical University From 1980 to 1986 □ Hewlett Packard Labs, Palo Alto in 1979 -1980 Nanofone Board members
  • 15. Nanofone Technical Team • Prof Hayrettin Koymen – CEO, CTO • MSc EEE - design, simulation, production, testing • PhD ME - production • MSc EEE - SW, simulation, testing, admin • PhD EEE - simulation, production, testing __________ • Prof Abdullah Atalar (Technical advisory)