Nanofone - Industry's First CMOS COMPATIBLE Microphone

1. presents
industry’s first CMOS COMPATIBLE microphone
August 2020

2. Small Size / Minimal Packaging
2
MEMS microphone
0.5mm
Requires front and back chamber
Metal housing required
Wire bonding required
No front or back chamber
No need for metal housing
No need for wire bonding
Front Chamber
Back Chamber 1mm
Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

3. Improved SNR
3
Noise Sources:
• Electronic
 Limited by Electronic noise which can
be further improved
 Lower electronic noise → Higher
SNR
Noise Sources:
• Acoustic (due to air friction through vent holes)
• Electronic
 Limited by Acoustic noise!
MEMS microphone Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd
0.5mm

4. Watertight & Ingress-proof
4
MEMS microphone
Vent holes
Perforated membrane & backplate
Prone to air friction noise
Open to water and ingress
contamination
No vent hole or perforations
No pressure compensation
No air flow
No acoustic noise
Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

5. Monolithic Structure
5
Sensor and Electronics
fabricated in CMOS foundry
(Requires some additional post-processing)
Sensor fabricated in MEMS
foundry, electronics fabricated in
CMOS foundry
MEMS microphone
XC06 Process
Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

6. Mic-in-CMOS Post-Processing
6
FabricateStructurein CMOS
ClearEtch Holes
Etch Gap
SealUnderVacuum
Proprietary & confidential Copyright 2020 Nanofone Ltd

7. Scalable for optimum performance
7
Matrix structureFixed size for each model
5 x 5 7 x 7 11 x 11
MEMS microphone
Larger area → More sensitivity
Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

8. On-Die EMI / EMC
8
A built-in Faraday cage using
CMOS metal layers
Metal cap required for EMI/EMC
protection
MEMS microphone Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

9. Production Cost Comparison
9
ASIC Die Cost
MEMS Die Cost
Wirebonding
Packaging Cost
Test & Calibration Cost
Yield Losses Cost
Monolithic Sensor & Electronics
No Wirebonding
Low Packaging Cost
Low Test & Calibration Cost
High Yield due to Simple Design
COSTS
MEMS
microphone Mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd

10. 10
 Small Size
 Watertight & Ingressproof
 SNR (Electronic Limited)
 CMOS compatible (Monolithic)
 Device ready in several post-processing steps
 Scalable
 On-Die EMI / EMC
 Minimal Packaging
 Reduced Fabrication Cost
Analytically Proven Optimum Solution
 Low Power Consumption via Electret-mic-in-CMOS
Proprietary & confidential Copyright 2020 Nanofone Ltd
Microphone-in-CMOS

11. IPR Protection
Proprietary & confidential Copyright 2020 Nanofone Ltd

12. is actively seeking
corporate research partners to further
develop its Mic-in-CMOS
Contact: Yavuz Ahıska
yahiska@nanofone.co.uk