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© 2009 Foundry, Ltd.

1
1
Nov. Mickey Ken
Technology Benchmark
- Benefit Foundry Platform Solutions
Advanced Foundry Platform Program
© 2009 Foundry, Ltd.
2 Nov. Mickey Ken
Contents
l  Overview – Value Chain
l  Challenge – Virtual Integration
l  Strategy – Engage and Focus
l  Mission and Responsibility
l  Deliverables - Encompass E2E Values
l  Future Perspectives
© 2009 Foundry, Ltd.
3 Nov. Mickey Ken
Overview
- Value chain of semiconductor
Material
& Equip.
Device &
Interconn.
IP/LIB &
Si-Chip
Electronics
Product
End-User
& Society
l  Foundry covers half or more of the Si E2E eco-value chains
l  Ought not to do Technology Benchmark in the silo
* Si, Ge * Planar CMOS * SRAM/ROM * Computer * Business
* III-V(GaAs, InP) * FinFET - Ion/Ioff * Combination Logic * Communication * Government
* HiK/MG * Strain-Si * Sequential Logic * Consumer * Military
* ELK, XLK * Hi Mobility * JEDEC Test Chip * Industrial * Automotive
* Immersion Litho * Cu interconnect * Arm-9/-11 * Special * Education
* ALDVCD * DSP, GPU … * Green * Medical
© 2009 Foundry, Ltd.
4 Nov. Mickey Ken
Coming Challenge
- How to extend virtual integration powers?
l  Whole Electronics Industrial including upstream partners
totaled 2.8% world GDP in 2007. Growth in future?
Electronics Industrial
- $1,500 B
System & Services
- $6,300 B
Semiconductors
- $256 B
Material & Equip.
- $85 B
2007
World GDP
$64,900 B
How can we
grow the
Electronics
Industrial higher
or greener?
(Source: Public)
© 2009 Foundry, Ltd.
5 Nov. Mickey Ken
Strategy for Benchmark – 1stD
- Enhancing internal communications
Computer
20/22 nm
16/14 nm
R&D
MAFD
SFP
Region
Office
Industrial
Communi-
cation
Consumer
Technology
Benchmark
DTP
l  Keep rolling to team up with relevant internal business units
- Areas or Div.s
© 2009 Foundry, Ltd.
6 Nov. Mickey Ken
Strategy for Benchmark – 2ndD
- Engaging external proactively
l  Enhance external engagements and collaborations, ranging
from Customer, competitor, agent, consortium and more ….
SIA/ITRS
Customer
Competitor
Forum
IPRS
ISSCC
VLSI
Symp.
Consortiums
(iNEMI)
IMEC
Technology
Benchmark
SI/CW
ServicesIEDM
Technology
Roadshow
© 2009 Foundry, Ltd.
7 Nov. Mickey Ken
Direction to Go
Strategy for Benchmark – 3rdD
- Focus on leading-edge Initiatives Globally
© 2009 Foundry, Ltd.
8 Nov. Mickey Ken
Mission and Responsibility
- Enhancing Trinity and collaborations
Missions
l Benchmark with the perfection
n  Enhance technology leadership
l Direct toward the right technology/product
n  Facilitate timely manufacturing excellence
l Tap customer’s experiences into business models
n  Raise values toward the eco-system end-customers
(customer’s customers)
© 2009 Foundry, Ltd.
9 Nov. Mickey Ken
Mission and Responsibility (Cont’d)
- Enhancing Trinity and collaborations
Responsibility
l Coordinate with other Div.s/Areas
n  Provide technology insights and perspective views for successful
business/technology platform development
l Collaborate academically with external entities or
even 1st-tier competitors (IBM, Intel …)
n  Share and exchange limited specifications of future technology
platforms (N+1 or N+2)
n  Entities - IEEE/IEDM&VLSI, IPRS, SIA, iNEMI, SEMI, IMEC,
SI, CW and …
l Leverage more with selected customers
n  Learn about the right technology specifications and offer
customers more values by future technology platforms
© 2009 Foundry, Ltd.
10 Nov. Mickey Ken
Material
& Equip.
Device &
Interconn.
IP/LIB &
Si-Chip
Electronics
Product
End-User
& Society
l  Virtual integration covers beyond half of the value chain
l  Strive to do E2E Technology Benchmark with values
* Si, Ge * Planar CMOS * SRAM/ROM * Computer * Business
* III-V(GaAs, InP) * FinFET - Ion/Ioff * Combination Logic * Communication * Government
* HiK/MG * Strain-Si * Sequential Logic * Consumer * Military
* ELK, XLK * Hi Mobility * JEDEC Test Chip * Industrial * Automotive
* Immersion Litho * Cu interconnect * Arm-9/-11 * Special * Education
* ALDVCD * DSP, GPU … * Green * Medical
Deliverables
- Encompass End-to-End (E2E) value chain
© 2009 Foundry, Ltd.
11 Nov. Mickey Ken
Summary and Perspectives
- Co-petition and Value Propositions
Current Focus
l  Start benchmarks with leading-edge technologies
n  Material/equipment, process, device, system and IP/LIB
l  Team up and work with RD, DTP, BD and WWSM
n  Identify most valuable technical items and KPI to formulate right
deliverables with value propositions
n  Engage or collaborate with selected customers or private sources
l  Low hanging fruit intelligence first
n  IEEE/IEDM&VLSI, IPRS, SIA, IMEC, SI, CW and …. more
© 2009 Foundry, Ltd.
12 Nov. Mickey Ken
Summary and Perspectives (Cont’d)
- Co-petition and value Propositions
Future Perspectives
l  Leverage more with selected customers
n  Understand competitor’s strength and right technology specifications
l  Enhance more external collaborations
n  Include customer, agent and consortiums, such as, SIA, SEMI, IMEC and
iNEMI …etc.
l  Set up co-petition forum academically even with 1st-tier competitors
n  Exchange key specs of future technologies (N+1 or N+2) including IBM,
Intel or Samsung …etc.
l  Tap end-customer’s expertise into business/technology value chains
n  Crate values toward the end customers (customer’s customers)
n  Ecosystem E2E value propositions – All wins strategies
© 2009 Foundry, Ltd.
13 Nov. Mickey Ken
Thank You for
Your Attention

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Foundry marketing program plan linked in

  • 1. © 2009 Foundry, Ltd. 1 1 Nov. Mickey Ken Technology Benchmark - Benefit Foundry Platform Solutions Advanced Foundry Platform Program
  • 2. © 2009 Foundry, Ltd. 2 Nov. Mickey Ken Contents l  Overview – Value Chain l  Challenge – Virtual Integration l  Strategy – Engage and Focus l  Mission and Responsibility l  Deliverables - Encompass E2E Values l  Future Perspectives
  • 3. © 2009 Foundry, Ltd. 3 Nov. Mickey Ken Overview - Value chain of semiconductor Material & Equip. Device & Interconn. IP/LIB & Si-Chip Electronics Product End-User & Society l  Foundry covers half or more of the Si E2E eco-value chains l  Ought not to do Technology Benchmark in the silo * Si, Ge * Planar CMOS * SRAM/ROM * Computer * Business * III-V(GaAs, InP) * FinFET - Ion/Ioff * Combination Logic * Communication * Government * HiK/MG * Strain-Si * Sequential Logic * Consumer * Military * ELK, XLK * Hi Mobility * JEDEC Test Chip * Industrial * Automotive * Immersion Litho * Cu interconnect * Arm-9/-11 * Special * Education * ALDVCD * DSP, GPU … * Green * Medical
  • 4. © 2009 Foundry, Ltd. 4 Nov. Mickey Ken Coming Challenge - How to extend virtual integration powers? l  Whole Electronics Industrial including upstream partners totaled 2.8% world GDP in 2007. Growth in future? Electronics Industrial - $1,500 B System & Services - $6,300 B Semiconductors - $256 B Material & Equip. - $85 B 2007 World GDP $64,900 B How can we grow the Electronics Industrial higher or greener? (Source: Public)
  • 5. © 2009 Foundry, Ltd. 5 Nov. Mickey Ken Strategy for Benchmark – 1stD - Enhancing internal communications Computer 20/22 nm 16/14 nm R&D MAFD SFP Region Office Industrial Communi- cation Consumer Technology Benchmark DTP l  Keep rolling to team up with relevant internal business units - Areas or Div.s
  • 6. © 2009 Foundry, Ltd. 6 Nov. Mickey Ken Strategy for Benchmark – 2ndD - Engaging external proactively l  Enhance external engagements and collaborations, ranging from Customer, competitor, agent, consortium and more …. SIA/ITRS Customer Competitor Forum IPRS ISSCC VLSI Symp. Consortiums (iNEMI) IMEC Technology Benchmark SI/CW ServicesIEDM Technology Roadshow
  • 7. © 2009 Foundry, Ltd. 7 Nov. Mickey Ken Direction to Go Strategy for Benchmark – 3rdD - Focus on leading-edge Initiatives Globally
  • 8. © 2009 Foundry, Ltd. 8 Nov. Mickey Ken Mission and Responsibility - Enhancing Trinity and collaborations Missions l Benchmark with the perfection n  Enhance technology leadership l Direct toward the right technology/product n  Facilitate timely manufacturing excellence l Tap customer’s experiences into business models n  Raise values toward the eco-system end-customers (customer’s customers)
  • 9. © 2009 Foundry, Ltd. 9 Nov. Mickey Ken Mission and Responsibility (Cont’d) - Enhancing Trinity and collaborations Responsibility l Coordinate with other Div.s/Areas n  Provide technology insights and perspective views for successful business/technology platform development l Collaborate academically with external entities or even 1st-tier competitors (IBM, Intel …) n  Share and exchange limited specifications of future technology platforms (N+1 or N+2) n  Entities - IEEE/IEDM&VLSI, IPRS, SIA, iNEMI, SEMI, IMEC, SI, CW and … l Leverage more with selected customers n  Learn about the right technology specifications and offer customers more values by future technology platforms
  • 10. © 2009 Foundry, Ltd. 10 Nov. Mickey Ken Material & Equip. Device & Interconn. IP/LIB & Si-Chip Electronics Product End-User & Society l  Virtual integration covers beyond half of the value chain l  Strive to do E2E Technology Benchmark with values * Si, Ge * Planar CMOS * SRAM/ROM * Computer * Business * III-V(GaAs, InP) * FinFET - Ion/Ioff * Combination Logic * Communication * Government * HiK/MG * Strain-Si * Sequential Logic * Consumer * Military * ELK, XLK * Hi Mobility * JEDEC Test Chip * Industrial * Automotive * Immersion Litho * Cu interconnect * Arm-9/-11 * Special * Education * ALDVCD * DSP, GPU … * Green * Medical Deliverables - Encompass End-to-End (E2E) value chain
  • 11. © 2009 Foundry, Ltd. 11 Nov. Mickey Ken Summary and Perspectives - Co-petition and Value Propositions Current Focus l  Start benchmarks with leading-edge technologies n  Material/equipment, process, device, system and IP/LIB l  Team up and work with RD, DTP, BD and WWSM n  Identify most valuable technical items and KPI to formulate right deliverables with value propositions n  Engage or collaborate with selected customers or private sources l  Low hanging fruit intelligence first n  IEEE/IEDM&VLSI, IPRS, SIA, IMEC, SI, CW and …. more
  • 12. © 2009 Foundry, Ltd. 12 Nov. Mickey Ken Summary and Perspectives (Cont’d) - Co-petition and value Propositions Future Perspectives l  Leverage more with selected customers n  Understand competitor’s strength and right technology specifications l  Enhance more external collaborations n  Include customer, agent and consortiums, such as, SIA, SEMI, IMEC and iNEMI …etc. l  Set up co-petition forum academically even with 1st-tier competitors n  Exchange key specs of future technologies (N+1 or N+2) including IBM, Intel or Samsung …etc. l  Tap end-customer’s expertise into business/technology value chains n  Crate values toward the end customers (customer’s customers) n  Ecosystem E2E value propositions – All wins strategies
  • 13. © 2009 Foundry, Ltd. 13 Nov. Mickey Ken Thank You for Your Attention