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• What are safety capacitors?
• Classification and Certification
• KEMET Ceramics Offering
• Key Takeaways
Ceramic Business Group
• Standard Surface Mount - Base MLCC Structure
• Leaded (Stacked) MLCC
• Leaded Axial and Radial
• KONNECT Technology
Agenda
Form Factor
Ceramic Capacitors
Surface Mount Non-Surface Mount
Standard
Surface Mount
Leaded
Surface Mount
Radial Leaded Axial Leaded
Form Factor
Key Drivers for Form Factor
Mounting Location
Mounting Method
Reduced Placements
CV  Volumetric Efficiency
Durability
Electrical Performance
Mechanical Performance
Noise Performance
Primary Drivers Secondary Drivers
or Impact
C = e0KA(n-1)
d
Ideal Capacitor Structure
Dielectric
Electrode
Distance
C = Design Capacitance
K = Dielectric Constant
A = Overlap Area
d = Ceramic Thickness
n = Number of Electrodes
C = e0KA(n-1)
d
+
-
Capacitances in parallel are additive
CT=C1+C2+C3+….Cn
Standard Surface Mount
Base MLCC Structure
Standard Surface Mount
Benefits
Highest Density
Smallest geometry
Lowest cost form factor
Lowest ESR
Lowest ESL
Model Parameters
• C - Nominal capacitance
• ESR - Series resistance
• ESL - Series inductance
Simplified Real Model
10pF example
Standard Surface Mount
Base Electrical Model
Typical MLCC Inductance <1nH
C ESR ESL
Current Path
Standard Surface Mount
Flex Cracking and CTE Mismatch
Flex Cracking CTE Mismatch
CTEMLCC
CTEBoard
Standard Surface Mount
Piezoelectricity and Electrostriction
Z
X
Y
Electrical Noise
Audible Noise
AC Voltage
Piezoelectricity
Electrical Noise
Electrostriction
Electrical Noise
Standard Surface Mount
Available Solutions
Standard Commercial
C0G, U2J, X7R, X5R, X8R, X8L, Z5U, Y5V
Sn & SnPb Plating Options
0201 - 2225
6.3 and 250 Vdc
Automotive
C0G, U2J, X7R, X5R, X8R, X8L
Sn Plating Options
0402 - 2225
6.3 and 250 Vdc
High Voltage (≥500V)
Commercial and Automotive
C0G, X7R
Sn & SnPb Plating Options
0603 - 6560
500 and 5,000 Vdc
High Temperature (≥150V)
Commercial and Automotive
C0G, X7R, X8R, X8L
Sn, SnPb, and Au Plating Options
0603 - 4540
500 and 3,000 Vdc
Defense and Aerospace
MIL-PRF-123, 55681, 32535
C0G, X7R, BP, BX
Sn, SnPb & Au Plating Options
0402 - 2220
4 and 200 Vdc
Flex Mitigation
Commercial, Automotive, High Voltage
C0G, X7R, X8L & X8R
Sn, SnPb Plating Options
0603 - 2225
6.3 and 250 Vdc
Leaded Stack MLCC
Higher CV – Bulk Capacitance
Leaded Stack MLCC
Benefits
Higher CVs vs MLCC
Compact Design
Higher Power (Low ESR)
Robust (Flex, Thermal Cycling, CTE,
Vibration)
Noise Mitigation
Leaded Stack MLCC
Robust Design
Flex Robust CTE Mismatch
CTEMLCC
CTEBoard
Mechanical Absorption
Leaded Stack MLCC
Piezoelectricity and Electrostriction
Z
X
Y
Electrical Noise
Piezoelectricity
Electrical Noise Electrostriction
Electrical NoiseAudible Noise
AC Voltage
Mechanical Absorption
Leaded Stack MLCC
Design Consideration: Size and Added Parasitics
Model Parameters
• C – Nominal capacitance
• ESR – Series resistance
• ESL – Series inductance
• L1/L2 – Lead Inductance
• R1/R2 – Lead Resistance
Simplified Real Model
Typical Inductance 1nH – 3nH
C ESR ESLL1 L2
R1 R2
ESL_total = ESL + L1 + L2
ESR_total = ESR + R1 + R2
Current Path
Leaded Stack MLCC
Available Solutions
KPS MIL
MIL-PRF-49470
B & T(space) Levels
SMD or Thru-hole
KPS+
Bulk Capacitance
Footprint reduction
SMD or Thru-hole
Hi Volt / Temp options
KPS Commercial and AUTO
AEC-Q200 qualified
1 or 2-chip stacks, SMD
1210 – 2220 footprints
10V – 250 Vdc
KPS HV
Commercial & Automotive Grades
1 or 2-chip stacks, SMD
2220 footprint, J Lead
500 and 630 Vdc
KPS X8L
High Temperature 150ºC
Commercial & Automotive Grades
1 or 2-chip stacks, SMD
1210 and 2220 footprint, J Lead
KPS SnPb
Commercial Grade
1 or 2-chip stacks, SMD
1210 and 2220 footprint, J Lead
Defense, Avionic & Industrial applications
KPS HV SM Series
Industrial Grade
C0G and X7R Dielectrics
L and J Lead
500 and 10kV Vdc
KPS-MCC SMPS Stacks
Industrial Grade
C0G
L and J Lead
50 and 20kV Vdc
Axial and Radial Leaded
Benefits
No PCB Required!
Flex Mitigation
Noise Reduction
Highly Versatile Mounting
High Vibration
Axial and Radial Leaded
No-PCB Required
Axial and Radial Leaded
No-PCB Required
EGR ValveEGR Valve
MotorsMotors
Axial and Radial Leaded
Highly Versatile Mounting
Hand Solder Conductive adhesive
Weld Crimp
Axial and Radial Leaded
Robust Design
Flex Cracking
CTE Mismatch
CTEMLCC
CTEBoard
Mechanical Absorption
AC Voltage
Axial and Radial Leaded
Piezoelectricity and Electrostriction
Z
X
Y
Electrical Noise
Piezoelectricity
Electrical Noise Electrostriction
Electrical Noise
Mechanical Absorption
Axial and Radial Leaded
Design Consideration: Added Parasitics
Model Parameters
• C – Nominal capacitance
• ESR – Series resistance
• ESL – Series inductance
• L1/L2 – Lead Inductance
• R1/R2 – Lead Resistance
Simplified Real Model
Typical Inductance ~10nH for
½” lead wire
C ESR ESL
L1 L2R1 R2
ESL_total = ESL + L1 + L2
ESR_total = ESR + R1 + R2
Axial and Radial Leaded
Available Solutions
Product Series C0G X7R Z5U
Commercial Auto Grade Commercial Auto Grade Commercial
Goldmax
Radial
Conformal Coated
C3XX
25 – 250Vdc
1.0pF –470nF
25 – 250Vdc
1.0pF– 220nF
25 – 250Vdc
100pF – 10 µF
25 – 250Vdc
100pF – 10 µF
25 – 200Vdc
100pF – 10 µF
Aximax
Axial
Conformal Coated
C4XX
25 – 250Vdc
1.0pF –470nF
25 – 250Vdc
1.0pF –100nF
25 – 250Vdc
10pF – 10µF
25 – 250Vdc
10pF – 4.7µF
50 – 200Vdc
1.0nF – 2.2µF
Radial Molded
C052/56
C062/66
C512/C522
50 – 200Vdc
1.0pF –180nF
50 – 200Vdc
10pF – 3.3µF
Axial Molded
C114/C124
C192/C202
C222
50 – 200Vdc
1.0pF –100nF
50 – 200Vdc
10pF – 3.3µF
Axial and Radial Leaded
Available Solutions
Product Series X8R X8L
Goldmax
Radial
Conformal Coated
C31X
C32X
C33X
25 – 200Vdc
1.0pF – 33nF
10pF – 180nF
56nF – 220nF
25 – 50Vdc
150nF – 680nF
150nF – 4.7µF
–
Aximax
Axial
Conformal Coated
C41X
C43X
50 – 200Vdc
100 pF – 22nF
1.1nF – 82nF
25 – 50Vdc
100nF – 0.68µF
330nF – 2.2µF
Currently Available
Axial and Radial Leaded
Available Solutions
Series C0G X7R
Commercial
C3xx
C6xx
1.0pF – 100nF
500 – 3000V
10pF – 2.9µF
500 – 3000V
Industrial HV20-36
10pF – 330nF
500 – 10,000V
150pF – 5.6µF
500 – 10,000V
Military Tested
HV60-66
HS20-36 (space)
12pF – 180nF
500 – 10,000V
820pF – 5.6µF
500 – 10,000V
High Temperature
200ºC
HV10-16
VCR/VRR
10pF – 47nF
500 – 5000V
680pF – 1.2µF
500 – 5000V
KEMET KONNECT Technology
Under Development
Low Power LossTraditional
Thank You!!!
Mark R. Laps
Technical Product Manager
Ceramic Business Unit
KEMET Electronics
Cell Phone: +1-864-399-4879
Office Phone: +1-864-963-6383
www.kemet.com | marklaps@kemet.com

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KEMET Webinar - Challenging Designs Drive Diverse Form Factors

  • 1. • What are safety capacitors? • Classification and Certification • KEMET Ceramics Offering • Key Takeaways Ceramic Business Group
  • 2. • Standard Surface Mount - Base MLCC Structure • Leaded (Stacked) MLCC • Leaded Axial and Radial • KONNECT Technology Agenda
  • 4. Ceramic Capacitors Surface Mount Non-Surface Mount Standard Surface Mount Leaded Surface Mount Radial Leaded Axial Leaded Form Factor
  • 5. Key Drivers for Form Factor Mounting Location Mounting Method Reduced Placements CV  Volumetric Efficiency Durability Electrical Performance Mechanical Performance Noise Performance Primary Drivers Secondary Drivers or Impact
  • 6. C = e0KA(n-1) d Ideal Capacitor Structure Dielectric Electrode Distance
  • 7. C = Design Capacitance K = Dielectric Constant A = Overlap Area d = Ceramic Thickness n = Number of Electrodes C = e0KA(n-1) d + - Capacitances in parallel are additive CT=C1+C2+C3+….Cn Standard Surface Mount Base MLCC Structure
  • 8. Standard Surface Mount Benefits Highest Density Smallest geometry Lowest cost form factor Lowest ESR Lowest ESL
  • 9. Model Parameters • C - Nominal capacitance • ESR - Series resistance • ESL - Series inductance Simplified Real Model 10pF example Standard Surface Mount Base Electrical Model Typical MLCC Inductance <1nH C ESR ESL Current Path
  • 10. Standard Surface Mount Flex Cracking and CTE Mismatch Flex Cracking CTE Mismatch CTEMLCC CTEBoard
  • 11. Standard Surface Mount Piezoelectricity and Electrostriction Z X Y Electrical Noise Audible Noise AC Voltage Piezoelectricity Electrical Noise Electrostriction Electrical Noise
  • 12. Standard Surface Mount Available Solutions Standard Commercial C0G, U2J, X7R, X5R, X8R, X8L, Z5U, Y5V Sn & SnPb Plating Options 0201 - 2225 6.3 and 250 Vdc Automotive C0G, U2J, X7R, X5R, X8R, X8L Sn Plating Options 0402 - 2225 6.3 and 250 Vdc High Voltage (≥500V) Commercial and Automotive C0G, X7R Sn & SnPb Plating Options 0603 - 6560 500 and 5,000 Vdc High Temperature (≥150V) Commercial and Automotive C0G, X7R, X8R, X8L Sn, SnPb, and Au Plating Options 0603 - 4540 500 and 3,000 Vdc Defense and Aerospace MIL-PRF-123, 55681, 32535 C0G, X7R, BP, BX Sn, SnPb & Au Plating Options 0402 - 2220 4 and 200 Vdc Flex Mitigation Commercial, Automotive, High Voltage C0G, X7R, X8L & X8R Sn, SnPb Plating Options 0603 - 2225 6.3 and 250 Vdc
  • 13. Leaded Stack MLCC Higher CV – Bulk Capacitance
  • 14. Leaded Stack MLCC Benefits Higher CVs vs MLCC Compact Design Higher Power (Low ESR) Robust (Flex, Thermal Cycling, CTE, Vibration) Noise Mitigation
  • 15. Leaded Stack MLCC Robust Design Flex Robust CTE Mismatch CTEMLCC CTEBoard Mechanical Absorption
  • 16. Leaded Stack MLCC Piezoelectricity and Electrostriction Z X Y Electrical Noise Piezoelectricity Electrical Noise Electrostriction Electrical NoiseAudible Noise AC Voltage Mechanical Absorption
  • 17. Leaded Stack MLCC Design Consideration: Size and Added Parasitics Model Parameters • C – Nominal capacitance • ESR – Series resistance • ESL – Series inductance • L1/L2 – Lead Inductance • R1/R2 – Lead Resistance Simplified Real Model Typical Inductance 1nH – 3nH C ESR ESLL1 L2 R1 R2 ESL_total = ESL + L1 + L2 ESR_total = ESR + R1 + R2 Current Path
  • 18. Leaded Stack MLCC Available Solutions KPS MIL MIL-PRF-49470 B & T(space) Levels SMD or Thru-hole KPS+ Bulk Capacitance Footprint reduction SMD or Thru-hole Hi Volt / Temp options KPS Commercial and AUTO AEC-Q200 qualified 1 or 2-chip stacks, SMD 1210 – 2220 footprints 10V – 250 Vdc KPS HV Commercial & Automotive Grades 1 or 2-chip stacks, SMD 2220 footprint, J Lead 500 and 630 Vdc KPS X8L High Temperature 150ºC Commercial & Automotive Grades 1 or 2-chip stacks, SMD 1210 and 2220 footprint, J Lead KPS SnPb Commercial Grade 1 or 2-chip stacks, SMD 1210 and 2220 footprint, J Lead Defense, Avionic & Industrial applications KPS HV SM Series Industrial Grade C0G and X7R Dielectrics L and J Lead 500 and 10kV Vdc KPS-MCC SMPS Stacks Industrial Grade C0G L and J Lead 50 and 20kV Vdc
  • 19. Axial and Radial Leaded Benefits No PCB Required! Flex Mitigation Noise Reduction Highly Versatile Mounting High Vibration
  • 20. Axial and Radial Leaded No-PCB Required
  • 21. Axial and Radial Leaded No-PCB Required EGR ValveEGR Valve MotorsMotors
  • 22. Axial and Radial Leaded Highly Versatile Mounting Hand Solder Conductive adhesive Weld Crimp
  • 23. Axial and Radial Leaded Robust Design Flex Cracking CTE Mismatch CTEMLCC CTEBoard Mechanical Absorption
  • 24. AC Voltage Axial and Radial Leaded Piezoelectricity and Electrostriction Z X Y Electrical Noise Piezoelectricity Electrical Noise Electrostriction Electrical Noise Mechanical Absorption
  • 25. Axial and Radial Leaded Design Consideration: Added Parasitics Model Parameters • C – Nominal capacitance • ESR – Series resistance • ESL – Series inductance • L1/L2 – Lead Inductance • R1/R2 – Lead Resistance Simplified Real Model Typical Inductance ~10nH for ½” lead wire C ESR ESL L1 L2R1 R2 ESL_total = ESL + L1 + L2 ESR_total = ESR + R1 + R2
  • 26. Axial and Radial Leaded Available Solutions Product Series C0G X7R Z5U Commercial Auto Grade Commercial Auto Grade Commercial Goldmax Radial Conformal Coated C3XX 25 – 250Vdc 1.0pF –470nF 25 – 250Vdc 1.0pF– 220nF 25 – 250Vdc 100pF – 10 µF 25 – 250Vdc 100pF – 10 µF 25 – 200Vdc 100pF – 10 µF Aximax Axial Conformal Coated C4XX 25 – 250Vdc 1.0pF –470nF 25 – 250Vdc 1.0pF –100nF 25 – 250Vdc 10pF – 10µF 25 – 250Vdc 10pF – 4.7µF 50 – 200Vdc 1.0nF – 2.2µF Radial Molded C052/56 C062/66 C512/C522 50 – 200Vdc 1.0pF –180nF 50 – 200Vdc 10pF – 3.3µF Axial Molded C114/C124 C192/C202 C222 50 – 200Vdc 1.0pF –100nF 50 – 200Vdc 10pF – 3.3µF
  • 27. Axial and Radial Leaded Available Solutions Product Series X8R X8L Goldmax Radial Conformal Coated C31X C32X C33X 25 – 200Vdc 1.0pF – 33nF 10pF – 180nF 56nF – 220nF 25 – 50Vdc 150nF – 680nF 150nF – 4.7µF – Aximax Axial Conformal Coated C41X C43X 50 – 200Vdc 100 pF – 22nF 1.1nF – 82nF 25 – 50Vdc 100nF – 0.68µF 330nF – 2.2µF Currently Available
  • 28. Axial and Radial Leaded Available Solutions Series C0G X7R Commercial C3xx C6xx 1.0pF – 100nF 500 – 3000V 10pF – 2.9µF 500 – 3000V Industrial HV20-36 10pF – 330nF 500 – 10,000V 150pF – 5.6µF 500 – 10,000V Military Tested HV60-66 HS20-36 (space) 12pF – 180nF 500 – 10,000V 820pF – 5.6µF 500 – 10,000V High Temperature 200ºC HV10-16 VCR/VRR 10pF – 47nF 500 – 5000V 680pF – 1.2µF 500 – 5000V
  • 29. KEMET KONNECT Technology Under Development Low Power LossTraditional
  • 30. Thank You!!! Mark R. Laps Technical Product Manager Ceramic Business Unit KEMET Electronics Cell Phone: +1-864-399-4879 Office Phone: +1-864-963-6383 www.kemet.com | marklaps@kemet.com