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Webinar „the 10µF Story“
EMEA Webinars 2017/2018
• ESD Ceramic Capacitor (English) December 11, 2017
• Test & Design Considerations – Class 1 & Class 2 MLCC December 18,2017
• ESA qualifizierte Polymer Kondensatoren January 12, 2017
(2 Webinars - German & English)
• HV Kondensatoren in Automotive & Industrie January 19, 2017
Anwendungen (German)
• Automotive Polymer HV Extensions up to 75V January 29, 2017
(2 Webinars - German & English)
go.kemet.com/emeawebex
ANNOUNCEMENT
KEMET EMEA Webinars – Year 2017/2018
„The 10 µF story“
A Journey
There are various 10µF capacitors of different size, voltage and
technologies available
What are the selection differences and criteria ? 3
Candidates
Possible Alternatives
• C0402C106K9PAC -1005
• C0603C106K9PAC -1608
• C0805C106K4PAC -2012
• C0805C106K8RAC -2012
• C1210C106K5RAC - 3225
• C2220C106K5RAC -5650
• C1210C106K5R2C -3226 double Stack
• C2220C106K5R1C -5650 single Stack
• T520A106M010ATE080 -3216-18
• T520B106M010ATE100 -3528-21
• T521V106M035ATE120 -7343-20
• T521X106M075ATE050 -7343-43
• A700V106M016ATE060 -7343-20
Capacitance 0402 versus 2220
0402 versus 2220 @ 5V DC-Bias
• Capacitance for 0402 drops by ~80%
Net capacitance in 5V DC-Bias
Polymer MLCC small case
0402 Polymer
Capacitance 1,6µF 10.2µF
Footprint/mm2 1,0 x 0,5 3,2 x 1,6
http://ec.kemet.com
13
Design tools
14
Different cases in MLCC - Z, ESR
• SRF higher for smaller cases - lower ESL
• Impedance is similar
ESL
• Increase with bigger cases size
• Shift resonance frequency to LOWER values
S-Parameter
Different cases in MLCC -Ripple Current
0402 2220
Current 10,7A 14,8A
Power calculations
• Nickel Elecrodes act as cooling plate
• High thermal conductivity
• Smaller case - more layers
• Trade off between convections and thermal conductivityCooling plate
Ripple current 10x1uF vs 1x10uF
• 10x 1uF increase current capability
10x 1µF 1x 10µF
10A 44A?
dielectric physics
t
Reliability
• Smaller case size - thinner dielectric
• Reliability decrease with smaller case size
1x10uF versus 10x 1uF
• SRF and ESR shift
Single and double stack
• KEMET Power Solutions = KPS
• C2220C106K5R1C -5650 single Stack
• C2220C106K5R2C -5650 double Stack
Single versus double stack
compare standard versus KPS
• Mechanical robust against crack
MLCC J-Lead
Output Noise
• Piezo create noise
• Leadframe eliminate Noise
Why single stack
Battery powered application
• Insulation resistance
• DCL(25°C) = U/R3 = 5V/100MΩ = 50nA
• DCL(45°C) = U/R3 = 5V/15MΩ = 330nA
25°C 45°C
Battery powered application Polymer
• Old rule DCL = 0,1 C[µF]*U[V]
• Insulation resistance significant lower than catalog values
• Higher rated voltage - means thicker dielectric - lower DCL
• DDCL reduced at higher temperature
25°C 45°C
1MΩ 1,6MΩ
Sum up
• Design can be optimized by using Tools
• MLCC smaller case size
• thinner dielectric
• loose more cap on DC-Bias thinner dielectric
• Polymer
• no capacitance loss due DC-Bias
• can replace several HiCV MLCC
• Single Stack noise reduction
• Double stack - reduce footprint
• Leakage current trade between C, Ur, T
Thank You!
Axel Schmidt
Senior Field Application Engineer
+49 172 89 25 284
AxelSchmidt@kemet.com
KEMET Electronics GmbH
Rudolf-Diesel-Straße 21
86899 Landsberg
08191 3350-0
www.kemet.com

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The 10uf Story Webinar

  • 2. EMEA Webinars 2017/2018 • ESD Ceramic Capacitor (English) December 11, 2017 • Test & Design Considerations – Class 1 & Class 2 MLCC December 18,2017 • ESA qualifizierte Polymer Kondensatoren January 12, 2017 (2 Webinars - German & English) • HV Kondensatoren in Automotive & Industrie January 19, 2017 Anwendungen (German) • Automotive Polymer HV Extensions up to 75V January 29, 2017 (2 Webinars - German & English) go.kemet.com/emeawebex ANNOUNCEMENT KEMET EMEA Webinars – Year 2017/2018
  • 3. „The 10 µF story“ A Journey There are various 10µF capacitors of different size, voltage and technologies available What are the selection differences and criteria ? 3
  • 4.
  • 6. Possible Alternatives • C0402C106K9PAC -1005 • C0603C106K9PAC -1608 • C0805C106K4PAC -2012 • C0805C106K8RAC -2012 • C1210C106K5RAC - 3225 • C2220C106K5RAC -5650 • C1210C106K5R2C -3226 double Stack • C2220C106K5R1C -5650 single Stack • T520A106M010ATE080 -3216-18 • T520B106M010ATE100 -3528-21 • T521V106M035ATE120 -7343-20 • T521X106M075ATE050 -7343-43 • A700V106M016ATE060 -7343-20
  • 8. 0402 versus 2220 @ 5V DC-Bias • Capacitance for 0402 drops by ~80%
  • 9. Net capacitance in 5V DC-Bias
  • 10. Polymer MLCC small case 0402 Polymer Capacitance 1,6µF 10.2µF Footprint/mm2 1,0 x 0,5 3,2 x 1,6
  • 13. Different cases in MLCC - Z, ESR • SRF higher for smaller cases - lower ESL • Impedance is similar
  • 14. ESL • Increase with bigger cases size • Shift resonance frequency to LOWER values
  • 16. Different cases in MLCC -Ripple Current 0402 2220 Current 10,7A 14,8A
  • 17. Power calculations • Nickel Elecrodes act as cooling plate • High thermal conductivity • Smaller case - more layers • Trade off between convections and thermal conductivityCooling plate
  • 18. Ripple current 10x1uF vs 1x10uF • 10x 1uF increase current capability 10x 1µF 1x 10µF 10A 44A?
  • 20. Reliability • Smaller case size - thinner dielectric • Reliability decrease with smaller case size
  • 21. 1x10uF versus 10x 1uF • SRF and ESR shift
  • 22. Single and double stack • KEMET Power Solutions = KPS • C2220C106K5R1C -5650 single Stack • C2220C106K5R2C -5650 double Stack
  • 24. compare standard versus KPS • Mechanical robust against crack
  • 25. MLCC J-Lead Output Noise • Piezo create noise • Leadframe eliminate Noise Why single stack
  • 26. Battery powered application • Insulation resistance • DCL(25°C) = U/R3 = 5V/100MΩ = 50nA • DCL(45°C) = U/R3 = 5V/15MΩ = 330nA 25°C 45°C
  • 27. Battery powered application Polymer • Old rule DCL = 0,1 C[µF]*U[V] • Insulation resistance significant lower than catalog values • Higher rated voltage - means thicker dielectric - lower DCL • DDCL reduced at higher temperature 25°C 45°C 1MΩ 1,6MΩ
  • 28. Sum up • Design can be optimized by using Tools • MLCC smaller case size • thinner dielectric • loose more cap on DC-Bias thinner dielectric • Polymer • no capacitance loss due DC-Bias • can replace several HiCV MLCC • Single Stack noise reduction • Double stack - reduce footprint • Leakage current trade between C, Ur, T
  • 29. Thank You! Axel Schmidt Senior Field Application Engineer +49 172 89 25 284 AxelSchmidt@kemet.com KEMET Electronics GmbH Rudolf-Diesel-Straße 21 86899 Landsberg 08191 3350-0 www.kemet.com