HARDNESS, FRACTURE TOUGHNESS AND STRENGTH OF CERAMICS
VLMADHUSUDAN Resume
1. HARDWARE DESIGN ENGINEER
MADHUSUDAN V L
E-mail: hardwaredesign_engineer@yahoo.com
Contact No: +91-7760189025
Objective:
Seeking a challenging career in the field of hardware system design, to succeed in an environment of growth and
competitive excellence that leverages my core competencies and determination in creating a niche for myself
Professional Summary:
Technically accomplished 5 Years 6 Months of experience in Embedded Hardware Design Engineering
• Presently working as Design Engineer in L&T Technology Services from August 2015 to till date
• Travelled to Chihuahua, Mexico for a month as onsite co-ordinator for requirement gathering
• Worked as Design engineer in Enventure Technology Services PVT LTD from January 2012 to July
2015
• Worked as Trainee engineer in Tech Mahindra from January 2011 to December 2011 as a part of
Internship
Experience Summary
Hands on experience in Designing and Debugging of Embedded Systems including Requirement analysis, Feasibility
study, Prototype manufacturing coordination, PCB Layout Design coordination.
Hardware Design
• Experience in complete hardware design life cycle.
• Experience in schematic tools OrCAD Capture CIS and Foot print verification.
• Experience in mixed signal board designs.
• Experience in I2C, SPI, and UART interfaces
• Component selection and BOM optimization.
Testing Experience
• Board bring-up and debugging, functional testing and test report preparation.
Technical Documentation
• Preparation of proposal for various projects
• Design requirements specification document.
• Hardware design specification document.
• Bill of material and cost estimation.
2. Skills
Domain
Hardware Development for Automotive Electronics, Industrial Electronics, Consumer
Electronics
Tools /DB/Packages
Schematic Design: OrCAD Capture CIS, Layout: Allegro Physical Viewer, LTSPICE,
TINA (TI), PSoC Designer, Keil, MPLAB X IDE
Tools : OrCAD Capture CIS, LTspice, Visio
Hardware Platforms
PSoC Controllers, Renesas – RL78, MICROCHIP – PIC16LF1936, STMicroelectronics –
STM32F100
Intel – VRX220
Interfaces & Memory
Technologies
I2C, SPI, USB & UART
ZigBee, Wi-Fi, BT & NFC
Test Equipements Digital Oscilloscope, Function Generator, Multimeter, Power supply
Highlight Project Details:
Project Name Topaz Spring, Smart Energy Meters – IoT, Intel Onsite
Team Size & Duration 4 Members / Ongoing
Description
A Smart hub device to connect with multiple meter devices, to fetch the meter data
The Solution is based on an integrated reference design comprising of 6LowPAN sensor
network, providing connectivity options for Wi-Fi
Responsibilities
• Hardware Specification/Design Document
• Component Engineering & Circuit Design
• Board Bring-up, Interfacing Tarang module to main board
Project Name Fork Lift – Multimedia Console – Bring-up/De-bugging
Team Size & Duration 3 Members / 6 Months
Description
Testing and debugging of i.MX5 processor based Hardware
• Camera- Blur image issue
• Boot-Up issue
• Display Issue
Responsibilities
• Board bring-up, debugging and functionality testing
• Schematic and Layout Validation
• Validate all the voltages using oscilloscope/DMM
• Validate control signals using Oscilloscope
3. Education Qualification:
Master of Science in Embedded Systems, 8.37 CGPA
Manipal University, Manipal
Bachelor of Engineering in Electronics and Communication,
Nitte Meenakshi Institute of technology, Bangalore
About Myself:
• I believe that I have strong technical, analytical and communication skills which enable me to grasp
concepts quickly.
• I am always willing to learn new things, be it technical or extra-curricular.
• I constantly look forward to new challenges so I would enjoy working and contributing to an organization
which encourages learning, growth and innovation.
• As a hobby project, designed and developed Bike Mobile charger (12V to 5V, 2A)
(V L Madhusudan)
Project Name Design & Development of IO Board for Android Smart Wireless Thermostat (IoT)
Team Size & Duration 5 Members / 9 months
Description
To design and develop an IO board for Android Smart Wireless Thermostat with Sensors,
IO for Android Controller Board and HVAC. It has ZigBee for Remote Temperature
Sensor Connectivity and WiFi/NFC for Mobile Phone Connectivity. It has as an array of
Sensors
Responsibilities:
• Hardware Specification/Design Document
• Component Engineering & Circuit Design
• PCB Design coordination
Project Name Automotive Tracker Module
Team Size & Duration
2 Members & 8 months
Description
A GPS – GSM (Telit Module) based tracking module with an accelerometer which starts
sending SMS (With GSM, GPS data) to the owner, once the module is shaken. Using this
SMS data the module can be easily located
Responsibilities
• Schematic design using OrCAD Capture
• Components selection
• BOM & Net-List generation
• Power estimation and Power Sequence analysis
• Board Bring-up
• Coordinating with firmware team member
• Create design documents and review
Project Name
CapSense based Switch Module
Team Size & Duration
2 Members & 6 months
Description
A CapSense based switch module which is used to control the Heater and Smartphone
charging. A low–end microcontroller from Cypress Semiconductor with capacitive sensing
I/O is used. The internal timer is used to implement the 45 minutes delay required to turn
OFF the heater if the same has not been turned OFF manually through a button. This button
will be backlit to indicate that a touch has been sensed. A USB connector is provided to
charge the smart phones externally
Responsibilities
• Schematic design using OrCAD Capture.
• Components selection.
• Layout co-ordination
• Board Bring-up
• Create design documents and review