Venkata Seshathri is a senior hardware engineer with over 13 years of experience in product design, embedded systems, and testing. He has expertise in circuit design, PCB design, analog and mixed-signal design, and EMI/EMC testing. Some of his projects include designing smart POS systems for retail applications, performing component stress analysis for aerospace power systems, and developing testing equipment for wireless communication modules. He is proficient in various design tools and has worked with processors like NXP i.MX53, Blackfin, and MediaTek.

1. Venkata Seshathri.S sv.seshathri@gmail.com
Mobile : +91-91767 40077
Professional Expertise:-
Having hands on experience in complete product design life cycle
which includes Custom Embedded Board architecture design, Engineering Specification, Circuit
Design and Analysis, Analog design and analysis, PCB Design co-ordination, Prototype board
bring-up, Debugging, EMI/EMC design analysis, Pilot build Co-Ordination.
Experience Summary:-
 Senior Hardware Engineer : Netree E-services Pvt. Ltd., Chennai.
since June 2011
 Senior Engineer : Goodrich (UTC) Aerospace India Pvt. Ltd., Bangalore
October 2010 to June 2011
 Sr. Technical Engineer : Midas Communication Technologies Pvt. Ltd., Chennai
Dec 2003 to Sep 2010
 Trainee : IITMadras, Chennai
Oct 2001 to Oct 2003
Key Competencies and Skills:-
 Complete Product Design Life Cycle.
 High Speed and Mixed Signal Board Design.
 Analog design & Low power regulator design
 Signal Integrity and Power Integrity analysis.
 Component Selection and Circuit Stress Analysis.
 Board and System Level functional Testing and validation.
 EMI/EMC Certification Testing.
 Linux OS, BSP customization and Porting support.
 Knowledge in enclosure design.
 Firmware development support (ARM and 8051 Architecture).
Equipment Used:-
 R&S Spectrum & Network Analyzers.
 Agilent Oscilloscopes, Logic Analyzers & Signal Generator.
 In Circuit Emulators and Debuggers.
Design Tool Experience:-
 Cadence Allegro OrCAD Capture CIS 16.5
 Pspice
 HyperLynx
 SABER & MATHCAD
 Keil MicroVision
Key Components Used:-
 MediaTek, MT6735 and MT6605 (NFC)
 Maxim, MAX3255 & MAXQ1850 (Mobile Payment)
 NXP, i.MX53
 Analog Devices (ADC,DAC and Op-Amp)
 Blackfin Processor (BF531,BF533)
 Altera, Spartan IIE, IIIE FPGAs
 Xilinx, CPLDs
Educational Qualifications:
 B.E in Electronics & Communication Engineering from Anna University.
 Diploma in Electronics & Communication Engineering from V.S.V.N Polytechnic.

2. Project Details:-
Project Name d’lite all in one Smart POS
Description Android based, 3G enabled, Smart PoS for Cloud application
Domain Retail Cloud Application
Key Device i.MX53 NXP processor, Maxim MAXQ1850 for payment section
Interfaces
• Android based Mobile payment,
• 3 inch printer,
• Wireless interfaces 3G, Wi-Fi & BT,
• Voice, Ethernet, USB and Capacitive touch screen.
Responsibilities
• Architecture Design
• Component Selection & Schematic Design
• SI and PI Design Support
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
• Enclosure design support
Role Highlights
• Tamper Proof Design for Payment (PCI-PTS)
• Android Driver integration support & BSP customization
Achievement Pilot Production Devices are successfully running in the customer places
Project Name d’lite all in one Smart POS v2.0
Description Android based, 3G enabled, Smart PoS for Cloud application
Domain Retail Cloud Application
Key Device Maxim MAX3255 for payment section and MediaTek MT6605 for NFC
Interfaces
• Mobile payment,
• 3 inch printer,
• Wireless interfaces 3G, Wi-Fi & BT,
• Voice, Ethernet, USB and Capacitive touch screen.
Responsibilities
• Architecture Design
• Component Selection & Schematic Design
• SI and PI Design Support
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
• Enclosure design support
Role Highlights
• Tamper Proof Design for Payment (PCI-PTS)
• Android Driver integration support & BSP customization
Achievement Design completed and ready for PCB manufacturing.

3. Project Name Power Distribution Circuit stress Analysis
Description
Component level stress analysis of the power distribution boxes in the Main Electrical
Power Generation and Management.
Domain Aerospace Application
Tools SABER and MATHCAD for simulation and Calculations
Interfaces Electrical Power Generation and Management System
Responsibilities
• Component level circuit design analysis
• Creating the Complete Component Stress Analysis Report using SABER
simulation tool
• Verifying the analysis using the MATHCAD calculation tools.
Project Name CH53K-GCU circuit stress Analysis
Description Complete Component Stress Analysis Report for AC CDB, DC CDB and PCU
Domain Aerospace Application
Tools SABER and MATHCAD for simulation and Calculations
Interfaces Primary AC Control Unit, AC & DC Contactor Driver Board
Responsibilities
• Component level circuit design analysis
• Creating the Complete Component Stress Analysis Report using SABER
simulation tool
• Verifying the analysis using the MATHCAD calculation tools.
Project Name DECT Radio Communication Tester
Description
RF Test equipment to qualifying the RF modules in the FP terminal used in corDECT
WLL system
Domain Testing Equipment
Key Device BF531 and Analog Devices
Interfaces • DSP Processor, SDRAM, FLASH
Responsibilities
• Schematic Design
• Component Selection & Schematic Design
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
• Enclosure design support
• Firmware development support
Achievement
98% accuracy achieved and verified with the DECT tester CTS-60 for a Pilot quantity
of 100 nos

4. Project Name RF Programmable attenuator
Description
RF attenuators which attenuates the frequencies between 10 MHz to 1 GHz of a range
from -30dBm to -95dBm designed for DRCT
Domain RF design
Interfaces • RF Attenuator
Responsibilities
• Component Selection & Schematic Design
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
• Enclosure design support
Achievement • Single Step attenuation achieved throughout the all ranges
Project Name Baseband Communication module for GSM
Description
Base band Interface card for GSM (BIG) Module covers all base band functionalities
required for GSM Base Station
Domain Baseband - ASIC Design
Key Device BF531, SDRAM, FLASH
Responsibilities
• Schematic Design
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
Achievement This Card replaces the full functionality of the GSM Base band interface IC
Project Name MeTEL
Description
Low-cost Messaging Terminal into the existing corDECT WLL Network. Also
provides minimal access to Mail, SMS, Chat, Browser and Call Meter. MTS supports
one voice and one data connection and also provides connectivity to standard fax
machines and modems.
Domain WLL Mobile – Embedded Product (8051 micro controller based design)
Responsibilities
• Schematic Design
• PCB Design Support
• Board Fabrication and Assembly support
• Functional testing and Evaluation
• Application code Development in Microcontroller 89C61X2
• Documentation and Field Support
Achievement Successfully installed and working in Field
DECLARATION:
I hereby declare that the above written particulars are genuine to the best of my knowledge
and belief.
Place : Chennai

5. Date : 13-10-2016 ( Venkata Seshathri.S )

6. Date : 13-10-2016 ( Venkata Seshathri.S )