1. VIKAS G
Email: gupta_vikas101@yahoo.com, Cell Phone: +91-9066509770, +91-8792739070
Work Experience:
 4+ Years of experience in Embedded Board Design and currently working as a Senior Hardware Design Engineer at
UTC Aerospace Systems and prior to that worked in L&T Technology Services.
 Responsible for Porting Project from requirement to production phase, Platform architecture, Engineering
Specification, Schematic design, Layout design co-ordination and review, Bring up and debugging of board,
Hardware Testing, Power management, Environmental testing and Production support.
 Experience in High speed Board design in Consumer and Automotive electronics domain & expertise in developing
Analog, Digital and Mixed Signals High Speed and Multilayer board design.
Profile Summary:
Platform: TI, Intel, NXP based Processors and Micro-controllers.
Interfaces: I2C, SPI, USB3.0, UART, 10/100 BaseT Ethernet, Memory Interfacing (DDR3,SDRAM,NAND,NOR).
Testing Equipments: Digital Oscilloscope, DPO, DMM, Power Supplies, Ni-DAQ, Current Probe, Soldering Equipments,
RF Shield box, Logic Analyzer, Thermal Chamber and Function Generator.
Software tools: ORCAD 16.6, Allegro PCB Editor, Flash tool, Mathcad, LT Powerplay, PSpice, Sigrity SI etc.
Software Exposure: Basic Embedded C, KEIL Compiler
Component Engineering: Selection of Active and Passive components (like Op-Amps ,MOSFETs, Transistors, Regulators,
Buffers, Switches, Connectors etc.) based on their electrical, mechanical, availability and cost parameters.
Technical Exposure:
 To prepare Engineering Specification document, Test plan, Test setup presentations for the project.
 Good hands on simulation tools like PSpice, LTspice and exposure to SI and PI tool Cadence Sigrity.
 Create designs for IP & systems validation boards, determine component placement, review layout and hand-off
for manufacturing.
 Good experience in designing Power supplies, LDO’s, SMPS, AC-DC, DC-DC converters.
 Exposure to Aeronautics Electronics Domain.
 To perform worst case analysis, simulations and design verification.
 Manage & Optimize Bill of Material (BOM).
 Provide hardware support to Software team in testing and debugging.
 Hands on experience in Soldering and handling the Lab equipments.
 Experience in AC –DC Analysis, Timing Analysis & EMI/EMC aspects of Hardware Product Design.
 Good documentation, communication & interpersonal skills.
 Signal Integrity Analysis: Experience in Signal Integrity Analysis i.e. ringing, crosstalk, signal loss, and power supply noise
within a Board design.
Project Details:
1. 2.5 inch and M.2 SSD SI and PI Validation :
Solid State Drive Design Validation has to be done which includes Signal Integrity Validation, Power Integrity
Validation and Simulation .
Duration: 6 Months Team Size: 8

2. o Responsibilities:
• Respin of the design for the two Form factor of the SSD i.e. 2.5 inch and M.2 .
• Gather requirements for the added circuitary, Documentation, Schematics, Layout Coordination, Test
Plan, Board Testing and Bring up .
• Coordination with the Onsite Team in their testing requirements.
• Entire power validation has performed individually.
• Coordination with the SI and PCB Engineer during the simulation and Layout.
• Exposure to Pre Layout and Post Layout SI and PI Analysis.
• Completely involved in documentation like Test Plan and Test Report.
• Involved in NAND , DDR3 , SATA validation for electrical and timing parameters.
• Involved in EMI/EMC Testing for Noise Immunity and Noise Coupling parameters.
• Gather requirements for the NGFF SSD for PCIe based solution.
2. Digital Multimedia Infotainment Receiver:
A Digital Multimedia System has been developed for Marine application which having three Modules to make a
complete system i.e. BlackBox, MW4 & Display Controller to display and control the multimedia information.
Duration: 10 Months Team Size: 12
o Responsibilities:
• Designed Display Controller module for the system.
• Gather requirements and contributes in Architecture, Schematics, Layout, Board Testing and debugging
for display controller module of the system.
• Provide Hardware support to the software team for their testing and development for flash file.
• Production support and successfully delivered the Boards to the Client.
• Performed Environmental Tests, Thermal Chamber Tests, ESD Tests for the Module.
• Performance testing for Audio, Bluetooth and RF section for the Module.
• Maintained a proper Inventory for the entire stocks for the project.
• Worked at Assembly House Vendor location for rework.
• Support to client to instruct the usage of entire module.
• Worked on Timing Analysis, DC Analysis.
• Respin of design has been done individually to release different versions of the module.
3. USB 3.0 FMC based evaluation Board:
To enhance the capabilities of Xilinx Virtex 6 FPGA Based ML605 board, FMC Based Adapter Card is developed for
USB 3.0 Validation and Testing Purpose.
Duration: 4 Month Team Size: 3
o Responsibilities:
• Designed and delivered the Board from requirements gathering to testing phase.
• Performed Hardware Testing and analysis for Power Management.
• Gather requirements and contributes in Architecture, Schematics, Layout and Board Testing.
• Customer support in Hardware Design relative to their requirement.
4. System Validation Board:
System Validation Board is designed for the validation of Intel based SoC for multimedia application platform.
Duration: 8 Months Team Size: 6
o Responsibilities:
• Involved in design respin and contributes in Engineering Specification document, Schematics drafting,
Layout review, Hardware Board Testing, debugging and production support.
• Involved in Hardware Testing and used equipments like R&S CMU200, CBT.
• Setup preparation for Volume Build Testing at Vendor’s place. Testing includes Chip Screening of the
newly developed Chip and after assembly of System Validation Board (SVB) perform Effusing, Flashing,
Calibration, GSM 900/DCS 1800 call & GPRS functional Testing.
• Run different Charger Test Cases and analyze the results.
• Making FF phone ready for the measurements by flashing System SW into the phone using Flash Tool,
Calibration using Calibration Tool .
• To perform worst case analysis and Smoke test to determine stress on components for the given set of
circuits.

3. 5. CAN IP Validation Board:
The goal of this project is to design the CAN validation board compatible to the Zynq ZC702 Board. Application
specific to this board is to validate the CAN transceivers according to Automotive standards.
Duration: 2 Month Team Size: 2
o Responsibilities:
• Gather requirements and contributes in Architecture, Schematics, Layout and Board Testing.
• Performed Hardware Testing and analysis for Power Management.
• Customer support in Hardware Design relative to their requirement.
6. Interface circuit simulation for BCM:
For a given set of circuits used in design of Body control Module (BCM), steady state analysis and transient pulses
analysis needs to be done.
Duration: 4 Month Team Size: 2
o Responsibilities:
• To perform worst case analysis, monte-carlo analysis for the circuits.
• To run Smoke test for the given set of circuits.
• Transient & steady state analysis for the circuit.
• Customer support in Hardware Design relative to their requirement.
7. Interposer Card design:
Interposer card designed for pin to pin communication between two base boards.
Duration: 1 Month Team Size: 1
o Responsibilities:
• Gather requirements and contributes in Schematics, Layout, Board Testing.
• Customer support in Hardware Design relative to their requirement.
8. FPGA Virtex VI Based PCIe Evaluation Platform:
The Virtex-6 FPGA x8 PCI Express Gen 2 kit is a comprehensive design environment for rapid prototyping and
development of PCI Express Gen 1 & 2. This kit is supported by a series of FMC Vita57 modules which expand the
functionality for wide range of high-speed serial connectivity applications.
Duration: 6 Months Team Size: 6
o Responsibilities:
• Contribution in interfacing FPGA to FMC Connectors.
• Component Placement and Layout guidelines for the PCB designer.
• Review Layout and Schematics for the entire Design.
• Coordination with Assembly House Vendors.
• Performed Hardware Testing and analysis for Thermal and Power Management.
9. IP Board based on TI’s DM3730 processor:
This is a Tablet Computer platform based on TI’s DM3730 ARM based processor. This is low cost 7” tablet platform which
includes all the basic features for the tablet and some of the special features are GSM Call & GPRS, 3G & Wi-Fi Connectivity,
Finger print Sensor etc.
Duration: 4 Months Team Size: 6
o Responsibilities:
• Design of the Power Architecture and Power budget analysis of the board.
• Design of Audio Codec Section of the Board.
• Design & Interfacing of different Sensors (like Accelerometer, Gyroscope, Magnetometer, Light &
Proximity, Temperature sensor) to the processor.
• Schematic Capture using ORCAD Design entry CIS ver. 16.3.
• BOM & Net-list generation.

4. Academic Qualification:
 Bachelor of Engineering in Elex & Comm. Engineering from ITM, Gwalior in 2010 with an aggregate of 72.63%.
 HSC from Kiddy’s Corner Hr. Sr. School in 2005 with an aggregate of 75.33%.
 SSC from Kiddy’s Corner Hr. Sr. School in 2003 with an aggregate of 67.8%.
Personal Details:
 D.O.B : 11 Jul 1988
 Passport No : K7874782
I hereby solemnly affirm that all the details provided above are true to the best of my knowledge. I shall carry myself in a
manner that lends dignity to the organization.
Date: Vikas Gupta