2. INTRODUCTION
A printed circuit board (PCB) mechanically
supports and electrically connects electronic
components using conductive tracks, pads and other
features etched from copper sheets laminated onto a
non-conductive substrate
4. Printed Circuit Board
Circuit connects components through board
Made of alternating layers of conducting and
insulating materials
5. Why PCB?
• Features
• Surprisingly Affordable
• Highly reliable
• Compact
• Drawbacks
• Requires more layout than other board types
• Higher initial cost than wire wrap or point-to-point
construction
7. Single Sided Circuit Board
A single sided board is made from
rigid laminate consisting of a
woven glass epoxy base
material clad with copper on one
side of varying thickness.
8. Double Sided Circuit Board
Double sided boards are made
from the same type of base
material clad with copper on two
sides of varying thickness.
9. Multi-Layer Board
Multi-layer boards are made
from the same base material
with copper foil on the top &
bottom and one or more
“inner layer”cores. The
number of “layers”
corresponds to the number
of copper foil layers.
10. PCB Design Steps
1 Design the circuit
2 Place the components
3 Route the wires
4 Manufacture
11. EDA Software
• PCB design software package
• Design the circuit (Schematics editor)
• Place the components (PCB editor)
• Route the wires (Autorouter module)
• Examples:
• EAGLE
• Express PCB
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13. Placement of Components
• Place big components first- e.g. microcontroller
• Place components in separate functional groups
• Put a ground plane under all components
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14. Signal Routing Component
Placement
Surface mount
• Top and bottom planes
• Minimal routing area
Through-hole mounted
• All components on same side
• Reduces routing area on all planes
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15. Signal Routing
Traces are wires connecting components
Traces can be routed through multiple layers
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16. Manufacturing
Etching process
• Industry standard file format to describe circuits
• Generated by PCB design software
• Contains all necessary info to manufacture a circuit
board (Traces, Pads, Silkscreen, etc.) by UV Exposure
• Put in to ferric chloride chemical
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17. Manufacturing
Drill
• Describes the location and size of holes
• Zipped with Gerber files and sent to assembly
PLACE THE COMPONENTS
SOULDER THE COMPONENTS AS PER CIRCUIT DIAGRAM