This document discusses a finite element analysis of extremely low cycle fatigue failure (less than 100 cycles) in an integrated circuit package solder joint. The goals are to evaluate the possibility of such failure during installation and extraction of a printed wiring board. The analysis predicts peak solder strain in the corner land of the component. It estimates that 25 flexes of the board at the connector edge could cause failure, with each flex accumulating enough strain energy in the solder joint. Specifically, a flexure of only 0.014 inches per cycle would result in failure after 25 cycles due to cumulative plastic strain energy in the solder.