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CHANDRA MOHAN .A
Contact Details: +91 7094760760 / 9962455562 E-Mail – chandramohan23@gmail.com
Forward-focused Manufacturing Management authority with a strong ability to identify opportunities for
revenue growth and build high-performance teams to support company objectives.
• Accomplished management professional with 13 years’ experience in Manufacturing and production
environments and recent experience focused on Electronics manufacturing industry
• Action-driven management executive with expertise in business and product development,
• Cross-functional team leadership and delivering positive outcomes with strong and sustainable gains.
• Able to identify and implement strategies to reduce costs, increase revenue, strengthen customer
relationships, improve business practices and drive profitable growth.
• Broad-based management skills, with strong planning, communication, organizational and decision-making
ability to successfully direct concurrent projects. Mentors staff and encourages a team environment for
high levels of employee confidence and satisfaction.
• Maximize quality assurance through direction of training initiatives and process improvements using lean
manufacturing techniques. Increase production efficiency by developing automation tools & work with
suppliers
CORE STRENGTHS & SKILLS
• Team Leadership
• Yield Improvement
• Process Improvement
• New Product Management
• Jigs / Fixtures development
• Document preparations
• Production Efficiency Enhancement
• EDM / IDM Cost & Consumption Reduction
• Production / Process Scrap Reduction
• Cycle time reduction
• Down time reduction
• Operator training
• ECO Development
• Negotiation skills with supplier
• Customer stratification
• Customer/Supplier Relations
• Continues improvement
• New Parts qualification
Accomplishments
• Improved ETE Yield >95%
• Held one of the highest Customer Satisfaction, while at Flextronics managing the Xerox account.
• Managed a highly efficient process team
• Improved product quality by introduced assembly tools and process optimization
• Reduced production and process scrap from 1.2 % to 0.2 % by optimizing process & developing new assembly jigs &
fixtures
• Improved productivity by eliminating NVA activity
• Cost saving 1.5 crore / year (Reduce the EDM material cost by identifying new supplier & negotiating with existing supplier
(solder paste / solder bar / solder wire / SMT printing glue & wave flux)
• Certified IPC–A–610 Acceptability of electronic assemblies: Reg No. 610MS 519585. by Mr.SUHIMI YAHYA (Malaysia)
IPC-A-610 certified IPC trainer: (Reg No. 610-T– 40259)
• Under gone Special training for process set-up and Box build assy at ISRAEL ( Flextronics technologies )
• Wave soldering process eliminated by introduce PIN IN PASTE process
• Managed the whole PROCESS & NPI activities.
• Taking right decision at right time.
• We participated in the CII Southern Region 11th
Edition of Kaizen Competition 2016 held on 26th October2016
at Hotel Westin, Chennai and we presented the Kaizen of the FTQ improvement @Wave soldering process for
W207BCM & we got 3rd prize in our category.
PROFESSIONAL HISTORY
Delphi Automotive Systems Private Limited - Oragadam,
• Designation : Assistant Manager
• Department :Manufacturing Engineering,
• From 20th July 2016 to Till date
• Expert in SMT Process, NPI/Proto run, ECN/ECO, LEAN Manufacturing tools (5S, Kaizen, 5 Whys,
Kanban, Poke-Yoke, Root Cause analysis & Tact Time), Six Sigma tools (FMEA, Control Plan, 8D, Flow
chart, Cause & effect, Pareto chart), Effective resource planning/ optimization, focusing on waste
reduction, enhancing productivity and profitability.
• Good Failure & Analysis skills for the process, part, design & test. Possess an inquisitive & analytical mind,
result oriented, creative thinking, system orientated approaches, excellent organizational skills, flexible &
detail oriented attitude combined with strong analytical & information analysis skills and a proven ability to
interact with diverse range of people in a professional manner.
• Ability to establish priorities and to plan, coordinate and monitor own work plan and the team. Equipped
with the willingness to learn to keep abreast of new developments.
• Frequently meeting with the customer for new products discussion (Understand customer requirements,
BOM changes, Tooling requirements, ECN changes, Special assembly process).
• Responsible for Defining new manufacturing process setup, by defining assembly process stages,
selecting right tools & machines.
• Reviewing all the customer documents, Bill of Materials, Assembly drawing, Gerber, Manufacturing
specifications, and special instructions along with the respective team for data adequacy for running the
product.
• Designing specific Jig & Fixtures ( Stencils, wave pallets ,VI templates and assembly fixtures) for the
special requirement Process
• Preparing Work Instruction, Process flow documents, procedures & providing training to Operators.
• Handling the end to end process (from the SMT process to Wave soldering process up to Packing OBA).
• Online problem solving in the Process related issues in the SMT & WAVE Soldering.
• Analysis the part failures and take corrective & preventive action (CAPA) by working with internal team &
Suppliers.
• Responsible for BOM changes based on customer ECO for mass production.
• Work with CFT and Customer in closure of corrective and Preventive actions for the NPI build
observations.
• Deftly Work on the continuous improvement of the process to achieve the targeted yield, Cycle time and
cost reduction goals.
• Reducing the manufacturing cost & time of the Product, by identifying & eliminating Non Value added
activities for the continual improvements.
• Work on the continuous improvement of the process to achieve the targeted yield, cycle time and cost
reduction goals.
• Establish the control charts, FMEA across various controls and quality compliances.
Previous Experience
 Duration : From Mar 2010 to July 2016.
 Name of the company : Flextronics Technologies India Pvt . Chennai
 Designation : Senior Engineer
 Department : Process Engineering.
Previous Experience
 Duration : From Oct 2009 to Mar 2010.
 Name of the company : Quad Electronics Pvt. Ltd (Celestica), Hyderabad.
 Designation : Team Leader -2.
 Department : In process Quality.
Previous Experience
 Duration : From Nov 2005 to Oct 2009.
 Name of the company : Solectron EMS India ltd, Bangalore
 Designation : Process Technician.
 Department : Process Engineering.
Previous Experience
 Duration : From Jan 2005 to Nov 2005.
 Name of the company : Opto Circuits India Ltd, Bangalore.
 Designation : In process quality Technician
 Department : In process Quality.
Previous Experience
 Duration : From July 2003 to Dec 2004.
 Name of the company : Applicaomp India Ltd, Bangalore.
 Designation : Technician
 Department : Production.
ACADEMICS
 B.Tech. Electronics & Tele Communication Engineering – 2012 - (RVD University Chennai)
 Diploma in Electrical & Electronics Engineering – 2003 (Government polytechnic, Anna University )
AWARDS & RECOGNITION
 Key Contributor Award - Revenue Achievement ( Productivity improvement )
 Presidents Award for Outstanding Achievement ( Yield improvement / EDM & IDM cost reduction)
PERSONAL DETAILS
Date of Birth : 30th
May 1983
Languages Known : English, Tamil, and Kannada.
Gender : Male
Marital Status : Un Married
Passport number :K0371517 (Valid -04/03/2022)
Yours Sincerely,
Chandra Mohan .A

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Resume

  • 1. CHANDRA MOHAN .A Contact Details: +91 7094760760 / 9962455562 E-Mail – chandramohan23@gmail.com Forward-focused Manufacturing Management authority with a strong ability to identify opportunities for revenue growth and build high-performance teams to support company objectives. • Accomplished management professional with 13 years’ experience in Manufacturing and production environments and recent experience focused on Electronics manufacturing industry • Action-driven management executive with expertise in business and product development, • Cross-functional team leadership and delivering positive outcomes with strong and sustainable gains. • Able to identify and implement strategies to reduce costs, increase revenue, strengthen customer relationships, improve business practices and drive profitable growth. • Broad-based management skills, with strong planning, communication, organizational and decision-making ability to successfully direct concurrent projects. Mentors staff and encourages a team environment for high levels of employee confidence and satisfaction. • Maximize quality assurance through direction of training initiatives and process improvements using lean manufacturing techniques. Increase production efficiency by developing automation tools & work with suppliers CORE STRENGTHS & SKILLS • Team Leadership • Yield Improvement • Process Improvement • New Product Management • Jigs / Fixtures development • Document preparations • Production Efficiency Enhancement • EDM / IDM Cost & Consumption Reduction • Production / Process Scrap Reduction • Cycle time reduction • Down time reduction • Operator training • ECO Development • Negotiation skills with supplier • Customer stratification • Customer/Supplier Relations • Continues improvement • New Parts qualification Accomplishments • Improved ETE Yield >95% • Held one of the highest Customer Satisfaction, while at Flextronics managing the Xerox account. • Managed a highly efficient process team • Improved product quality by introduced assembly tools and process optimization • Reduced production and process scrap from 1.2 % to 0.2 % by optimizing process & developing new assembly jigs & fixtures • Improved productivity by eliminating NVA activity • Cost saving 1.5 crore / year (Reduce the EDM material cost by identifying new supplier & negotiating with existing supplier (solder paste / solder bar / solder wire / SMT printing glue & wave flux) • Certified IPC–A–610 Acceptability of electronic assemblies: Reg No. 610MS 519585. by Mr.SUHIMI YAHYA (Malaysia) IPC-A-610 certified IPC trainer: (Reg No. 610-T– 40259) • Under gone Special training for process set-up and Box build assy at ISRAEL ( Flextronics technologies ) • Wave soldering process eliminated by introduce PIN IN PASTE process • Managed the whole PROCESS & NPI activities. • Taking right decision at right time. • We participated in the CII Southern Region 11th Edition of Kaizen Competition 2016 held on 26th October2016 at Hotel Westin, Chennai and we presented the Kaizen of the FTQ improvement @Wave soldering process for W207BCM & we got 3rd prize in our category.
  • 2. PROFESSIONAL HISTORY Delphi Automotive Systems Private Limited - Oragadam, • Designation : Assistant Manager • Department :Manufacturing Engineering, • From 20th July 2016 to Till date • Expert in SMT Process, NPI/Proto run, ECN/ECO, LEAN Manufacturing tools (5S, Kaizen, 5 Whys, Kanban, Poke-Yoke, Root Cause analysis & Tact Time), Six Sigma tools (FMEA, Control Plan, 8D, Flow chart, Cause & effect, Pareto chart), Effective resource planning/ optimization, focusing on waste reduction, enhancing productivity and profitability. • Good Failure & Analysis skills for the process, part, design & test. Possess an inquisitive & analytical mind, result oriented, creative thinking, system orientated approaches, excellent organizational skills, flexible & detail oriented attitude combined with strong analytical & information analysis skills and a proven ability to interact with diverse range of people in a professional manner. • Ability to establish priorities and to plan, coordinate and monitor own work plan and the team. Equipped with the willingness to learn to keep abreast of new developments. • Frequently meeting with the customer for new products discussion (Understand customer requirements, BOM changes, Tooling requirements, ECN changes, Special assembly process). • Responsible for Defining new manufacturing process setup, by defining assembly process stages, selecting right tools & machines. • Reviewing all the customer documents, Bill of Materials, Assembly drawing, Gerber, Manufacturing specifications, and special instructions along with the respective team for data adequacy for running the product. • Designing specific Jig & Fixtures ( Stencils, wave pallets ,VI templates and assembly fixtures) for the special requirement Process • Preparing Work Instruction, Process flow documents, procedures & providing training to Operators. • Handling the end to end process (from the SMT process to Wave soldering process up to Packing OBA). • Online problem solving in the Process related issues in the SMT & WAVE Soldering. • Analysis the part failures and take corrective & preventive action (CAPA) by working with internal team & Suppliers. • Responsible for BOM changes based on customer ECO for mass production. • Work with CFT and Customer in closure of corrective and Preventive actions for the NPI build observations. • Deftly Work on the continuous improvement of the process to achieve the targeted yield, Cycle time and cost reduction goals. • Reducing the manufacturing cost & time of the Product, by identifying & eliminating Non Value added activities for the continual improvements. • Work on the continuous improvement of the process to achieve the targeted yield, cycle time and cost reduction goals.
  • 3. • Establish the control charts, FMEA across various controls and quality compliances. Previous Experience  Duration : From Mar 2010 to July 2016.  Name of the company : Flextronics Technologies India Pvt . Chennai  Designation : Senior Engineer  Department : Process Engineering. Previous Experience  Duration : From Oct 2009 to Mar 2010.  Name of the company : Quad Electronics Pvt. Ltd (Celestica), Hyderabad.  Designation : Team Leader -2.  Department : In process Quality. Previous Experience  Duration : From Nov 2005 to Oct 2009.  Name of the company : Solectron EMS India ltd, Bangalore  Designation : Process Technician.  Department : Process Engineering. Previous Experience  Duration : From Jan 2005 to Nov 2005.  Name of the company : Opto Circuits India Ltd, Bangalore.  Designation : In process quality Technician  Department : In process Quality. Previous Experience  Duration : From July 2003 to Dec 2004.  Name of the company : Applicaomp India Ltd, Bangalore.  Designation : Technician  Department : Production. ACADEMICS  B.Tech. Electronics & Tele Communication Engineering – 2012 - (RVD University Chennai)  Diploma in Electrical & Electronics Engineering – 2003 (Government polytechnic, Anna University ) AWARDS & RECOGNITION  Key Contributor Award - Revenue Achievement ( Productivity improvement )  Presidents Award for Outstanding Achievement ( Yield improvement / EDM & IDM cost reduction) PERSONAL DETAILS Date of Birth : 30th May 1983 Languages Known : English, Tamil, and Kannada. Gender : Male Marital Status : Un Married Passport number :K0371517 (Valid -04/03/2022) Yours Sincerely,