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NANTHA KUMARAN THIAGARAJAN
NO 14, JALAN GELANG 7,
BANDAR PUTERI 41200
KLANG, SELANGOR
H/Phone: +6012-2699864
Email: mtnantha@hotmail.com
PERSONAL DETAILS
Date of birth : 15th
March 1982
Citizenship : Malaysian
NRIC : 820315-05-5385
Gender : Male
Marital Status : Married
CAREER OBJECTIVE
 To work in an environment that promotes continuous personal and professional
development to assist in exploration of new ideas and achieving positive outcomes.
 To contribute my technical and academic knowledge with my management experience
to obtain solutions that fulfill the technical, environmental, social and commercial needs
of the organization.
PERSONAL ABILITIES
 Years of experience in high volume manufacturing on electronic consumer products
with process improvements skill-sets to reduce cost and increase revenue.
 Project management knowledge to deliver project on time, within budget and fulfills
customer requirements; ability to use Project Management Tools.
 Presentable and results-driven with excellent prioritization and planning skills.
 Energetic and able to work independently in a fast pace environment with good
problem solving skills and process improvement tools (fishbone diagram, DMAIC, Poka
Yoke and SWOT methods)
 Good public relations skills with ability to interact effectively with a diverse group of
people of all level.
 Good knowledge on Six Sigma process, methods (DMAIC) and on Lean Manufacturing.
 Knowledge on GR&R, Cp & Cpk statistical study to ensure stability of testers/processes
using Minitab and JMP.
ACADEMIC BACKGROUND
2006- 2008:
University Putra Malaysia (UPM), Serdang, Malaysia
Master of Engineering Management with CGPA 3.75
2001- 2005:
Multimedia University (MMU), Cyberjaya, Malaysia
Bachelor of Engineering (Hons) Electronics
WORKING EXPERIENCE
• INFINEON TECHNOLOGIES (M) SDN BHD
Duration : October 2013 till current
Designation : Project Manager
Department : Logic Development
Business Scope : Lead Project Management Team handling Assembly Technology project from
Initiation phase to Ramp up Manufacturing Release.
Job Descriptions:
 Project Management for Assembly technology projects
 Drive and manage package development projects and ensure success in meeting the
target, namely timeline, quality, cost and yield.
 Plan and manage IC packaging development projects and activities
 Drive definition and concept engineering development for new assembly technology
and new packaging concept
 Coordinate reverse engineering activity on IC packaging solution
 Aware about the latest technical trend and assembly technology developments at
subcon and within IC assembly community
 Support for development roadmapping process, plan and execute development
program from idea generation to final realization into Back-end production environment
 Control, monitor, and report project progress to management and internal customer
 Coordinate with process technology engineering and operation on the development and
implementation of new processes and technology
 Setup systematic documentations for development projects and coordinate the
assessment and implementation of new assembly design rules
Achievements:
• GOLD Award winner for Team of Quarter Award 2015
• Assembly Development Goal (AdeGo) Gold and Silver Awards for 3 projects.
• Completed and Released 3 Major Assembly Development Projects
o Cost of project ~ 500 k€
o Timeline of projects ~2 years
o Team consists of 10 members
o Project scope – New wafer technology with current existing package
• Lead for Logic segment for Task Force in solving Lifted Ball with metallization issue under
new wafer technology. Cross functional team involving Front End, Back End and Technology
groups.
• Lead 2 Major Customer Issue on Lifted Ball Bond and Non Stick Bond and drive team
towards manufacturable solutions.
• Completed Project Management Training (under Infineon Program) 5 days with certificate
• FLEXTRONICS INTERNATIONAL LTD.
Business Unit: Flextronics Shah Alam Sdn Bhd
Duration : October 2012 till June 2013 (Company shut down)
Designation : Staff Engineer
Department : Product/Yield Engineering
Business Scope : Product Engineering team handles the product development;
manufacturability, prototyping for camera module for high volume manufacturing. Lead all yield
improvements and provide technical support during project execution.
Job Descriptions:
 Lead a group of Product Engineers & support project team to meet customer
requirements and project needs.
 Prepare Work Breakdown Structure (WBS), define Scope of Work (SOW), and define
deliverables according to Flextronics product life cycle.
 Study operations sequence, material flow, functional statements, organization charts,
and project information to determine areas of improvement.
 Develop manufacturing methods, labor utilization standards, and cost analysis systems
to promote efficient staff and facility utilization.
 Develop failure verification systems to validate production failures and to perform first
level failure analysis.
 Estimate production cost and effect of product design changes for management review,
action, and control.
 Coordinate quality control objectives and activities to resolve production problems,
maximize product reliability, and minimize cost.
 Define and implement yield monitoring system, yield triggering system and yield target
for future builds.
 Apply statistical methods and perform mathematical calculations to determine
manufacturing processes, staff requirements, and production standards.
 Analyze statistical data and product specifications to determine standards and establish
quality and reliability objectives of finished product.
 Regulate and alter workflow schedules according to established manufacturing
sequences and lead times to expedite production operations.
 Implement tools on yield analysis and yield report with the use of Shop Floor system for
efficient and effective monitoring.
Achievements:
• Lead Yield team to achieve 91% product cumulative yield from baseline 78% through various
Quality Improvement Team approach.
• Supported product ramp plan from 30K per day to 180K per day production plan capacity.
• Implemented Yield OCAP (Out of Action Control Plan) to have a systematic machine
shutdown due to low yield triggering limit.
• Member of Particles Reduction QIT. Reduced particles yield loss from 10 % to 5 % using
various improvement techniques and methods.
• WESTERN DIGITAL CORPORATION.
Business Unit: Western Digital (M) Sdn. Bhd
Duration : April 2011 till October 2012
Designation : Senior Engineer
Department : New Product Launch
Business Scope : Manage and coordinate all factory efforts to prepare new product transfers.
Job Descriptions:
• Manage and coordinate all factory efforts to prepare new product transfers. This
involves reviewing all new material cum process requirements, interfacing with other
WD sites to solicit required support and training and working out a systematic factory
implementation plan.
• Based on material requirement, plan and coordinate all new head/media introduction to
the factory which involves managing product evaluations.
• Maintain working knowledge of on-going product development – Release of new
firmware, material changes, customer configurations and etc.
• Verify accuracy of new product start up preparation and new Bill of Materials.
• Support new PCBA builds.
• Coordinate special engineering evaluations for new materials, processes, and new
firmware.
Achievements:
• Successfully launched 4TB HDD new product into manufacturing phase with 30K units
weekly output.
• Lead NPL engineer for 3 WD Thailand clean room start up product in WD Malaysia due
to Thailand flooding in Nov 2011.
• Part of the project team to recover 1.2 million drives trapped in WD Thailand during
flood. Successfully shipped all the drives to customer with special requirement.
Certificates and incentives given upon this successful completion.
• Successfully qualified WD Malaysia for new head component build. This was part of the
plan to bring up WDM as new head site for transferred products.
• FREESCALE SEMICONDUCTOR (M) SDN.BHD
Duration : July 2008 till April 2011
Designation : Senior Product Engineer
Department : Network Multimedia Group – Business Unit
Business Scope : Supporting business group / final manufacturing in enabling critical NPI launch,
ensuring customer shipment, and fan out lesson learnt/ manufacturing requirement to
development and manufacturing teams for subsequent products/ technology improvement.
Job Descriptions:
 Perform assessment on critical NPI and formulate strategy to overcome its challenges.
 Take charge in new product bring-up through early/upfront engagement to enable
product launch in Final Test meeting HVM requirement.
 Supporting business group / final manufacturing in enabling critical NPI launch, ensuring
customer shipment, and fan out lesson learnt/ manufacturing requirement to
development and manufacturing teams for subsequent products/ technology
improvement.
 Identify and manage risk to minimize impact to product launch and improve its
manufacturability robustness.
 Provide technical guidance to engineers/technicians on manufacturing challenges and
innovative solutions to improve new products towards meeting all manufacturing
requirements.
 Strategize and execute yield improvement plan for NPI through data analysis
 Lead and drive a team of engineers to perform product maturity level (PML) assessment
and identify improvement
 Plan and execute projects to improve cost, yield, quality and productivity of products
 Analyze and resolve technical issues and challenges in Fabrication, Probe, Assembly, Test
and Burn In and Design
 Work closely with global design, wafer fabrication process, device engineering and
manufacturing teams during the product launch and manufacturing.Organize
countermeasure to overcome problems or complains from customers and evaluate new
strategy and concepts, which can enable to low cost and less down time.
Achievements:
• Lead Product Engineer for the first Freescale 45nm technology product launch in
Freescale Malaysia. This product is a powerful six core based DSP products using latest
technology.
• Undergone specialized product and project based training in Freescale USA ( Austin,
Texas) for 3 months with on job training included.(Aug’2009 –Nov’ 2009)
• Successfully launched DSP product manufacturing in Freescale Malaysia with a capacity
of 20K delivery per month.
• Involved in major cost reduction project: Yield improvement, Test Time reduction, Burn
in process time reduction.
• FLEXTRONICS INTERNATIONAL LTD.
Business Unit: Flextronics Manufacturing (M) Sdn. Bhd
Duration : Dec 2005 till July 2008
Designation : Engineer
Department : New Product Introduction (NPI)
Business Scope : To coordinate on NPI products transfer into manufacturing phase and execute
the installation of new processes for camera modules.
Job Descriptions:
• Take charge in new product bring-up through early/upfront engagement to enable
product launch in Final Test meeting HVM requirement.
• Responsible for new camera module line setup as well as process specification
documentation (FMEA/Control Plan) for NPI in order to fulfill Quality System
requirement.
• To communicate with customer on technical requirements and translating to production
and engineering implementation in manufacturing process.
• To study on product design and to translate to engineering know-how in manufacturing.
• To prepare Failure Analysis report during testing new products.
REFERENCES
Name: Mr. Visvanaathan Renganathan
Designation: Regional NPI Engineering Head
Company Name: Flextronics International
Contact Number: +6012-3917229
Name: Mr. Sutharthan Marimuthu
Designation: Business Partner( former superior at Flex)
Company Name: BUSS Consulting Sdn Bhd
Contact Number: +6012-3680519
• Responsible for new camera module line setup as well as process specification
documentation (FMEA/Control Plan) for NPI in order to fulfill Quality System
requirement.
• To communicate with customer on technical requirements and translating to production
and engineering implementation in manufacturing process.
• To study on product design and to translate to engineering know-how in manufacturing.
• To prepare Failure Analysis report during testing new products.
REFERENCES
Name: Mr. Visvanaathan Renganathan
Designation: Regional NPI Engineering Head
Company Name: Flextronics International
Contact Number: +6012-3917229
Name: Mr. Sutharthan Marimuthu
Designation: Business Partner( former superior at Flex)
Company Name: BUSS Consulting Sdn Bhd
Contact Number: +6012-3680519

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Nantha Kumaran CV_1

  • 1. NANTHA KUMARAN THIAGARAJAN NO 14, JALAN GELANG 7, BANDAR PUTERI 41200 KLANG, SELANGOR H/Phone: +6012-2699864 Email: mtnantha@hotmail.com PERSONAL DETAILS Date of birth : 15th March 1982 Citizenship : Malaysian NRIC : 820315-05-5385 Gender : Male Marital Status : Married CAREER OBJECTIVE  To work in an environment that promotes continuous personal and professional development to assist in exploration of new ideas and achieving positive outcomes.  To contribute my technical and academic knowledge with my management experience to obtain solutions that fulfill the technical, environmental, social and commercial needs of the organization. PERSONAL ABILITIES  Years of experience in high volume manufacturing on electronic consumer products with process improvements skill-sets to reduce cost and increase revenue.  Project management knowledge to deliver project on time, within budget and fulfills customer requirements; ability to use Project Management Tools.  Presentable and results-driven with excellent prioritization and planning skills.  Energetic and able to work independently in a fast pace environment with good problem solving skills and process improvement tools (fishbone diagram, DMAIC, Poka Yoke and SWOT methods)  Good public relations skills with ability to interact effectively with a diverse group of people of all level.  Good knowledge on Six Sigma process, methods (DMAIC) and on Lean Manufacturing.  Knowledge on GR&R, Cp & Cpk statistical study to ensure stability of testers/processes using Minitab and JMP. ACADEMIC BACKGROUND 2006- 2008: University Putra Malaysia (UPM), Serdang, Malaysia Master of Engineering Management with CGPA 3.75 2001- 2005: Multimedia University (MMU), Cyberjaya, Malaysia
  • 2. Bachelor of Engineering (Hons) Electronics WORKING EXPERIENCE • INFINEON TECHNOLOGIES (M) SDN BHD Duration : October 2013 till current Designation : Project Manager Department : Logic Development Business Scope : Lead Project Management Team handling Assembly Technology project from Initiation phase to Ramp up Manufacturing Release. Job Descriptions:  Project Management for Assembly technology projects  Drive and manage package development projects and ensure success in meeting the target, namely timeline, quality, cost and yield.  Plan and manage IC packaging development projects and activities  Drive definition and concept engineering development for new assembly technology and new packaging concept  Coordinate reverse engineering activity on IC packaging solution  Aware about the latest technical trend and assembly technology developments at subcon and within IC assembly community  Support for development roadmapping process, plan and execute development program from idea generation to final realization into Back-end production environment  Control, monitor, and report project progress to management and internal customer  Coordinate with process technology engineering and operation on the development and implementation of new processes and technology  Setup systematic documentations for development projects and coordinate the assessment and implementation of new assembly design rules Achievements: • GOLD Award winner for Team of Quarter Award 2015 • Assembly Development Goal (AdeGo) Gold and Silver Awards for 3 projects. • Completed and Released 3 Major Assembly Development Projects o Cost of project ~ 500 k€ o Timeline of projects ~2 years o Team consists of 10 members o Project scope – New wafer technology with current existing package • Lead for Logic segment for Task Force in solving Lifted Ball with metallization issue under new wafer technology. Cross functional team involving Front End, Back End and Technology groups. • Lead 2 Major Customer Issue on Lifted Ball Bond and Non Stick Bond and drive team towards manufacturable solutions. • Completed Project Management Training (under Infineon Program) 5 days with certificate
  • 3. • FLEXTRONICS INTERNATIONAL LTD. Business Unit: Flextronics Shah Alam Sdn Bhd Duration : October 2012 till June 2013 (Company shut down) Designation : Staff Engineer Department : Product/Yield Engineering Business Scope : Product Engineering team handles the product development; manufacturability, prototyping for camera module for high volume manufacturing. Lead all yield improvements and provide technical support during project execution. Job Descriptions:  Lead a group of Product Engineers & support project team to meet customer requirements and project needs.  Prepare Work Breakdown Structure (WBS), define Scope of Work (SOW), and define deliverables according to Flextronics product life cycle.  Study operations sequence, material flow, functional statements, organization charts, and project information to determine areas of improvement.  Develop manufacturing methods, labor utilization standards, and cost analysis systems to promote efficient staff and facility utilization.  Develop failure verification systems to validate production failures and to perform first level failure analysis.  Estimate production cost and effect of product design changes for management review, action, and control.  Coordinate quality control objectives and activities to resolve production problems, maximize product reliability, and minimize cost.  Define and implement yield monitoring system, yield triggering system and yield target for future builds.  Apply statistical methods and perform mathematical calculations to determine manufacturing processes, staff requirements, and production standards.  Analyze statistical data and product specifications to determine standards and establish quality and reliability objectives of finished product.  Regulate and alter workflow schedules according to established manufacturing sequences and lead times to expedite production operations.  Implement tools on yield analysis and yield report with the use of Shop Floor system for efficient and effective monitoring. Achievements: • Lead Yield team to achieve 91% product cumulative yield from baseline 78% through various Quality Improvement Team approach. • Supported product ramp plan from 30K per day to 180K per day production plan capacity. • Implemented Yield OCAP (Out of Action Control Plan) to have a systematic machine shutdown due to low yield triggering limit. • Member of Particles Reduction QIT. Reduced particles yield loss from 10 % to 5 % using various improvement techniques and methods.
  • 4. • WESTERN DIGITAL CORPORATION. Business Unit: Western Digital (M) Sdn. Bhd Duration : April 2011 till October 2012 Designation : Senior Engineer Department : New Product Launch Business Scope : Manage and coordinate all factory efforts to prepare new product transfers. Job Descriptions: • Manage and coordinate all factory efforts to prepare new product transfers. This involves reviewing all new material cum process requirements, interfacing with other WD sites to solicit required support and training and working out a systematic factory implementation plan. • Based on material requirement, plan and coordinate all new head/media introduction to the factory which involves managing product evaluations. • Maintain working knowledge of on-going product development – Release of new firmware, material changes, customer configurations and etc. • Verify accuracy of new product start up preparation and new Bill of Materials. • Support new PCBA builds. • Coordinate special engineering evaluations for new materials, processes, and new firmware. Achievements: • Successfully launched 4TB HDD new product into manufacturing phase with 30K units weekly output. • Lead NPL engineer for 3 WD Thailand clean room start up product in WD Malaysia due to Thailand flooding in Nov 2011. • Part of the project team to recover 1.2 million drives trapped in WD Thailand during flood. Successfully shipped all the drives to customer with special requirement. Certificates and incentives given upon this successful completion. • Successfully qualified WD Malaysia for new head component build. This was part of the plan to bring up WDM as new head site for transferred products. • FREESCALE SEMICONDUCTOR (M) SDN.BHD Duration : July 2008 till April 2011 Designation : Senior Product Engineer Department : Network Multimedia Group – Business Unit Business Scope : Supporting business group / final manufacturing in enabling critical NPI launch, ensuring customer shipment, and fan out lesson learnt/ manufacturing requirement to development and manufacturing teams for subsequent products/ technology improvement. Job Descriptions:
  • 5.  Perform assessment on critical NPI and formulate strategy to overcome its challenges.  Take charge in new product bring-up through early/upfront engagement to enable product launch in Final Test meeting HVM requirement.  Supporting business group / final manufacturing in enabling critical NPI launch, ensuring customer shipment, and fan out lesson learnt/ manufacturing requirement to development and manufacturing teams for subsequent products/ technology improvement.  Identify and manage risk to minimize impact to product launch and improve its manufacturability robustness.  Provide technical guidance to engineers/technicians on manufacturing challenges and innovative solutions to improve new products towards meeting all manufacturing requirements.  Strategize and execute yield improvement plan for NPI through data analysis  Lead and drive a team of engineers to perform product maturity level (PML) assessment and identify improvement  Plan and execute projects to improve cost, yield, quality and productivity of products  Analyze and resolve technical issues and challenges in Fabrication, Probe, Assembly, Test and Burn In and Design  Work closely with global design, wafer fabrication process, device engineering and manufacturing teams during the product launch and manufacturing.Organize countermeasure to overcome problems or complains from customers and evaluate new strategy and concepts, which can enable to low cost and less down time. Achievements: • Lead Product Engineer for the first Freescale 45nm technology product launch in Freescale Malaysia. This product is a powerful six core based DSP products using latest technology. • Undergone specialized product and project based training in Freescale USA ( Austin, Texas) for 3 months with on job training included.(Aug’2009 –Nov’ 2009) • Successfully launched DSP product manufacturing in Freescale Malaysia with a capacity of 20K delivery per month. • Involved in major cost reduction project: Yield improvement, Test Time reduction, Burn in process time reduction. • FLEXTRONICS INTERNATIONAL LTD. Business Unit: Flextronics Manufacturing (M) Sdn. Bhd Duration : Dec 2005 till July 2008 Designation : Engineer Department : New Product Introduction (NPI) Business Scope : To coordinate on NPI products transfer into manufacturing phase and execute the installation of new processes for camera modules. Job Descriptions: • Take charge in new product bring-up through early/upfront engagement to enable product launch in Final Test meeting HVM requirement.
  • 6. • Responsible for new camera module line setup as well as process specification documentation (FMEA/Control Plan) for NPI in order to fulfill Quality System requirement. • To communicate with customer on technical requirements and translating to production and engineering implementation in manufacturing process. • To study on product design and to translate to engineering know-how in manufacturing. • To prepare Failure Analysis report during testing new products. REFERENCES Name: Mr. Visvanaathan Renganathan Designation: Regional NPI Engineering Head Company Name: Flextronics International Contact Number: +6012-3917229 Name: Mr. Sutharthan Marimuthu Designation: Business Partner( former superior at Flex) Company Name: BUSS Consulting Sdn Bhd Contact Number: +6012-3680519
  • 7. • Responsible for new camera module line setup as well as process specification documentation (FMEA/Control Plan) for NPI in order to fulfill Quality System requirement. • To communicate with customer on technical requirements and translating to production and engineering implementation in manufacturing process. • To study on product design and to translate to engineering know-how in manufacturing. • To prepare Failure Analysis report during testing new products. REFERENCES Name: Mr. Visvanaathan Renganathan Designation: Regional NPI Engineering Head Company Name: Flextronics International Contact Number: +6012-3917229 Name: Mr. Sutharthan Marimuthu Designation: Business Partner( former superior at Flex) Company Name: BUSS Consulting Sdn Bhd Contact Number: +6012-3680519