Thermal management smartphone overview 2017 teardown reverse costing report published by System Plus

©2017 System Plus Consulting | Thermal Management Review in Smartphones 1
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Thermal Management in Smartphones:
Technology Comparison 2017
Comparative Analysis of 10 Smartphones of Apple, Samsung, Huawei, Xiaomi, LG
Power report by Elena BARBARINI
November 2017 – Version 1

Table of Contents
Overview / Introduction 3
o Executive Summary
o Methodology
o Glossary
Company Profile 7
o Apple, Samsung, Huawei, Xiaomi, LG
o Smartphone History
Thermal Management Solutions & Comparison 43
o Heating Zones
o Processor Design & Packaging
o Telephone Assembly Thermal Solutions
Physical Analysis 53
o Physical Analysis Methodology
o Apple 55
o iPhone 6s Plus
 Package View & Heating Zones
 Board PBC & Heat spreader
 Processor A9
o iPhone 7 Plus
 Processor A10
o iPhone 8
 Processor A11
o iPhone X
 PCB Integration
o Samsung 139
o Galaxy S7
 Processor Snapdragon 820 & Ekynos 8
 Heat Pipes
o Galaxy S8
 Processor Snapdragon 835
 Heat Pipes
o Huawei 211
o P9
 Processor Kirin 955
o Mate 9
o LG 264
o G6
 Heat Pipes
o Xiaomi 285
o Mi5
Company services 297

Overview / Introduction
o Executive Summary
o Methodology
o Glossary
Company Profile & Phone
History
Thermal Management
Solutions
iPhone Physical Analysis
Samsung Physical Analysis
Huawei Physical Analysis
LG Physical Analysis
Xiaomi Physical Analysis
Feedback
About System Plus
Executive Summary
• A smartphone contains several components that generate heat and other components sensitive to heat; to maintain
acceptable temperature levels in these small handheld devices, manufacturers propose different solutions which
require high performance and design constraints.
• To complement Yole Développement’s Thermal Management in Smartphones report, System Plus Consulting has
conducted a comparative technology review to provide insights into the assembling structure and thermal
management technology of 10 flagship smartphones from leading suppliers: Apple, Samsung, Huawei, LG and
Xiaomi.
• In this report, we highlight the differences and the innovations in the thermal management solutions chosen by the
end-user OEMs.
• Whereas some OEMs use standard solutions such as heat spreaders of metal frames, others choose to consider
more complex structures such as heat pipes.
• Moreover, as the processor is one of the most important heat sources, we have seen how the PCB design has
changed to improve thermal dissipation and how the packaging of the processor itself has evolved to solve thermal
problems caused by miniaturization and efficiency increase. Located close to the battery and the DRAM chip on the
main board, the application processors are packaged using different PoP technologies. Some AP providers, like
HiSilicon or Samsung, use conventional PoP with embedded land-side capacitors; others, like Apple or Qualcomm,
use innovative technologies like fan-out PoP or embedded die packaging with advanced PCB substrate.
• This report includes multiple comparisons based on physical analyses of the latest flagship smartphones. It offers the
unique possibility of seeing thermal management technology evolution, tracked by manufacturer.

o Executive Summary
o Methodology
o Glossary
History
Thermal Management
Solutions
Feedback
About System Plus
Why thermal management in smartphones?
• Thermal management for modern electronic systems can follow two fundamental paths: one concentrates
design efforts towards low power/high efficiency electronic circuits/components, the other implies, where
the previous one reaches its limits, optimizing thermal transfer in the entire system at chip level, package
level, and PCB/assembly level.
• Those technological evolutions could be seen in smartphones because of the big market share. Big market
share and small devices sizes push the telephone manufacturers to improve the processor performances
(low power/high efficiency) and/or optimize thermal transfer in the complete smartphone system.
• Device manufactuers are interested in following these evolutions because they will be then integrated in
other electronic systems.

o Executive Summary
o Methodology
o Glossary
History
Thermal Management
Solutions
Feedback
About System Plus
2016’s Leading smartphone companies BY units sold per year
Market share of leading smartphone suppliers in 2016 by number of smartphones sold.
Yole Développement
Samsung, Apple and Huawei were the leading smartphone suppliers in 2016.

o Executive Summary
o Methodology
o Glossary
History
Thermal Management
Solutions
Feedback
About System Plus
Thermal Management Market
Source: Yole Développement
• TM component value relative to total BoM seems to be extremely low, but considering the huge number of smartphones sold per
year, TM components represent important revenue for suppliers.
• Despite the small share of thermal management components in total smartphone value, their role is crucial to avoid overheating
issues which are undesirable for customers.

o Executive Summary
o Methodology
o Glossary
History
Thermal Management
Solutions
Feedback
About System Plus
Analysed Telephones
• Ten references of telephones have been analyzed.
End-users
OEM
Device
Smarthphones
sold (2016)
Apple
iPhone 6S Plus
215.4 MUnits
iPhone 7 Plus
iPhone 8
iPhone X
Samsung
Galaxy S7
287.2 MUnit
Galaxy S8
Huawei
P9
143.6 MUnit
Mate 9
LG G6 43.1 MUnit
Xiaomi Mi5 86.2 MUnit

o Executive Summary
o Methodology
o Glossary
History
Thermal Management
Solutions
Feedback
About System Plus
Analysed Processor Packaging

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
Why telephones get hot?
There are different reasons for overheating of telephones: these can be related to the design, the construction itself, the
utilization mode and the environment.

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
Processor Packaging platform
WHICH PACKAGES ARE USED IN SMARTPHONES?
•QFN (quad-flat no-leads)
o Main applications are in automotive; very rare in mobile phones
•Fan-in approach (WLCSP–Wafer-Level Chip Scale Package)
o Interconnects are within the die surface area
o Used in mobile phones, RF devices, power devices
o Limitation by the chip size
•FC-BGA
o FC-CSP/FC-BGA are the most standard packages, used in almost all
smartphones today.
•Fan-out approach
o Inter connects not limited by the die size
o Good thermal conductivity
o Good electrical conductivity
o More recent approach, therefore still higher cost compared to
traditional packaging solutions

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
PoP packaging Technologies
The electrically conductive material (18 in the Shinko patent) can include a solid core formed from a metal like copper, which
solid core can be coated with a solder.
The copper core solder ball seems to be dropped and reflowed before molding. The copper ball has a small shift during the
reflow. The presence of the copper ball prevent a shrink of the solder ball during the reflow and also offers better electrical and
heat conductivity.
Theorical Technology
Source : Patent US7782624B2
MCeP package from Shinko Electric Industries Co.
Shinko’s PoP for
Application Processor (AP)
Chipset
FC-PoP is the conventional PoP packaging. Two actors uses this type of package: Huawei, Samsung. One of the two other actors
(Qualcomm) uses different approach whith Shinko’s MCeP who choose advanced substrate to support the AP.

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
Package Cross-Section Comparison
In the cross-section, two main choice has been
made by the End-Users OEM with the PoP.
Apple and Qualcomm choose advanced
packaging through TSMC and Shinko. Huawei
and Samsung choose conventional packaging
through Amkor and Samsung.
TSMC and Shinko managed to get thin
packaging compared to traditional PoP.
In each PoP, the memory package has
approximatively the same thickness, even if
one of them doesn’t use stack memory
The high reliability of copper based through
molding via solution is obvious when we
compared the cross section of the packages.
Depending on the packaging manufacturer,
TMV could have some distortion form or
unwanted connection.
Even if Samsung and Amkor use the same PoP
technology, some differences can be seen. For
Samsung, the via have a better definition than
Amkor.
With 3 RDL layers, TSMC managed to avoid the
use of top PCB with small L/S dimensions.
A10 Package cross-section – SEM view
Kirin 955 Package cross-section – SEM view
Exynos 8 Package cross-section – SEM view
Snapdragon 820 Package cross-section – SEM view

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
20 18 16 14 12 10 8 6 4 2
800
1000
1200
1400
1600
1800
2000
I/Onumber
Line/Space (µm/µm)
Application processor I/O count & Line/Space width

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
PCB Design
The Printed Circuit Board (PCB) has large potential for smartphone thermal management improvement. In fact the PCB is in
contact with the heat generating devices, but it has a large area to dissipate the heat.
There are different parameters to take in account in the analysis of the PCB design

History
Thermal Management
Solutions
o Synthesis
o PCB
o Processor
Feedback
About System Plus
Heat Spreader
HEAT SPREADER are thin layer of material which are used to distribute heat across the telephone
to prevent hotspot and provide lateral heat conduction.
They can be made of different materials:
• Aluminium
• Graphite
• Copper
• ……
And have different shapes:
• Foils
• Adhesive tapes
• Sheets

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple Processor Supply Chain History
Apple utilizes a fabless production model. They rely on independent third-party suppliers to perform manufacturing and
assembly.
60 %
Die
Manufacturing
Package
Manufacturing
Package
Technology
FC-PoP FC-PoP inFO-PoP
2014 2015 2016 2017
40 %
Gate-last HKMG 20 nm
89 mm²
FinFET 14 nm
96 mm²
FinFET 16 nm
104.5 mm²
FinFET 16 nm
125 mm²
Die Technology
& Area
FinFET 10 nm
87.7 mm²
inFO-PoP

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone 6s Plus Teardown
Apple iPhone 6s Plus Front View Apple iPhone 6s Plus SideViewApple iPhone 6s Plus Front View
158.2mm
77.9 mm 7.3 mmTelephone surface: 12,323 mm2

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone 6s Plus Heating zones

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone 6s Plus Processor Board

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
PCB iPhone 6s Plus

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
A9 Package Cross-Section

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone 7 Plus Opening

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone 7 Plus Teardown

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
PCB cross section

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone X Teardown

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone X Heating zones

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Apple iPhone X Processor Board

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Samsung Smartphone History & Major Players

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Samsung Galaxy S7 Teardown – European Version

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Samsung Galaxy S7 Teardown EMI (US version)

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Exynos 8 Package Cross-Section

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Samsung Galaxy S8 Teardown

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
Heat Pipes

History
Thermal Management
Solutions
o Synthesis
Feedback
About System Plus
Huawei Smartphone History & Major Players

History
Thermal Management
Solutions
o Synthesis
Feedback
About System Plus
Huawei P9 Opening

History
Thermal Management
Solutions
o Synthesis
Feedback
About System Plus
Huawei P9 Processor Board

History
Thermal Management
Solutions
o Synthesis
Feedback
About System Plus
Kirin 955 Package View & Dimensions

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
LG Smartphone History & Major Players

History
Thermal Management
Solutions
o Synthesis
o Telephone
Feedback
About System Plus
LG G6Opening

History
Thermal Management
Solutions
Feedback
About System Plus
o Company services
o Contact
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REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
Packaging
• Advanced RF SiPs for Cell Phones: Reverse
Costing Overview
• 2016 Comparison of Application Processor
Packaging
Related Reports
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
Batteries / Energy Management
• Market Opportunities for Thermal Management
Components in Smartphones

COMPLETE TEARDOWN
WITH:
Detailed photos
Precise measurements
Internal packaging
structures
Thermal management
solutions
PCB package cross-sections
Processor package analysis
Thermal Management in Smartphones:
Technology Comparison 2017
Title: Thermal
Management in
Smartphones: Technology
Review 2017
Pages: 150
Date: November 2017
Format: PDF & Excel file
Price: Full report:
EUR 3,490
Bundle offer with Market
Opportunities for Thermal
Management Components
in Smartphones Report by
Yole Développement
Comparative analysis of thermal management solution analysis of 10
flagship smartphones from Apple, Samsung, Huawei, LG and Xiaomi.
Whereas some OEMs use standard solutions such as heat spreaders of metal frames,
others choose to consider more complex structures such as heat pipes.
Moreover, as the processor is one of the most important heat sources, we have seen
how the PCB design has changed to improve thermal dissipation and how the packaging
of the processor itself has evolved to solve thermal problems caused by miniaturization
and efficiency increase. Located close to the battery and the DRAM chip on the main
board, the application processors are packaged using different Package-on-Package
(PoP) technologies. Some AP providers, like HiSilicon or Samsung, use conventional PoP
with embedded land-side capacitors; others, like Apple or Qualcomm, use innovative
technologies like fan-out PoP or embedded die packaging with advanced PCB substrate.
This report includes multiple comparisons based on physical analyses of the latest
flagship smartphones. It offers the unique possibility of seeing thermal management
technology evolution, tracked by manufacturer.
A smartphone contains several components that generate
heat and other components sensitive to heat; to maintain
acceptable temperature levels in these small handheld
devices, manufacturers propose different solutions which
require high performance and design constraints.
To complement Yole Développement’s Market
Opportunities for Thermal Management Components in
Smartphones report, System Plus Consulting has conducted
a comparative technology review to provide insights into
the assembling structure and thermal management
technology of 10 flagship smartphones from leading
suppliers: Apple, Samsung, Huawei, LG and Xiaomi.
In this report, we highlight the differences and the
innovations in the thermal management solutions chosen
by the end-user OEMs.

TABLE OF CONTENTS
Company Profile
Apple, Samsung, Huawei, Xiaomi,
LG
Smartphone History
Thermal Management
Solutions and Comparison
Heating Zones
Processor Design and Packaging
Telephone Assembly Thermal
Solutions
Physical Analysis
Physical Analysis Methodology
Apple
iPhone 6s Plus: Package view and
heating zones, board PCB and heat
spreader, processor A9
iPhone 7 Plus: Package view and
heating zones, board PCB and heat
iPhone 8: Package view and heating
zones, board PCB and heat
iPhone X: Package view and heating
spreader, PCB integration
Samsung
Galaxy S7: Package view and
heating zones, board PCB and
heat spreader, processor
Snapdragon 820 and Exynos 8,
heat pipes
Galaxy S8: Package view and
heat spreader, Qualcomm
Snapdragon 835, heat pipes
Huawei
P9: Package view and heating
spreader, processor Kirin 955
Mate 9 Pro: Package view and
heat spreader
LG
G6: Package view and heating
spreader, heat pipes
Xiaomi
Mi5: Package view and heating
spreader
Performed byPerformed by
AUTHORS:
3D-Package CoSim+
ANALYSIS PERFORMED WITH OUR COSTING TOOLS 3D-PACKAGE COSIM+
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It is possible to enter any Package
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Power Electronics and Compound
Semiconductors. She has a deep
knowledge of Electronics R&D and
Manufacturing environment. Elena
holds a Master in Nano-
technologies and a PhD in Power
Electronics.
Elena
Barbarini
Elena is in charge of
costing analyses for
laboratory. He previously worked
for 25 years at Atmel Nantes
Technological Analysis Laboratory
as fab support in physical analysis,
and for three years at Hirex
Engineering in Toulouse, in a
destructive physical analysis lab.
Yvon
Le Goff (Lab)
Yvon joined System
Plus Consulting in
2011 to set up its

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3.2 Yole may offer a pre release discount for the companies willing to acquire in the future the specific report and agreeing on the fact that the report may be release later than the anticipated release date. In exchange
to this uncertainty, the company will get a discount that can vary from 15% to 10%.
3.3 Payments due by the Buyer shall be sent by cheque payable to Yole Développement, credit card or by electronic transfer to the following account:
HSBC, 1 place de la Bourse 69002 Lyon France
Bank code: 30056
Branch code: 00170
Account n°: 0170 200 1565 87
BIC or SWIFT code: CCFRFRPP
IBAN: FR76 3005 6001 7001 7020 0156 587
To ensure the payments, the Seller reserves the right to request down payments from the Buyer. In this case, the need of down payments will be mentioned on the order.
3.4 Payment is due by the Buyer to the Seller within 30 days from invoice date, except in the case of a particular written agreement. If the Buyer fails to pay within this time and fails to contact the Seller, the latter shall be
entitled to invoice interest in arrears based on the annual rate Refi of the «BCE» + 7 points, in accordance with article L. 441-6 of the French Commercial Code. Our publications (report, database, tool...) are delivered
only after reception of the payment.
3.5 In the event of termination of the contract, or of misconduct, during the contract, the Seller will have the right to invoice at the stage in progress, and to take legal action for damages.
4. Liabilities
4.1 The Buyer or any other individual or legal person acting on its behalf, being a business user buying the Products for its business activities, shall be solely responsible for choosing the Products and for the use and
interpretations he makes of the documents it purchases, of the results he obtains, and of the advice and acts it deduces thereof.
4.2 The Seller shall only be liable for (i) direct and (ii) foreseeable pecuniary loss, caused by the Products or arising from a material breach of this agreement
4.3 In no event shall the Seller be liable for:
a) damages of any kind, including without limitation, incidental or consequential damages (including, but not limited to, damages for loss of profits, business interruption and loss of programs or information) arising out of
the use of or inability to use the Seller’s website or the Products, or any information provided on the website, or in the Products;
b) any claim attributable to errors, omissions or other inaccuracies in the Product or interpretations thereof.
4.4All the information contained in the Products has been obtained from sources believed to be reliable. The Seller does not warrant the accuracy, completeness adequacy or reliability of such information, which cannot
be guaranteed to be free from errors.
4.5 All the Products that the Seller sells may, upon prior notice to the Buyer from time to time be modified by or substituted with similar Products meeting the needs of the Buyer. This modification shall not lead to the
liability of the Seller, provided that the Seller ensures the substituted Product is similar to the Product initially ordered.
4.6 In the case where, after inspection, it is acknowledged that the Products contain defects, the Seller undertakes to replace the defective products as far as the supplies allow and without indemnities or compensation of
any kind for labor costs, delays, loss caused or any other reason. The replacement is guaranteed for a maximum of two months starting from the delivery date. Any replacement is excluded for any event as set out in
article 5 below.
4.7 The deadlines that the Seller is asked to state for the mailing of the Products are given for information only and are not guaranteed. If such deadlines are not met, it shall not lead to any damages or cancellation of the
orders, except for non acceptable delays exceeding [4] months from the stated deadline, without information from the Seller. In such case only, the Buyer shall be entitled to ask for a reimbursement of its first down
payment to the exclusion of any further damages.
4.8 The Seller does not make any warranties, express or implied, including, without limitation, those of sale ability and fitness for a particular purpose, with respect to the Products. Although the Seller shall take
reasonable steps to screen Products for infection of viruses, worms, Trojan horses or other codes containing contaminating or destructive properties before making the Products available, the Seller cannot guarantee that
any Product will be free from infection.
5. Force majeure
The Seller shall not be liable for any delay in performance directly or indirectly caused by or resulting from acts of nature, fire, flood, accident, riot, war, government intervention, embargoes, strikes, labor difficulties,
equipment failure, late deliveries by suppliers or other difficulties which are beyond the control, and not the fault of the Seller.
6. Protection of the Seller’s IPR
6.1 All the IPR attached to the Products are and remain the property of the Seller and are protected under French and international copyright law and conventions.
6.2 The Buyer agreed not to disclose, copy, reproduce, redistribute, resell or publish the Product, or any part of it to any other party other than employees of its company. The Buyer shall have the right to use the
Products solely for its own internal information purposes. In particular, the Buyer shall therefore not use the Product for purposes such as:
- Information storage and retrieval systems;
- Recordings and re-transmittals over any network (including any local area network);
- Use in any timesharing, service bureau, bulletin board or similar arrangement or public display;
- Posting any Product to any other online service (including bulletin boards or the Internet);
- Licensing, leasing, selling, offering for sale or assigning the Product.
6.3 The Buyer shall be solely responsible towards the Seller of all infringements of this obligation, whether this infringement comes from its employees or any person to whom the Buyer has sent the Products and shall
personally take care of any related proceedings, and the Buyer shall bear related financial consequences in their entirety.
6.4 The Buyer shall define within its company point of contact for the needs of the contract. This person will be the recipient of each new report in PDF format. This person shall also be responsible for respect of the
copyrights and will guaranty that the Products are not disseminated out of the company.
6.5 In the context of annual subscriptions, the person of contact shall decide who within the Buyer, shall be entitled to access on line the reports on I-micronews.com. In this respect, the Seller will give the Buyer a
maximum of 10 password, unless the multiple sites organization of the Buyer requires more passwords. The Seller reserves the right to check from time to time the correct use of this password.
6.6 In the case of a multisite, multi license, only the employee of the buyer can access the report or the employee of the companies in which the buyer have 100% shares. As a matter of fact the investor of a company,
the joint venture done with a third party etc..cannot access the report and should pay a full license price.
7. Termination
7.1 If the Buyer cancels the order in whole or in part or postpones the date of mailing, the Buyer shall indemnify the Seller for the entire costs that have been incurred as at the date of notification by the Buyer of such
delay or cancellation. This may also apply for any other direct or indirect consequential loss that may be borne by the Seller, following this decision.
7.2 In the event of breach by one Party under these conditions or the order, the non-breaching Party may send a notification to the other by recorded delivery letter upon which, after a period of thirty (30) days without
solving the problem, the non-breaching Party shall be entitled to terminate all the pending orders, without being liable for any compensation.
8. Miscellaneous
All the provisions of these Terms and Conditions are for the benefit of the Seller itself, but also for its licensors, employees and agents. Each of them is entitled to assert and enforce those provisions against the Buyer.
Any notices under these Terms and Conditions shall be given in writing. They shall be effective upon receipt by the other Party.
The Seller may, from time to time, update these Terms and Conditions and the Buyer, is deemed to have accepted the latest version of these terms and conditions, provided they have been communicated to him in due
time.
9. Governing law and jurisdiction
9.1 Any dispute arising out or linked to these Terms and Conditions or to any contract (orders) entered into in application of these Terms and Conditions shall be settled by the French Commercial Courts of Lyon, which
shall have exclusive jurisdiction upon such issues.
9.2 French law shall govern the relation between the Buyer and the Seller, in accordance with these Terms and Conditions.
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Headquarters
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+33 2 40 18 09 16
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+49 151 23 54 41 82
llevenez@systemplus.fr
America Sales Office
Steve LAFERRIERE
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www.systemplus.fr
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DELIVERY on receipt of payment:
By credit card:
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Expiration date: |__|__|/|__|__| Card Verification Value: |__|__|__|
By bank transfer:
HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain France
BIC code: CCFRFRPP
In EUR
Bank code : 30056 - Branch code : 00955 - Account : 09550003234
IBAN: FR76 3005 6009 5509 5500 0323 439
In USD
Bank code : 30056 - Branch code : 00955 - Account : 09550003247
IBAN: FR76 3005 6009 5509 5500 0324 797
Return order by:
FAX: +33 2 53 55 10 59
MAIL: SYSTEM PLUS CONSULTING
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Contact:
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TEL: +33 2 40 18 09 16
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SHIP TO PAYMENT
Please process my order for “Thermal Management in Smartphones: Technology Review 2017” Reverse Costing Report
 Full Reverse Costing report: EUR 3,490*
 Annual Subscription (including this report as the first of the year):
System Plus Consulting is specialized in the cost analysis of electronics from semiconductor devices to electronic systems.
A complete range of services and costing tools to provide in-depth production cost studies and to estimate the objective selling
price of a product is available.
Our services:
TECHNOLOGY ANALYSIS - COSTING SERVICES - COSTING TOOLS - TRAININGS
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*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing
date: November 2017
Ref.: SP17369

TERMS AND CONDITIONS OF SALES
1.INTRODUCTION
The present terms and conditions apply to the offers, sales and deliveries of services managed by System Plus Consulting
except in the case of a particular written agreement.
Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.
2.PRICES
Prices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros and worked
out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will be charged on
these initial prices.
System Plus Consulting may change its prices whenever the company thinks it necessary. However, the company commits
itself in invoicing at the prices in force on the date the order is placed.
3.REBATES and DISCOUNTS
The quoted prices already include the rebates and discounts that System Plus Consulting could have granted according to the
number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of early payment.
4.TERMS OF PAYMENT
System Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in the case of a
particular written agreement.
If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting a penalty
for late payment the amount of which is three times the legal interest rate. The legal interest rate is the current one on the
delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoice deadline. This penalty is
sent without previous notice.
When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the total
invoice amount when placing his order.
5. OWNERSHIP
System Plus Consulting remains sole owner of the delivered services until total payment of the invoice.
6.DELIVERIES
The delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed. Consequently
any reasonable delay in the delivery of services will not allow the buyer to claim for damages or to cancel the order.
7.ENTRUSTED GOODS SHIPMENT
The transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost or
damage on the base of their real value, he must imperatively point it out to System Plus Consulting when the shipment takes
place. Without any specific requirement, insurance terms for the return of goods will be the carrier current ones
(reimbursement based on good weight instead of the real value).
8.FORCE MAJEURE
System Plus Consulting responsibility will not be involved in non execution or late delivery of one of its duties described in
the current terms and conditions if these are the result of a force majeure case. Therefore, the force majeure includes all
external event unpredictable and irresistible as defined by the article 1148 of the French Code Civil?
9.CONFIDENTIALITY
As a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.
A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATION
The Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.
Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirect damage,
financial or otherwise, that may result from the use of the results of our analysis or results obtained using one of our costing
tools.
11.APPLICABLE LAW
Any dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolved
applying the French law.
It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
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