AGILE 2nd F2F MEETING, 14-15 April 2016, Athens, GR

1. WP1
Gateway HW Design & Implementation
LEADER: EUROTECH
INVOLVED PARTNERS: ATOS, SKYWATCH, BIOASSIST,
MOBISTAR, LIBELIUM
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

2. WP1 Objectives (recap)
Main objective:
specification, design and implementation of the hardware
of the modular gateway.
The modular gateway:
• will be available in two versions:
• the “makers” version based on RaspberryPi;
• the industrial version with a new HW design based on Intel architecture.
• will be based on a set of core and expansion modules:
• core modules: carrier module, cpu module, the storage module or the power supply,
etc.;
• extension modules: the communication modules, sensing modules, etc..
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

3. WP1 Objectives (recap 2)
Address two levels of modularity:
• modularity for existing HW: an expansion module (shield) allows the RPi to
be extended with new modules;
• intrinsic modularity: in the industrial gateway any architectural element is a
module.
Hardware module interoperability:
❓ identify the HW technologies that simplify and promote interoperability;
❓ specify a set of rule to follow during modules design and development.
Hardware prototypes development:
• Implement a set of prototypes of the “makers” gateway;
• Implement a set of prototypes of the industrial gateway;
• implement a set of expansion modules that will be adopted in the pilots.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

4. WP1 - Status
T1.1 We have to start collecting the requirement from WP8: task ends
at M5.
T1.2 Maker’s Gateway design: ongoing.
T1.3 Design of industrial Gateway: ongoing.
Next deadlines:
◦ M6 - D1.1 AGILE Gateway architecture specifications and initial design
◦ Gateway requirements, design specification and initial architectural design for both
the industrial and makers version.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

5. WP1 - Timeline
• D1.1 - AGILE Gateway architecture specifications and initial design
Gateway requirements, design specification and initial architectural design for both the industrial and makers version.
• D1.2 - AGILE Gateway hardware final prototypes 2nd AGILE Release – Hardware Platform
Final designs, features and functional specifications of the hardware prototypes. Delivery of the final AGILE Gateway prototypes.
• MS1 - AGILE Initial Design MS1 & Draft Framework Release
Initial design of the AGILE platform (SW and HW) and release of a draft version of the AGILE framework (sw and basic hw built on existing prototyping
platforms).
• MS2 - AGILE Framework (SW and HW) release & Initial Integration
Delivery of the AGILE platform (software components, makers and industrial gateway prototypes) and the initial integration of the software components.
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

6. Design methodology
Design for modularity (DFM): DFM follows the emerging trend in HW design and
manufacturing known as “Build to Order”.
◦ BTO products are not built until a confirmed order for products is received.
◦ We extend BTO also to the design phase (not only manufacturing).
◦ Traditionally, BTO is the most appropriate approach used for highly customized or low
volume products.
◦ DFM allows to map a custom design in a design based on standard modules!
Why BTO? Modularity has a cost and is only partially covered by the higher cost of a
custom product.
DFM & BTO objectives:
◦ reduce the effects of fixed costs;
◦ reduce the development costs;
◦ offer custom products with lower costs.
Two different types of modularity:
◦ modularity for existing HW - an expansion module (shield) allows the RPi to be extended
with new modules;
◦ intrinsic modularity - in the industrial gateway any architectural element is a module.

7. DFM Methodology
(design &dev)
1. Analysis of the company expertise, background, vertical markets, customers, etc..
2. Requirements definition in terms of:
◦ system functionalities,
◦ target price,
◦ lead time,
◦ life cycle.
3. Reference partitioning of the system architecture.
4. Design review and optimization based on the target verticals:
1. technical aspects,
2. manufacturing, stocking planning and operation aspects,
3. vertical evaluation.
It provides a set of trade-off, adjustments and costs balancing.
5. Reference partitioning refinement.
6. Consolidated modular design (based on off-the-shelf modules and/or custom modules).

8. DFM Methodology
(product implementation)
Customer gateway design and manufacturing.
1. Customer requirements analysis.
2. Mapping/fitting of the requirements on the gateway consolidated
design.
3. Implementation choices about modules:
◦ the functional module becomes a physical module;
◦ the functional module is integrated on the carrier;
◦ the functional module is integrated in SoC.
4. Potential custom modules development.
5. Final design of the customer gateway.

9. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN
•Architecture & Configuration defined
•Shield for Raspberry Pi in design
• Working on first prototype
• 2 modules to be plugged on top of Rasp Pi
• Raspberry Pi GPIOs accessible for sensors
•Hot Swap à Allowed by pressing button
• The gateway is able to recognize which module (among the list of supported
modules) has been plugged

10. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN

11. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
FIRST DESIGN
•CONNECTIVITY
• Raspberry Pi 2
• 2 modules to be plugged
• Wifi & 3G/4G à USB Dongle
• Raspberry Pi 3
• 2 modules to be plugged
• Wifi & Bluetooth Low Energy à included in Raspberry
• 3G/4G à USB Dongle

12. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT

13. WP1 - Makers gateway
AGILE KICK-OFF MEETING, 12-14 January 2016, Trento IT
Other REQUIREMENTS
•Getting Requirements from PILOTS
• Communication technologies
• Physical constraints (weight and volume)
•Getting Requirements from IoT Survey
• Communication technologies
•According to D1.1 à definition of a plan for the elicitation of use case
dependent requirements from WP8.

14. Industrial modular gateway:
requirements
Requirements elicitation from:
◦ Eurotech background;
◦ horizontal requirements;
◦ WP8: pollution & air quality monitoring use case.
Main requirements:
◦ modular architecture;
◦ to grow a library of standard HW “building blocks” to be reused across verticals
and system configuration;
◦ confine any customization outside the core “building blocks”, in particular User
I/O, connectivity, mechanics & enclosure, thermal solutions.
◦ standard Computer On Module (COM)
◦ for embedded application, multivendor support,
◦ commercial grade and industrial grade versions available,
◦ with recognized roadmap until 2018,
◦ designed for Intel Architecture.

15. …main requirements:
◦ Use of standard BUSes providing peripheral enumeration support.
◦ Use of widely adopted standard peripheral interfaces for ES.
◦ Support for multiple WAN/LAN connectivity options.
◦ Verticals & certification driven power supply configuration.
◦ Fanless thermal design.
◦ Multiple storage solutions available.
◦ Support for a wide range of environmental sensing modules
◦ with pre-calibrated sensor conditioning.
◦ Timestamp and optional geo-localization information.
◦ Maximum power consumption 40W.
◦ Extended temperature range support (target -20 +70 °C).
◦ Maximum size: 250 x 200 x 88 mm (LxDxH, SBC footprint, 2 rack-mount unit).
Industrial modular gateway:
requirements (2)

16. I/O
Expansion
Module
Modules
physically
independent
and connected
to the carrier
with cabled
connection
Carrier Module
CPU Module
Board
Management
Module
(BMM)
Power
supply
module
Internal
Expansion
Module 1
Internal
Expansion
Module 3
AUX I/O
Module
I/O
Module
for field
bus
Internal
Expansion
Module 2
Modules
physically
independent
and connected
to the carrier via
a board to board
connection
Can be an
external module
or an internal
expansion or
integrated
User I/O
Storage
module
DFM Gateway modular design

17. Industrial Gateway Modules
CPU Module:
◦ Intel Atom BayTrail or Apollo Lake families
◦ 10W TDP Class CPU
◦ COM Express Type 10
Board Management Module BMM:
◦ 32 Bit Microcontroller
◦ Manages system and modules status and related transitions (cold boot,
warm boot, low power states such as suspend or hybernate).
◦ Manages system maintenance, e.g.:
◦ secure update,
◦ auto test,
◦ extended input wakeup & suspend,
◦ special features like injection sensing, timed procedure, etc.

18. Industrial Gateway Modules (2)
Storage module:
1. storage integrated in the CPU module, e.g. eMMC Flash, SATA SSD
(e.g. it is used in high rugged and reliable system to avoid vibration
issue).
2. Internal expansion, e.g. mSATA SSD Drive or SD Memory Card.
3. External storage module, e.g. HDD/SDD Disk with optional Drive Bay.
AUX I/O Module (e.g. PoE or panel display backlight): these modules
have a power absorption that is not supported by the carrier and must
be connected directly to the power supply module. The I/O modules are
powered by the carrier.

19. Industrial Gateway Modules (3)
I/O Expansion modules:
◦ they generate the signal that must be available on the external panel;
◦ implement I/O functionalities for a specific vertical;
◦ provide connectors for a specific vertical;
◦ allows to customize the external connections.
◦ Examples:
◦ BUS converter
◦ Expander, e.g. I2C-> 10 GPIO
◦ Isolated and protected I/O
◦ Special functions like a particular
field bus for a Scada application.
I/O
Expansion
Module
USB
EXTERNAL PANEL
3xRS485
Ethernet RJ45
ML2
MIL

20. Industrial Gateway Modules (3)
User I/O Modules: it can be an external module or a set of functionalities
implemented in the carrier. It’s cheaper than I/O expansion and satisfies
mechanical requirements.
◦ SD Memory Card.
◦ Test, debug and development interfaces.
◦ Maintenance interfaces.
◦ Legacy interfaces, like mouse and keyboard.
I/O Modules for fieldbus:
◦ integrated, provided by the CPU module or by the BMM, e.g. CANBus;
◦ internal expansion module, providing potentially any kind of fieldbus.
Power module: it can be integrated or external and provide a wide range
power for multiple domain application (24V-110V).
◦ Insulated and/or protected version available.
◦ Support for tensions lower than the nominal range (e.g. for automotive).
◦ Designed for EN50155, MIL-STD, FCC, CE.

21. Carrier Module
CPU Module
Standard COM Express
Rev.2.1
Board
Management
Module
(BMM)
Integrated
Power
supply
N x miniPCIe
slots
expansion
GPS
module (?)
I/O Expansion
Module (CANBus,
I/O expander)
Optional
PoE
custom
internal
expansion
User I/O
Alternate
Power
supply
eMMC
Flash
SATA DRIVE
(Drive
bay?)
Integrated
MicroSD
Card Slot
Maintenance
I/O
Dumb I/O Panel
(e.g. for user I/O)
Consolidate AGILE modular
gateway design
Integrated
module
Internal
expansion
External
expansion

22. Industrial gateway preliminary
specifications
Standard COM Express Rev.2.1
Intel Atom BayTrail and Apollo Lake CPU families.
8GB eMMC Flash
1x SATA internal connector on carrier (Drive Bay), 1x SATA internal
connector, Micro SD slot (maintenance).
I/O interfaces: 2x(10/100/100) Ethernet, 1USB 3.0 circular, 1USB 2.0
maintenance, 1xRS232, 3xRS485/RS422, 1xCANBus, 1xMiniDisplay,
8xDigital I/O, 1xAudio Line In, 1xAudio Line out.
Radio interfaces: 3G/4G, 802.11b/g/n, Bluetooth 4.0 BLE, GPS.
Power: 24V/110V, 4W-17W.

23. D1.1 Deliverable
TOC and contents discussion.
Requirements:
◦ we can start the identification of the use case independent requirements;
◦ definition of a plan for the elicitation of use case dependent requirements
from WP8.
Definition of a deadline for contributions.
Document links:
https://redmine.create-net.org/dmsf/files/6340/download
https://drive.google.com/a/create-
net.org/file/d/0B2wGNjDl_JNZeXFIakFwX1Btb3M/view?usp=sharing_ei
d&ts=5703c734

24. Thanks for the attention.
That’s all folks.