This document discusses how to integrate analysis of electronics subjected to random vibration and thermal cycling constraints. It presents a method using Miner's cumulative damage ratio and ASONIKA software to conduct trade studies of printed circuit board size and vibration isolator parameters. This allows identifying designs that satisfy expected loads from vibration and thermal stresses. An example is analyzed where different vibration isolator types are evaluated and type II isolators with higher rigidity values are determined to be more appropriate for the highway and driving conditions.