This presentation discusses piezoelectric MEMS actuators using thin film piezoelectric materials. It begins with an introduction to piezoelectricity and discusses lead zirconate titanate (PZT) as the most commonly used piezoelectric material. The presentation then covers the processing of thin film PZT, including sol-gel deposition and patterning techniques. Several applications of piezoelectric MEMS actuators are presented, including inkjet printheads, autofocus camera lenses, micropumps, and ultrasonic transducers. The presentation concludes by discussing opportunities for piezoelectric energy harvesting and ST's role in commercializing thin film piezo MEMS technology.
THE SMALLEST MEMS OSCILLATOR ON THE MARKET ASSEMBLED IN AN INNOVATIVE WAFER LEVEL CHIP SIZE PACKAGE
SiTime presents its first MEMS oscillator assembled in Wafer Level Chip Scale package to get the word smallest (1.2mm2) ultra-low power oscillator for consumer and industrial applications.
SiTime is taking fully benefit of all semiconductor manufacturing processes and infrastructures in order to develop a really compact device and compete with quarts solutions for the same application.
This full Reverse Costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the SiTime SiT1552 low-power 32kHz Temperature Compensated Crystal Oscillator.
The report includes comparisons with SiT8002 Oscillator and with the Dicera DSC8002 and Silicon Lab Si504 Oscillators.
SiTime SiT1552 uses an innovative 1.55x0.85 mm Wafer Level Chip Scale Packaging containing two stacked dies: a MEMS oscillator and an ASIC for signal conditioning. The MEMS oscillator is flipped and connected to the ASIC by solder bumps. The component is protected by a polymeric coating and electrically connected by solder balls. For this new generation oscillator, SiTime has integrated many new technologies in order to be competitive to quartz devices.
The MEMS oscillator is manufactured on SOI wafer using MEMSFirstTM and EpiSealTM processes licensed by Robert Bosch GmbH.
STMicroelectronics MEMS Microphone -- Reverse Engineering AnalysisMEMS Journal, Inc.
This is a reverse engineering report of the STMicroelectronics MP34DT01 omnidirectional digital microphone. Details include a full description, tear down analysis and 3D model of the MEMS microphone with cross-sections and SEM images. The reports also includes a full review of the packaging strategy and a description of the sensor assembly process. Furthermore the report has 40 descriptive images, background on the application, performance specifications, interconnect strategies, materials used, EMC strategy description, an electrical schematic, chip attachment means, strengths and weaknesses of the design and links to the patent, data sheets and more.
The report is extremely useful for engineers and business leaders looking to better understand MEMS microphone design, packaging and assemblies processes. It is also beneficial within the MEMS microphone community as a competitive analysis tool.
Transparent electronics is an emerging technology that employs wide band-gap semiconductors for the realization of invisible electronics circuits and optoelectronics devices.
Presentation on 19th June 2018 by Guido Tronca at GPR 2018 – the 17th International Conference on Ground Penetrating Radar, in Rapperswil, Switzerland.
Based on the paper of the same name authored by Guido Tronca, Isaak Tsalicoglou and Samuel Lehner of Proceq SA (Switzerland), together with Gianluca Catanzariti of 3D Geoimaging (Italy).
The use of Ground Penetrating Radar (GPR) in structural investigations is based on the detection of features, embedded objects and flaws that cause a reflection of the transmitted electromagnetic wave. Construction types may vary from concrete to masonry and rock and possible targets include metallic reinforcements, ducts, plastic pipes, air voids, as well as the boundaries of the object itself.
While a traditional impulse Ground Penetrating Radar (GPR) system uses time-domain measurements of the reflected waves within the investigated objects, a Stepped-Frequency Continuous-Wave (SFCW) system collects data in the frequency domain and converts the data to time-domain data through computer processing. Until recently, the time-consuming calculations associated with the real-time inverse Fourier transforms in SFCW systems limited its application. Thanks to faster processing capabilities available nowadays, this limitation no longer applies to structural GPR.
The experimental work on representative concrete and masonry structures presented in this paper shows a systematic comparison of a new SFCW GPR system with traditional impulse radar systems. The results illustrate that SFCW technology combines the highest resolution in the detection of shallow targets, with a very broad detection range, potentially resolving the resolution/penetration trade-off observed in established structural GPR systems.
Full tutorial to start with OpenFOAM: run tutorials, adapt tutorials, single phase flow, immiscible two-phase flow, grid complex geometries, program equations.
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
THE SMALLEST MEMS OSCILLATOR ON THE MARKET ASSEMBLED IN AN INNOVATIVE WAFER LEVEL CHIP SIZE PACKAGE
SiTime presents its first MEMS oscillator assembled in Wafer Level Chip Scale package to get the word smallest (1.2mm2) ultra-low power oscillator for consumer and industrial applications.
SiTime is taking fully benefit of all semiconductor manufacturing processes and infrastructures in order to develop a really compact device and compete with quarts solutions for the same application.
This full Reverse Costing analysis has been conducted to provide insight on technology data, manufacturing cost and selling price of the SiTime SiT1552 low-power 32kHz Temperature Compensated Crystal Oscillator.
The report includes comparisons with SiT8002 Oscillator and with the Dicera DSC8002 and Silicon Lab Si504 Oscillators.
SiTime SiT1552 uses an innovative 1.55x0.85 mm Wafer Level Chip Scale Packaging containing two stacked dies: a MEMS oscillator and an ASIC for signal conditioning. The MEMS oscillator is flipped and connected to the ASIC by solder bumps. The component is protected by a polymeric coating and electrically connected by solder balls. For this new generation oscillator, SiTime has integrated many new technologies in order to be competitive to quartz devices.
The MEMS oscillator is manufactured on SOI wafer using MEMSFirstTM and EpiSealTM processes licensed by Robert Bosch GmbH.
STMicroelectronics MEMS Microphone -- Reverse Engineering AnalysisMEMS Journal, Inc.
This is a reverse engineering report of the STMicroelectronics MP34DT01 omnidirectional digital microphone. Details include a full description, tear down analysis and 3D model of the MEMS microphone with cross-sections and SEM images. The reports also includes a full review of the packaging strategy and a description of the sensor assembly process. Furthermore the report has 40 descriptive images, background on the application, performance specifications, interconnect strategies, materials used, EMC strategy description, an electrical schematic, chip attachment means, strengths and weaknesses of the design and links to the patent, data sheets and more.
The report is extremely useful for engineers and business leaders looking to better understand MEMS microphone design, packaging and assemblies processes. It is also beneficial within the MEMS microphone community as a competitive analysis tool.
Transparent electronics is an emerging technology that employs wide band-gap semiconductors for the realization of invisible electronics circuits and optoelectronics devices.
Presentation on 19th June 2018 by Guido Tronca at GPR 2018 – the 17th International Conference on Ground Penetrating Radar, in Rapperswil, Switzerland.
Based on the paper of the same name authored by Guido Tronca, Isaak Tsalicoglou and Samuel Lehner of Proceq SA (Switzerland), together with Gianluca Catanzariti of 3D Geoimaging (Italy).
The use of Ground Penetrating Radar (GPR) in structural investigations is based on the detection of features, embedded objects and flaws that cause a reflection of the transmitted electromagnetic wave. Construction types may vary from concrete to masonry and rock and possible targets include metallic reinforcements, ducts, plastic pipes, air voids, as well as the boundaries of the object itself.
While a traditional impulse Ground Penetrating Radar (GPR) system uses time-domain measurements of the reflected waves within the investigated objects, a Stepped-Frequency Continuous-Wave (SFCW) system collects data in the frequency domain and converts the data to time-domain data through computer processing. Until recently, the time-consuming calculations associated with the real-time inverse Fourier transforms in SFCW systems limited its application. Thanks to faster processing capabilities available nowadays, this limitation no longer applies to structural GPR.
The experimental work on representative concrete and masonry structures presented in this paper shows a systematic comparison of a new SFCW GPR system with traditional impulse radar systems. The results illustrate that SFCW technology combines the highest resolution in the detection of shallow targets, with a very broad detection range, potentially resolving the resolution/penetration trade-off observed in established structural GPR systems.
Full tutorial to start with OpenFOAM: run tutorials, adapt tutorials, single phase flow, immiscible two-phase flow, grid complex geometries, program equations.
Deep dive analysis of the fourth generation of mid/high band front-end module for 4G and 5G from Broadcom.
More information : https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8200-pamid-in-the-apple-iphone-12-series/
Slides of invited talk on ALD for MEMS at the AVS-ALD conference ALD 2009 Monterey, California, USA
---
Full reference:
R. L. Puurunen, M. Blomberg, H. Kattelus, ALD layer in MEMS fabrication, 9th International Conference on Atomic Layer Deposition “ALD 2009”, Monterey, California, July 19-22, 2009. Invited talk.
SmalTec International is the world’s leading manufacturer of micromachining equipment for aerospace, communications, medical, automotive, optics, nanotechnology and other innovative industries.
Slides of invited talk on ALD for MEMS at the AVS-ALD conference ALD 2009 Monterey, California, USA
---
Full reference:
R. L. Puurunen, M. Blomberg, H. Kattelus, ALD layer in MEMS fabrication, 9th International Conference on Atomic Layer Deposition “ALD 2009”, Monterey, California, July 19-22, 2009. Invited talk.
SmalTec International is the world’s leading manufacturer of micromachining equipment for aerospace, communications, medical, automotive, optics, nanotechnology and other innovative industries.
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Track 1 session 4 - st dev con 2016 - mems piezo actuators
1. October 4, 2016
Santa Clara Convention Center
Mission City Ballroom
MEMS Piezo Actuators
Simon Dodd
2. Agenda
16:20 MEMS in ST Simon Dodd
What is Piezo?
17:00 Thinfilm Piezo Processing
Applications
Conclusion
Time
Speaker
Presentation
2
3. MEMS Piezo Actuators
A piezo-electric material, such as PZT (Lead Zirconium Titinate),
is a substance that links mechanical movement to electrical
potential. If voltage is applied to the PZT, a mechanical
deflection is observed. Or, if a deflection is induced in the PZT, a
voltage is generated. Thick piezo actuators (1mm) have been
around for 30+ years, but deposited PZT material (2um) is just in
its commercial infancy. This thinfilm piezo capability can be
implemented in high volume production already in use for
MEMS sensors. The development of the technology has led to
the creation of custom piezo print heads and a revolutionary
autofocus lens. This presentation will give an introduction to the
technology and show potential uses in other market segments.
3
5. Sensing and Actuating
MEMS act in both directions
Sensors
Micro-actuators
MEMS
Signal
Electric
Motion
Piezo actuators
Physical
change
Mechanical
Fluidic
Micro-actuators
Environmental Audio
Electro
Mechanical
Micro
Mirrors
5
6. Building Micro-actuators
Micro-mechanical
part
Micro-mechanical
part
Analog signal
processing
Analog signal &
power management
Sensors
Micro-actuators
MEMS micro-actuators have high
voltage/current analog and power
management parts
(since higher voltages required for some
applications)
MEMS sensors have ultra-low
power analog signal processing
parts
MEMS micro-actuators & MEMS sensors use the same principles and same basic
processes
Leveraging ST BCD technologies
6
8. What is a piezoelectric element?
Piezo
Element
Voltage Meter
or
Voltage SourceThe piezo element
generates a voltage
when deformed
If a voltage is applied
across the piezo
element, it will deform
Source: https://en.Wikipedia.org/wiki/Energy_harvesting
8
9. History
First demonstration of a
piezoelectric material was by
Pierre and Jacques Curie – 1880.
First use was a Quartz
based sonar
9
11. What is PZT?
Solid solution: Pb(Zrx,Ti1-x)O3 – Perovskyte structure
PZT has the best ferroelectric and piezoelectric performances at
morphotrophic phase boundary (MPB), where rhomboedral and
tetragonal phase are coexisting.
This happens for Zr/Ti ~ 52/48
P along <100>
Zr/Ti
Pb
O
P along <111>
Pure PbTiO3
Tetragonal
Pure PbZrO3
Rhomboedral
Pb
O
Zr/Ti
11
12. The word piezoelectricity means literally “electricity resulting from pressure”
Actuation conditions:
• Triangular wave form actuation
(20V peak);
• Frequency ~1Hz;
30um displacement
PZT
cantilever
A A
Fabricated and characterized in ST
Cantilever actuated with PZT Technology 12
13. Bulk Piezo Thin Film Piezo
• Large form factor
• High power
consumption
• Mechanical assembly
requires high capital or
low volume
manufacturing
• Micron thick layers
produce 2D form
factor
• Lower drive voltages
for similar mechanical
displacement
• Integrated into fab
processing for very
high volume
manufacturing
Advantages of Thin Film Piezo
vs Bulk Piezo
13
15. MEMS Processing
• Material Substrate
• Silicon
• Flexible
• Biocompatible material (polyamide)
• Dry and Wet etching
• Permanent and Photosensible: from 1 to 20 um
• Physical Vapor Deposition: e-beam, sputtering
• Chemical Vapor Deposition
• Electroplating: Au up to 20um
• Full range of Metals
• Ag, Au, Al, Ir, Cr, CrSi, Cu, Fe, Ni, Pd, Pt, Co
• Full range of dielectric materials
• SiNx, SiOx, SiON
• One & Double side Lithography
• Dry and Wet Etch
• Wafer/Wafer Bonding
Process Modules & Materials
MEMS technology can be used to
produce geometrically well defined,
highly reproducible structures and
surfaces area
Technologies
15
17. PZT Film Quality
2 um PZT
Bottom electrode
Top electrode
SEM
TEM
• Very dense film structure, columnar grains
• No defects/voids visible in the film or at interfaces between coatings
• Film is flat with very small grain
17
18. • The 2um thick etched PZT and Electrodes
• Sloped sidewalls for good passivation step coverage
Cross section SEM view Tilted SEM view
Top Electrode
Bottom Electrode
PZT
PZT
Top Electrode
Bottom Electrode
Oxide
PZT Definition 18
19. Sputter PZT
Sources: www.ulvac.co.jp, www.Fujifilm.com/about/research/
Advantages:
• Can be done at 500C
• Can integrate higher
percentage of Nb
Disadvantages:
• Infantile technology
• Only one company with
real experience
19
22. Printhead using PZT
• Working principle: ink volume displacement by a PZT actuated membrane
• Thin-Film Piezo vs Thermal Inkjet Benefits
• Compatibility with wide set of inks (hot melt or wax based fluids)
• Higher printing speed > 80KHz
• Superior print output quality
• Extended print-head lifetime
22
27. Norway’s poLight® using
the ST Piezo technology
to revolutionize mobile-
camera autofocus function
The ST Piezo deforms the
membrane when a voltage is
applied, while a soft polymer
acts as a deformable lens
providing variable focus
Preparing for market
launch in H1 2017
Courtesy of poLight TLens
poLight T-Lens® for Auto Focus Camera 27
28. Source: www.poLight.com
Response time: <1 mS
Power consumption: < 5 mW
Field of view: No AF pumping
Smallest Footprint: 3.2 x 3.2 mm2
Product performances
Glass membrane
PZT Piezo film
Polymer optic
Glass
Silicium
From MEMS Wafer to Camera module
Principle
of operation
Implementation
Lens made of a glass
membrane actuated
by a PZT layer
TLens® Technology – Auto Focus Actuator 28
36. Optical Micro-actuators for Projection 36
HUD
Drivers Information
HMD
Wearable Devices
Image Projection
Extending Mobile Displays
37. Intel RealSense® Depth Camera
http://www.intel.com/content/www/us/en/architecture-and-technology/realsense-overview.html
MEMS
µMirror
Powers
IR Projector
(Some) Applications Examples
3D Scanning for 3D Printing,
Accurate Gesture Control for Immersive Gaming
Face Recognition
Object Avoidance in autonomous devices
37
41. Conclusion
• A broad and untapped range of applications possible
• MEMS utilizing Thin Film Piezo provide the required large linear forces with
fast actuation at small drive voltages
• Industrial scale integration of Thin Film Piezo into MEMS is being developed
• ST is currently finalizing industrialization phase for high volume manufacturing
• Partnership with market leaders and emerging startups is key to drive the
creation of new markets
41
42. Thank You!
Piezo MEMS Actuators
Simon Dodd
Technical Marketing Director
MEMS Actuator Division
ST Microelectronics
simon.dodd@st.com