This document proposes a methodology for modeling active components for electromagnetic compatibility (EMC) and high-speed circuit board design simulations. It describes modeling components using time domain reflectometry (TDR) measurements to account for parameter dispersion. An enhanced model is presented that considers the component core, package, power and ground rails. The conclusion recommends a methodology using standard models for most components but developing enhanced models for critical components to improve simulation accuracy without modeling all components.

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TECHNIQUES DE MODELISATION POUR LES
COMPOSANTS ACTIFS
E. Leroux, R. Ene
F. Maggioni
CEM COMPO 99 - TOULOUSE - 14, 15 Janvier 1999
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INDEX
•INTRODUCTION
•DISPERSION OF ELECTRICAL PARAMETERS OF
COMPONENTS
•A MODELLING METHOD BASED ON TDR
•A MORE COMPLETE MODEL
•CONCLUSION, A METHODOLOGY IS PROPOSED

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INTRODUCTION
In EMC simulation of Printed Circuit Boards
•Need of realistic models for components
You have:
•SPICE, IBIS
But:
•Components suffer from dispersion of their electrical
parameters
Solution:
•A modelling methodology well adapted to EMC & high
speed designs

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DISPERSION OF ELECTRICAL PARAMETERS
OF COMPONENTS
•Unloaded output voltage
•Rise & fall times
•Clamping diodes
•Input threshold
•Input or output capacitances

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A MODELLING METHOD BASED ON TDR:
description
TDR
BIAS
DUT
launch
cable
bias
probe
power supply
control
launch cable
DUT
gnd plane
gnd
connection
power supply
decoupling capacitor
bias
bias probe

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0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.60
TIME[nS]
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
RHO
A
B
C
D
A MODELLING METHOD BASED ON TDR:
CMOS input

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Pvdd
Pgnd
VDD10
GND20
1 Tin
Z0,Td
Bin
STF
Vout
Vin
2
0
0
1
5
E1
+
A MODELLING METHOD BASED ON TDR:
CMOS input

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A MODELLING METHOD BASED ON TDR:
CMOS output
Vcontrol
R( )
1
1K
1M
52.5
sw2 sw1

DTF
t
DTF
STF
Vout
Vin
1
Vout
Vout
Z0,Td
E2
20 GND internal
2
Bout
sw2
sw1
Pvdd
Pgnd
t
E1
10 VDD internal

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0.01 0.11 0.21 0.31 0.41 0.51 0.60 0.70 0.80 0.90 1.00
FREQ[GHz]
-100.00
-90.00
-80.00
-70.00
-60.00
-50.00
-40.00
-30.00
-20.00
-10.00
0.00
10.00
dBV
IBIS-like
model
Enhanced
model
measured
Validity limit for
IBIS-like model
Validity limit for
Enhanced model
Comparison between an IBIS-like and an enhanced
model

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A MORE COMPLETE MODEL
component
power rail
ground rail
core
package

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Example of special component model
AC02 (four NOR):
1234567
gnd
vcc
standard
receiver model
8 9 10 11 12 13 14
R
1V
0V
Delay
Delay
Delay
2
3
1
Single NOR model
Four NOR models
A B OUT
0 0 1
1 0 0
0 1 0
1 1 0 standard driver model
pin crosstalk
model
. ..
timing/logic core

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CONCLUSION & PROPOSAL FOR AN
INDUSTRIAL USE OF THE METHODOLOGY
A modelling method permits to avoid the dispersion of certain electrical
parameters of components and can be used by all HDT tools and THRIS
environnement
•But it can not be applied to all components placed on an industrial
board
Solution: a methodology that
•use standard library, SPICE or IBIS models for most of components
on the board
•build enhanced models (improving existing IBIS models for
example) for critical components
•using Models provider (HDT for example)