This document summarizes the key features and specifications of Taconic's MCCL products. It provides details on the product portfolio, heat dissipation performance, dielectric breakdown voltage, hipot testing reliability, and general material properties. Testing results show the MCCL products have high dielectric breakdown voltages above 5kV on average, excellent heat dissipation capabilities, and 100% hipot reliability when tested up to 3kV. Customized product dimensions and metal types are available.

1. A stunning choice for “LED Light”
Taconic’s MCCL
TacLED
Korea Taconic

2. Contents
 Features 2
 Product Portfolio 3
 Heat Dissipation 4-7
 Dielectric Breakdown Voltage 8-9
 Hipot 10-14
 Peel strength 15-16
 Aluminium surface treatment 17
 Punchability 18
 General Properties 19
 UL 20-21
 How to order 22
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3. Features
 Customized Products Line Up
(Commercial/Bendable MCCL, Various Copper Thickness)
 Guaranteed Hipot Reliability – 100% sorted out
 Higher PCB yield
(Good PCB processability & stable punchability)
 Bigger width than 700mm is available
 Excellent Heat Dissipation
 Superior Dielectric Breakdown Voltage
 Ultra High Thermal Resistance
 Outstanding Dielectric Adhesion Strength on Al & Cu
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4. Product Portfolio
 Structure Copper Foil
Dielectric
Base Metal
 Portfolio
Available Metal Dielectric Thickness(㎛)
Real Thermal
Dielectric
Grade Conductivity
constituent
(W/m/K)
Type Thickness Standard Available
TacLED-10/85 Aluminium 1.0 85
0.6mm
A-5052, 50
1.0mm
Epoxy+Filler ~
1.5mm
Copper 100
2.0mm
TacLED-20/85 C-106 1.7 85
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5. Heat Dissipation
 Overall T/C & T/I
Over-all Dielectric
Dielectric Metal Thermal Conductivity Thermal Impedance
Trace
Thermal (W/mK) (℃㎠/W)
Copper Foil
Conductivity
(oz)
(W/mK)
Al-5052 Cu Plate
Real Value*(Calc.) Calc. Value
(mm) (mm)
1 1 1.0 25.0 (12.1) 0.85
1 1 1.0 34.0 (12.8) 0.85
1 1.7 1.0 40.0 (19.5) 0.50
1 1.7 1.0 56.0 (21.3) 0.50
* Measured in Laser Flash in Ajou Univ. Lab. in 2010
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6. Heat Dissipation
 Comparative Thermal Conductivity
- Measuring Method : Laser Flash Type(ASTM E1461)
- Analyzer : Thermal Diffusivity Instrument by NETZSCH
3.0
2.5
1.9
2.0 1.7 1.6
1.3 1.3
1.5 1.2
1.1
1.0 0.7
0.5
0.0
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7. Heat Dissipation
 Measuring heat dissipation by chip temp.
- Measuring System : Chip Temperature Convergence
[ Heat Release Curve ]
Load
60
55
50
Temperature
Thermocouple 45
40
35
ΔT
Heat Generation Chip
Electric Power (20W) 30
Supplier
25
Heating Controller Sample 20
0 600 12001800240030003600420048005400600066007200
Time(sec)
50mm
Heat Sink 50mm Cu
(1.2 ℃/W, Size 15cm×14.7cm×5cm)
Dielectric
Al
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8. Heat Dissipation
 Comparative Chip Temperature
58
56.8
56
54.3 54.1
53.9
53.5 53.3
54 53.1
52.3
51.7
52
50.5
50
48
46
44
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9. Dielectric breakdown voltage
 Specimen and Equipment
 Specimen : Unclad 85㎛ thick  Test Equipment : Puncture Tester
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10. Dielectric break down voltage
 Test Condition & Results Unit : kV
Condition Need n Min. Max. Avg.
A 30 7.1 8.7 7.8
C-500/85/85 10 5.0 6.4 5.9
C-168/121/100 10 5.1 7.0 6.1
D-2/100 above 30 5.0 7.4 5.7
5kV
E-0.5/260 10 5.2 8.3 7.6
E-1000/160 10 5.0 5.9 5.4
1000cycle 150℃/30min
10 5.2 6.5 5.8
 -50℃/30min
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85
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11. What is a Hipot test
 Definition  An abbreviation for High Potential test
 Also called a dielectric withstand test
 Objective  Below the established Breakdown Voltage is applied
 To verify electrical insulation in PCB, cables, motors, etc.
 Apparatus & Test
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12. How to operate Hipot
 Test Condition 1500
VDC
@1mA 1000
500
0
0 1 2 3 4 5
Seconds
 Q-Policy  Performed as a 100% production line test
on all products upon customer request
 Pass Go, Fail No Go
 Assuring customers electric safety
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13. Hipot result
 Burnt shape
Burnt shape by short @1200VDC
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14. Hipot Reliability
 Specimen and Equipment
 Specimen : Etched MCCL with copper dot
2.5φ Copper dot
 Test Equipment : Hipot Tester
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15. Hipot Reliability
 Test Condition & Results Unit : pcs
Condition Need Tested Passed
A 30 30
C-500/85/85 10 10
C-168/121/100 10 10
above
D-2/100 3kV 30 30
@1mA
E-0.5/260 10 10
E-1000/160 10 10
1000cycle 150℃/30min
10 10
 -50℃/30min
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85 –C1/Al 1.5mm
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16. Peel Strength
 Specimen and Equipment
 Specimen : 3.2mm width trace  Test Equipment : Instron
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17. Peel Strength
 Specimen and Equipment Unit : kg/cm
Condition Need n Min. Max. Avg.
A 10 1.80 2.00 1.93
C-500/85/85 5 1.50 1.59 1.54
C-168/121/100 5 1.52 1.62 1.56
above
D-2/100 5 1.85 1.96 1.93
1.2kg/cm
E-0.5/260 5 1.67 1.75 1.72
E-1000/160 5 1.65 1.91 1.76
1000cycle 150℃/30min
5 1.88 1.97 1.90
 -50℃/30min
※ 1) A : As it is, C : Environment Chamber, D : Dip, E : Oven – Time(hrs)/Temp.(℃)/Humidity(%RH)
2) Referece Sample : TacLED-10/85 –C1/Al 1.5mm
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18. Aluminum surface treatment
 Roughness by Ra & SEM(x500)
Taconic D company P company
0.33~0.44㎛ 0.36~0.62㎛ 0.31~0.77㎛
※ A larger surface area brings a faster heat transfer and a stronger bonding!
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19. Punchability
 Die Punching in 150MT Press – 10/85-C1/AL1.5mm
 Die punched sample
 Cross-sectional View  Edge side View
Left
Right
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20. General Properties
Typical Values
Properties Test Method Unit TacLED-10 TacLED-20
Thermal Conductivity(k) ASTM E1461 W/m∙K 1.0 1.7
Dielectric Thickness(t) - µm 85 85
Thermal Impedance(t/k)*1 - ℃cm2/W 0.85 0.5
IPC-TM-650 2.4.8 kg/cm 1.8 1.8
Peel Strength(1oz ED Cu)
(Test Condition A) lbs/in 10.0 10.0
ASTM D149
Dielectric Breakdown Voltage(AC) kV(kV/mm) > 6(70.5) > 6(70.5)
(Test Condition A)
Dielectric Constant @1MHz IPC-TM-650 2.5.5.3 - 4.5 6.0
Dissipation Factor @1MHz IPC-TM-650 2.5.5.5.1 - 0.022 0.029
Solder Resistance(@300℃) - min > 20 > 20
Surface Resistivity IPC-TM-650 2.5.17.1 Mohm > 1.0E+16 > 1.0E+16
Volume Resistivity IPC-TM-650 2.5.17.1 Mohm∙cm > 1.0E+16 > 1.0E+16
Moisture Absorption IPC-TM-650 2.6.2.1 % < 0.5 < 0.5
Tg DMA ℃ 135 116
CTE(α1/α2, Z axis) ASTM D3386(TMA) ppm/℃ 41/127 34/123
Flammability Rating UL-94 - V-0 V-0
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21. Life time by UL746E
 Mechanical and Electrical Life Time Prediction for Dielectric
100,000
Life time (UL746E 50% initial value)
10,000
115 125 135 145 155 165 175
Temperature (℃)
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22. UL
 Certification
- File No. : QMTS2.E335041
 RTI
- Acquired RTI up to date
: 90℃
- Raising to 130℃
: in April. 2012
 CTI
- Acquired 600V
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23. How to order
 Available Size
 Standard : 510x610 mm (quarter sheet)
 Available : smaller panel sizes; also > 700mm panel length
 Available Aluminium
 grade 5052
 0.5, 0.6, 0.8, 1.0 and 1.5 mm
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