This document introduces Bended MBPCB, a 3D aluminum printed circuit board. It has the following key features: - It is bendable and formable for 3D LED lighting applications. - It complies with environmental standards and has excellent heat dissipation, insulation, and mechanical adaptation properties. - Testing shows it can withstand bending to complex angles like 90 and 60 degrees without failures when high voltage is applied.

1. INTRODUCING :
Bended MBPCB
3D aluminium PCB

2. Structure and Features
Structure :
Cu
Dielectric
Base Metal
Product
Model
LSAE
Dielectric
(Al2O3 filled Pre-preg)
Thermal
Thickness
Conductivity
(μm)
(W/m.K)
1.0
Features :
Bendable and formable for 3D LED lighting
●
Complied with ROHS & REACH, Halogen-free
●
Excellent heat dissipation
●
Excellent insulation properties
●
Good mechanical adaptations
●
Superior dielectric & adhesion strenght on Aluminium & Copper
●
40
Available Metal
Type
Thickness
(mm)
Aluminium
(5052*)
Copper
(HTE)
0.6
1.0
1.5
2.0

3. Application for 3D LED Lighting

4. General Properties (Al)
Properties
Thermal Conductivity
Dielectric Thickness
Thermal Impedance
Peel Strength (1oz HTE Cu)
Test Method
ASTM E 1461
ASTM D 1005
ASTM E 1461
IPC-TM-650 2.4.9
(Test Condition A)
IPC-TM-650 2.5.6
(Test condition A)
Dielectric Breakdown
Dielectric Constant @3GHz
IPC-TM-650 2.5.5.3
Dissipation Factor @3GHz
Solder Resistance (@288°C) IPC-TM-650 2.4.13
IPC-TM-650 2.5.17
Surface Resistivity
IPC-TM-650 2.5.17
Volume Resistivity
MOT
UL746-E
CTI
UL746-E
CTE
TMA Method
UL-94
Flammability Rating
Unit
W/m.K
μm
°C In²/W
kg/cm
lbs/in
LSAE
2.0
40
0.08
1.3
7.3
kV
min
Ω
Ω.cm
°C
Grade
ppm/°C
-
> 2.0
4.7
0.03
> 2.0
10E+13
10E+12
130
0
< 70
V-0

5. Hi-Pot Testing of 3D Structure
Bend Hi-Pot Test (Compare to LSAE)
Testing Condition :
Peak Voltage: DC2000 volts, limited current 2mA
Ramp rate to peak voltage: 100 volts per second
●
Hold time at peak voltage: 5 seconds
●
Dielectric
Copper
90°
60°

6. Complex bending
(Stretched + Compressed)
90°
90°
Items
LSAE HTE 1oz Al 1.5mm
LSAE HTE 1oz Al 1.0mm
LSAE HTE 1oz Al 0.8mm
LSAE HTE 1oz Al 0.6mm
60°
No Bend Complex 90° Complex 60°
2 KV Pass 1.52 KV
1.35 KV
1.31 KV
2 KV Pass 1.61 KV
2 KV Pass 1.55 KV
1.29 KV
1.33 KV
2 KV Pass 1.57 KV
60°

7. Bending Test

8. Molded knuckle design
External minimum radius
Radius: 6~3mm
Radius: 6~3mm
Possibilities to reduce radius

9. Heat Dissipation
Thermal conductivity test
Dielectric Thermal Impedance
●
Base Metal
Copper (oz)
Al-5052 (mm)
1
Cu (oz)
1.0
1.0
Dielectric
Thermal
Conductivity
(W/m.K)
2.03
Dielectric Thermal
Impedance (°C
in²/W)
0.082

10. Thermal Resistance
Specimen : 2” x 2”, n=12
●
Test Condition: Floating for 120sec @288°C
●
Solder float test (solder pot)
Result: No blister and no delamination
●

11. Peel Strength
●
Specimen : 1oz Cu/Al 1.5mm
●
Test Condition: IPC TM-650 2.4.9
Peel strength test
RESULT [Unit : Kg/cm]
Item
1
2
3
4
5
6
7
8
AVG.
A
1.32
1.33
1.31
1.35
1.34
1.35
1.32
1.32
1.33

12. THANK YOU
Head Office:
Advanced Electronic Technology H.K. Limited,
Office 02, 18th floor, Qualipak Tower,
122 Connaught Road West, Western, Hong Kong
Tel : +852 3528 0460
Fax :+852 3528 0470 / Fax USA : 2134 55 2604
Skype : attscs
email : info@aetpcb.com
Sales and Marketing Office:
Room 4, 13fl., Bldg 02, Haiyang, Haibin Garden,
Xinhua Road 05, Shekou, Nanshan District,
Shenzhen, P.R.C.
Tel : +86 4006 782 881
Fax: +86 755 3360 9545
Factories:
Guangzhou, China
Incheon, Korea
www.aetpcb.com