Sandeep Kumar has over 3 years of experience in embedded hardware design, signal integrity analysis, and testing. He has skills in microprocessor-based design, high-speed design, signal integrity analysis, hardware verification, and more. He provides concise summaries of his qualifications, experiences, skills, education, projects, and personal details.

1. Sandeep Kumar Mobile No.: +91- 9971873079
Sector-56, Kendriya Vihar Email: s.sandilya05@gmail.com
Gurgaon, Haryana 122002
Professional Synopsis
3 years and 6 months hands on experience in Embedded Product Hardware
Design and Development, Signal Integrity Analysis and Testing.
Area of Interest
 High speed Digital System Design & Testing
 Analog and Mixed Signal Design and Testing.
 Signal Integrity & Power Integrity Analysis
Skill Set
 Micro-Processor based design including mixed signal design interfacing
ADCs, DACs and OPAMPs.
 High Speed Design & Multi-Layer Board Stackup Layout & Routing
planning and review.
 Experience in Signal Integrity Analysis with HyperLynx Simulation tool.
 Hardware Design Verification through ORCAD, ALTIUM & ALLEGRO.
 Providing High Speed Layout & Routing Guidelines to PCB engineer
keeping Signal Integrity & EMC aspect in picture.
 PSPICE and ORCAD Simulation for Design aid.
 Power Integrity analysis for Decoupling, Plane noise & DC drop.
 BOM preparation and Design documentation for consumer/industrial
product designs.
 Exposure to Industrial standard protocols RS232, RS485, SPI, I2C, UART,
LON, MVB HART, CAN.
 Experience in interfacing of USB, DDR2, DDR3, LPDDR, NAND FLASH, NOR
FLASH, ETHERNET, EEPROM, SENSORS.
 Value Engineering
 Reverse Engineering
 Knowledge of LDO & Switching regulators.
 Knowledge of EMI/EMC and Environmental Testing as per IEC61000
 Experience in Obsolescence Management with the web tool Part Miner.
 Experience in MTBF calculation with Item Tool Kit for given BOM.
 Exposure to all stages of PDLC and Customers quality process.
Primary Skills Sets
 Basic knowledge of C Language.
 Knowledge of VHDL (Very High Speed Integrated Circuit Hardware Description
Language )
 Proactive , Interactive , Quick Learner

2.  Adaptable & Optimistic
 Good Communication skill & Strong team building qualities.
Tools used/ known
 Orcad 16.5 for schematic design.
 Hyperlynx Simulation for signal integrity & Power Integrity Analysis.
 Part Miner for Obsolescence Management.
 Item Tool Kit for MTBF calculation
 Altium Designer for Schematic & PCB
 Allegro for schematic design & PCB.
Achievements
Winner of GOLD TEAM ACADEMY award of year 2011 in Larsen & Toubro Ltd. -
IES for outstanding contribution in the project management.
Career Highlights
Employer Mando Corp Korea (South Korean MNC)
Period November 15th,2013 to present
Work Location Gurgaon (India)
Designation Embedded Hardware Design & Signal Integrity Engineer
Responsibilities  Signal Integrity Analysis
 Hardware Design and Development
 Hardware Functional Testing
 Pre-compliance testing
 Obsolescence Management
 MTBF Report Generation
Employer Larsen & Toubro Ltd-IES [CMMI–5],
Period June 20th,2011 – November 8th,2013
Work Location Mysore (India)
Designation Embedded Hardware Engineer
Responsibilities  Hardware Design and Development
 Hardware Functional Testing
 Pre-compliance testing
 Obsolescence Management
 Signal Integrity Testing
 MTBF Report Generation

3. Education
Examination
Passed
Board/
University
Name of school
/college
Year of
Passing
Percentage
Scored
B.TECH
(Electronics &
Communication
Engineering)
G.B.T.U.
Hindustan College Of
Science & Technology
2011
75.00%
12th C.B.S.E
Kendriya Vidyalaya
Muzaffarpur
2006 86.00%
10th C.B.S.E
Shantiniketan Awasiya
Bal Vidayalaya
2004 88.40%

4. Project Profiles
Project1
Wabtec Minerva Electronics Control Unit Development
(Railway Domain)
Description
Minerva ECU (Electronics Control Unit) development consists of
the Brake network, Command network & Diagnostics network.
Its main work is to calculate the brake need for a particular car
based on the information provided by PCM (pressure Control
Module) & PTM (pressure transducer Module) & Communicate it
to the Main Control Unit placed in the Locomotive. It consists of
nearly all the main communication protocols & Memory
interfaces.
 DDR2SDRAM ,NOR flash interface
 MVB, ETHERNET & LON interface.
 RTC, EEPROM & Temperature sensor interface.
 Power supply: Buck-Boost c onverter, LDO’s & PMIC.
 SPI Ethernet port.
 USB on the go implementation.
 CAN interface
Team size 5
Role & Contribution
Role: Project Team Member
Contribution:
 Component selection, BOM preparation and cost
estimation
 Preparation of design documents and working on part
miner software
 DDR2 SDRAM, NOR FLASH, MVB interfacing with
Processor MCF54415.
 Study & providing inputs for LON and Battery to Digital
Circuit design.
 Vender Interaction
 Hardware troubleshooting and debugging for the
DDR2SDRAM,NOR Flash ,Power Supply and other
functionalities in the unit
Project2 Leica Electronic Box (Medical Domain)
Description
Electronic box is used in medical equipments such as Tissue
processor units. The purpose of this project is to design and
develop Electronic Box for LEICA Products ST8000 Staining
Machine (Colorado Project) and CV8010 Cover Slipping Machine
(Sepia Project).
 Processor and carrier board interface
 DDR2SDRAM ,NAND flash interface
 DVI interface
 Power supply: Buck-Boost converter, PMIC and coin cell
for RTC.
 FEC 2 port Ethernet switch
 SPI Ethernet port

5.  2 port USB switch and USB to RS232 converter
 AUDIO Codec and AUDIO amplifier
 SD card interface
 CAN interface
Team size 5
Role & Contribution
Role: Project Team Member
Contribution:
 Component selection, BOM preparation and cost
estimation
 Preparation of design documents and working on part
miner software
 USB, ETHERNET interfacing & PMIC implementation.
 Study & providing inputs for CAN and LDO in the unit.
 Vender Interaction
 Hardware troubleshooting and debugging for different
modules in the unit
Project3
High Definition – Around View Monitoring
Description
The Project aims at providing assistance to driver while driving
by providing bird’s eye view of all around the vehicle.
Team size 1
Role & Contribution
Role: Signal Integrity Analyst
Contribution:
 Providing high-speed guidelines to the PCB engineer for
layout & routing.
 Pre-Layout Signal Integrity analysis for length constraint
determination in case of high speed signal DDR3, PCIe.
 IBIS Model collection, check & editing them if correction
required.
 Vender Interaction
 Post- Layout simulation of Address & Command, Data and
Control signals
 Analyzing Overshoot, Undershoot, Reflection,
Ringing, Length matching, Set up time & Hold time
margin & Crosstalk, giving solution if there is any
discrepancy found.
 Report preparation

6. Project4 Lane Keeping Assistance System (LKAS)
Description
LKAS makes a vehicle to follow a particular lane, if a vehicle
violates lane rule because of any reason then it produces a
reverse torque to keep the vehicle in lane.
Team size 1
Role & Contribution
Role: Signal Integrity Analyst
Contribution:
 Providing high-speed guidelines to the PCB engineer for
layout & routing.
 Pre-Layout Signal Integrity analysis for length constraint
determination in case of high speed signal LPDDR2.
 IBIS Model collection, check & editing them if correction
required.
 Vender Interaction
 Post- Layout simulation of Address & Command, Data and
Control signals
 Analyzing Overshoot, Undershoot, Reflection,
Ringing, Length matching, Set up time & Hold time
margin & Crosstalk, giving solution if there is any
discrepancy found.
 Report preparation
Project5 MOSS-30 (Mando Operated Safety System)
Description
The Project aims at providing assistance to driver by displaying all
information from front of a vehicle through camera like pedestrian
detection , Lane detection etc.
Team size 1
Role & Contribution
Role: Signal Integrity Analyst
Contribution:
 Providing high-speed guidelines to the PCB engineer for
layout & routing.
 Pre-Layout Signal Integrity analysis for length constraint
determination in case of high speed signal DDR3.
 IBIS Model collection, check & editing them if correction
required.
 Vender Interaction
 Post- Layout simulation of Address & Command, Data and
Control signals.
 Analyzing Overshoot, Undershoot, Reflection,
Ringing, Length matching, Set up time & Hold time
margin & Crosstalk, giving solution if there is any
discrepancy found.
 Report preparation

7. Project6 Smart Serial Adapter
Description
The purpose of the project is to design the hardware of Smart
Serial Adapter and improve the performance in terms of
accuracy, cost and electromagnetic compatibility
Product / Project Overview
The Smart Serial Adapter can be operated in 2 modes:
 RS232 or USB to RS485 pass-thru adapter
 Host controller using a Atmega2560uC
1. Pass thru Adapter:
In this mode, RS232 and USB are connected to the PC. The data
from RS232/USB is serially transferred to RS485 using pass thru
adapter. A jumper switch is used to select the device from RS232
and USB. The data received by the serial adapter is transferred
to RS485 in both full duplex and half duplex modes.
2. Stand-alone host:
In this mode, we can use it as a stand-alone host which can
measure the charge of Li-ion battery pack and also it can handle
some external interfaces to connect to other PCs. This can be
done by interfacing an ATMEGA 2560 microcontroller with the
serial adapter. This microcontroller is pre-programmed which
executes simple ASCII command st rings and is compatible with
standard terminal programs like Hyper Terminal.
Team size 2
Role & Contribution
Role: Project Team Member
Contribution:
 Component selection, BOM preparation and cost
estimation
 Schematic preparation using tool ORCAD.
 Overvoltage protection circuit implementation
 Preparation of design documents
 Involved in Module Testing
 Bug Fixing
Project7 Leica Sunrise-DMR (Device Master Record)
Description
The purpose of the project to create a master record of the
device which is essential to get FDA approvals for medical
devices. It consists of verifying schematic, Bill Of materials,
creating test instruction and testing of the PCB boards along with
the documentation.
Team size 5
Role & Contribution
Role: Project Team Member
Contribution:
 Creation of DB Files
 Creation of Bill of Materials
 Creation of PRS (Project Requirement Specification) &
Test Instructions.
 Review of Documents done by team members

8.  Verifying Schematics and Layout
 Suggesting alternate for the obsolete components
 Testing of different PCB modules
Project8 Z-Series BOM Scrubbing (RoHS Conversion)
Description
This project consist of recognizing RoHS components and if they
are non RoHS then suggest alternate for them. Z-series is a
medical device manufactured by Beckman & Coulter.
Team size 3 people
Role & Contribution
Role: Project Team Member
Contribution:
 Verifying Components as RoHS
 Searching of alternate components to replace Non RoHS
parts
Project9 TQ Prep BOM Scrubbing (RoHS Conversion)
Description
This project consist of recognizing RoHS components and if they
are non RoHS then suggest alternate for them. TQ Prep is a
medical device manufactured by Beckman & Coulter.
Team size 3 People
Role & Contribution
Role: Project Team Member
Contribution:
 Verifying Components as RoHS
 Searching of alternate components to replace Non RoHS
parts
Project10
MTBF report generation for 2 different BOMs using Part Count
Method
Description
Generate the MTBF Report at different ambient temperatures for
predicting the reliability of the components used & whole Board.
Team size 2
Role & Contribution
Role: Project Team Member
Contribution:
 Data collection (FIT Rate) for the components from their
respective Manufacturer site
 Vender Interaction for getting the data if not available on
their Website
 Generate the Report at different ambient temperatures

9. Personal Details
Name Sandeep Kumar
Father’s Name Ram Pravesh Ojha
Date Of Birth 05-01-1989
Nationality Indian
Sex Male
Marital Status Single
Passport Number L2399990
Present Address
Sector-56, House No. – MS-12, Kendriya Vihar, Distt. – Gurgaon,
State – Haryana, PIN - 122002
Permanent
Address
Village + P.O. - Amma, P.S. – Hathuari, Via – Bochaha, Distt. –
Muzaffarpur , State – Bihar, PIN - 843103
Languages
Known
English, Hindi