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Summer trainingin MEMS at CSIR-CEERI
The document summarizes a summer training program at CSIR-CEERI on miniaturizing technologies. CSIR-CEERI is a research institute located in Rajasthan, India that focuses on electronics engineering. The training program covers MEMS (Micro-Electro-Mechanical Systems) which integrate electrical and mechanical components on a small scale using microfabrication. MEMS devices range from 1 to 100 micrometers and are used in applications like smartphones, sensors, automotives and more. The document outlines the MEMS fabrication process including deposition, patterning, etching and discusses some specific MEMS technologies being researched at CSIR-CEERI.
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Summer trainingin MEMS at CSIR-CEERI
- 1. SUMMER TRAINING ATCSIR-CEERI A presentation on - A way to miniaturize our life style IN Submitted by :- MANISH KUMAR KASWAN B-tech Final year ECE UCE, RTU, KOTA (Raj.)
- 2. INTRODUCTION TO CEERI •It stands for “COUNSIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH – CENTRAL ELECTRONICS ENGINEERING AND RESEARCH INSTITUTE”. • It is only CSIR center in RAJASTHAN. • The first Indian Prime Minister Pt. Jawaharlal Nehru laid the foundation stone of the institute on 21st September 1953. • Major research areas are Electronics Systems, Semiconductor Devices and Microwave Tubes. • There are over 12 groups working on the various R&D sectors. 5/6/2015Department of electronics engineering
- 3. ELECTRONICS SYSTEMS DIVISION 5/6/2015Departmentof electronics engineering • MEMS and Nano-sensors Group (MNG) • Industrial Electronics Group (IEG) • Agro Electronics Group (AEG) • Digital System Group (DSG) • IC Design Group (IDG)
- 4. WHAT IS MEMS? • Mems is a technology of very small devices. It is a combination of mechanical functions and electrical functions on the same chip using micro fabrication technology. • MEMS are made up of components between 1 to 100 micrometers in size • MEMS devices generally range in size from 20 micrometers to a millimeter 5/6/2015Department of electronics engineering
- 5. 5/6/2015Department of electronicsengineering Deposition Patterning Etching Physical Chemical Lithography Dry Wet Design process of mems
- 6. DEPOSITION • Physical Physicalvapor deposition Electrodeposition Epatixial growth Thermal oxidation • Chemical Chemical vapor deposition Evaporation Sputtering 5/6/2015Department of electronics engineering
- 7. PATTERENING Pattern Transfer Alignment Exposure 5/6/2015Department ofelectronics engineering
- 8. ETCHING WET etching This isthe simplest etching technology. Wet etching works very well for etching thin films on substrates. It have two basic types anisotropic and isotropic. Dry etching The dry etching technology can split in three separate classes called reactive ion etching (RIE), sputter etching, and vapor phase etching. 5/6/2015Department of electronics engineering
- 9. FABRICATION TECHNOLOGIES • Icfabrication technology • Bulk Micromachining • Surface Micromachining • Micro molding 5/6/2015Department of electronics engineering
- 10. DESIGN PROCESS CYCLE 5/6/2015Departmentof electronics engineering
- 11. APPLICATIONS OF MEMS Inmedicines In smartphones In sensors In satalites In automotives In boimems As gyroscopes In military products 5/6/2015Department of electronics engineering
- 12. ADVANTAGES AND DISADVANTAGES Advantages Improvedreproducibility. Improved accuracy and reliability. Increased selectivity and sensitivity. Minimize energy and materials. Disadvantages Farm establishment requires huge investments. Micro-components are costly compared to macro components. Design includes very much complex procedures 5/6/2015Department of electronics engineering
- 13. VM-ADS • Vehicle mounted-Activedenial systems • This is an non-lethal, directed- energy weapon. • This is designed for area denial, perimeter security and crowd control. • Still only U.S. army used it. 5/6/2015Department of electronics engineering
- 14. SMART SPOON 5/6/2015Department ofelectronics engineering • The “smart” spoon allows Parkinson’s sufferers to feed themselves. • It contains an ultra thin rechargeable battery, gyroscopes, motion-sensors and actuators. • It has multiple attachments for different foods.
- 15. Conclusion • This enablingtechnology promises to create entirely new categories of products. • Mems will be the indispensible factor in advancing technology • As with all emerging technologies had been predicted to revolutionize technology and our lives 5/6/2015Department of electronics engineering
- 16. REFERENCES Online Resources • IEEEExplore http://ieeexplore.ieee.org/Xplore/Dyn Wel.jsp • MEMS Clearinghouse http://www.memsnet.org/ • MOSIS http://www.mosis.org/ • Trimmer http://www.trimmer.net/ Journals • •Journal of Micromechanical Systems . • Journal of Micromechanics and Microengineering. • Sensors Magazine. 5/6/2015Department of electronics engineering
- 17. QUERIES??? 5/6/2015Department of electronicsengineering
- 18. 5/6/2015Department of electronicsengineering