Summer trainingin MEMS at CSIR-CEERI
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The document summarizes a summer training program at CSIR-CEERI on miniaturizing technologies. CSIR-CEERI is a research institute located in Rajasthan, India that focuses on electronics engineering. The training program covers MEMS (Micro-Electro-Mechanical Systems) which integrate electrical and mechanical components on a small scale using microfabrication. MEMS devices range from 1 to 100 micrometers and are used in applications like smartphones, sensors, automotives and more. The document outlines the MEMS fabrication process including deposition, patterning, etching and discusses some specific MEMS technologies being researched at CSIR-CEERI.
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plan different solutions regarding RES and energy storage system (ESS)
topologies and sizes. Also, the demand curves for the real microgrids of
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Mems
MEMS are tiny integrated devices that combine mechanical and electrical components on a micro scale. They are able to sense, control and actuate on a micro scale but generate effects on a macro scale. MEMS utilize various fields including design, engineering, materials science and electrical engineering. Current MEMS devices include sensors in airbags, inkjet printer heads, and blood pressure sensors. MEMS are fabricated using deposition, patterning, and etching processes and are used in applications such as automotive, medical, military, and consumer electronics.
SUBSTATION MONITORING AND CONTROLLING BASED ON MICROCONTROLLER BY USING IOT
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Structural Health Monitoring: Review and practice
Structural health monitoring (SHM) aims to monitor infrastructure for degradation but has seen limited practical application. The document discusses reasons for this, including:
1) Sensors can malfunction requiring redundancies and maintenance which increases costs.
2) Electronics have shorter lifespans than structures, requiring frequent replacements.
3) Engineers lack education on SHM, making owners reluctant to rely on the approaches.
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Omega electronics ppt
The document summarizes a practical training seminar on electronics circuits design and components that was pursued at Omega Electronics. It provides information on Omega Electronics' company profile, products, international presence, training program, and introduces concepts of PCB design and fabrication processes, surface mount techniques, and robotics. The training seminar covered basics of electronics, PCB design and fabrication including soldering, and an introduction to robotics including what robotics is, why it is used, types of robots, power supplies, and motors used to power robots.
cel training report
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Mems brahma
Micro-electro-mechanical systems (MEMS) are miniature devices that combine electrical and mechanical components. MEMS components range in size from 1-100 micrometers and are fabricated using microfabrication techniques. MEMS devices can sense and control the physical world on small scales and have applications in areas like sensors, actuators, and biomedical devices. The document discusses MEMS fabrication techniques including deposition, patterning, etching, and packaging and provides examples of common MEMS devices and applications. Challenges to the future development of MEMS include access to foundries, design and simulation tools, packaging and testing standards, and education.
Mems unit 1-lec_1
Micro-electro-mechanical systems (MEMS) are miniature devices that combine electrical and mechanical components. MEMS components range in size from 1-100 micrometers and are fabricated using microfabrication techniques. MEMS devices can sense and control the physical world on small scales and have applications in areas like sensors, actuators, and biomedical devices. The document discusses MEMS fabrication techniques including deposition, patterning, etching, and packaging and provides examples of common MEMS devices and applications.
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Summer trainingin MEMS at CSIR-CEERI
- 1. SUMMER TRAINING AT CSIR-CEERI A presentation on - A way to miniaturize our life style IN Submitted by :- MANISH KUMAR KASWAN B-tech Final year ECE UCE, RTU, KOTA (Raj.)
- 2. INTRODUCTION TO CEERI • It stands for “COUNSIL OF SCIENTIFIC AND INDUSTRIAL RESEARCH – CENTRAL ELECTRONICS ENGINEERING AND RESEARCH INSTITUTE”. • It is only CSIR center in RAJASTHAN. • The first Indian Prime Minister Pt. Jawaharlal Nehru laid the foundation stone of the institute on 21st September 1953. • Major research areas are Electronics Systems, Semiconductor Devices and Microwave Tubes. • There are over 12 groups working on the various R&D sectors. 5/6/2015Department of electronics engineering
- 3. ELECTRONICS SYSTEMS DIVISION 5/6/2015Department of electronics engineering • MEMS and Nano-sensors Group (MNG) • Industrial Electronics Group (IEG) • Agro Electronics Group (AEG) • Digital System Group (DSG) • IC Design Group (IDG)
- 4. WHAT IS MEMS ? • Mems is a technology of very small devices. It is a combination of mechanical functions and electrical functions on the same chip using micro fabrication technology. • MEMS are made up of components between 1 to 100 micrometers in size • MEMS devices generally range in size from 20 micrometers to a millimeter 5/6/2015Department of electronics engineering
- 5. 5/6/2015Department of electronics engineering Deposition Patterning Etching Physical Chemical Lithography Dry Wet Design process of mems
- 6. DEPOSITION • Physical Physical vapor deposition Electrodeposition Epatixial growth Thermal oxidation • Chemical Chemical vapor deposition Evaporation Sputtering 5/6/2015Department of electronics engineering
- 7. PATTERENING Pattern Transfer Alignment Exposure 5/6/2015Department of electronics engineering
- 8. ETCHING WET etching This is the simplest etching technology. Wet etching works very well for etching thin films on substrates. It have two basic types anisotropic and isotropic. Dry etching The dry etching technology can split in three separate classes called reactive ion etching (RIE), sputter etching, and vapor phase etching. 5/6/2015Department of electronics engineering
- 9. FABRICATION TECHNOLOGIES • Ic fabrication technology • Bulk Micromachining • Surface Micromachining • Micro molding 5/6/2015Department of electronics engineering
- 10. DESIGN PROCESS CYCLE 5/6/2015Department of electronics engineering
- 11. APPLICATIONS OF MEMS In medicines In smartphones In sensors In satalites In automotives In boimems As gyroscopes In military products 5/6/2015Department of electronics engineering
- 12. ADVANTAGES AND DISADVANTAGES Advantages Improved reproducibility. Improved accuracy and reliability. Increased selectivity and sensitivity. Minimize energy and materials. Disadvantages Farm establishment requires huge investments. Micro-components are costly compared to macro components. Design includes very much complex procedures 5/6/2015Department of electronics engineering
- 13. VM-ADS • Vehicle mounted-Active denial systems • This is an non-lethal, directed- energy weapon. • This is designed for area denial, perimeter security and crowd control. • Still only U.S. army used it. 5/6/2015Department of electronics engineering
- 14. SMART SPOON 5/6/2015Department of electronics engineering • The “smart” spoon allows Parkinson’s sufferers to feed themselves. • It contains an ultra thin rechargeable battery, gyroscopes, motion-sensors and actuators. • It has multiple attachments for different foods.
- 15. Conclusion • This enabling technology promises to create entirely new categories of products. • Mems will be the indispensible factor in advancing technology • As with all emerging technologies had been predicted to revolutionize technology and our lives 5/6/2015Department of electronics engineering
- 16. REFERENCES Online Resources • IEEE Explore http://ieeexplore.ieee.org/Xplore/Dyn Wel.jsp • MEMS Clearinghouse http://www.memsnet.org/ • MOSIS http://www.mosis.org/ • Trimmer http://www.trimmer.net/ Journals • •Journal of Micromechanical Systems . • Journal of Micromechanics and Microengineering. • Sensors Magazine. 5/6/2015Department of electronics engineering
- 17. QUERIES??? 5/6/2015Department of electronics engineering
- 18. 5/6/2015Department of electronics engineering