Micro and nano manufacturing

1. UNIT 2 MICRO-NANO-MACHINING
PROCESSES
Structure
2.1 Introduction
Objectives
2.2 Micro-milling and Macro-drilling
2.3 Micro-electromechanical Systems (MEMS)
2.4 Micro-fabrication Technologies
2.5 Micro-fabrication Processes
2.5.1 Silicon Layer Processes
2.5.2 LIGA Micro-fabricationProcess
2.5.3 Micro-machining Process
2.6 Nano-technology
2.6.1 Applicationsof Nano-materials
2.6.2 CarbonNano-tubesand Structures
2.6.3 Nano-finishing
2.7 Summary
2.8 Key Words
2.9 Answers to SAQs
2.1 INTRODUCTION
I
In the middle of manufacturing era, we have studied the methods of manual
manufacturing processes and designing of parts, components and customer required
products. After a decade various developmental activities have been taken place. Usage
of IT and computers in the manufacturing and their supporting areas have been
implemented. With this technological developments CAD, CNC machining, DNC
controlling, CAM, CAPP, CAQC, and CAI have been implemented in the manufacturing
processes. These technological developments, served the several purposes, such as faster
product development, JIT manufacturing, minimum inventory, reduced the costs of the
products, improved manufacturing processes (FMS, CMS, GT).
I With further advancements in the internet connectivity, networking and integrating all
the manufacturing processes leads to concentrating on CIM and TQM implementation
strategies. These broader view concepts increased the growth of manufacturing many
fold in tenns of financial growth and customer satisfaction. Further, developments in the
software and computer languages, like ERP, SAP, Oracle, C, C++, Jawa, etc. have been
provided the way to improve the production and operations management processes.
! Further, developments in the electrical, electronics, computers, materials technology,
general science and inserting these with mechanical systems became a new system of
mechanical devices or study of mechatronics.
1
,Further, Research and Development studies developed innovative and electromechanical,
macro-electromechanical and micro-electro-mechanical systems.
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In this unit, we study about the micro-manufacturing, micro-machining, micro-milling,
micro-drilling, micro-mechatronics, etc. This unit also describes three new concepts like
nano-technology, nano-machining and nano-finishing, etc.

2. Advanced Manufacturing Objectives
After studying this unit, you should be able to
understand micro-manufacturing,
classify the types of micro-machining,
define nano-technology, and
describe about various types of nano-finishing processes, etc.
2.2 MICRO-MILLING AND MICRO-DRILLING
Micro-milling is the process of creating three dimensional miniaturised structures.
The size of milling tools used in micro-milling, having hundreds of micro-meters
in diameter. These tools are designed by the use of focused-ion beam machining
process and are used in a specially designed, high precision milling machine.
The micro-milling process is applied for making micro-molds and masks to aid in
the development of micro-components.
Micro-drilling is the process of drilling of micro, or ultrafine holes. The special
purpose precision drilling machines uses special micro-drills to make the micro
and ultrafine holes. Chisel edge micro-drills removes materials (cutting) at a
negative rake angle. Micro-drills are made of either micro-grain tungsten carbide
or cobalt steel.
The range of drilling.operation carried out in this milling operation is about the
size of 0.03 mm to 0.05 mm in diameter.
An example of this is a sub-micro-drilling technique utilising the phenomenon of
ultrafast pulse laser interference. Smooth 300 mm holes were successfully drilled
on a 1000-A0-thickgold film using the interfered laser beam.
Micro-drilling operations used in the following industrial applications :
(a) Air bearing and bushing
(b) EDM tooling
(c) Electronic components
(d) Gas and liquid flow
(e) Microwave components
(f) Nozzles
(g) Optical components
By using Bessel beam, high depth drilling operations can be achieved. The
pseuodo-Bessel beam is generated using a pulsed laser.
2.3 MICRO-ELECTROMECHANICALSYSTEMS
(MEMS)
Micro-electromechanical Systems (MEMS) are used in most of the industrial applications
such as, manufacturing, automobile industry, aircraft industry, chemical industry, etc.
The progress in micro-fabrication technologies is transforming the field of solid state into
MEMS. MEMS are manufactured by micro-fabrication methods or processes. Radio
frequency MEMS are mostly used in the field of wireless communication technologies.
Chemical industry based MEMS, such as surgical instruments, artificial organs,
genomics and drug discovery systems are based on BIOMEMS products.

3. MEMS devices are useful for controlling micro-mechanisms such as micro-manipulators,
micro-handling equipment, micro-grippers, micro-robots, and others, which are primarily
used for clinical, industrial and space applications.
2.4 MICRO-FABRICATION TECHNOLOGIES
At present the new trend in manufacturing is going to manufacture electro-chemical
systems, electronic products, which should be useful for electronic, electrical and
mechanical application. These products sizes are reducing to very small sizes are
measured in micron's (10- mm or 1o - ~
mm).
Micro-System Technologies (MST) are refer to the products as well as the fabrication
technologies used to produce, MEMS and micro-machines.
2.4.1 Classification of Micro-System Devices
Micro-system devices are classified as follows :
Devices
(a) Micro-sensors, and
@) Micro-actuators.
Applications
(a) Medical, and
(b) Automobile.
The term sensor is used for an element which produces a signal relating to the
quantity being measured.
A sensor is a device (transducer) is used to detect or measure some physical
phenomena, such as heat or pressure. These transducers converts one form of
physical form into another form. For example, piezoelectric device converts
mechanical force into electrical current. Micro-sensors are fabricated on a silicon
substrate using the same processing technologies as those used for integrated
circuits fabrication. In further advancement in these micro-systems, takes the shape
of producing hybrid micro-sensors. Hybrid micro-sensor is nothing but
combination of transducer with electronic components to give the
electro-mechanical outputs, for example, micro-accelerometer.
An actuators converts a physical variable of one type into another, with some
mechanical action. An actuator causes a change in position or the application of
force. For example, valves, positioners, switches, pumps, etc.
2.4.2 Industrial Applications
The varieties of micro-devices and systems are used for industrial applications. The
following are some applications :
(a) Ink-jet printing heads
(b) Thin-film magnetic heads
(c) Compact Discs (CDs)
(d) Automotive
(e) Medical
(f) Chemical and Environmental
(g) Electronics
Micro-Plano-Machining
Processes.
(h) Biotechnology.

4. Advanced Manufacturing -2.4.3 Automotive Applications
In earlier days, there was no any sensor or electronic component used in the automotive
applications. But now in automotive products, there are number of micro-sensors and
other devices are widely used. These micro-systems and devices are mainly used to
accomplish control and safety functions for the vehicles. The various control and safety
functions performed by these systems are as follows :
(a) Electronic engine control
(b) Anti-lock breaking systems
(c) Air-bag deployment
(d) Automatic transmission control
(e) Power steering
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(0 Remote locking and unlocking, etc.
These control systems and safety functions require sensors and actuators, these are all
microscopic in size.
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Some of the microscopic sensors are listed in Table 2.1.
Table 2.1 :Micro-sensors Installed in a Modern Automobile 1
I Micro-device Applications
I Accelerometer I Air-bag release I 1
Angular speed sensor Intelligent navigation systems
Level sensors Sense oil and gasoline levels
Pressure sensors Sense oil pressure, suspension systems,
climate control and tire pressure
I Proximity and range sensors Sense distance from front and rear
bumpers for parking control and
I collision prevention
1 Temperature sensors / Cabin climate control I
2.4.4 Chemical Applications
The micro-sensors are very much used in chemical industries to analyse the substances in
order to measure and trace the amounts of chemicals and detect harmful contaminants. A
variety of chemical micro-sensors have the capability to analyse very small samples of
the substance of interest. Some of the examples of micro-system technologies are
micro-pumps which are integrated into these systems so that the proper amounts of the
substance can be delivered to the sensor component.
2.4.5 Computer Applications
Compact Disc (CDs) are widely used in computer applications, for storing of data, audio,
video, and computer software applications. These CDs are manufactured by plastic
moulding processes. The molds are fabricated by using micro-system technologies.
2.4.6 Medical Applications
In the medical applications, these are variety of micro-system technologies and devices
have been developed. These are very much used in various applications. Some of the
16 applications have been listed in Table 2.2.

5. Micro-Nam-Machining
Processes
Table 2.2 :Applications of MST in Medical Field
Device
Stereomicroscope and
microscopic surgicaltools
Implantablesensors To monitor blood pressure and
temperature
Applications
Telemicrosurgery,in which a surgical
operation isperformed
Heartpacemakers and
hearing aids
Artificial eyes Artificial eyes
Artificialprosthesis
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1 These are various advantages of using micro-system technologies in the medical field.
- Some of advantages are :
1 (a) Less patient discomfort,
(b) Quicker recovery,
(c) Fewer and smaller scares,
(d) Shorter hospital stays, and
(e) Lower health insurance costs,etc.
!!.4.7 BiotechnologyApplications
E)iotechnologyresearches and applications are very much used for microscopic
applications. Therefore, the micro-system rechnologiesare highly suitable for
biotechnology industries. Biotechnology study related to microscopic objects. In order to
study these microscopic specimens, manipulators and other tools are needed that are the
same size and scale.The small samples of biomaterials are studied and tested under the
microscope. Micro-devices also used for holding, moving, sorting,dissectingof small
biomaterials.
2.4.8 Electronic Applications
Some of the electronic applicationsinclude, Printed CiraiteBoards (PCB's) and '
Connectors.
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2.5 MICRO-FABRICATION PROCESSES
The raw material for production of micro-system technologies and devices is the silicon.
Silicon has a good material properties, such as electronic and mechanicalproperties like
high strength and elasticity,good hardness and relatively low density.
Siliconprocessing technologies are improved due to the wide spread use of
micro-electronics single crystal silicon has high quality characteristicsand permits the
production of physical featuresto very close tolerances. Micro-fabrication technique
consists of:
(a) Silicon layering process,
(b) The LIGA process, and
(c) Other processes accomplished on a microscopic scale.
2.fi.l Silicon Layer Processes
Thl: first silicon product used in micro-system technology is sipiezoresistive sensors for
the measurement of stress, strain and pressure. Silicon is mostly used in fabricationof
integrated circuit boards and micro-system device, such as sensorsand actuators. The

6. Advanced Manufacturing manufacturing process for these two (IC's and Micro) Devices products is similar but a
certain differences exists, that is the aspect ratio.
Aspect ratio is nothing but height to width ratio of product features produced are shown
in Figure 2.1.
-
1 Width *k
Figure 2.1 :Aspect Ratio (Height-to-WidthRatio) Typical in (a) Fabrication of Integrated Circuits
and (b) Micro-fabricated Components
Aspect ratio in IC's processing are about 1.0or less. But in micro-devices manufacturing
the aspect ratio is as high as 400 or more.
There are more differences exist between these IC's and micro-devices fabrication
methods. Like IC's products are less in height and planner in shape. The micro-system
devices are more in height, high density and possess 3D structures.
The micro-fabrication processing steps are explained in Table 2.3.
Table 2.3 :Micro-fabrication Processes
Lithography It is the printing process used to transfer copies of mask pattern on to
Photolithography
the surface of silicon of other material (SOz)
Fabrication Processes-
Electron lithography
X-ray lithography
Thermal oxidation By thermal oxidation of silicon surfaceto form SiOzlayer
Chemicalvapour This is also layer additionprocess. By decomposition of gases or
deposition chemical reaction, thin layer will be formed in the surfaceof the
siliconsubstrate
Physical vapour In this process, material is converted to vapour phase and condensed
deposition on to a substratesurface as a thin film
Description
I Electroplatingand I Metal ions in solution are deposited on to a cathodework materials I
I
I electroformina 1 I
I Electrolersplating 1 Deposition an aqueous solution containingions of the plating metal 1
I 1 with no externalelectric current I
Thermal difision In this processes, atoms migrate from high concentration region to
low concentrationregion
Ion implantation Embedding atoms ofone or more elementsin a substrateusing a high
energy beam of ionized particles
Wet etching Applications of chemical etchent in aqueous solution to etch away a
target material
Dry etching Dry plasma etchingusing an ionized gas to etch a target material
Surface Micro-machining
A cantilever micro-machining is clearly explained in the Figures 2.2(a), (b), (c),
(d) and (e). By surface micro-machining process, cantilevers, overhangs and
similar structures can be produced by using silicon substrate. The cantilevers
produced in this process maintains the micron range gap between cantilever and
silicon surface.

7. Cantilevers
Figure 2.2 :SurfaceMicro-machiningto Form a Cantilever
2..5.2 LIGA Micro-fabricationProcess
The letters LIGA stands for German words~ithogra~hic,
Galvano-forming,
Abform-technique.The LIGA processing is explainedthrough the Figures 2.3(a) and (b).
p Mask
m m m
Resist
n - /
Substrate
(a) (b)
(c)
I
Figure 2.3 :LlGA ProcessingSteps
L
b
Figure 2.3(a) indicatesthat A thick layer of radiation-sensitiveresist is applied to a
I
substrate.The produced parts ranges from several microns to centimeters. The common
resist material used in LIGA is polymethylmethaacrylate. The resist is exposed through a
mask to high energy X-ray radiation. In Figure 2.3(b), the irradiatedareas of the positive
rt:sist are chemically removed from the substratesurface, leavingthe unexposed positions
I s~.anding
as a three dimensionalplastic structure.The Figure 2.3(c), the regions where the
resist has been removed are filled with common plating metal Nickel using electrode
position. The Figure 2.3(d) shows the remaining resist structure is stripped, yielding a
three-dimensionalmetal structure.
Advantages of LIGA Process
(a) Possible high aspect ratios.
(b) Produced wide range of part sizes.
(c) Possible close tolerances.
Disadvantages of LIGA Process
It is.very expensive.
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2.5.3 Micro-machining Process
There are two types of micro-machiningprocesses availablein MST.
(a) Bulk micro-machining,and
i (b) Surface micro-machining.

8. Advanced Manufacturing Bulk Micro-machining
In this bulk micro-machining process the raw material used is silicon,because of
its high materials qualities, positioning to electronicproperties. It is the process of
fabricationof micro-mechanical structureswith aid of etching techniques to
remove part of the substrateor a thin film. Bulk micro-machining refers to etching
through the wafer from the backside in order to form the desired structures.The
structuresare formed by wet chemical etching or by reactive ion etching.
The advantagesof bulk micro-machiningand chemical etching is that substrate
materials such as quartz and single crystal silicon are readily available and
reasonably high aspect-ratiostructures can be fabricated.
Surface Micro-machining
The surface micro-machining process is used to fabricateMEMS and IC's, which
are widely used in mechanical systems and computer electronics.It involves the
formation of mechanical structures in thin films formed on the surface of the
wafer. The thin film is primarily composed of three layers :
Low Pressure Chemical VapourDeposition
(a) Polycrystallinesilicon
(b) Silicon nitride
(c) Silicon dioxide.
They are deposited in sequenceand subsequentlyselectivelyremoved to build up a
three-dimensional mechanical structures integratedwith the electronics.The
structure is fixed from the planer substrate.
Some of the examples of polysilicon micro-mechanical devices are :
(a) flexible suspension,
(b) gear trains,
(c) turbines,
(d) cranks,
(e) tweezers, and
(f) linkager.
Which have already been fabricated on silicon.
SAQ 1
(a) What is micro-milling?
(b) What is micro-drilling?
(c) What is MEMS? What are its applications?
(d) Describe the process of micro-fabrications.
(e) Explain the various micro-machiningprocesses and their applications.
2.6 NONO-TECHNOLOGY
-
Nano-technology is a term used for measuring and manufacturingvery smaller devices
beyond micro-devices,which involves the control of feature sizes measured on the
nanometer (one nm = m) scale. Nano-structureconsists of physical features whose
dimensions are in the range 1to 100nm.

9. Nano-technology has applications in many fields including automotive, aerospace, Micro-Nano-Machining
household appliances, sporting goods, telecommunication equipment and medical Processes
suppliers.
1Vano-technologystudies or processes is the ability to systametically organise and
manipulate properties and behaviour of matter and even builds matter at the atomic and
molecular levels. It is certainly setting the pace for the creation of functional devices,
manufacturing and fabrication, materials and systems at the molecular level, atom by
atom, to create large structures with fundamentallyprecise and specific molecular
ccrganisation.
An important group of nano-structures matenals is the nano-tubes, which are currently
fiibricated from various materials, such as boron nitride, molybdenum, carbon, etc.
C'arbon nano-tubes are various applications in micro- or nano-scale electronics,
biomedical devices, nano-composites, gas storage media, scanning probe tips, etc.
Definition of Nano-technology
Nano-science and nano-technology deals with the study and application of
nano-objects in the various fields. Nano stands for the smaller measure, i.e.
10- m. Making the nano-objects by utilising strange properties of materials
smaller than 100nm.
Nano-technology is a multi-disciplinary area of applied science and engineering
that deals with the design and manufacture of extremely small components and
systems. They are built at the molecular level of matter, are characterised by large
surface areas in comparison with their volumes.
Nano-technology is used for various applications :
(a) Mechanical engineering
(b) Material engineering
(c) Micro-electronics
(d) Micro-measurements
(e) Communications
(f) Photoelectric
(g) Biomedical
+ (h) Chemical engineering
! (i) Energy and storage, etc.
Nano-technology materials have very good and required properties such as :
(a) Mechanical properties
(b) Magnetic properties
(c) Electronic properties
(d) Surface properties
(e) Thermal properties, etc.
Nano-technology developed some of the nano-materials comprises various
dimensions in nature are :
(a) OD - Powder
(b) 1D - StringITubelWire
(c) 2D - Paper/Layer
(d) 3D - Nano-composites

10. Advanced Manufacturing Nano-materials
Nano-materials are ha<ing grain sizes of about billionth of a meter. They posses
excellent properties, which can be used for variety of structural and non-structural
applications.
Properties of Nano-materials
Nano-materials have the following properties. Due to these excellent properties,
which are used in varieties of industries.
Nano-crystalline materials are exceptionally strong, hard, ductile, wear resistant,
corrosion resistant and are chemically very active.
2.6.1 Applications of Nano-materials
Nano-materials are being used in variety of industries with greater efficiency which are
very much used in automotive, chemical, computer, electronic and medical industries.
Some of the important applications are as follows :
(a) Computer chips
(b) Better insulation materials
(c) Tougher and harder cutting tools
(d) High-energy density batteries
(e) High-sensitive sensors
(f) Automobiles with greater fuel efficiency
(g) Longer lasting medical implants.
Computer Chips
Requirement of smaller materials and systems are increased in the microelectronic
industry. Therefore, microelectronic industry is emphasising mineaturisation,
whereby the sizes of electronic goods, such as transistors, resisters, and capacitors
are reduced in sizes. This cause further improved by nano-materials and
nano-technology.
Better Insulation Materials
Aerogels are the one of the good insulating materials for house ventilations
purpose. With the use of arogels in the offices and house current bills can be
reduced drastically. The cooling effect or heating effect or rooms will be effective
by using arogels for office insulation. These arogels extremely light in weight and
composed of three-dimensional continuous networks of particles with air trapped
at their interstices. These arogels also used for spectacles as sunglasses.
Tougher and Harder Cutting Tools
Nano-crystalline materials are very much used in manufacturer of cutting tools,
which are harder, wear-resistant, erosion-reistant and long lasting.
Micro-drills are used in electronic industry for miniaturisation of microelectronic
circuits. The micro-drills are very small in diameter, such as 100 pm. These
micro-drills are having enhanced edge retention and for better wear resistant.
Nano-crystalline carbides are used for manufacturer of micro-drills which are
much stronger, harder and wear-resistant.
High Energy Density Batteries
Nano-crystalline materials, such as nickel-metal hydride (Ni-MH) batteries are
used in all field of applications. The application include automobiles, laptop
computers, electric vehicles, next-generation electric vehicles (NGEV) to reduce
environmental pollution, cellular and cordless phones and atches.

11. Automobiles with Greater Fuel Efficiency Micro-Nano-Machining
Processes
The new spark plugs are manufactured.with nano-materialsare called 'Rail plugs".
Now which are in the prototype stage. These rail plugs generate much more
powerful sparks, about 1 k ~ / m m ~
of energy density. Rail plugs made.of
nano-materials are longer lasting and combust fuel for more efficiently and
completely.
Another application of diesel engine cylinder coating with nano-crystalline
ceramics, such as zirconia and alumina, so that they retain heat much more
efficiently and result in complete and efficient combustionof the fuel.
Longer Lasting Medical Implants
Nano-crsytallinezirconia (zirconimumoxide) ceramic is hard, wear-resistant,
corrosion resistant and bio-compatible. So these materials mostly used as medical
implants. One of the most suitable applicationof these nano-materials,such as
nano-crystallinesilicon carbide (Sic) is a good quality material for artificial heart
valves due to its low weight, high strength, extreme hardness,wear-resistance,
inertness and corrosion resistance.
2.6.2 Carbon Nano-tubes and Structures
Carbon nano-tubes are having excellentmaterial properties, such as :
Mechanical
(a) High tensile strength
(b) High resilience
Thermal
(a) Thermal conductivity
(b) Stable at high temperatures
Electronic Properties
(a) High current densities
P
i (b) Semi-conductingproperties
r Chemical Properties
Strong Covalent Bond.
Due to all these specialproperties, the nano-tubes are widely used electronicdevices,
super capacitors, lithium ion batteries, field emission displays, fuel cells, actuators,
'chemicaland biological sensors, electron sources, space lift, tennis rackets and also used
for storage of gases, etc.
(Carbonnano-tubes (CNT's) are thin hollow cylindrical in shape, with a diameter about
10,000 times smaller than a human hair. CNT's are typically longer in length about few
tens of nanometersto several micrometers. The range of CNT's diameter is 30-2.5 nm.
Some of the carbon nano-tubes are shown in Figure 2.4.
Figure2.4 :The Carbon Nano-tube

12. Advanced Manufacturing ManufacturingProcess of Nano-tubes
There are different methods are availableto manufacturethe nano-tubes, which
include :
(a) Chemical vapour deposition
(b) Laser vapourisationof graphite targets
(c) Arc dischargeof graphite electrodes
Chemical VapourDeposition
Carbon nano-tubes can be grown by chemical vapour deposition (CVD)
across the predefined trenches. The trenches can be fabricated
lithographicallyin SiO2 and then by depositing Pt over the sample to serve
as the conducting substrate.
A catalytic chemical vapour depositionprocess is shown in the Figure 2.5. It
is a reactor of having horizontal tabular furnace. The tube is about 30 mm in
diameter and 1000rnm in length and is made off quartz materials.
Inert Gas
Figure 2.5 :Schematic of CatalyticCVD Operated either as Floating Catalyst
In this chemical vapour deposition (CVD) process, the catalytic mixture of
ferrocene,benzene and carbon atoms were transported by argon or hydrogen
or mixture of both in the reaction chamber, in the reaction chamber the
mixture is decomposedinto the respective ions of Fe and carbon atoms,
resulting into carbon nano-structures. These nano-structureswill be grown
by heating in heating zone at the temperatureranges from 500°C and 1150°C
for about 25-30 minutes. The flow of H2gas was 210mllmin. The argon gas
was used to cool the reactor.
Laser VapourisationTechnique
Laser vapourisationprocess is also known as laser ablationprocess or laser
vapourisationof graphite target. It involves the use of laser beam to
vapourise a target of mixture of graphite and metal catalyst, such as Co or
Ni at temperature approximately 1200°Cin a flow of controlled inert gas
and pressure as shown in Figure 2.6, where the nano-tubes deposite are
recovered at a water cooled collector at much lower and convenient
temperature.
Cooling water
Laser beam Exhaust
Figure 2.6 :Schematicof LaserAblation Method
Arc Discharge Method
As shown in Figure 2.7, by arc discharge fabrication,the first ever
nano-tubes was produced. In this method, nano-tubes was produced with the
Direct Current (DC) arc dischargebetween carbon electrodes,anode and
cathode in a noble gas, i.e. He or argon environment.The nano-tube
deposition rate is around 1mrn/min and the incorporationof transition
metalssuch as Co, Ni or Fe into the electrodes as catalyst favours
nano-tubes formation against other nano-particles and at low operating

13. temperatures. To get good quality of nano-structures and also for the safety Micro-Nano-Machining
purpose, the arc discharge unit must be provided with cooling mechanism. P~.ocesses
Inert atmosphere
Plasma
' I
Figure 2.7 :Schematic of Arc Discharge Method
I Types of Carbon Nano-tubes
Research and development activities are rapidly growing in this area. At present,
there is about three types of carbon nano-tubes (CNT's) are available and shown in
Figure 2.8.
(a) Arm chair
(b) Zig-zag
(c) Chiral tubes
Figure 2.8 :Some Typesof Nano-tubes
Nano-finishing is a subset of the nano-machining process and it can provide advanced
material shaping with very finer finishing. There are various types of high precision
finishing processes are available :
(a) Magnetic Abrasive Finishing (MAF)
(b) Magnetic Float Polishing (MFP) with CeO2
(c) Elastic Emission Machining (EEM) with Zr02abrasive
(d) Ion Beam Machining (IBM)
hi the conventional finishing processes, the accuracies achieved would be 1 pm, and in
ultra-precision finishing processes, the accuracies achieved would be 1 pm.
(a) What do you understand about nano-technology?
(b) What are the various applications of nano-materials?
(c) Describe the different types of nano-manufacturing methods.

14. In the manufacturing field, there are various types of machiningprocesses available.At
present, the trend of manufacturingof smaller and thinner objects is increasing. With
these increased need of specialisedobjects and systems, like integrated chips,
micro-devices,micro-systems,nano-tubes, etc. the specialisedmachining, manufacturing
and fabricationsystems also developed.
Micro-machining,micro-fabrication and nano-machining,nano-finishingprocesses are
the specialisedprocesses developed to produce the specialisedneed based products,
which suitable for the variety of uses.
Micro-devices,micro-mechanical systems,nano-tubes and nano-technologiesare used in
mechanical, electronicand chemical industries widely. With this we conclude that, in this
unit, we have discussed all the above processes elaborately.
2.8 KEY WORDS
MEMS
Micro Sensors
Nano-technology
: Micro-ElectroMechanical Systems.
: Micro sensors are fabricated on a silicon substrate.
: It is the term used for measuring and
manufacturingvery smaller devices.
2.9 ANSWERS TO SAQs
Please refer the preceding text for all the Answers to SAQs.