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SEMI Penang 2013 Presentation on One Step Chip Attach (OSCA)

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Christopher Breach
Christopher Breach

A general presentation about One Step Chip Attach (OSCA) underfills.

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Developments in One Step Chip Attach (OSCA) for Thermo-compression Bonded Advanced Packaging! 1Kester 2Kester, Singapore United States 20th November 2013 Penang Malaysia Christopher Breach1 PhD! Dan Duffy2 PhD! Dave Eichstadt2! Adrian Hawkins2 PhD
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 2!
Wire bonded interconnects have evolved somewhat! Wire bonded interconnect remains an important assembly option ! Technically limited mainly by the ‘external’ nature of the long interconnection path and use only of die peripheries 3!
Flip chip assembly has grown! And growth is expected to continue For LF solder and particularly for copper pillar bumps 4!
3D IC Integration is the leading edge application driving flip chip! The ‘internal’ interconnections through silicon bring obvious benefits and technical (manufacturing) challenges! 5!
And 2.5D is what is generally practical at the moment! Interposers permit the use of ‘internal’ or ‘thru’ connections without the headache of digging holes in active circuits! Passive and active interposers can be used! 6!
Cu pillar grows and LF solder bumped flip chip remains important ! Not everything needs to be 3D packaging or 3D IC integration! These are simply more options for package designers as and when needed! Single IC flip chip packaging (Cu pillar, LF solder bumps) is also important! 7!
These are the various bump types and typical pitches! Illustration from Sami Vaehaenen: ‘Emerging fine-pitch bump bonding techniques’, LCD-WG4 Vertex detector technology meeting, 3-September-2010. 8!
Bump pitch limits the assembly method! 200 180 Reflow 2D IC 2D Limit 2.5D IC 3D IC Bump Pitch (microns) 160 140 120 100 80 60 40 Thermocompression 20 0 2010 2011 2012 2013 2014 2015 2016 Year 9!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 10!
Solder micro-bumps cannot be easily fluxed! There is a possibility of flux bridging 11!
Solder micro-bumps cannot be easily reflowed & underfilled! Collapse of micro-bumps during reflow can result in bump fusing Reflow 12!
High microbump density impedes capillary flow! High bump density slows capillary flow with solder and Cu pillar bumps Very narrow channels encourage voids 13!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 14!
The OSCA Process ! The number of steps required to underfill can be reduced! Conventional capillary flow process OSCA process 15!
OSCA materials flow less than capillary flow underfills! OSCA underfills undergo squeeze flow Squeeze flow is fluid flow between rigid surfaces The presence of bumps modifies the flow front 16!
TCB can also be used for stacked devices! Conventional TCB 17!
OSCA materials provide a ‘tunable’ resistance to solder flow! The rheology of the OSCA underfill limits micro-bump impingement While the fluxing action enables intermetallic formation Rheology and flux activity are controlled by chemistry 18!
Process profiles depend on specific assemblies ! Cycle time is a concern with TCB processes Shorter profiles mean better cycle time Longer profiles may prove better for yield *S. Katsurayama & H. Tohmyoh. Effect of thermomechanical properties of no-flow underfill materials on interconnect reliability. IEEE Trans. Comp. Pkgg. & Manfg. Tech. 3 370 (2013) 19!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 20!
OSCA materials are most commonly thermosets! There is a wide range of thermosetting polymers, hardeners, catalysts and modifiers The most common are epoxies and epoxy variants There are many possible formulations: Epoxy-epoxy blends Epoxy-novolac blends Epoxy-thermoplastic blends And a multitude of catalysts and additives that control adhesion, flow etc… 21!
Epoxy fluxes require careful chemical design! Filled/Unfilled Systems Epoxy Flux Initiator SubsystemA1 Hardener Subsystem 2 Epoxy Monomers Additives Subsystem 3 Activator Subsystem 4 A A B 22! C B C Process Time B C
Customizing or ‘tuning’ material properties! 2-D packages may often use ‘standard’ formulations! Increasing package complexity results in complex processes! There is not a ‘one material fits all’ with OSCA! OSCA materials may need to be designed around packages & processes! 23!
Viscosity & Temperature! Temperature dependence of viscosity helps select dispensing tool and substrate temperatures to optimize flow and substrate wet out Complex  Viscosity   (  Pa-­‐s) 100 10 1 0.1 0 25 50 75 100 Temperature  (  oC  ) 125 150 24!
Viscosity & Filler Loading! Rheology, onset of shear thickening depends on filler content of material Complex  Viscosity   (Pa-­‐s) 1000 100 10 0 50 100 150 Strain  Amplitude   (  %)    at  1  Hz 200 25!
Cure Kinetics! Curing must not interfere with the fluxing action Cure kinetics is important for profile design The extent of reaction α is given by dα = K (T ) f (α ) dT ⎛ −E ⎞ K (T ) = A exp ⎜ a ⎟ ⎝ RT ⎠ This is one of many models: it assumes an α independent A, Ea Kissinger Method ⎛ AR ⎞ Eα ⎛ β ⎞ ln ⎜ 2 ⎟ = ln ⎜ − ⎝ TP ⎠ ⎝ Eα ⎟ RTP ⎠ 26!
Rheology & Curing! Isothermal viscosity measurements allow process staging time and temperature selection 100 160 120 10 100 110  C 130  C 150  C 80 60 1 Temperature  (  oC  ) Complex  Viscosity   (  Pa-­‐s  ) 140 40 20 0.1 0 2160 1920 1680 1440 1200 960 720 480 240 0 Time  (  sec  ) 27!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 28!
OSCA materials can be filled or unfilled! Filler content is physically limited to <70% Connected! Connected! Not Connected! Kawamoto et al. The Effect of Filler on the Solder Connection for No Flow Underfill. Proceedings of ECTC 2006 p479! 29
CTE reduces with filler content! Novel chemistry can improve the toughness of unfilled OSCA! Intrinsic toughening by ‘tailor made’ epoxy blends and curing agents Optimum formulations obtained by statistically designed experiments 1.2 micron fumed silica filler 30!
Representative properties! Property Value Tg 116 CTE T<Tg 27 CTE T>Tg 89 Modulus (MPa) 1375 Tensile strength (MPa) 37 Density (g/cm3) 1.72 Cure shrinkage (%) 0.9 Fracture toughness K1C (MPa-m0.5) 2.7 31!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 32!
Solder bumped IC thermocompression bonding! Adequate results have been attained with thermocompression bonding of solder bumps! CSAM images: 1268 solder bumps/250 µm pitch, 10mm x 10mm chip* *L. R. Bao, I, Sawicki, A. Y. Xiao, B. Marr, O. M. Musa, Z. Liu, P. Tan & R. Wang. No Low Underfill with Novel Fluxes Proc. ECTC p.474 (2006) 33!
Thermocompression bonding with high bump density! The thermocompression bonding process can yield excellent results with high bump counts! Kester chip: ~12,000 solder bumps/140µm pitch, 10mm x 10mm chip, 50µm Ø, 50µm high 34!
Process optimization is crucial! Successful bonding depends on materials and process optimization Materials chemistry and process design go hand-inhand Poor process design can cause excessive voiding 35!
Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 36!
Summary! OSCA underfills are available for conventional package assembly now as ‘standar’ materials! With more advanced (challenging) assemblies interactions between materials chemistry and process are important! OSCA underfills can be designed to meet the specific needs of advanced packaging! 37!
Thank you!! For further information contact! Christopher Breach! cbreach@kester.com.sg ! 38!

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SEMI Penang 2013 Presentation on One Step Chip Attach (OSCA)

  • 1. Developments in One Step Chip Attach (OSCA) for Thermo-compression Bonded Advanced Packaging! 1Kester 2Kester, Singapore United States 20th November 2013 Penang Malaysia Christopher Breach1 PhD! Dan Duffy2 PhD! Dave Eichstadt2! Adrian Hawkins2 PhD
  • 2. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 2!
  • 3. Wire bonded interconnects have evolved somewhat! Wire bonded interconnect remains an important assembly option ! Technically limited mainly by the ‘external’ nature of the long interconnection path and use only of die peripheries 3!
  • 4. Flip chip assembly has grown! And growth is expected to continue For LF solder and particularly for copper pillar bumps 4!
  • 5. 3D IC Integration is the leading edge application driving flip chip! The ‘internal’ interconnections through silicon bring obvious benefits and technical (manufacturing) challenges! 5!
  • 6. And 2.5D is what is generally practical at the moment! Interposers permit the use of ‘internal’ or ‘thru’ connections without the headache of digging holes in active circuits! Passive and active interposers can be used! 6!
  • 7. Cu pillar grows and LF solder bumped flip chip remains important ! Not everything needs to be 3D packaging or 3D IC integration! These are simply more options for package designers as and when needed! Single IC flip chip packaging (Cu pillar, LF solder bumps) is also important! 7!
  • 8. These are the various bump types and typical pitches! Illustration from Sami Vaehaenen: ‘Emerging fine-pitch bump bonding techniques’, LCD-WG4 Vertex detector technology meeting, 3-September-2010. 8!
  • 9. Bump pitch limits the assembly method! 200 180 Reflow 2D IC 2D Limit 2.5D IC 3D IC Bump Pitch (microns) 160 140 120 100 80 60 40 Thermocompression 20 0 2010 2011 2012 2013 2014 2015 2016 Year 9!
  • 10. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 10!
  • 11. Solder micro-bumps cannot be easily fluxed! There is a possibility of flux bridging 11!
  • 12. Solder micro-bumps cannot be easily reflowed & underfilled! Collapse of micro-bumps during reflow can result in bump fusing Reflow 12!
  • 13. High microbump density impedes capillary flow! High bump density slows capillary flow with solder and Cu pillar bumps Very narrow channels encourage voids 13!
  • 14. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 14!
  • 15. The OSCA Process ! The number of steps required to underfill can be reduced! Conventional capillary flow process OSCA process 15!
  • 16. OSCA materials flow less than capillary flow underfills! OSCA underfills undergo squeeze flow Squeeze flow is fluid flow between rigid surfaces The presence of bumps modifies the flow front 16!
  • 17. TCB can also be used for stacked devices! Conventional TCB 17!
  • 18. OSCA materials provide a ‘tunable’ resistance to solder flow! The rheology of the OSCA underfill limits micro-bump impingement While the fluxing action enables intermetallic formation Rheology and flux activity are controlled by chemistry 18!
  • 19. Process profiles depend on specific assemblies ! Cycle time is a concern with TCB processes Shorter profiles mean better cycle time Longer profiles may prove better for yield *S. Katsurayama & H. Tohmyoh. Effect of thermomechanical properties of no-flow underfill materials on interconnect reliability. IEEE Trans. Comp. Pkgg. & Manfg. Tech. 3 370 (2013) 19!
  • 20. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 20!
  • 21. OSCA materials are most commonly thermosets! There is a wide range of thermosetting polymers, hardeners, catalysts and modifiers The most common are epoxies and epoxy variants There are many possible formulations: Epoxy-epoxy blends Epoxy-novolac blends Epoxy-thermoplastic blends And a multitude of catalysts and additives that control adhesion, flow etc… 21!
  • 22. Epoxy fluxes require careful chemical design! Filled/Unfilled Systems Epoxy Flux Initiator SubsystemA1 Hardener Subsystem 2 Epoxy Monomers Additives Subsystem 3 Activator Subsystem 4 A A B 22! C B C Process Time B C
  • 23. Customizing or ‘tuning’ material properties! 2-D packages may often use ‘standard’ formulations! Increasing package complexity results in complex processes! There is not a ‘one material fits all’ with OSCA! OSCA materials may need to be designed around packages & processes! 23!
  • 24. Viscosity & Temperature! Temperature dependence of viscosity helps select dispensing tool and substrate temperatures to optimize flow and substrate wet out Complex  Viscosity   (  Pa-­‐s) 100 10 1 0.1 0 25 50 75 100 Temperature  (  oC  ) 125 150 24!
  • 25. Viscosity & Filler Loading! Rheology, onset of shear thickening depends on filler content of material Complex  Viscosity   (Pa-­‐s) 1000 100 10 0 50 100 150 Strain  Amplitude   (  %)    at  1  Hz 200 25!
  • 26. Cure Kinetics! Curing must not interfere with the fluxing action Cure kinetics is important for profile design The extent of reaction α is given by dα = K (T ) f (α ) dT ⎛ −E ⎞ K (T ) = A exp ⎜ a ⎟ ⎝ RT ⎠ This is one of many models: it assumes an α independent A, Ea Kissinger Method ⎛ AR ⎞ Eα ⎛ β ⎞ ln ⎜ 2 ⎟ = ln ⎜ − ⎝ TP ⎠ ⎝ Eα ⎟ RTP ⎠ 26!
  • 27. Rheology & Curing! Isothermal viscosity measurements allow process staging time and temperature selection 100 160 120 10 100 110  C 130  C 150  C 80 60 1 Temperature  (  oC  ) Complex  Viscosity   (  Pa-­‐s  ) 140 40 20 0.1 0 2160 1920 1680 1440 1200 960 720 480 240 0 Time  (  sec  ) 27!
  • 28. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 28!
  • 29. OSCA materials can be filled or unfilled! Filler content is physically limited to <70% Connected! Connected! Not Connected! Kawamoto et al. The Effect of Filler on the Solder Connection for No Flow Underfill. Proceedings of ECTC 2006 p479! 29
  • 30. CTE reduces with filler content! Novel chemistry can improve the toughness of unfilled OSCA! Intrinsic toughening by ‘tailor made’ epoxy blends and curing agents Optimum formulations obtained by statistically designed experiments 1.2 micron fumed silica filler 30!
  • 31. Representative properties! Property Value Tg 116 CTE T<Tg 27 CTE T>Tg 89 Modulus (MPa) 1375 Tensile strength (MPa) 37 Density (g/cm3) 1.72 Cure shrinkage (%) 0.9 Fracture toughness K1C (MPa-m0.5) 2.7 31!
  • 32. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 32!
  • 33. Solder bumped IC thermocompression bonding! Adequate results have been attained with thermocompression bonding of solder bumps! CSAM images: 1268 solder bumps/250 µm pitch, 10mm x 10mm chip* *L. R. Bao, I, Sawicki, A. Y. Xiao, B. Marr, O. M. Musa, Z. Liu, P. Tan & R. Wang. No Low Underfill with Novel Fluxes Proc. ECTC p.474 (2006) 33!
  • 34. Thermocompression bonding with high bump density! The thermocompression bonding process can yield excellent results with high bump counts! Kester chip: ~12,000 solder bumps/140µm pitch, 10mm x 10mm chip, 50µm Ø, 50µm high 34!
  • 35. Process optimization is crucial! Successful bonding depends on materials and process optimization Materials chemistry and process design go hand-inhand Poor process design can cause excessive voiding 35!
  • 36. Agenda! 1.  Overview! 2.  Challenges with Assembly of Microbumped ICs! 3.  One Step Chip Attach (OSCA) Solutions for Micro-Bumped Arrays! 4.  Properties of Uncured OSCA-T Materials! 5.  Properties of Cured OSCA-T Materials! 6.  OSCA-T with Solder Bumps! 7.  Summary! 36!
  • 37. Summary! OSCA underfills are available for conventional package assembly now as ‘standar’ materials! With more advanced (challenging) assemblies interactions between materials chemistry and process are important! OSCA underfills can be designed to meet the specific needs of advanced packaging! 37!
  • 38. Thank you!! For further information contact! Christopher Breach! cbreach@kester.com.sg ! 38!