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Zestron Seminar
                   Hotel Equatorial
                        Penang
                   15th March 2013




Effects of Water Soluble Tacky Flux
Formulation on Solder Ball Attach to a
Cu-OSP Surface Finish in N2 and Air
    J. Z. Hussain, S. A. Khoo, C. D. Breach and A. Hawkins
                   cbreach@kester.com.sg
This presentation is about the relative
performance of four tacky fluxes
                                  1. Performance                                                    2. What’s in a Water
                                     Requirements                                                      Soluble Tacky Flux?




                               3. Experimental Results                                              4. Summary
                               100000
                                                     Flux A
                                                     Flux B
                                80000                Flux C
  Apparent Viscosity (Poise)




                                                     Flux D


                                60000                         400
                                                                           Apparent viscosity is    Flux A Viscosity Table 1
                                                              300          similar at ~50s-1
                                                                                                    Flux B Viscosity Table 1
                                40000                                                               Flux C Viscosity Table 1
                                                              200
                                                                                                    Flux D Viscosity Table 1

                                                              100
                                20000

                                                                  0
                                                                      10       20      40   60 80
                                    0

                                        0.01   0.1            1       10         100        1000
                                                         Shear Rate (s-1)
1. Performance Requirements
What’s expected from a tacky flux
Tacky fluxes are primarily used for
chip attach and solder ball attach




Source: Yole
This is what is currently expected of
tacky fluxes in electronics packaging

1. Hold solder balls/dice firmly in
   position at room temperature



2. Wet & spread over the ball/pad
   at/above a critical temperature



3. Realign misplaced balls in
   AIR
                                      Pre-reflow   Post-reflow


4. Remove oxides/coatings and enable
   base metal-Sn reactions in AIR
At room temperature tacky fluxes must
 have good adhesion
 At ambient temperature tacky fluxes are viscous and sticky but they
 must not spontaneously spread




Viscosity decreases when sheared to allow wetting/spreading
over a substrate
At and above a certain temperature
tacky fluxes must wet and spread
Must become fluid and able to wet/spread when heated above a
certain temperature
Tacky fluxes must react with tin oxides
on solder balls

SnO and SnO2 may be              SnO2 is the more thermodynamically
present on solder balls          stable material and is more common




                           Solder Ball



                                                      SnO2

                                         SnO2 is amphoteric i.e. it is
         SnO
                                         both acidic and basic

Acidic and basic components of fluxes can react with oxides but
                                                                         8
acids are more reactive
Tacky fluxes must also remove surface
coatings like OSP
                                                   Azole    Benzimidazole
OSPs (Organic Solderability Preservative)
are azole-derived chemical coatings

OSPs are used to protect the surface of copper
and minimize/inhibit copper oxide growth
                                                 Substituted benzimidazole
They form chemical bonds with copper


                                                        Substituted
                                                    arylphenylimidazole




Cu
In summary, this is what a tacky flux has
to do to facilitate reaction of Sn & Cu
A                        B




C                        D
There is a final (obvious) property of
water soluble tacky fluxes

The flux residue needs be soluble in
DI water or DI water-based solutions


The flux components must be water
soluble

Air reflow may result in oxidation of
residues and reduce water solubility

Flux must be designed to be
oxidation-resistant


OR oxidized flux residue must be
designed to be water soluble
2. What’s in a Water Soluble Tacky Flux?
Tacky fluxes are complex mixtures of
components that form organic fluids


Tacky fluxes are similar to
emulsions: often multi-phase


Emulsions are dispersions of liquid
droplets in a continuous liquid



Dispersion size and volume
fraction affects properties
These are the kinds of materials that
are mixed together

Vehicles that transport components & react with with metal oxides

Activators that accelerate reaction with oxides and surface finishes


Surfactants to wet/spread the flux and help wetting of surfaces by
molten solder


Solvents to dissolve the components and reduce viscosity


Thickening agents to control the viscosity of fluxes


These components often have more than one function
Vehicles
Materials that contain and
transport other components

Vehicles usually have more
than one function
Vehicles impart viscosity and react
with oxides
Water soluble tacky fluxes use low
molecular weight water soluble polymers

These materials typically have
multiple functions

Surfactants and activators may
also be used as vehicles
Activators
Molecules that stimulate
reactions with metal oxides
Activators are chemicals that react
with oxides
Typical activators are carboxylic
acids
Acetic acid         Pentanoic acid




Oxalic acid             Malonic acid       Succinic acid


                                                           Acid group




Example: Oxalic acid reaction with SnO


              +   SnO                  Sn + 2CO2 + H2O
Surfactants
Molecules that lower surface
tension

Surfactants may also be
thickeners
Surfactants reduce the surface tension of
liquids allowing them to wet surfaces
The surface layer of a liquid is like a ‘skin’ of unbalanced forces that
result in a surface ‘tension’

Larger unbalanced forces-larger surface tension




Surfactant molecules reduce liquid surface tension, making it
easier to break the surface layer and allow the liquid to spread
Solvents
Organic materials used to reduce
viscosity

Used in combination with
thickeners to control viscosity
Solvents are used to dissolve the other
components and control viscosity

Solvents are organic and
used to reduce viscosity



Isopropyl alcohol (IPA) is
a typical solvent


But there are many other
types available
Thickeners
Organic materials used to
increase viscosity

Used in combination with
solvents to control viscosity

Surfactants may also be
thickeners
Thickening agents provide additional
viscosity control
Thickeners are typically water soluble
polymers/oligomers

Thickeners bind components by weak chemical
interactions (hydrogen bonding)




                                resin




                                         activator

                resin
Physiochemical Interactions
Flux component molecules
interact by physical and
chemical reaction

The nature of the interactions
affects the viscosity and water
solubility
Tacky fluxes contain components with
low and medium molecular weights

Tacky fluxes are similar to
emulsions: often multi-phase


The different molecular lengths
leads to some components
attracting and others repelling



Dispersion size and volume
fraction affects properties
Physical interactions at the molecular
level are determined by chemistry
There is a microstructure in fluxes that depends on the component
chemistry




Polar substances form bonds (H bonds) with other components
The various components interact to
form complex structures
Emulsions: microstructure determined by physical and/or chemical
interactions




This is a SIMPLE example of oil, water and a surfactant
This is a cryo-TEM image of the
microstructure of an emulsion

Emulsions have a microstructure determined by chemical interactions
                   Bi-continuous phase (dark lines)




    Microstructure strongly affects rheology, wetting, spreading

                           A Berheim-Grosswasser et al Langmuir 1999 15 5448
Types of emulsions are determined by
composition and processing
Emulsions may be unstable and can be stabilised by additives
                               100                     Thermodynamic Stability




                                10
      Droplet size (microns)




                                          Macroemulsions


                                 1




                                                              Microemulsions
                                0.1
                                                                                    Miniemulsions



                               0.01
                                      0     Mins      Hours      Days      Months     Years         ∞

                                                               Stability

 Figure after Klaus Tauer, MPI Colloids and Interfaces, Am Mühlenberg, D-14476 Golm, Germany
The structures of emulsions vary but
typically contain dispersed phases

Dispersoid formation and size is determined
partially by chemical interactions


Dispersoid size is affected by shearing during
mixing of components and temperature


Dispersoid size distribution and spatial
distribution affect rheology


Rheology affects printing and dispensing
behaviour
Solubility in water means the
components prefer to bond with water
The polar bond with water must be stronger than the polar bond with
other components

Flux components prefer to bond with water rather than other
components/surfaces




                          +water
Solubility in water after air reflow
requires minimal chemical change
Some components of the flux will be lost but what remains should
not react much with oxygen in the air
OR after reflow the reactions with air must not affect water solubility
much




                           +water




Even with minimal change to the flux after reflow it is still necessary
to use some form of cleaning solution to aid with residue removal
The Mixing Process




                     Image: Physics World
The chemical mixing process is critical
and determines the flux properties
A tacky flux is a viscous fluid that starts as a
mixture of fluids and solids



The mixing blades are designed
to impart chaotic mixing




The curves in the figure show the
paths travelled by the blades


With increasing revolutions material
from all over the vessel is mixed                        Increasing revolutions
 Mixer blade and revolutions diagram from Ross (www.mixers.com)
The same mixture prepared by different
processes is different
Changing the process (mixing, heating, cooling) can change the
physiochemical properties of the mixture




Dispersoid size distribution and spatial distribution affect rheology
3. Experimental Results
This sections shows results of the
following experimental measurements
3.1 Basic Properties        3.2 Thermal Analysis




3.3 Tack Force & Rheology   3.4 Reflow & Ball Shear
3.1 Basic Properties
These data compare some fundamental
properties of the fluxes
Measurement                                    Flux
                            A            B             C           D
Acid No. (mg KOH/g)         40           39            41          32
pH                          3.5          7.3          6.8         4.7
Malcom Viscosity (Poise)   1740         3950          4510        3390
Solubility in DI Water     High         High          Low         High


Acid number: Fluxes A-C were similar and Flux D had a
significantly lower acid number

Significant variation in pH with Fluxes A and D on the low side

Malcom viscosity: Flux A had the lowest viscosity

Solubility in DI water: Flux C had the lowest solubility
The significance of acid number is…
Acid number measures of the concentration of
bound acidic groups in organic molecules

                  Higher concentration of acidic groups




Flux
          D             B               A                 C
Flux D - lowest acid number of all the fluxes: a non-chemist might
think lower acid number = poor flux activity


Acid number says nothing about acid STRENGTH!
pH tells more about how water reacts
with flux components

The relative concentration of hydronium only tells us the extent to
which water reacts with the flux
                   Stronger Acid in Aqueous Solution




Flux
          B             C                D             A

Fluxes A and D are stronger acids in aqueous solution than fluxes
B and C
The significance of pH is…
pH is an indication of the hydronium concentration i.e. the acidity of a
solution

Hydronium ions are small and relatively mobile in aqueous solutions




Water soluble tacky fluxes are usually not aqueous systems and acidic
components are not expected to dissociate without water

Hydronium ions are not expected in tacky flux in the absence of
water
An acid is a substance that donates a proton and
dissociates in water to produce hydronium ions
Simple acids react with water and release hydronium ions:

                               Acetic acid
                                     ⎯⎯  →
                  CH 3CO 2 H + H 2O ←⎯ CH 3CO-2 + H 3O +
                                         ⎯
                  pK a = 4.75 ; this is a weak acid

                                  Ethanol
                               ⎯⎯
                                →
             CH 3CH 2OH + H 2O ←⎯ CH 3CO 2O − + H 3O +
                                ⎯
             pK a = 16 ; this is a weaker acid than acetic acid


pKa is an index that characterizes the strength of an acid in water

Smaller pKa : stronger aqueous acid (higher H3O+ concentration)

The strength of acid is different in other solvents
Solid compounds can be acids even
when not in aqueous solution
Acidity of organic groups is determined by the distribution of
charge around molecules

More electronegative atoms are atoms that have more power to
attract negative charges
                                  Increasing acidity
                           Electronegativity F>Cl>Br>I>C




  Acetic acid   Iodoacetic acid       Bromoacetic acid     Chloroacetic acid   Fluoroethanoic acid
  pKa=4.76      pKa=3.15              pKa=2.86             pKa=2.81            pKa=2.15


More acidic molecules have a smaller pKa but pKa only measures
acid strength in aqueous solutions
When mixed with other solvents the acid strength will differ
4.2 Thermal Analysis
Thermal analysis was performed with
DSC and TGA

Homogeneity, solvent loss and
phase separation can be assessed
by DSC




TGA (Thermogravimetric Analysis)
measures mass loss during heating
The graphs below show DSC data for
Flux B and Flux C
Flux B appeared inhomogeneous,
possibly mixing related


Phase transitions did not shift to higher
temperature with increased heating rate



Flux C also appeared inhomogeneous,
possibly mixing related



Phase transitions showed erratic shifts
with increased heating rate
The graphs below show DSC data for
each Flux A and Flux D
Flux A appeared relatively
homogeneous

Phase transitions shifted to higher
temperature with increased heating rate




Flux D appeared relatively
homogeneous


Phase transitions did not shift to higher
temperature with increased heating rate
The TGA weight loss curves in N2 and
air are shown in the graphs below
At 260°C Flux Din air shows the least weight loss of all fluxes relative
to N2
The DTGA weight loss curves in air are
shown in the graphs below
The derivative curves show multiple chemical reactions

The behaviour of Flux D is similar in air and nitrogen but the
other fluxes show significant differences starting at 220°C
Rheology & Tack Force
Tack force measures a combination of
adhesion and flux viscoelastic properties
Tack force tests measure a combination of adhesion
and viscoelastic properties
Rheology and tack force are relevant
to the pin transfer process
The pin transfer process begins with coating the pins with flux

                                                             The pins
                                                             descend
                      As the pins         The pins
                    retract the flux   penetrate to a
                      deforms &         fixed depth
    Each pin is
   coated with a       fractures
  uniform film of
       flux




                                            The flux is viscoelastic
                                             and starts to fracture
Rheology and tack force are also
relevant pin to substrate flux transfer
The pin transfer process ends with flux deposited at the bond site

                                                            The pins
                                                            descend
                      As the pins    The pins reach a
                    retract the flux pre-set height
  Each bond site      deforms &
 is coated with a      fractures
 uniform amount
      of flux




                                           The flux is viscoelastic
                                            and starts to fracture
Tack force changes with pin speed
and specimen thickness
Tack force increase with speed: typical viscoelastic behaviour

At 2mil specimen thickness fluxes A, C and D showed similar behaviour

At 4mil specimen thickness fluxes there were clearer differences between
the fluxes




                                                                           56
At 1Hz the fluxes have different
viscoelasticity / viscoplasticity
Flux A: almost linear
response, low stress


Flux B: nonlinear response,
high stress

Flux C: nonlinear response,
high stress, similar shape to B


Flux D: nonlinear response,
medium stress


Stiffness of the fluids falls in this order:
Flux B≈Flux C>Flux D>Flux A
The effects frequency on viscoelastic
behaviour support the stress-strain data
With increasing frequency the elastic and viscous components of
shear modulus increase

Fluxes B, C and D are the ‘stiffest’ and have the highest viscous
components

Flux A is very ‘soft’ and is the most ‘liquid like’
The effect of shear rate on apparent
   viscosity (AV) is shown below
                                 Peak in AV followed by shear thinning



Slight increase in AV with                    At 40-50s-1 the AVs
shear rate at low shear rates                     are similar




Flux A has very low initial AV
compared with other fluxes


 At high enough shear rates all fluxes show almost the same response
Reflow and Ball Shear
Reflow was characterized using a
miniature reflow oven
Tacky flux was printed on OSP coated
Cu PCB

Highly oxidized solder spheres were used
to compare the efficacy of the fluxes
The videos below show how each flux
attacks oxides in N2
A heavily oxidized solder ball was used to test flux performance



                         Flux A                             Flux B




                         Flux C                             Flux D
The videos below show how each flux
attacks oxides in Air
A heavily oxidized solder ball was used to test flux performance


                         Flux A                            Flux B




                         Flux C                            Flux D
Two of the fluxes showed good capability
     to realign misplaced spheres
                                         Excellent

                                          Flux D


                          Flux B
        Poor


           Flux C

                                          Flux A




64
Ball Shear Data-Air Reflow
The distribution of ball shear strength may be an indirect indication of how well
a flux removes OSP to allow contact between molten solder and copper
Fluxes A, C and D achieved good results




                                                                                    65
Cleaning
Tacky fluxes were simply printed on
copper pads and reflowed in air

During reflow when the flux is activated it attacks the
OSP
At the same time the flux is attacked by oxygen
Cleaning was assessed in a very
simple way
Reflowed specimens were placed in DI water + 10
minutes in an ultrasonic bath

Rinsed with DI water and examined
with an optical microscope
Discolouration (tarnishing) after air
     reflow is an indicator of cleanliness
       Flux A                                 Less discolouration
                                               Cleaner surface
                       Flux B                More easily removable
                                                   residues


                                  Flux C



                                                    Flux D




      Discolouration


69
Discolouration is related to thermal
stability
Degradation of the flux in air renders the flux unable to protect the
copper from oxidation
The rate of loss of flux and flux
oxidation reactions affect tarnishing
More flux reaction with air equates to higher rate of
degradation
Faster reaction with air may mean lack
of protection for the copper

Faster thinning of flux=thinner barrier and increased
chances of Cu oxidation
Summary
Summary/1
Flux D exhibited the least mass loss in air relative to N2
indicating minimal reaction with air
Summary/2
Flux D had the lowest acid number but was the most
effective at removing oxides during reflow in air
High acid number is not necessary for optimum flux
performance

Measurement                           Flux
                         A       B           C        D
Acid No. (mg KOH/g)      40      39          41       32

                Flux C                       Flux D
Summary/3
     Flux D exhibited the best realignment of misplaced balls due
     to flux activity and the ability to remove OSP and oxides and
     obtain contact between molten solder and bare CU

                                                 Excellent

                                                       Flux D

                                 Flux B
           Poor
           Flux C

                                                       Flux A




76
Summary/4
Higher ball shear was obtained with Flux D implying more
bonded interfacial area and easier flow of solder through the
flux OR easier displacement of the flux by the molten solder
Summary/4
The least tarnishing of Cu pads after was achieved with Flux
D indicating minimal penetration of air to the Cu
   Flux A


                   Flux B



                                   Flux C



                                                    Flux D

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Tacky Flux Presentation at the Zestron Seminar, Equatorial Hotel, Penang, 15/03/2013

  • 1. Zestron Seminar Hotel Equatorial Penang 15th March 2013 Effects of Water Soluble Tacky Flux Formulation on Solder Ball Attach to a Cu-OSP Surface Finish in N2 and Air J. Z. Hussain, S. A. Khoo, C. D. Breach and A. Hawkins cbreach@kester.com.sg
  • 2. This presentation is about the relative performance of four tacky fluxes 1. Performance 2. What’s in a Water Requirements Soluble Tacky Flux? 3. Experimental Results 4. Summary 100000 Flux A Flux B 80000 Flux C Apparent Viscosity (Poise) Flux D 60000 400 Apparent viscosity is Flux A Viscosity Table 1 300 similar at ~50s-1 Flux B Viscosity Table 1 40000 Flux C Viscosity Table 1 200 Flux D Viscosity Table 1 100 20000 0 10 20 40 60 80 0 0.01 0.1 1 10 100 1000 Shear Rate (s-1)
  • 3. 1. Performance Requirements What’s expected from a tacky flux
  • 4. Tacky fluxes are primarily used for chip attach and solder ball attach Source: Yole
  • 5. This is what is currently expected of tacky fluxes in electronics packaging 1. Hold solder balls/dice firmly in position at room temperature 2. Wet & spread over the ball/pad at/above a critical temperature 3. Realign misplaced balls in AIR Pre-reflow Post-reflow 4. Remove oxides/coatings and enable base metal-Sn reactions in AIR
  • 6. At room temperature tacky fluxes must have good adhesion At ambient temperature tacky fluxes are viscous and sticky but they must not spontaneously spread Viscosity decreases when sheared to allow wetting/spreading over a substrate
  • 7. At and above a certain temperature tacky fluxes must wet and spread Must become fluid and able to wet/spread when heated above a certain temperature
  • 8. Tacky fluxes must react with tin oxides on solder balls SnO and SnO2 may be SnO2 is the more thermodynamically present on solder balls stable material and is more common Solder Ball SnO2 SnO2 is amphoteric i.e. it is SnO both acidic and basic Acidic and basic components of fluxes can react with oxides but 8 acids are more reactive
  • 9. Tacky fluxes must also remove surface coatings like OSP Azole Benzimidazole OSPs (Organic Solderability Preservative) are azole-derived chemical coatings OSPs are used to protect the surface of copper and minimize/inhibit copper oxide growth Substituted benzimidazole They form chemical bonds with copper Substituted arylphenylimidazole Cu
  • 10. In summary, this is what a tacky flux has to do to facilitate reaction of Sn & Cu A B C D
  • 11. There is a final (obvious) property of water soluble tacky fluxes The flux residue needs be soluble in DI water or DI water-based solutions The flux components must be water soluble Air reflow may result in oxidation of residues and reduce water solubility Flux must be designed to be oxidation-resistant OR oxidized flux residue must be designed to be water soluble
  • 12. 2. What’s in a Water Soluble Tacky Flux?
  • 13. Tacky fluxes are complex mixtures of components that form organic fluids Tacky fluxes are similar to emulsions: often multi-phase Emulsions are dispersions of liquid droplets in a continuous liquid Dispersion size and volume fraction affects properties
  • 14. These are the kinds of materials that are mixed together Vehicles that transport components & react with with metal oxides Activators that accelerate reaction with oxides and surface finishes Surfactants to wet/spread the flux and help wetting of surfaces by molten solder Solvents to dissolve the components and reduce viscosity Thickening agents to control the viscosity of fluxes These components often have more than one function
  • 15. Vehicles Materials that contain and transport other components Vehicles usually have more than one function
  • 16. Vehicles impart viscosity and react with oxides Water soluble tacky fluxes use low molecular weight water soluble polymers These materials typically have multiple functions Surfactants and activators may also be used as vehicles
  • 18. Activators are chemicals that react with oxides Typical activators are carboxylic acids Acetic acid Pentanoic acid Oxalic acid Malonic acid Succinic acid Acid group Example: Oxalic acid reaction with SnO + SnO Sn + 2CO2 + H2O
  • 19. Surfactants Molecules that lower surface tension Surfactants may also be thickeners
  • 20. Surfactants reduce the surface tension of liquids allowing them to wet surfaces The surface layer of a liquid is like a ‘skin’ of unbalanced forces that result in a surface ‘tension’ Larger unbalanced forces-larger surface tension Surfactant molecules reduce liquid surface tension, making it easier to break the surface layer and allow the liquid to spread
  • 21. Solvents Organic materials used to reduce viscosity Used in combination with thickeners to control viscosity
  • 22. Solvents are used to dissolve the other components and control viscosity Solvents are organic and used to reduce viscosity Isopropyl alcohol (IPA) is a typical solvent But there are many other types available
  • 23. Thickeners Organic materials used to increase viscosity Used in combination with solvents to control viscosity Surfactants may also be thickeners
  • 24. Thickening agents provide additional viscosity control Thickeners are typically water soluble polymers/oligomers Thickeners bind components by weak chemical interactions (hydrogen bonding) resin activator resin
  • 25. Physiochemical Interactions Flux component molecules interact by physical and chemical reaction The nature of the interactions affects the viscosity and water solubility
  • 26. Tacky fluxes contain components with low and medium molecular weights Tacky fluxes are similar to emulsions: often multi-phase The different molecular lengths leads to some components attracting and others repelling Dispersion size and volume fraction affects properties
  • 27. Physical interactions at the molecular level are determined by chemistry There is a microstructure in fluxes that depends on the component chemistry Polar substances form bonds (H bonds) with other components
  • 28. The various components interact to form complex structures Emulsions: microstructure determined by physical and/or chemical interactions This is a SIMPLE example of oil, water and a surfactant
  • 29. This is a cryo-TEM image of the microstructure of an emulsion Emulsions have a microstructure determined by chemical interactions Bi-continuous phase (dark lines) Microstructure strongly affects rheology, wetting, spreading A Berheim-Grosswasser et al Langmuir 1999 15 5448
  • 30. Types of emulsions are determined by composition and processing Emulsions may be unstable and can be stabilised by additives 100 Thermodynamic Stability 10 Droplet size (microns) Macroemulsions 1 Microemulsions 0.1 Miniemulsions 0.01 0 Mins Hours Days Months Years ∞ Stability Figure after Klaus Tauer, MPI Colloids and Interfaces, Am Mühlenberg, D-14476 Golm, Germany
  • 31. The structures of emulsions vary but typically contain dispersed phases Dispersoid formation and size is determined partially by chemical interactions Dispersoid size is affected by shearing during mixing of components and temperature Dispersoid size distribution and spatial distribution affect rheology Rheology affects printing and dispensing behaviour
  • 32. Solubility in water means the components prefer to bond with water The polar bond with water must be stronger than the polar bond with other components Flux components prefer to bond with water rather than other components/surfaces +water
  • 33. Solubility in water after air reflow requires minimal chemical change Some components of the flux will be lost but what remains should not react much with oxygen in the air OR after reflow the reactions with air must not affect water solubility much +water Even with minimal change to the flux after reflow it is still necessary to use some form of cleaning solution to aid with residue removal
  • 34. The Mixing Process Image: Physics World
  • 35. The chemical mixing process is critical and determines the flux properties A tacky flux is a viscous fluid that starts as a mixture of fluids and solids The mixing blades are designed to impart chaotic mixing The curves in the figure show the paths travelled by the blades With increasing revolutions material from all over the vessel is mixed Increasing revolutions Mixer blade and revolutions diagram from Ross (www.mixers.com)
  • 36. The same mixture prepared by different processes is different Changing the process (mixing, heating, cooling) can change the physiochemical properties of the mixture Dispersoid size distribution and spatial distribution affect rheology
  • 38. This sections shows results of the following experimental measurements 3.1 Basic Properties 3.2 Thermal Analysis 3.3 Tack Force & Rheology 3.4 Reflow & Ball Shear
  • 40. These data compare some fundamental properties of the fluxes Measurement Flux A B C D Acid No. (mg KOH/g) 40 39 41 32 pH 3.5 7.3 6.8 4.7 Malcom Viscosity (Poise) 1740 3950 4510 3390 Solubility in DI Water High High Low High Acid number: Fluxes A-C were similar and Flux D had a significantly lower acid number Significant variation in pH with Fluxes A and D on the low side Malcom viscosity: Flux A had the lowest viscosity Solubility in DI water: Flux C had the lowest solubility
  • 41. The significance of acid number is… Acid number measures of the concentration of bound acidic groups in organic molecules Higher concentration of acidic groups Flux D B A C Flux D - lowest acid number of all the fluxes: a non-chemist might think lower acid number = poor flux activity Acid number says nothing about acid STRENGTH!
  • 42. pH tells more about how water reacts with flux components The relative concentration of hydronium only tells us the extent to which water reacts with the flux Stronger Acid in Aqueous Solution Flux B C D A Fluxes A and D are stronger acids in aqueous solution than fluxes B and C
  • 43. The significance of pH is… pH is an indication of the hydronium concentration i.e. the acidity of a solution Hydronium ions are small and relatively mobile in aqueous solutions Water soluble tacky fluxes are usually not aqueous systems and acidic components are not expected to dissociate without water Hydronium ions are not expected in tacky flux in the absence of water
  • 44. An acid is a substance that donates a proton and dissociates in water to produce hydronium ions Simple acids react with water and release hydronium ions: Acetic acid ⎯⎯ → CH 3CO 2 H + H 2O ←⎯ CH 3CO-2 + H 3O + ⎯ pK a = 4.75 ; this is a weak acid Ethanol ⎯⎯ → CH 3CH 2OH + H 2O ←⎯ CH 3CO 2O − + H 3O + ⎯ pK a = 16 ; this is a weaker acid than acetic acid pKa is an index that characterizes the strength of an acid in water Smaller pKa : stronger aqueous acid (higher H3O+ concentration) The strength of acid is different in other solvents
  • 45. Solid compounds can be acids even when not in aqueous solution Acidity of organic groups is determined by the distribution of charge around molecules More electronegative atoms are atoms that have more power to attract negative charges Increasing acidity Electronegativity F>Cl>Br>I>C Acetic acid Iodoacetic acid Bromoacetic acid Chloroacetic acid Fluoroethanoic acid pKa=4.76 pKa=3.15 pKa=2.86 pKa=2.81 pKa=2.15 More acidic molecules have a smaller pKa but pKa only measures acid strength in aqueous solutions When mixed with other solvents the acid strength will differ
  • 47. Thermal analysis was performed with DSC and TGA Homogeneity, solvent loss and phase separation can be assessed by DSC TGA (Thermogravimetric Analysis) measures mass loss during heating
  • 48. The graphs below show DSC data for Flux B and Flux C Flux B appeared inhomogeneous, possibly mixing related Phase transitions did not shift to higher temperature with increased heating rate Flux C also appeared inhomogeneous, possibly mixing related Phase transitions showed erratic shifts with increased heating rate
  • 49. The graphs below show DSC data for each Flux A and Flux D Flux A appeared relatively homogeneous Phase transitions shifted to higher temperature with increased heating rate Flux D appeared relatively homogeneous Phase transitions did not shift to higher temperature with increased heating rate
  • 50. The TGA weight loss curves in N2 and air are shown in the graphs below At 260°C Flux Din air shows the least weight loss of all fluxes relative to N2
  • 51. The DTGA weight loss curves in air are shown in the graphs below The derivative curves show multiple chemical reactions The behaviour of Flux D is similar in air and nitrogen but the other fluxes show significant differences starting at 220°C
  • 53. Tack force measures a combination of adhesion and flux viscoelastic properties Tack force tests measure a combination of adhesion and viscoelastic properties
  • 54. Rheology and tack force are relevant to the pin transfer process The pin transfer process begins with coating the pins with flux The pins descend As the pins The pins retract the flux penetrate to a deforms & fixed depth Each pin is coated with a fractures uniform film of flux The flux is viscoelastic and starts to fracture
  • 55. Rheology and tack force are also relevant pin to substrate flux transfer The pin transfer process ends with flux deposited at the bond site The pins descend As the pins The pins reach a retract the flux pre-set height Each bond site deforms & is coated with a fractures uniform amount of flux The flux is viscoelastic and starts to fracture
  • 56. Tack force changes with pin speed and specimen thickness Tack force increase with speed: typical viscoelastic behaviour At 2mil specimen thickness fluxes A, C and D showed similar behaviour At 4mil specimen thickness fluxes there were clearer differences between the fluxes 56
  • 57. At 1Hz the fluxes have different viscoelasticity / viscoplasticity Flux A: almost linear response, low stress Flux B: nonlinear response, high stress Flux C: nonlinear response, high stress, similar shape to B Flux D: nonlinear response, medium stress Stiffness of the fluids falls in this order: Flux B≈Flux C>Flux D>Flux A
  • 58. The effects frequency on viscoelastic behaviour support the stress-strain data With increasing frequency the elastic and viscous components of shear modulus increase Fluxes B, C and D are the ‘stiffest’ and have the highest viscous components Flux A is very ‘soft’ and is the most ‘liquid like’
  • 59. The effect of shear rate on apparent viscosity (AV) is shown below Peak in AV followed by shear thinning Slight increase in AV with At 40-50s-1 the AVs shear rate at low shear rates are similar Flux A has very low initial AV compared with other fluxes At high enough shear rates all fluxes show almost the same response
  • 61. Reflow was characterized using a miniature reflow oven Tacky flux was printed on OSP coated Cu PCB Highly oxidized solder spheres were used to compare the efficacy of the fluxes
  • 62. The videos below show how each flux attacks oxides in N2 A heavily oxidized solder ball was used to test flux performance Flux A Flux B Flux C Flux D
  • 63. The videos below show how each flux attacks oxides in Air A heavily oxidized solder ball was used to test flux performance Flux A Flux B Flux C Flux D
  • 64. Two of the fluxes showed good capability to realign misplaced spheres Excellent Flux D Flux B Poor Flux C Flux A 64
  • 65. Ball Shear Data-Air Reflow The distribution of ball shear strength may be an indirect indication of how well a flux removes OSP to allow contact between molten solder and copper Fluxes A, C and D achieved good results 65
  • 67. Tacky fluxes were simply printed on copper pads and reflowed in air During reflow when the flux is activated it attacks the OSP At the same time the flux is attacked by oxygen
  • 68. Cleaning was assessed in a very simple way Reflowed specimens were placed in DI water + 10 minutes in an ultrasonic bath Rinsed with DI water and examined with an optical microscope
  • 69. Discolouration (tarnishing) after air reflow is an indicator of cleanliness Flux A Less discolouration Cleaner surface Flux B More easily removable residues Flux C Flux D Discolouration 69
  • 70. Discolouration is related to thermal stability Degradation of the flux in air renders the flux unable to protect the copper from oxidation
  • 71. The rate of loss of flux and flux oxidation reactions affect tarnishing More flux reaction with air equates to higher rate of degradation
  • 72. Faster reaction with air may mean lack of protection for the copper Faster thinning of flux=thinner barrier and increased chances of Cu oxidation
  • 74. Summary/1 Flux D exhibited the least mass loss in air relative to N2 indicating minimal reaction with air
  • 75. Summary/2 Flux D had the lowest acid number but was the most effective at removing oxides during reflow in air High acid number is not necessary for optimum flux performance Measurement Flux A B C D Acid No. (mg KOH/g) 40 39 41 32 Flux C Flux D
  • 76. Summary/3 Flux D exhibited the best realignment of misplaced balls due to flux activity and the ability to remove OSP and oxides and obtain contact between molten solder and bare CU Excellent Flux D Flux B Poor Flux C Flux A 76
  • 77. Summary/4 Higher ball shear was obtained with Flux D implying more bonded interfacial area and easier flow of solder through the flux OR easier displacement of the flux by the molten solder
  • 78. Summary/4 The least tarnishing of Cu pads after was achieved with Flux D indicating minimal penetration of air to the Cu Flux A Flux B Flux C Flux D